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The top documents of vpw
[IEEE 4th Electronics Packaging Technology Conference (EPTC 2002) - Singapore (10-12 Dec. 2002)] 4th Electronics Packaging Technology Conference, 2002. - Mechanical response of PCBs
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Constitutive description of Bulk Metallic Glass composites at high homologous temperatures
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Effect of interphase and strain-rate on the tensile properties of polyamide 6 reinforced with functionalized silica nanoparticles
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La-based bulk metallic glass failure analysis under static and dynamic loading
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A constitutive description of the rate-sensitive response of semi-crystalline polymers
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On the generation of nanograins in pure copper through uniaxial single compression
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Wiki Collaboration and Brainstorming
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Mccabe Nist235r
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