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©2020 by System Plus Consulting | SP20571 - 3D Time-o-Flight Module in Meizu 17 Pro | Sample 1
22 bd Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 info@systemplus.fr www.systemplus.fr
3D Time-of-Flight Module in Meizu 17 Pro
The first 3D ToF camera from Samsung with Lumentum’s VCSEL
SP20571 - IMAGING report by Taha AYARI Laboratory analysis by Youssef EL GMILI
November 2020 - Sample
REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT
http://www.systemplus.fr/
©2020 by System Plus Consulting | SP20571 - 3D Time-o-Flight Module in Meizu 17 Pro | Sample 2
Table of Contents
Overview / Introduction 4
o Executive Summary
o Reverse Costing Methodology
Company Profile 11
Market Analysis 15
Physical Analysis 19
o Summary of the Physical Analysis
o 3D Sensing System Assembly
✓ Module Views
✓ Module Opening
✓ System Cross-Section
o NIR Camera Module
✓ Module Views & Dimensions
✓ Module Cross-Section
o NIR CMOS Image Sensor
✓ Die Overview & Dimensions
✓ Die Process
✓ Die Cross-Section
✓ Die Process Characteristics
o Flood Illuminator
✓ Module Views & Dimensions
✓ Module Cross-Section
o NIR VCSEL Die
✓ Die Views & Dimensions
✓ Die Process
✓ Die Cross-Section
✓ Die Process Characteristics
o VCSEL Driver Die
✓ Views & Dimensions
✓ Delayering & Main Blocs
✓ Die Process
Manufacturing Process 79
o Global Overview
o NIR Sensor Die Front-End Process & Fabrication Unit
o NIR VCSEL Process Flow & Fabrication Unit
o VCSEL Driver Die Front-End Process & Fabrication Unit
Cost Analysis 92
o Summary of the Cost Analysis
o Yields Explanation & Hypotheses
o NIR Camera Module
✓ Pixel Array, BSI & Optical Front-End Cost
✓ NIR ToF Image Sensor Wafer & Die Cost
o Flood Illuminator Module
✓ NIR VCSEL Front-End Cost
✓ NIR VCSEL Probe Test, Thinning & Dicing
✓ NIR VCSEL Die Wafer Cost
✓ Component Cost
o VCSEL Driver
✓ Front-End Cost
✓ Probe Test, Thinning & Dicing
✓ Die Cost
o ToF Module
✓ Complete Module Cost
✓ Complete Module Price
Technical and Cost Comparison 121
o Meizu 17 Pro vs. Galaxy Note10+ vs iPad Pro
Feedbacks 126
SystemPlus Consulting Services 128
http://www.systemplus.fr/
©2020 by System Plus Consulting | SP20571 - 3D Time-o-Flight Module in Meizu 17 Pro | Sample 3
Overview / Introductiono Executive Summaryo Reverse Costing Methodologyo Glossaryo Meizu’s ToF module
Company Profile
Market Analysis
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Technical & Cost Comparison
Feedbacks
Related Reports
About System Plus
Meizu 17 pro- Overview
Dimensionso Height: 160 mmo Width: 77.2 mmo Thickness: 8.5 mm
Weighto 219 g
Meizu 17 Pro - Overview
http://www.systemplus.fr/
©2020 by System Plus Consulting | SP20571 - 3D Time-o-Flight Module in Meizu 17 Pro | Sample 4
Overview / Introductiono Executive Summaryo Reverse Costing Methodologyo Glossaryo Meizu’s ToF module
Company Profile
Market Analysis
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Technical & Cost Comparison
Feedbacks
Related Reports
About System Plus
Meizu 17 Pro - Overview
UltraWide camera moduleRGB main camera module
Meizu 17 Pro - Rear optical block ©2020 by System Plus Consulting
ToF module
Telephoto camera module
http://www.systemplus.fr/
©2020 by System Plus Consulting | SP20571 - 3D Time-o-Flight Module in Meizu 17 Pro | Sample 5
Overview / Introduction
Company Profile
Market Analysis
Physical Analysiso Summary of the Physical
Analysiso ToF Module Disassemblyo NIR Camera Moduleo NIR CIS Dieo Flood illuminatoro NIR VCSEL Dieo VCSEL Driver Die
Manufacturing Process Flow
Cost Analysis
Technical & Cost Comparison
Feedbacks
Related Reports
About System Plus
Summary of the Physical Analysis
http://www.systemplus.fr/
©2020 by System Plus Consulting | SP20571 - 3D Time-o-Flight Module in Meizu 17 Pro | Sample 6
Overview / Introduction
Company Profile
Market Analysis
Physical Analysiso Summary of the Physical
Analysiso ToF Module Disassemblyo NIR Camera Moduleo NIR CIS Dieo Flood illuminatoro NIR VCSEL Dieo VCSEL Driver Die
Manufacturing Process Flow
Cost Analysis
Technical & Cost Comparison
Feedbacks
Related Reports
About System Plus
ToF Module Disassembly
Module opening – Optical View ©2020 by System Plus Consulting
NIR cameraFlood illuminator
Metal enclosure
Module tilted view – Optical View ©2020 by System Plus Consulting
http://www.systemplus.fr/
©2020 by System Plus Consulting | SP20571 - 3D Time-o-Flight Module in Meizu 17 Pro | Sample 7
Overview / Introduction
Company Profile
Market Analysis
Physical Analysiso Summary of the Physical
Analysiso ToF Module Disassemblyo NIR Camera Moduleo NIR CIS Dieo Flood illuminatoro NIR VCSEL Dieo VCSEL Driver Die
Manufacturing Process Flow
Cost Analysis
Technical & Cost Comparison
Feedbacks
Related Reports
About System Plus
ToF Module Cross-section
http://www.systemplus.fr/
©2020 by System Plus Consulting | SP20571 - 3D Time-o-Flight Module in Meizu 17 Pro | Sample 8
Overview / Introduction
Company Profile
Market Analysis
Physical Analysiso Summary of the Physical
Analysiso ToF Module Disassemblyo NIR Camera Moduleo NIR CIS Dieo Flood illuminatoro NIR VCSEL Dieo VCSEL Driver Die
Manufacturing Process Flow
Cost Analysis
Technical & Cost Comparison
Feedbacks
Related Reports
About System Plus
Image Sensor Die – Cross-Section – Lenses
http://www.systemplus.fr/
©2020 by System Plus Consulting | SP20571 - 3D Time-o-Flight Module in Meizu 17 Pro | Sample 9
Overview / Introduction
Company Profile
Market Analysis
Physical Analysiso Summary of the Physical
Analysiso ToF Module Disassemblyo NIR Camera Moduleo NIR CIS Dieo Flood illuminatoro NIR VCSEL Dieo VCSEL Driver Die
Manufacturing Process Flow
Cost Analysis
Technical & Cost Comparison
Feedbacks
Related Reports
About System Plus
VCSEL Die Cross-section
http://www.systemplus.fr/
©2020 by System Plus Consulting | SP20571 - 3D Time-o-Flight Module in Meizu 17 Pro | Sample 10
Overview / Introduction
Company Profile
Market Analysis
Physical Analysiso Summary of the Physical
Analysiso ToF Module Disassemblyo NIR Camera Moduleo NIR CIS Dieo Flood illuminatoro NIR VCSEL Dieo VCSEL Driver Die
Manufacturing Process Flow
Cost Analysis
Technical & Cost Comparison
Feedbacks
Related Reports
About System Plus
VCSEL Driver Die - Logic Circuit
http://www.systemplus.fr/
©2020 by System Plus Consulting | SP20571 - 3D Time-o-Flight Module in Meizu 17 Pro | Sample 11
Overview / Introduction
Company Profile
Market Analysis
Physical Analysis
Manufacturing Process Flowo Global Overviewo NIR Sensor Die Front-End
Process & Fabrication Unito NIR VCSEL Process Flow &
Fabrication Unito VCSEL Driver Die Front-End
Process & Fabrication Unit
Cost Analysis
Technical & Cost Comparison
Feedbacks
Related Reports
About System Plus
Pixel Array & DSP Circuit Process Flow
http://www.systemplus.fr/
©2020 by System Plus Consulting | SP20571 - 3D Time-o-Flight Module in Meizu 17 Pro | Sample 12
Overview / Introduction
Company Profile
Market Analysis
Physical Analysis
Manufacturing Process Flowo Global Overviewo NIR Sensor Die Front-End
Process & Fabrication Unito NIR VCSEL Process Flow &
Fabrication Unito VCSEL Driver Die Front-End
Process & Fabrication Unit
Cost Analysis
Technical & Cost Comparison
Feedbacks
Related Reports
About System Plus
NIR VCSEL Wafer Process Flow 1/2
http://www.systemplus.fr/
©2020 by System Plus Consulting | SP20571 - 3D Time-o-Flight Module in Meizu 17 Pro | Sample 13
Overview / Introduction
Company Profile
Market Analysis
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Summary of the Cost Analysiso Yields Explanation &
Hypotheseso NIR Camera Module Costo Flood Illuminator Module Costo VCSEL Driver IC o ToF Module
Technical & Cost Comparison
Feedbacks
Related Reports
About System Plus
Complete Module Cost
http://www.systemplus.fr/
©2020 by System Plus Consulting | SP20571 - 3D Time-o-Flight Module in Meizu 17 Pro | Sample 14
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Technical & Cost Comparisono Meizu 17 Pro vs. Galaxy
Note10+ vs iPad Pro
Feedbacks
Related Reports
About System Plus
Meizu vs. Samsung vs. Apple – NIR ToF Image Sensor
http://www.systemplus.fr/
©2020 by System Plus Consulting | SP20571 - 3D Time-o-Flight Module in Meizu 17 Pro | Sample 15
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Technical & Cost Comparisono Meizu 17 Pro vs. Galaxy
Note10+ vs iPad Pro
Feedbacks
Related Reports
About System Plus
Meizu vs. Samsung vs. Apple – NIR VCSEL
Pictures at scale
http://www.systemplus.fr/
©2020 by System Plus Consulting | SP20571 - 3D Time-o-Flight Module in Meizu 17 Pro | Sample 16
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Feedbacks
Related Reports
About System Plus
Related Reports
MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT
IMAGING• 3D Imaging & Sensing 2020• Status of CMOS Image Sensor Industry 2020• CMOS Camera Module Industry for Consumer & Automotive
2020• CMOS Image Sensor Quarterly Market Monitor
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
IMAGING• Samsung Galaxy Note 10+ 3D Time of Flight Depth
Sensing Camera Module• iPad Pro LiDAR Module• Sony’s 3D Time-of-Flight Sensing Solution in the Huawei
P30 pro• Sony’s 3D Time-of-Flight Depth Sensing Camera Module• Huawei’s 3D Depth Sensing System, 3D Camera, Flood
Illuminator and DOT projector in the Mate 20 Pro• STMicroelectronics’ Near Infrared Camera Sensor in the
Apple iPhone X• Apple iPhone X – Infrared Dot Projector
http://www.systemplus.fr/https://www.i-micronews.com/products/status-of-cmos-image-sensor-industry-2020/https://www.systemplus.fr/reverse-costing-reports/sonys-3d-time-of-flight-sensing-solution-in-the-huawei-p30-pro/https://www.i-micronews.com/products/3d-imaging-sensing-2020/https://www.i-micronews.com/products/status-of-cmos-image-sensor-industry-2020/https://www.i-micronews.com/products/cmos-camera-module-industry-for-consumer-automotive-2020/?utm_source=Yole&utm_medium=relatedreports_Report&utm_campaign=r_Status_of_CIS_2020_Nov2020https://www.i-micronews.com/products/cmos-image-sensor-service-camera-module-research/https://www.systemplus.fr/reverse-costing-reports/samsung-galaxy-note-10-3d-time-of-flight-depth-sensing-camera-module/https://www.systemplus.fr/reverse-costing-reports/apple-ipad-pro-11s-lidar-module/https://www.systemplus.fr/reverse-costing-reports/sonys-3d-time-of-flight-sensing-solution-in-the-huawei-p30-pro/https://www.systemplus.fr/reverse-costing-reports/sonys-3d-time-of-flight-depth-sensing-camera-module/https://www.systemplus.fr/reverse-costing-reports/the-huawei-mate-20-pros-3d-depth-sensing-system/https://www.systemplus.fr/reverse-costing-reports/stmicroelectronics-near-infrared-camera-sensor-in-the-apple-iphone-x/https://www.systemplus.fr/reverse-costing-reports/apple-iphone-x-infrared-dot-projector/https://www.systemplus.fr/reverse-costing-reports/samsung-galaxy-note-10-3d-time-of-flight-depth-sensing-camera-module/https://www.i-micronews.com/products/3d-imaging-sensing-2020/
©2020 by System Plus Consulting | SP20571 - 3D Time-o-Flight Module in Meizu 17 Pro | Sample 17
COMPANYS E RVI CES
©2020 by System Plus Consulting | SP20571 - 3D Time-o-Flight Module in Meizu 17 Pro | Sample 18
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Feedbacks
Related Reports
About System Pluso Company Serviceso Contacts
Business Model - Fields of Expertise
Custom Analyses(>130 analyses per year)
Reports(>60 reports per year)
Costing Tools
Trainings
http://www.systemplus.fr/
©2020 by System Plus Consulting | SP20571 - 3D Time-o-Flight Module in Meizu 17 Pro | Sample 19
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Feedbacks
Related Reports
About System Pluso Company Serviceso Contacts
Contact
Headquarters22 bd Benoni Goullin44200 NantesFRANCE+33 2 40 18 09 16sales@systemplus.fr
Europe Sales OfficeLizzie LEVENEZFrankfurt am MainGERMANY+49 151 23 54 41 82llevenez@systemplus.fr
www.systemplus.fr
NANTESHeadquarters
FRANKFURT/MAINEurope Sales Office
LYONYOLE HQ
TOKYOYOLE KK
GREATER CHINAYOLE
KOREAYOLE
CORNELIUSYOLE Inc.
Asia Sales OfficeTakashi ONOZAWATokyoJAPANT : +81 804 371 4887onozawa@yole.fr
Mavis WANGTAIWANT :+886 979 336 809CN: +8613661566824wang@yole.fr
America Sales OfficeSteve LAFERRIEREWESTERN UST : +1 310 600 8267laferriere@yole.fr
Chris YOUMANEASTERN US & CANADAT : +1 919 607 9839 chris.youman@yole.fr
http://www.systemplus.fr/mailto:wang@yole.frmailto:laferriere@yole.frmailto:chris.youman@yole.fr