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8/3/2019 4._12001230_0_3D IC Si Interposer_Semicon Taiwan 2011
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3D-IC Si Interposer
LED
SEMIhunterchang@csun.com.tw
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1966196619661966
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PCBPCBPCBPCBFPDFPDFPDFPDLEDLEDLEDLED
20202020
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1966196619661966 9999 28282828 15.2315.2315.2315.23
930930930930 \\\\ \\\\ \\\\ \\\\ \\\\ PCBPCBPCBPCB
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PVPVPVPVSEMI & LEDSEMI & LEDSEMI & LEDSEMI & LED PRINTING & SHOEPRINTING & SHOEPRINTING & SHOEPRINTING & SHOE
( )
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(VOC) &
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c sunc sunc sunc sun
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Outline:
LED Introduction
LED Applications
Challenges for SSL: Brightness and Thermal Management
Wafer Level Package Solutions for LED Si Submount
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1. LED Introduction
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1. LED Introduction
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CIE1931
RGB Color modelSource: Wikipedia
1. LED Introduction
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2. LED Applications-
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2. LED Applications- 3C
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2. LED Applications
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2. LED Applications-
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3. Challenges for SSL LED Manufacturing , Overall Performance
Source: Yole Development
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Source: Yole Development
2. LED Applications LED Market Forecast , by LED type (packaged LEDs)
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2. LED Applications Sales revenue of packaged LED to 2020, split by type
Source: Yole Development
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Source: DOE Manufacturing Workshop consensus
2. LED Applications Projected LED Luminaire Cost Track
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Source: Proceedings of the IEEE, August 2009
3. Challenges for SSL LED Manufacturing , Overall Performance
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3. Challenges for SSL Overall LED Efficiency
Source: Yole Development
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3. Challenges for SSL Manufacturing challenges
THERMAL
Package thermalresistance
must be
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THERMAL
Package thermalresistance
must be
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LED
1., ~90%;,~10-20%
2., light extractiona. Substrate material
b. Geometrically deformed
c. Light scattering and Diffraction
( )
:
:
:
:
:
,
,efficiencyPlug-Wall;,efficiencyRadiant
opt
rad
inj
v
ext
voptradinj
vextwp
wpR
=
=
=
.
.
,(2006)
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35.45GaN SiO2
54.55SiO2 Sapphire
32.68ITO Air
47.73GaN ITO
23.58GaN Air
45.4GaN Sapphire
34.18Sapphire Air
The critical angle between various kinds of materials
1.451.852.51.781Refractive
Index (n)
SiO2ITOGaNSapphir
eAirMaterials
LED - Refraction
Phys. Stat. Sol.(b) Vol. 277, No.1, 1-43, (2001)
,
(2008)
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Depth>for light scattering and diffraction
GaNofR.I.isn;n4
1
PSSscattering and diffraction
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9.3 E8 cm-2 4.5 E8 cm-2
,(2007)
PSSGaNdislocation top view
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PSS
Wafer start PR coating Exposure Dry etchingDeveloping
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c sunMask Aligner for PSS PR Profile
Contact mode
PR profile
Proximity mode
PR profile
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A facet will develop,=m
Brian N. Chapman, Glow Discharge Processessputtering and plasma etching, John Wiley & Sons, Inc.,1980,
PSS profile angle
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Contact mode
Etched profile
c sunICP for PSS dry etching result
Proximity mode
Etched profile
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Electrical
Input power
5WCurrent 1.5A
Optical
100-150 lm/W
Encapsulation
No shrink
CostPhosphor
Epoxy
Heat Sink
EPI
Wafer processes
Substrate
THERMAL
Package thermalresistance
must be
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4. Solutions Package
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4. Solutions Flip chip
Air PCB MCPCB Epoxy Al2O3Solder
(80%Au-20%Sn)
Si AlN Al 6061 Cu
Thermalconductivity
(W/m-K)
0.024 0.36 2 2.2 28 57 130 160 160 385
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Q is the heat flowing from hot to cold, through the LED
Tj is the junction temperature in the device
Tc is the temperature at its case
Th is the temperature where the heat sink is attached
Tamb is the ambient air temperature
Rjc is the device's thermal resistance from junction to caseRch is the thermal resistance from the case to the heat sinkR
ha is the thermal resistance of the heat sink
)(
)(
44
=
=
=
TTAQ
TThAQ
dX
dTkAQ
sradiation
sconvection
conduction
heatfor;Q
)T(TR
yx
xy
=
efor;I
VR =
hachjcja RRRR ++=
Summation of Series Thermal Resistances:
4. Solutions Theory Single chip in one package
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jhnjh2jh1jh R
1....
R
1
R
1
R
1+++=
Summation of Parallel Thermal Resistances:
4. Solutions Theory Multi chips in one package
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Heat flow
TIM poor xy thermalconductivity (0.3W/m-K)
TIM good xy thermalconductivity (3 W/m-K)
4. Solutions Theory
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4. Solutions Wafer Level Packaging
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4. Solutions Wafer Level Packaging
Source: Yole Development
S l i W f L l P k i
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4. Solutions Wafer Level Packaging
4 S l ti C SUN W f L l P k i S l ti f LED Si S b t
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4. Solutions C SUN Wafer Level Packaging Solution for LED Si Submount
WVL-M12WVL-A8/A12
4 S l ti C SUN W f L l P k i S l ti f LED Si S b t
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DryFilm
Wafer
Roller Laminator Vacuum laminator
Dry
Film
Roller
Wafer
Air bag
4. Solutions C SUN Wafer Level Packaging Solution for LED Si Submount
4 Solutions C SUN Wafer Level Packaging Solution for LED Si Submount
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66.538um
21.257um
Dry Film : DuPont PerMX 3050
Equipment:CSUN WVL-M12
4. Solutions C SUN Wafer Level Packaging Solution for LED Si Submount
4 Solutions C SUN Wafer Level Packaging Solution for LED Si Submount
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Lens
Phosphor
LED Die
Interposer
Spacer
PerMX7000 Series Epoxy PermanentDFR
Back Side Heat Sink ModuleWBR2000 Series Thick DFR for CuPlatingEKC162/265 Stripper / Cleaner
Reflecting MaterialWBR2000 Series Electroless Ag Plating*Reflective PasteWB3000 Series Lift-off Process
RDLWLP1000 Series Ultra-high ResolutionCu/Ni/Au PlatingEKC162/265 Stripper / Cleaner
TSVWLP1000 Series DRIE Process
EKC162/265 Stripper / CleanerPassivation
WPR1000 Series
UBM / Solder Bump
WLP1000 Series Ultra-high Resolution
EU/LF/Pillar Plating
4. Solutions C SUN Wafer Level Packaging Solution for LED Si Submount
Example of c sunDF Laminator,ADRIE TSV process and Du Pont DFRfor LED Si Submount
4 Solutions C SUN Wafer Level Packaging Solution for LED Si Submount:
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Etching-through DRIE Si Via
fabricated by c sunADRIE moduleand Du Pont WLP1020, with highetching selectivity (DFR/Si=1/115).
4. Solutions C SUN Wafer Level Packaging Solution for LED Si Submount:a. TSV formation
4 Solutions C SUN Wafer Level Packaging Solution for LED Si Submount:
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Selective plated Cu/Ni/Ag layer withTSV structure through applying DuPont WLP1050 DFR and EKC162stripping chemical.
Seed Layer Sputtering
Double Sides DFR
Cu/Ni/Au or Ag Electroplating
Stripping and Seed Layer Etching
InterposerInterposer
InterposerInterposerInterposer
InterposerInterposerInterposer
InterposerInterposerInterposer
4. Solutions C SUN Wafer Level Packaging Solution for LED Si Submount:b. Selective Plating
4 Solutions C SUN Wafer Level Packaging Solution for LED Si Submount:
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WB3075 Lift-Off process
Double Sides DFR
Ti/Al Sputtering
Stripping and Lift-off
Residual Metal Film
Lift-off Part
InterposerInterposerInterposer
DFR
InterposerInterposerInterposer
DFR
InterposerInterposerInterposer
4. Solutions C SUN Wafer Level Packaging Solution for LED Si Submount:c. Lift-Off Reflection Layer
4. Solutions C SUN Wafer Level Packaging Solution for LED Si Submount:
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Ultra-thick DFR Lamination
Photo Process for Pattern Define
InterposerInterposerInterposer
InterposerInterposerInterposer
4. Solutions C SUN Wafer Level Packaging Solution for LED Si Submount:d. Spacer
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Cost Effective Solutions from C SUN:
1. PSS Turn key for light extraction:a. Mask Aligner
b. ICP Etcher
2. WLP with Si Interposer for thermal management:a. Si DRIE Etcherb. DF roller and vacuum type laminator
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Thank You