5G mMIMO Modules with Enhanced Power and Efficiency

transcript

Company Public – NXP, the NXP logo, and NXP secure connections for a smarter world are trademarks of NXP

Marketing Manager EMEA - Radio Power BL

Pascal Massot

November 2019 | EUF-IND-T3931

COMPANY PUBLIC 1

Focus of this presentation

COMPANY PUBLIC 2COMPANY PUBLIC 2

Agenda

• Introduction to cellular network market

• 5G network RF technology dynamics

• 5G RF Amplifier portfolio

• RF Circuit collection

COMPANY PUBLIC 3

Introduction to cellular network

market

COMPANY PUBLIC 4

Wireless Connectivity Landscape

Ultra-short Range

Short Range

Wide Range

CAT-M1 NB-IoT5G

COMPANY PUBLIC 5

History of Communication Standards

1G-AMPS

1980 – 1990

Voice Only

64 kb/s

2G-GSM

1990 – 2000

Digitized Voice

2 Mb/s

3G-WCDMA

2000 – 2010

Mobile Internet

1 Gb/s

4G-LTE

2010 – 2020

Mobile Broadband

5 Gb/s

2020 –

Man-to-Man Communication Man-to-Internet Communication Everything Connected

COMPANY PUBLIC 7

Explosive Growth in Connected Devices

2015 20182016

2017 2019 2020 2021

Customers Facing…

• Skyrocketing data rates

• Multiple wireless standards

• Increasing network complexity

• Stringent power requirements

• Worldwide rise in IP traffic

Mobile Broadband for Evolving

Cellular Market

• Reduced energy consumption

• Shrinking equipment footprint

• Reduced time-to-market

Connected Devices vs.

Global Mobile Traffic

(Monthly Exabytes)

Source: Ericsson, June 2016

Everything Connected Requires a New Communication

Protocol: 5G New Radio (5G-NR)

Ultra-high reliability:

99.9999999%

Ultra-low latency:

Less than 1millisecondUltra-high density

1M nodes / km2

Ultra low complexity:

10s of kbps 5G

Mobile Broadband

Smart Transport

Realtime Virtual Reality

Internet of Things

Massive

Machine

Communication

Data rate: 10s Gbps

Capacity: 10 Tbps / km2

COMPANY PUBLIC 9

5G: Cell Phones and Much MoreL

Critical

Latency &

reliability

Connected Cars

Beyond LOS

Ultra low latency

Conventional freq.

Low Power & BW

Mobile

Broad Band

(MBB):

Capacity &

Coverage

LTE Advanced

High BW / CA

Higher diversity

Conventional freq.

Low & high power

Ultra High

Capacity

mmWave

GBps Data

Last mile connectivity

Ultra high bandwidth

New frequencies

Massive Machine

Communication

(MTC):

Low Power &

Small signaling

overhead

Internet of Things

Low power & BW

NB-LTE / WiFi / 2G

Conventional freq.

2017-2019 2020-2025

COMPANY PUBLIC 10

5G Network RF

Technology Dynamics

Evolution of the Cellular Base Station

COMPANY PUBLIC 12

Massive MIMO

• Active Antenna Solutions enable a leap in capacity by utilizing between 16 and 64 transmit and receive paths in a single active system.

• TDD-mMIMO systems are leading the way at 2.6 GHz and 3.5 GHz bands but will expand to FDD and other frequencies as well.

• Although system costs are currently higher than traditional RRH, significant throughput improvements justify the investment.

COMPANY PUBLIC 13

mmWave Solutions

• To improve capacity even further, the industry is looking to mmWave frequencies ranging from 24 GHz to 39 GHz, enabling over 1 GHz of bandwidth.

• Beamforming will enable spatial multiplexing for increased spectrum reuse.

• Solutions include Fixed Wireless Access as well as Radio Access Networks.

COMPANY PUBLIC 14

Throughput Evolution

Massive MIMO

• Used in Macro BTS

• Existing spectrum + new bands below 6 GHz

• More data with LTE and existing handsets

• Possible now

• Least expensive option to increase throughput,

even at increased equipment cost

Microwave & Millimeterwave Frequencies

• > 6 GHz on WRC-2019 agenda

• GHz bandwidth has potential to carry a lot of data

• Propagation and building penetration issues force

“small cell” deployments – many of them needed

• Significant increase of throughput – will see use

starting 2020

Today:

Tomorrow:

mMIMO + LTE

After 2020:

mMIMO + 5G

COMPANY PUBLIC 15

Solutions for mmWave

beamforming

Required RF building blocks for a mmWave TDD beamforming system:

− Splitter / combiner network

− TX front end (PA)

− RX front end (LNA)

− TX / RX switch

− Phase shifter

Example of an integrated 4 channel solution:

Wireless Infrastructure MIMO EvolutionAntenna Diversity Increasing in All Market Sub-segments

2 x 80W 4 x 40W 8 x 15W 32/64 x 2.5W 256 x 200mW

2T120 Mb/s

4T230 Mb/s

8T440 Mb/s

mMIMO2-5 Gb/s

MMW>10 Gb/s

4 x 40W 32x 5W 32/64 x 2.5W 256 x 200mW

4T230 Mb/s

16T1 Gb/s

32T1-2 Gb/s

64T2-5 Gb/s

MMW>10 Gb/s

16x 10W

4G LTE

Wide Area Coverage

LDMOS & GaN

LTE Adv. / 5G

Suburban Coverage

LDMOS, GaN & SiGe

LTE Adv. / 5G

Urban Coverage

LDMOS, GaN & SiGe

LTE Adv. / 5G

Dense Urban Areas

LDMOS, GaN & SiGe

5G – Highest Capacity

Dense Urban Areas

SiGe & GaN

COMPANY PUBLIC 17

5G RF Module Portfolio

NXP’s RF Technology Toolbox

40-60W

10-20W

LNA SW

LDMOS 28V

and LDMOS

LDMOS 28 V IC

SiGe and RFCMOS

GaAs (HBT, pHEMT)

< 1000MHz 2,0 GHz 2.6 GHz 3.5 GHz 4-10 GHz 10-60 GHz

Existing Spectrum

and LDMOS

New Spectrum

From sub-1GHz to mm-wave;

from mW’s to 10’s of W

Leveraging the Benefits of GaN and LDMOS

GaN Benefits

• Differentiating performance exceeding

LDMOS above 2.5 GHz

• Enables 5G at higher frequencies

• Broadband design

• High efficiency at high frequencies

• Comparable thermal package as LDMOS

• Compact PA design (more power in smaller

package, smaller matching circuitry)

• Wideband CW and Pulse PA applications:

• 200-2600 MHz at 100 W

• S-band 2.7-3.5 GHz at 700 W

LDMOS Benefits

• Competitive performance to 2.7 GHz

• Cost effective PA solutions

• Mature process technology

• High ruggedness up to 65:1 VSWR

• Consistent thermal behavior

• Broadband VHF/UHF below 1 GHz

• Highest power up to 1.5 GHz

• Narrow-band PA applications:

• Cellular bands up to 2.7 GHz

• Avionics/L-band 1.2-1.4 GHz up to 1.5 kW

• S-band 2.7-3.1 GHz at 300 W

NXP Family of Fully-Integrated High Efficiency Power

Amplifiers

• Power levels 2.5 –

5 Watt devices

• Roadmap covering bands

2.3 GHz to 5 GHz

• Easy implementation –

50 Ω input & output

• Pin-compatibility between

all frequency bands and

power levels

• LDMOS – low cost solution

Rx Front-End

Module4x4 mm2 package

PA Module6x10 mm2 package

Pre-Driver Amplifier3x4 mm2 package

Low Cost Small Size21x35 mm2 solution

Block diagram

ENABLE

RX OUT

CONTROL

BYPASS

AFRX5G132

AFLP5G35647

BIAS CONTROLLER

AFSC5G35D37

T/R SWITCH

TO ANTENNA

FEEDBACK OUT

BYPASS

TX OUT /

CONTROL

Final stage:

AFSC5G35D37

Driver:

AFLP5G25641

RX Module:

AFRX5G372

Airfast 5G MCM Benefits

Device 10x6 mm2

Solution 15x11 mm2

Time To Market

The ease of use of a 50-ohm, high gain dual-stage PA with integrated Doherty shortens design cycle time

• Eliminates multiple prototype passes

• No compromise on performance

• 50-ohm, pin-compatibility from a MCM PA to another enables reuse for other frequencies / power levels

Manufacturing

A surface mount device, compatible with standard pick and place + reflow, facilitates manufacturing

• Reduces assembly time increasing ROI for manufacturing equipment and reduced need for capital investment

• Eliminates testing redundancies while improving yields

Smaller, lighter active antenna systems

The high integration enables lighter 64T active antenna systems.

• Small size enabled by a 10 x 6 mm package

• 50-ohm in/out with integrated Doherty reduces external component out

Devices

Dual-stage PA• AFSC5G23D37

• AFSC5G26D37

• AFSC5G35D37

• AFSC5G37D37

• AFSC5G35D35 10x6 mm2

LNA + switch• AFRX5G272

• AFRX5G3726.2x6.2 mm2

Pre-driver• AFLP5G25641

• AFLP5G35645

4x3 mm2

Airfast 5G MCM Enablement – Reference Circuits & Reference Designs

Reference DesignReference Circuits

Documentation

(data pack, dxf

drawings) available

from nxp.com

Orderable P/N:

“device#”-EVB (ex: AFSC5G37D37-EVB)

$250 MSRP

Reference Designs

Reference Design:

AFDEV5G-26D37

Reference Design:

AFDEV5G-35D37

More details on

AFDEV5G-26D37

More details on

AFDEV5G-35D37

Orderable Q4 2019

Available now

Orderable Sep 2019

Pre-driver, PA and

LNA together

Part Number Decoder

AFSC5G35D37T2

5G Family

2000 pcs reel

size (MPQ)

NXP’s RF Signature for Cellular

Infrastructure: Airfast

System-in-compact

package

Frequency

dBm Avg

Doherty Series

PA Modules:

AFLP5G35645T5Linear Pre-driver Frequency

5000 pcs reel

size (MPQ)

Pre-Drivers:

AFRX5G372T4Receiver Frequency

bandGeneration

2500 pcs reel

size (MPQ)Rx Modules:

Back to

portfolio

selection

Back to 5G

portfolio

Introduction

Introducing Airfast 5G MCM Solutions – 28 V LDMOSA

2300 MHz 2400 MHz 2500 MHz 2600 MHz 2700 MHz ~ 3400 MHz 3500 MHz 3600 MHz 3700 MHz 3800 MHz

AFSC5G23D37 AFSC5G26D37

AFSC5G35D35

AFSC5G35D37 AFSC5G37D37

27 dB gain, 38% PAE

2300-2400 MHz

27 dB gain, 38% PAE

2545-2655 MHz

27 dB gain, 36% PAE

3400-3600 MHz

29 dB gain, 38% PAE

3600-3800 MHz

29 dB gain, 38% PAE

3400-3600 MHz

PA MCMs:

Rx Front-end Modules (LNA + switch):

Pre-Driver Amplifiers:

Bm AFLP5G25641

2300-2700 MHz

AFLP5G35645

3400-3800 MHz

AFRX5G272

2300-2700 MHz

AFRX5G372

3300-4200 MHz

Test conditions: PAE @ 8-8.5 dB OBO

✓ Simple DPD

✓ ACPR < -50 dBc w/ 2x20MHz LTE 7.5dB PAR

mMIMO Power budget

BTS Total Pout (W)

BTS Total Pout (dBm)

MIMO (#)

Antenna Pout (W) Antenna Pout (dBm)

PA avg Pout (W)

PA avg Pout (dBm)

Losses (dB)

320 55 16 20.0 43 32 45 2

240 54 16 15.0 42 24 44 2

200 53 16 12.5 41 20 43 2

320 55 32 10.0 40 16 42 2

240 54 32 7.5 39 12 41 2

200 53 32 6.3 38 10 40 2

160 52 16 10.0 40 16 42 2

100 50 16 6.3 38 10 40 2

320 55 64 5.0 37 8 39 2

240 54 64 3.8 36 6 38 2

200 53 64 3.1 35 5 37 2

160 52 32 5.0 37 8 39 2

100 50 32 3.1 35 5 37 2

3 35 4 0.8 29 1.27 31 2

AFSC5G37D37

Typical line-up:

• 3600-3800 MHz

• 37 dBm / 5 W avg (45.6 dBm / 36 W peak)

• 28 V LDMOS• 50-ohm in/out, dual-stage MCM with Doherty combiner

• 38% efficiency @ 8 dB OBO

• 29 dB gain

• 10x6 mm2 over-molded plastic package

Comments:

• Designed for 240 W, 64T mMIMO active antennas

for the B48

• In production

• Reference circuit: AFSC5G37D37-EVB available

Reference Circuit:

Pout = 5 W avg., VDD = 29 V, 1x 20 MHz LTE, Input PAR 8 dB

Carrier Center

Frequency

3600 MHz 29.5 -32.4 39%

3700 MHz 29.7 -33.6 38%

3800 MHz 29.9 -34.4 38%

Final stage:

AFSC5G37D37

Driver:

AFLP5G35645

RX Module:

AFRX5G372

AFSC5G35D37

Typical line-up:

• 3400-3600 MHz

• 29 dB gain

Comments:

for the B42

• In production

Reference Circuit:

Final stage:

AFSC5G35D37

Driver:

AFLP5G35645

RX Module:

AFRX5G372

Carrier Center

Frequency

3400 MHz 29.2 -31.4 39%

3500 MHz 29.3 -32.8 39%

3600 MHz 29.4 -31.0 39%

AFSC5G35D35

Typical line-up:

• 3400-3600 MHz

• 35 dBm / 3 W avg (43 dBm / 20 W peak)

• 25 dB gain

Comments:

for the B42

• In production

Reference Circuit:

Final stage:

AFSC5G35D35

Driver:

AFLP5G35645

RX Module:

AFRX5G372

Carrier Center

Frequency

3400 MHz 25.3 -27.6 37%

3500 MHz 24.9 -30.8 37%

3600 MHz 24.8 -32.9 35%

AFSC5G26D37

Typical line-up:

• 2496-2690 MHz

• 27 dB gain

Comments:

for the B41

• In production

Reference Circuit:

Final stage:

AFSC5G26D37

Driver:

AFLP5G25641

RX Module:

AFRX5G272

Carrier Center

Frequency

2575 MHz 27.4 –27.8 40%

2600 MHz 27.2 –27.9 40%

2625 MHz 27.1 –27.7 40%

AFSC5G23D37

Typical line-up:

• 2300-2400 MHz

• 27 dB gain

Comments:

for the B40

• In production

Reference Circuit:

Final stage:

AFSC5G23D37

Driver:

AFLP5G25641

RX Module:

AFRX5G272

Carrier Center

Frequency

2575 MHz 27.4 –27.8 40%

2600 MHz 27.2 –27.9 40%

2625 MHz 27.1 –27.7 40%

AFLP5G35645

Functional Block Diagram: Typical line-up:

• 3400-3800 MHz pre-driver

• 29 dBm avg (25 dBm @ 3.3 V)

• 5 V GaAs• 50-ohm in/out, 3-stage MCM with 1.8 V logic control pin for bias

enable/disable TDD operation.

• Very low power consumption: 158 mW @ 5 V

(114 mW @ 3.3 V)

• 4x3 mm2 plastic package

Comments:

• Pre-driver for AFSC5G37D37, 35D37, 35D35

• In development, qualification planned end Q4 2019

CONTROLLER

GND GND GND GNDVCC2

GND EN VCC1 GNDLLS

Final stage:

AFSC5G35D37

Driver:

AFLP5G35645

RX Module:

AFRX5G372

AFLP5G25641

• 2300-2700 MHz pre-driver

• 29 dBm avg (25 dBm @ 3.3 V)

• 5 V GaAs• 50-ohm in/out, 3-stage MCM with 1.8 V logic control pin for bias

enable/disable TDD operation.

• Very low power consumption: 158 mW @ 5 V

(114 mW @ 3.3 V)

• 4x3 mm2 plastic package

Comments:

• Pre-driver for AFSC5G23D37, 26D37

• In development, qualification planned end Q4 2019

CONTROLLER

GND GND GND GNDVCC2

GND EN VCC1 GNDLLS

Final stage:

AFSC5G26D37

Driver:

AFLP5G25641

RX Module:

AFRX5G272

AFRX5G372

Comments:

• Rx for AFSC5G37D37, 35D37, 35D35

• In development, qualification planned in Q1 2020

• Support circuitry to work from a 5 V supply and a 1.8

logic-level T/R control

• Support Tx and Rx modes, which are controlled by

T/R logic signaling

• 3300-5000 MHz

• 5 V GaAs LNA + switch

• Noise Figure: 1.3 dB • Gain 33dB

• 50-ohm in/out

• 6.2x6.2 mm2 plastic package

Controller

LNA LNARx Tx

Tx / RxDigital control (1.8 V JEDEC)

6.2 x 6.2 LGA

P in switch

Final stage:

AFSC5G35D37

Driver:

AFLP5G35645

RX Module:

AFRX5G372

AFRX5G272

• 2300-2700 MHz LNA + switch

• Noise Figure: 1.3 dB

• 5 V GaAs• Gain 33dB

• 50-ohm in/out

• 6.2x6.2 mm2 plastic package

Comments:

• Rx for AFSC5G23D37, 26D37

• In development, qualification planned in Q1 2020

• Support circuitry to work from a 5 V supply and a 1.8

logic-level T/R control

• Support Tx and Rx modes, which are controlled by

T/R logic signaling

Controller

LNA LNARx Tx

Tx / RxDigital control (1.8 V JEDEC)

6.2 x 6.2 LGA

P in switch

Final stage:

AFSC5G26D37

Driver:

AFLP5G25641

RX Module:

AFRX5G272

AFDEV5G-35D37 Reference Design

• 3400-3600 MHz

• 30 V LDMOS

• 5 W AVG, 37 dBm• Integrated RF design

• 50 ohm input/output

• In development, orderable Q1 2020

Design Size:

20.95 mm 38.35 mm

57.15 mm

34.52 mm

Total height including

cover 9.7 mm

ENABLE

RX OUT

CONTROL

BYPASS

AFRX5G372

AFLP5G35647

BIAS CONTROLLER

AFSC5G35D37

T/R SWITCH

TO ANTENNA

FEEDBACK OUT

BYPASS

TX OUT /

CONTROL

Final stage:

AFSC5G35D37

Driver:

AFLP5G35645

RX Module:

AFRX5G372

AFDEV5G-26D37 Reference Design

• 2496-2690 MHz

• 30 V LDMOS

• 5 W AVG, 37 dBm• Integrated RF design

• 50 ohm input/output

• In development, orderable Q1 2020

Design Size:

20.95 mm 38.35 mm

57.15 mm

34.52 mm

Total height including

cover 9.7 mm

ENABLE

RX OUT

CONTROL

BYPASS

AFRX5G272

AFLP5G25641

BIAS CONTROLLER

AFSC5G26D37

T/R SWITCH

TO ANTENNA

FEEDBACK OUT

BYPASS

TX OUT /

CONTROL

Final stage:

AFSC5G26D37

Driver:

AFLP5G25641

RX Module:

AFRX5G272

COMPANY PUBLIC 38

RF Circuit Collection

COMPANY PUBLIC 39

Full Set of Design

Support Tools

On-Demand

Accessibility

Proven RF

Designs

COMPANY PUBLIC 40

Announced in October

What is it?

• The RF Circuit Collection is a unique tool to quickly search for the right board, order a fully assembled board, and obtain reference circuit design files

• It resides on NXP.com and available to the general public with no special log-in required

• It provides access to over 400 reference circuits

− 60 orderable board part#s with distributor inventory

− 80 downloadable design files

− Quick access to request hundreds of other assembled specialty boards

COMPANY PUBLIC 42

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Remember:

All boards with the

button have orderable NXP

part numbers. Examples:• MRF101AN-27MHZ

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All others can be special

ordered directly from NXP

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5G mMIMO Modules with Enhanced Power and Efficiency

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