B T4 17-15 Lattice Mobile Influenced Markets …...© 2017 MIPI Alliance, Inc. Industrial 4 Lattice...

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Tom Watzka Satwant SinghLattice Semiconductor Lattice Semiconductor

Mobile Influenced Markets –Evolution of Camera and Display Uses

©2017MIPIAlliance,Inc.

• ThePCindustrycreateddemandinadjacentmarketssuchastestequipment,POSterminals,andindustrialcontrols

• DesignersleveragedtheiraccesstostandardizedAPIsandhardware

• Inasimilarway,themobileindustryisexperiencingdemandforhighquality,lowcostcomponentsinmobileinfluencedmarkets

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LatticeMIPID-PHY℠Applications

©2017MIPIAlliance,Inc.

TraditionalDisplayApplications

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RearDisplay

FrontDisplay

SplitAP

AP

• Traditionaldisplayapplicationswillincludeone(maybetwo)staticdisplays

©2017MIPIAlliance,Inc.

Industrial

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Appliances

Automotive

SOC Bridge

AP Bridge LVDSDSI

LVDS

BRIDGING

Manyconsumer,automotive,andindustrialapplicationsuseolderLVDSinterfaces

©2017MIPIAlliance,Inc.

AR/VR(Displays)

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LatticeSemiconductor

SplitAP

LeftEyeRightEye

HDMIBridge

Input

Monitor

Minimumframerateof75Hzisneededtoavoidmotionsickness.

Mergingisthefavoredmethodtominimizeeye-to-eyelatency.

©2017MIPIAlliance,Inc.

MuxvsMerge

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MergeLine1 Line2Camera1

Output

Line1

Line1 Line2Camera1

Line2

Input Output=2XInputBandwidth,0Latency

MuxFrame1Camera1

Output Frame1

Frame1Camera2

Frame2

Frame2

Frame3

Frame3

Frame4

Frame4

Frame2 Frame3 Frame4

Input Output=1XInputBandwidth,1FrameLatency

Frame1 Frame2 Frame3

• Videodatacanbe“multiplexed”throughasingleMIPID-PHYportbymux-ing framebyframe,ormergingtosuperframes.

©2017MIPIAlliance,Inc.

TraditionalCameraApplications

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RearCamera

FrontCamera

Mux AP

• Traditionalcameraapplicationsstaticallyswitchfromonecameratotheother

©2017MIPIAlliance,Inc. 8

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RequiresEnvironmentAwareness• IMU– InertialMeasurementUnitPerformingSensorFusionforAccelerometer,

Gyrometer &Magnetometer• Cameras

– DistanceMeasurement– EnvironmentalUnderstanding

AR/VR(Cameras)

©2017MIPIAlliance,Inc.

AR/VRTracking

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Outside-InSystem

• Twoapproachestopositionaltracking:– Outside-Inrequiresexternalhardware– Inside-outisselfcontained

Inside-OutSystem(suchasMicrosoftHololens)

©2017MIPIAlliance,Inc.

AR/VRPermutationsforInside-Out

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2XBandwidth,0Latency

~3XBandwidth,0Latency

:

Input

~5XBandwidth,0Latency

TOF TOF

TOFTOF

Output• Inside-out

implementationsaregrowinginthenumberofcamerasandsensors

©2017MIPIAlliance,Inc.

Drones

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• RequiresamethingsasAR/VR• Plusmorecameras

360Cameras

Automotive

• Justmorecameras

Merge Transport GPU

• RequiresamethingsasAR/VR• Plustransport

Merge AP

Merge AP

©2017MIPIAlliance,Inc. 12

LatticeSemiconductor

EverythingElseSOC Bridge

AP Bridge LVDSDSI

LVDS

LVDS

DSI

AP Bridge DualLVDS

DSI LVDSLVDS

SOC BridgeCMOSRGB/24

DSI

APBridge CSI-2CMOSRGB/24

SOCBridgeCSI-2

CMOSRGB/24

APRe-Time CSI-2CSI-2

©2017MIPIAlliance,Inc.

• FPGAshavegeneralpurposeIOsinadditiontospecializedIOssuchasMIPID-PHY

• FPGAsprovideanarrayofflexibleprogrammablelogiccellsthatcansupporthighspeeddataflowincludingsplittingandmergingfunctions

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LatticeSemiconductor

CrossLink

Prog

rammab

leI/O

MIPID

-PHY

ProgrammableFPGAFabric

WhyFPGAs?Flexibility

©2017MIPIAlliance,Inc.

WhyFPGAs?TimeToMarket

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ASICs=18monthdev cycle

Consumer=6– 12

monthdevcycle

Design RTL

Simulate

Pass

Synthesize

Debug

Pass

Features

Time

DaystoWeeks

DevCycle

• ProductdevelopmentcycleismuchfasterthanASICcycles• FPGAsenableinnovation

©2017MIPIAlliance,Inc.

Summary• MIPIcomponentshavebecomeubiquitous

– Cameras,Displays,APs,Accelerometers,Gyrometers,Magnetometers…

• Mobileinfluencedmarketsareleveragingthesecomponentsinallsortsofwaysandcombinations

• FPGAshavebeeninstrumentalinenablingthesenew(andunforeseen)marketsinwaysthatsimplebridgescannot,intermsoftimeandfunctionality

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