Post on 04-Jun-2018
transcript
General Information · Technical Overview
BASE FOR ALL INNOVATION
J
www.isola-group.com
11/0
9
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Base for All Innovation
Table of Contents
General 3
LaminateThicknessesandPrepregTypes 4
ProductGuide 5ProductOverview 6
SupplyForms 8
Storage/Packaging 9
PressParameters–Recommendations 10
SpecialityQualityDURAFLEX 12
SpecialityQualityNoFlowPrepreg 14
SpecialityQualityIS450 15
SpecialityQualityforIMSApplications 15
SpecialityQualitySmartCard 16
SpecialityQualityforHFApplications 17
REACH 20
TBBA 20
InnovativeTechnologies 22
Service/CustomerSupport 23
Our information and our eventual advice for the application of our products in any form (for instance oral, written or
by tests) is given carefully and by the best of our knowledge but is not binding and is provided without making any
representation or warranty, expressed or implied, and without any liability. The user is not released also in the case
of our prior testing or if the use is based on our practical application advice from it’s sole responsibility to use our
product and to insure the correct application, the condition and fitness of our product for this application as well as
the condition and fitness of the product itself.
311/09
Base for All Innovation
Morethan50yearsofexperienceinmanufacturingbasematerialarestillensuringthatIsolahasaversatile,high-qualityproductportfolioencompassingepoxylaminatesofhighlyvariablespecificationsaswellashalogenfreesystemsandmaterialforhighfrequencyapplications.
Figure1showstheepoxyresinglassfibrebasematerialsaccordingtotheirTglevel.Besidesthedicyandiamidecuredstandardmaterialweseetrend-settingmaterialforstate-of-the-artPCBinpar-ticularinthermalreliable,partlycycleresistantsystems.
Tg Dicy- Curing
Phenolic Curing
Halogen free
135°C DE104*PCL240FR4-74
–
150°C – IS400 DE156*
170°C – IS410IS415IS420
PCL370HR
IS500
Figure 1: Epoxy Resin Material *DURAVER-E-Cu-#
Arangeofhighfrequencymaterialtunedtothedifferentfrequencyrangescompletestheportfolioofepoxyresinbasematerial.Figure2givesanaccordingoverview.
Frequency Range
Isola Quality
<10GHz FR408FR408HR
<50GHz IS620i
<77GHz IS680
Figure 2: High Frequency Materials
TheofferingofspecialitylaminatesroundsIsola’sport-foliooff.DURAFLEXisacost-efficientalternativetohighflexiblematerialsincaseofnopermanentflexuralstressasitcanbefounde.g.atmanyrigid-flexPCBs.Likewiseforrigid-flexPCBsIsolaoffersanumberofso-callednoflowprepregs.Moreover,weproducebasematerialforsmartcardapplications.
Furthermore,wecanprovideourcustomerswithPoly-imidewhichishighlytemperatureresistantandwithBTasaprovedchipcarrierquality.
Quality Application
DURAFLEX Semiflexrequirements
A11FR406N
P26NIS572N
NoflowPrepregs
P96/P26 thermosettingPolyimidewithTg260°C
G200 BT/Epoxy-Blendfore.g.Chip-Carrier
Figure 3: Speciality Laminates
Isolaproducesallitsqualitiesstrictlyaccordingtointer-nationalstandard.Thus,itisamatterofcoursethatwecomplywithREACHandRoHS.
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Base for All Innovation
Standard Laminate Thickness (Multilayer)
Nominal Thickness Thickness Tolerance
IPC-4101C Cl. B IPC-4101C Cl. C
mm inch mm mm
0.050 0.002 ±0.018 ±0.013
0.100 0.004 ±0.018 ±0.013
0.125 0.005 ±0.025 ±0.018
0.150 0.006 ±0.025 ±0.018
0.200 0.008 ±0.038 ±0.025
0.250 0.010 ±0.038 ±0.025
0.300 0.012 ±0.050 ±0.038
0.360 0.014 ±0.050 ±0.038
0.540 0.021 ±0.064 ±0.050
0.710 0.028 ±0.064 ±0.050
0.900 0.035 ±0.100 ±0.075
Other thicknesses on request.
Standard Rigid
Nominal Thickness Thickness Tolerance
IPC-4101C Cl. L IPC-4101C Cl. M
mm inch mm mm
0.8 0.031 ±0.100 ±0.075
1.0 0.039 ±0.100 ±0.075
1.2 0.047 ±0.130 ±0.075
1.5 0.059 ±0.130 ±0.075
1.55 0.061 ±0.130 ±0.075
1.6 0.063 ±0.130 ±0.075
2.0 0.079 ±0.180 ±0.010
2.4 0.094 ±0.180 ±0.010
3.2 0.126 ±0.230 ±0.013
Standard Prepreg
Prepreg type: 106
1080
2116
2125
7628
Other prepreg types on request.
Calculation of constructions for Multilayer see Multical Program (MLB Design Tool) on www.isola.de
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Base for All Innovation
Product Guide
Additional material grades:
•IS415(Tg170Epoxy,improveddielectrics)
•FR408(highfrequency)
•GETEK(Tg180PPO/Epoxyblend)
•DURAFLEX•Smart Card
StandardEpoxy-Laminates
GreenLaminates
Thermal ReliableEpoxy-Laminate
Signal-Integrity
High- Performance
DE104*/PCL240/FR4-74 ● ● ● 21DE104KF* (CTI400) ● ● ● ● 21DE 117*/FR406/PCL370 ● ● ● 21
DE156* ● ● ● ● ● ● 92IS500 ● ● ● ● ● ● 94
DE104i* ● ● ● ● ● ● 21IS400 ● ● ● ● ● ● ● 97/98IS410 ● ● ● ● ● 24/26PCL370HR ● ● ● ● ● ● ● 98IS420 ● ● ● ● ● ● ● 98
FR408 ● ● ● ● ● ● ● ● ● 24IS620i ● ● ● ● ● ● ● ● ● ● 30IS680 ● ● ● ● ● ● ● ● ●
G200 ● ● ● ● ● ● ● 30P96/P26 ● ● ● ● 41
Std.
-Tg 1
30-1
40 °
C
Med
ium
-Tg 1
50 °
C
High
-Tg ≥
170
°C
Ther
mal r
esist
ant,
esp.
for l
eadf
ree t
echn
ologie
s
Cycl
e re
sist
ant -
40 °
C/+1
40 °
C, 1
000
cycl
es
αz C
TE <
70
ppm
/K
αz C
TE <
50
ppm
/K
αz C
TE <
40
ppm
/K
ε r D
k < 3
.9 @
2 G
hz
Tan δ
D f <
0.0
1@ 2
Ghz
High
spe
ed, h
igh
frequ
ency
low
dam
ping
(a S
21/d
b)
CAF-
enha
nced
Filled
resin
syste
m
Duer
en
Othe
r reg
ions
IPC 41
01C-
No.
ProductionLocation
*DURAVER-E-Cu-#
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Base for All Innovation
Product Overview
Isola Type IPC 4101CSlash Sheet
Glass transition
temperature
Requirements / Applications Dielectric constant
Dissipation factor Coefficient of Expansion Thermal Characteristics Solder Limits
CTI (UL
class)
Flexural strength acc. IPC-4101B
Tg (DSC)
°C
thermal resistant
for leadfree soldering
cycle resistant -40 °C/
+140 °C/ 1000 cycles
CAF enhanced
RoHS conform
>0.50 mm >0.50 mm RT-TG ppm/°C > Tg ppm/°C Decomposition Temperature
Max. Operating
Temperature
288 °C N/mm²sample thickness
> 0.50 mm
1 MHz 1 GHz 1 MHz 1 GHz X Y Z X Y Z
T 260 T 288 TD UL UL
length crossmin min °C °C sec
DE104*/PCL240 /21 135 x 4.6-4.9 0.019 17 12 45 12 7 230 10 - 310 130 30 2 550 480
DE104KF* /21 135 x x 4.6-4.9 0.020 16 13 45 14 7 230 130 30 1 580 460
PCL370 /24 >160 x 4.6-4.9 0.016 17 12 60 12 7 260 >60 >10 120 274°C/20 3 600 490
DE104i* /21 135 x x x 4.6-4.9 0.019 17 12 53 12 7 265 >60 >10 350 130 30 3 600 480
IS400 /21/24/97/101 150 x x x x 4.8-5.1 0.013-0.015 15 12 40 12 5 200 >60 >15 330 130 30 3 530 450
IS410 /21/24/26/28/121/124 >170 x x x 4.8 0.018 17 13 55 15 6 217 >60 >15 350 130 30 3 590 530
IS420 /98/99/101 >170 x x x x 4.9 0.012 15 12 38 12 5 200 >60 >15 340 130 20 3 570 420
PCL370HR /21/24/26/98/101 >170 x x x x 4.9 0.012 15 12 40 12 5 225 >60 >15 330 130 30 3 510 430
FR408 /24/121/124 >170 x x x 3.8 3.7 0.010 0.010 13 13 >60 >15 360 130 20 3 538 427
IS620i /30 220 x x x 3.5-3.7 3.6 0.008 0.006 15 12 40 13 5 230 >60 >15 364 140 60 3 528 362
IS680 190 x x x 12 12 15 13 13 190 >60 >60 360 2
G200 /30 185 x x x 4.0 3.8 0.010 0.010 14 14 55 14 14 275 320 150 60 3 600 420
P96/P26 /41/42/40 260 x x 4.6 4 0.014 0.014 13 17 4
DE156* /92 150 x x x x 4.6-4.9 0.02 0.015 17 12 60 12 7 200 >60 >15 380 130 20 4 650 450
IS500 /94 >165 x x x x 4.6-5.1 0.02 17 12 40 12 7 200 >60 >15 400 130 20 3 580 480
*DURAVER-E-Cu-#TestsarecarriedoutinaccordancewithIPC-650testmethods.
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Base for All Innovation
Isola Type IPC 4101CSlash Sheet
Glass transition
temperature
Requirements / Applications Dielectric constant
Dissipation factor Coefficient of Expansion Thermal Characteristics Solder Limits
CTI (UL
class)
Flexural strength acc. IPC-4101B
Tg (DSC)
°C
thermal resistant
for leadfree soldering
cycle resistant -40 °C/
+140 °C/ 1000 cycles
CAF enhanced
RoHS conform
>0.50 mm >0.50 mm RT-TG ppm/°C > Tg ppm/°C Decomposition Temperature
Max. Operating
Temperature
288 °C N/mm²sample thickness
> 0.50 mm
1 MHz 1 GHz 1 MHz 1 GHz X Y Z X Y Z
T 260 T 288 TD UL UL
length crossmin min °C °C sec
DE104*/PCL240 /21 135 x 4.6-4.9 0.019 17 12 45 12 7 230 10 - 310 130 30 2 550 480
DE104KF* /21 135 x x 4.6-4.9 0.020 16 13 45 14 7 230 130 30 1 580 460
PCL370 /24 >160 x 4.6-4.9 0.016 17 12 60 12 7 260 >60 >10 120 274°C/20 3 600 490
DE104i* /21 135 x x x 4.6-4.9 0.019 17 12 53 12 7 265 >60 >10 350 130 30 3 600 480
IS400 /21/24/97/101 150 x x x x 4.8-5.1 0.013-0.015 15 12 40 12 5 200 >60 >15 330 130 30 3 530 450
IS410 /21/24/26/28/121/124 >170 x x x 4.8 0.018 17 13 55 15 6 217 >60 >15 350 130 30 3 590 530
IS420 /98/99/101 >170 x x x x 4.9 0.012 15 12 38 12 5 200 >60 >15 340 130 20 3 570 420
PCL370HR /21/24/26/98/101 >170 x x x x 4.9 0.012 15 12 40 12 5 225 >60 >15 330 130 30 3 510 430
FR408 /24/121/124 >170 x x x 3.8 3.7 0.010 0.010 13 13 >60 >15 360 130 20 3 538 427
IS620i /30 220 x x x 3.5-3.7 3.6 0.008 0.006 15 12 40 13 5 230 >60 >15 364 140 60 3 528 362
IS680 190 x x x 12 12 15 13 13 190 >60 >60 360 2
G200 /30 185 x x x 4.0 3.8 0.010 0.010 14 14 55 14 14 275 320 150 60 3 600 420
P96/P26 /41/42/40 260 x x 4.6 4 0.014 0.014 13 17 4
DE156* /92 150 x x x x 4.6-4.9 0.02 0.015 17 12 60 12 7 200 >60 >15 380 130 20 4 650 450
IS500 /94 >165 x x x x 4.6-5.1 0.02 17 12 40 12 7 200 >60 >15 400 130 20 3 580 480
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Base for All Innovation
Prepregs
Prepregsaresuppliedinrollsorpanels.
RollsStandardwidths(tolerance±5.0mm)1250mm(locationoriented);otherrollwidthsavailableonrequest.Standardlengthsapprox.100–300m,dependingonthetypeoffabric.
PanelsProductionaccordingtocustomerspecification(tolerance±1.0mm)
Correcthandlingandstorageoftheprepregsareessentialprerequisitesfortrouble-freeprocessing.Ifrequiredbythecustomer,theprepregpanelscanalsobetooledinaccordancewithspecifications,i.e.providedwiththereferencesystemforpin-lamtechnology.
Supply Forms
Laminates
One-sidedandtwo-sidedcopper-cladlaminatesareavail-able:Typicalcopperfoilnominalthicknesses(18,35and70µm)correspondtoIPC-4562,Grade3(HTE-quality).Forlaminateswithasubstrate<0.1mmVLP-foilswithHTEpropertiesareused,preferredRTF.
SheetsThelaminatesareproducedinthefollowingsheetsizes:1070mmx1165mmwarp1225mmx1070mmwarp1225mmx925mmwarp1070mmx1285mmwarpTolerances:+3.0mm-0mm
PanelsPanelsaresuppliedcuttospecification.Withaminimumthicknessof0.25mm,mechanicallyprofilededgesareavailableonrequest.Variousformsofidentificationarealsoavailable,suchaslasermarking,embossing,orink-jetprinting(alsoasbarcode).
Onrequestthepanelscanbestackedonplasticminipal-letswhicharesuitableforadirectbindingtotheinnerlay-erproductionline.Thus,itispossibletoreduceadditionalhandlingstepswhichhasapositiveimpactonthecoppersurfacequality.IsolathinlaminatesareadjustedtoabsorbUVlight.Thispropertyhelpstoreducethepseudo-errorrateinauto-opticalinspections(AOI),particularlywhenusingAOIlaserscannerswhichoperatewithfluorescentmethods.Undesiredthrough-exposure(ghosting)ontheoppositesideisavoidedwhenexposingthesolderresisttoUVlight.
Important note for processingThewarpandweftofthelaminatesandprepregsruninthesamedirectioninthemultilayerstobelaminated.Orderingpanels,itisthereforeimportanttospecifywhichvalueistocorrespondtothewarpdirection.
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Base for All Innovation
General
Ingeneral,thepackagingoughttoprovidecoveragainstclimatical(dampness)andmechanicaldamagesaswellasagainstultravioletlight.
Standard Materials
Standardmaterialsarepackedinpolyethylenebags.Thedurabilityoftheprepregsis6monthsat<5°Cor3monthsat<23°Candarelativehumidityof<50%.Whenremovingchilledproductfromstorage,takeappro-priatestepstopreventcondensation.Werecommendare-conditioningof24hours.Inprincipal,weadvisetohermeticallyrepackagelami-natesaswellasprepregsafteropeningtheoriginalpackaging.Prepregsoughttobestackedonplasticminipallets,whicharesuitableforadirectbindingtotheinnerlayerproductionline.Therebyitispossibletoreduceadditionalhandlingsteps,whichwillhaveapositiveimpactonthecoppersurfacequality.
Technical notes for the storage of prepregs for standard material
Supply Forms and Storage
Use in ML-production
Condition 1•Temperature <5°C•Shelflife ≤180days
Condition 2•Temperature <23°C•Relativehumidity <50%•Shelflife ≤90days
Removal
Storage24hoursatlay-up-
ambienttemperatures
High Performance Products (IS620i, IS680, P26/P96, G200)
1.PrepregThedurabilityoftheprepregsintheoriginalpackaging(moisturebarrierfoilincludingdrypackandhumidityin-dicatorcard)is3monthsat<23°Candrelativehumidityof<50%(seeIPC-4101).Astorageat<5°Cdoesnotprolongthedurabilityoftheseparticularprepregs.Whenremovingchilledproductfromstorage,takeappropriatestepstopreventcondensation.Werecommendare-conditioningof24hours.Inprincipal,weadvisetoher-meticallyrepackagelaminatesaswellasprepregsafteropeningtheoriginalpackaging.
2.LaminateLaminatesarepackedinmoisturebarrierfoilincludingdrypackandhumidityindicatorcard.Werecommendanad-ditionaldryingprocessat105–125°Cforapprox.4hoursifthematerialwasstoredforalongertime.
Storage of PCBsWeadviseanadditionaldryingprocessat105–125°Cforapprox.4hoursbeforesoldering/assembling.
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Base for All Innovation
Theflowandpolymerizationbehaviouroftheprepregsusedformultilayerproductionaredecisivelyinfluencedbythefollowingparameters:
• Prepreg type• Type of multilayer
Format,Construction,Layout• Package
Mould,Padding,Separatingsheets,Packageheight
• Press parameters Temperatureprofile,Pressureprofile,Vacuumsupport
Recommended Press Parameters
DE104*, FR4-74, DE104i*, DE156*, IS400, DURAFLEXHydraulic Vacuum Press
0
20
40
60
80
100
120
140
160
180
200
0 10 20 30 40 50 60 70 80 90 100 110 120 130
time [min]
0
5
10
15
20
25
30
35
40
45
50
tem
pera
ture
[°C
]
spec
. pre
ssur
e [b
ar]
Temperature Pressure *DURAVER-E-Cu-#
0
20
40
60
80
100
120
140
160
180
200
0 5 10 15 20 25 30 35 40 45 50
time [min]
0
5
10
15
20
25
tem
pe
ratu
re [
°C]
spe
c. p
ress
ure
[b
ar]
Temperature Pressure *DURAVER-E-Cu-#
DE104*, FR4-74, DE104i*, DE156*, DURAFLEXADARA Press
tem
pera
ture
[°C
]
spec
. pre
ssur
e [b
ar]
Temperature Pressure
0
20
40
60
80
100
120
140
160
180
200
0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 160 170 1800
5
10
15
20
25
30
35
40
45
50
IS410, IS420, PCL370HRHydraulic Vacuum Press
time [min]
tem
pera
ture
[°C
]
spec
. pre
ssur
e [b
ar]
Temperature Pressure
time [min]
0
50
100
150
200
250
0 10 20 30 40 50 60 70 80 90 100 110 1200
5
10
15
20
25
IS410, IS420, PCL370HRADARA Press
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Base for All Innovation
tem
pera
ture
[°C
]
spec
. pre
ssur
e [b
ar]
Temperature Pressure
time [min]
IS620iHydraulic Vacuum Press
0
50
100
150
200
250
0 20 40 60 80 100 120 140 160 180 200 220 240 260 2800
5
10
15
20
25
30
35
40
45
50
tem
pera
ture
[°C
]
spec
. pre
ssur
e [b
ar]
Temperature Pressure
time [min]
IS680Hydraulic Vacuum Press
0
50
100
150
200
250
0 20 40 60 80 100 120 140 160 180 200 220 240 260 280 3000
5
10
15
20
25
30
35
40
45
50
tem
pera
ture
[°C
]
spec
. pre
ssur
e [b
ar]
Temperature Pressure
time [min]
0
20
40
60
80
100
120
140
160
180
200
0 20 40 60 80 100 120 140 160 1800
5
10
15
20
25
30
35
40
45
50
FR408Hydraulic Vacuum Press
tem
pera
ture
[°C
]
spec
. pre
ssur
e [b
ar]
Temperature Pressure
time [min]
FR408HRHydraulic Vacuum Press
0
20
40
60
80
100
120
140
160
180
200
0 20 40 60 80 100 120 140 160 180 200 220 240 2600
5
10
15
20
25
30
35
40
45
50
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Base for All Innovation
Speciality Laminates
➜DURAFLEX ➜No Flow Prepreg ➜IS450 ➜IMS ➜Smart Card
➜DURAFLEX
Preliminary Datasheet
Flexible base material for printed circuit board applications
DURAFLEX
DURAFLEXisanepoxybased,leadadhesiveless,semi-flexiblelaminatewhichcanreplacewell-knownflexiblebasematerialslikePolyesterandPolyimide.TypicalapplicationsforDURAFLEXarerigid-flexPCBsorbendtoassemblydesignswheredynamicbendingcharacteristicsarenotrequired.BesidesthehighflexibilityDURAFLEXhasaTgat≥150°C(DSC).UsingournewdevelopedI-Fabglassfabricswewereabletoimprovesignificantlytheflexuralstrenght(uptofactor2.5)comparedtoconventionalfabrictypes.Itsen-durancebendingstrengthhasbeenverifiedinseveraltestseries.After3xleadfreereflowthebasematerialhasbeenbendedwitharadiusof2mminanangleof180°.
DURAFLEXisavailableaslaminateandprepreg.Epoxybaseditcanbeprocessedwithstandardprocessparame-ters(relaminationaswellasPCBmanufacturingprocess).DURAFLEXdoesnotneedanadhesivelayertothecop-perfoilwhichhelpstoavoidmanyproblemsinthePCBmanufacturingprocess.
Additional characteristics-excellentsolderbathresistanceat288°C-chemicalresistancewhichreducesthedangerofresin
recession-highmechanicalstrength-nosmearingduetoabsenceofadhesivelayer-compatiblytootherIsolabasematerialsaswellastoPI
andPE-dimensionalstabilitysimilartoFR4MLcoresPolyesterorPolyimidebasedmaterialscanbeusedascoverlayer.
Standard availability50µmand100µmthickness(w/oCu-foil)
Cladding18,35µm-HDFoilsingleordoublesidedotherthicknessesonrequest
PrepregDURAFLEX106iDURAFLEX2113i
Supply form1225mmx925mmwarp1225mmx1070mmwarpsheets,panels,onroll,otherformatsonrequest
1311/09
Base for All Innovation
Typical Values
Characteristics Dimension Pre-Treatment IPC 4101C/21Specification
Typical Value
Surfaceresistance MΩMΩ
C96/35/90E-24/125
1.0·104
1.0·1034.5·106
1.5·106
Volumeresistivity MΩ·cmMΩ·cm
C-96/35/90E-24/125
1.0·106
1.0·1033.4·107
5.5·106
PermittivityDk@1MHz
– A 5.4 4.7
LosstangentDf@1MHz
– A 0.035 0.013
Cu-peelstrength,35µm N/mm E 0.7 1.3
Thermalstress@288°C s A ≥10 ≥10
Moistureabsorption1) % A 0.8 0.18
Flammabilityclass2) – A V-1 V-0
Glasstransitiontemp.Tg3) °C 110–150 ≥150
50µmlaminatethickness,18/18;Radius2mm,angle180°
Numberofbendings 3xleadfreereflow – ≥150x
100µmlaminatethickness,18/18;Radius5mm,angle180°
Numberofbendings 3xleadfreereflow – ≥20x
Remarks:A=withoutpreconditioningC=preconditioningwithmoistureE=preconditioningattemperature1)=testsperformedat1.55mmthicklaminates2)=specificationUL943)=DSC-method
AlltestshavebeenperformedaccordingtotheIPC-650testmethods.
11/0914
Base for All Innovation
Prepreg Characteristics
Property A11 FR406N P26N IS572N Condition
Resin Content (%)
104 75±3 A
106 65±1.5 65±1.5 66±2 A
1080(108A11only) 65±3 65±1.5 60±1.5 63±2 A
Pressed Thickness (mil)
104 2.0±0.3 A
106 1.7±0.3 1.7±0.3 1.8±0.3 A
1080(108A11only) 3.7±0.3 2.7±0.3 2.8±0.3 3.1±0.3 A
Resin Flow (%) IPCTM6502.3.17
104 2.0%max A
106 A
1080(108A11only) 2.0%max A
Modified Circle Flow (inch)
104 0.010–0.100 A
106 0.050–0.120 0.050–0.120 0.040–0.120 A
106 0.150–0.350 A
1080(108A11only) 0.010–0.100 0.050–0.120 0.050–0.120 0.040–0.120 A
1080 0.090–0.210 A
1080 0.150–0.350 A
Condition A as received
Property A11 FR406N P26N IS572N Condition
Tg-fullcurenominal 100°C 170°C 250°C 170°C E-2/105
CureTemperature
Recommendedforfullcure 171°C 188°C 218°C –
Min.forfunctionalbonding 171°C 163°C 191°C –
Flammability HB V-0 V-0 V-0 ULtest
DielectricStrength(volts/mil) 2000 1750 1600 D-48/50
DielectricConstantDk@1MHz 4.5 4.3 3.7 4.6 C-24/23/50
DissipationFactorDf@1MHz 0.033 0.018 0.0195 C-24/27/50
CTE(ppm)x-axis 18 17 13 17 AmbienttoTg
y-axis 16 20 14 13 AmbienttoTg
z-axis 80 75 55 95 AmbienttoTg
PeelStrength(N/mm)1ozcopper
1.58 1.75 1.23 1.24 AfterThermalStress
ThermalConductivity(W/m·K) 0.25 0.30 0.40 A
➜NoFlow
1511/09
Base for All Innovation
Epoxy base material for improved heat dissipation
IS450 Standard prepreg and laminte constructions
Glass fabrics Prepreg
Theoretical Thickness (mm) Resin content (%)
1x106 0.070 75
1x1080 0.100 73
1x2116 0.120 53
1x7628 0.200 47
Other thicknesses on request.
Typical Applications
•Automobileelectronics•HeatSinkcircuitboards•Industrialelectronics
Special properties
•HighthermalresistanceTgapprox.170°C(DSC)T260>60minT288>20min
•Highthermalconductivityλ=1W/m·K
•Lowz-axisexpansionαz=40–50ppm/K@RT-120°C
•CAF-enhanced
➜IntermetallicSubstrates(IMS)New Product Development
Thickness ThermalResistance1)
(K/W)Copper(µm)
Dielectric(µm)
Aluminium(mm)
IMSGrade1 18–210 60 1/1.5/2.0 2.468
IMSGrade2 18–210 60 1/1.5/2.0 0.668
IMSGrade3 18,35,70 15/80 1.5 0.258
1) related to 18 µm copper, 1,5 mm Aluminium, and a surface of 10 sq. mm
Heattransmissionatelectronicdevicesisbecomingmoreandmoreimportant.
HighperformancedevicesandLEDsinparticularproduceasubstantialquantityoflostheat.Intermetallicsub-strates,shortIMS,basedonaluminium,specialdielectrics,andcopperfoilhaveproventheirworthas„heatsink“insuchapplication.
Accordingtothethicknessofthecopperfoilandofthealuminiumplatescombinedwithverythindielectricsofgoodheatconductivityefficientheattransmissioncanbeachieved.Isolahasdevelopedthreedifferentsystemswhichcanbecharacterisedasfollows:
➜IS450
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Base for All Innovation
➜SmartCard
Smart Cards
Nowadays,SmartCardshavebecomeaninherentpartofourdailylife.Thenumberofapplicationsisveryversatilee.g.:
•creditcards•cashcards•healthinsurancecard•electronicpassports•accessauthorisation•SIMCard
Itistobeexpectedthatthenumberofboththeapplicationsandtheuserwillincrease.
Undertheeye-catchinggoldenpinofsuchsmartcardsthereisarathervisiblechipwhichisbroughtuponacorematerial.
Isolaproducessuchcorematerials.Accordingtotheapplicationthesematerialsareavailablecoppercladorunclad.
Duetothesubsequentproducingthisthinlaminate,usually<100µm,isavailableonrolls.Thelowthicknesstolerancesareaparticularchallenge.
NotableSmartCardproducerinEuropearealreadypurchasingthismaterialfromIsola.
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High Frequency Applications
➜FR408 ➜FR408HR ➜IS620i ➜IS680
Isola High Speed Digital Products
FR408•Tg180°C•3.5%Expansion•Dk3.75(10GHz)•Df0.0120(10GHz)
FR408HR•Tg200°C•2.8%Expansion•Dk3.65(10GHz)•Df0.0095(10GHz)
IS620i•Tg225°C•2.5%Expansion•Dk3.59(10GHz)•Df0.0069(10GHz)
IS680•Tg200°C•2.8%Expansion•Dk3.20(10GHz)•Df0.0031(10GHz)
T288–60Min.TD–400°C**
T260–60Min.TD–350°C**
Lead Free Assembly Compatible
T260–10Min.TD–300°C
Tin/Lead AssemblyCompatible
Imp
rovi
ng
Th
erm
al P
erfo
rman
ce –
T26
0 /
TD /
IST DE156 155 Tg
Halogen Free
P95 260 Tg Polyimide HB
P96 260 TgPolyimide V0/V1
FR408HR 200 Tg Low Df, Low CTE
IS680 - 200 Tg Very Low Loss Df < 0.0036 @ 10 GHz
ISE25 - 245 Tg Df < 0.0055 @ 10 GHz
nNewProducts
** Laminate Data - IST performance is a function of Hole diameter, board thickness, plating parameters and laminate attributes.
IS420 170 TgPhenolic-Filled
DE104i135 Tg
370HR 180 TgPhenolic-Filled
IS410 180 TgPhenolic
370 Turbo 180 Tg
IS415 200 TgMid Dk/Df
FR408 180 Tg Low Dk & Df
IS620i Tg 225 Low LossDf < 0.0070 @10 GHz
G200/GI 180BT Epoxy
GETEK 180 Tg Mid Dk & Df
FR406 High Tg170 Epoxy
1 GHz Improving Electrical Performance – Lower Dk/Df – Higher Speed 20 GHz
IS400 150 TgPhenolic-Filled FR406HR High Tg
190 °C Epoxy
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Base for All Innovation
100 MHz 1 GHz 10 GHz 100 GHz
Medium to High Frequency Applications
Car Immobilisation30–500kHz
Car Parking Aid40kHz
RFIDLogistic CMP850–950MHz
Electr.Car Key433–868MHz
City Band27MHz
Terristic TVVHF87–230MHzUHF470x862MHz
Cable TV4MHz–1GHz
Blue Tooth2.45GHz
Navigation Systems1.2–1.575GHz
Digital Telephone1.880–1.900GHz
Mobile Phone(i-phone)850MHz–2.2GHz(UMTS)Follow-upsystems5GHz
Notebooks2.14–5.0GHz
Router5–12GHz
Server4.0–10.0GHz
Toll Systems2.4–5.8GHz
W-LAN2.4–5.725GHz
Amplifier2.5–4.0GHz
NetworkingSystems3.6–6.25GHz
Optical Systems >10GHz
TV Astra13.75–14.0GHz
Satellite TV10.7–12.75GHz
DSL Satellite13.0–15.0GHz
Avionics10.0–15.0GHz
Defence >10GHz
Car AdaptingCruise Control76–77GHz
Car DistanceControl24.0GHz
Base Materials for Different Applications
STANDARD FR-4BASE MATERIALS
MID TO HIGH FREQUENCYBASE MATERIALS
100 MHz 1 GHz 5 GHz 10 GHz 50 GHz 100 GHz
Df 0.028Dk 4.2 – 4.6
DE104iTg135
Df 0.028Dk 4.2 – 4.6
IS400Tg150
Df 0.021-0.025Dk 4.0 – 4.2
PCL370HRIS420Tg175
Df 0.013Dk 3.63
FR408Tg180
Df 0.009Dk 3.57
FR408HRTg200
Df 0.007Dk 3.57
IS620iTg225
Df 0.0028–0.0036Dk 2.80 – 3.45
IS680Tg200
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Base for All Innovation
Physical Properties
Property Units FR408 FR408HR IS620i IS680
Dk2GHz – 3.67 3.68 3.58 2.80–3.45
Dk5GHz – 3.66 3.64 3.54 2.80–3.45
Dk10GHz – 3.65 3.65 3.54 2.80–3.45
Df2GHz – 0.0116 0.0092 0.006 0.0028–0.0036
Df5GHz – 0.0122 0.0098 0.0066 0.0028–0.0036
Df10GHz – 0.012 0.0095 0.0071 0.0028–0.0036
ElectricalStrength volts/mil 1400 1700 1400 1200
Peels1oz lb/in 7 7 >7 5
Flammability – 94V-0 94V-0 94V-0 94V-0
MoistureAbsorption % 0.15 0.06 0.15 0.016
ULRecognition – FR-4 FR-4 GPY non-ANSI
Frequency (GHz)
1 3 5 7 9 10
0
-5
-10
-15
2.4489 GHz-3.0029 dB
3.663 GHz-3.0184 dB
4.6216 GHz-3.0032 dB 5.0341 GHz
-3.0378 dB 5.6101 GHz-3.005 dB
6.6078 GHz-3.0218 dB
8.9942 GHz-2.6371 dB
■■■ FR408 ■■■ FR408HR ■■■ High T FR-4 ■■■ IS415 ■■■ IS620 ■■■ IS680 ■■■ Phenolic Cured system
Comparisation Simulated S21 on Isola Products 4 mil wide 6 Inch long lines 3dB BW
dB L
oss
g
Isola Products – Simulated S21 data
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REACHisthenewEuropeanCommunityregulationno.1907/2006onRegistration,EvaluationandAuthorisationofChemicals.ItenteredintoforceonJune1st,2007.Theaimistoimprovetheprotectionofhumanhealthandofenvironmentagainsttherisksthatcanbeposedbychemicals.REACHeffectsallproducers,importers,distributors,andusersofchemicalsubstancesofmorethan1tonperyear.
Isola got involved into this new regulation at an early stage:
1. In co-operation with our suppliers of chemicals, all rel-evant substances were registered with the European Chemicals Agency in Helsinki. In this way we ensure a continuous problem-free supply of our basic chemicals.
2. Being also a processor of chemicals, we consequently registered the information on these substances in the central database, too. Any products manufactured
thereof comply with the REACH guidelines and can therefore be safely delivered to customers.
3. Isola products, both laminates and prepregs, are not obligatory for registration.
Isolaconfirmsthatpurchaseandprocessingofchemi-calsubstancesatIsolacomplywiththeregulationsofREACH.
REACH
Recentlytherearemoreandmorerumoursconcerning”TBBA”causingmoreconfusionthanclarificationinthemarket.Unfortunatelytherearesomebasematerialsupplierswhotrytoabusethissituationtopushalternativeproductstofront.Therefore,Isolawantstomakeuseofthefollowinginfor-mationtobringclarityandtomakeacontributiontotheavoidanceofunnecessaryandverycost-intensivematerialqualifications.
1. What is TBBA?
TBBA(Tetrabromo-bisphenolA)isaflameretardantwhichcanbeusedasanadditiveorasareactivecomponent.IntheepoxyresintypesFR-4orFR-5itissolelyusedasareactivecomponent,whichmeansitbecomesaninseparableelementoftheresinmatrix.TBBAdoesnotbelongtothegroupofthepolybrominatedbiphenyls(PBB)ortothepolybrominatedbiphenylethers(PBBE),whichusageisprohibitedbyRoHSsince2007.AformationofhighlytoxicdioxinsordibenzofuranesisnotpossiblewithreactedinTBBAincontrasttotheadditivesPBB/PBBE.Correspondingexaminationresultsareavailable.
2. Have risk evaluations concerning TBBA been made?
Foryearsnumerous“riskassessments”havebeencarriedout.AllassessmentsreachedtheconclusionthatthereisnoriskfromreactedinTBBA.
Information on TBBA
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Theretosomeexamples:•“Draftingofbasisofvaluationtosubstituteenvironmen-
tallyrelevantflameretardant”,FederalEnvironmentAgencyBerlin,December2000,carriedoutbyÖko-InstituteFreiburggNo Risk!
•EuropeanHumanHealthRiskAssessment,February2005gNo Risk!
•EuropeanEnvironmentalRiskAssessment,June2007gNo Risk!
•EuropeanCommissionScientificCommitteeSCHER,January2008gComplies with the EU Risk Assess-ment Report!
•REAChgTBBA does not meet any of the criteria for questionable substances!
•Thereareapproximately200furtherstudiesarrivingatthesameconclusion.
3. Why is TBBA still in discussion?
SometimeagotheEuropeanCommissionmandatedtheÖko-Institutetochecktheguideline2002/95/EG(RoHS)regardingwhethertherearefurthersubstanceswhichshouldbeaddedtothebannedsubstances.TheÖko-Instituterecommendedbesideothercom-poundstoaddTBBA,butnotasreactedinTBBA,butasanadditive.Unfortunatelythisproposalhasbeenworkedoutwithouttheparticipationoftheconcernedindustryandtheconcernedassociations.Theindustrymeetsthiswithalackofunderstanding,especiallyastheelectronicindustryhasproveninthepastthatitsupportedinanac-tiveandresponsiblewayjustifiedenvironmentalissues.AsanexampleWEEE,RoHS,andREACHshouldbementioned.
4. Are the associations active?
ToavoidsuchprematurelyproposalsliketheoneoftheÖko-InstituteworkinggroupshavebeenbuiltaswellintheZVEI/VdLasintheIPC.TheycarriedtogetherfactstobeabletocreateappropriatepositionpaperswhichshouldbemadeavailabletotherelevantauthoritiesinBrusselsandBerlin,butalsototheÖko-Institute.Isolaisactivelysupportingbothassociations.
Summingupwewanttostate:•Therearenowell-groundedconclusionswhichcould
justifyabanofTBBA.•BasedonlonglastingexaminationstheEuropean
Commissiongavethego-aheadfortheunlimitedusageofTBBA.
•Wearesupportingourassociationsintheirefforttoinformthecorrespondingauthoritiesinanobjectiveway.
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•ThinDielectrics
•Hi-Pot-Resistance
•ContinuousLamination
•SpecialApplications
•SmartCard
•UncladLaminate
•Semi-flexibleBaseMaterial
Innovative Technologies
Continua
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Base for All Innovation
•ApplicationEngineeringService-ProjectSupport-TechnicalCustomerService-Experiencedapplicationengineersassistinginthelaunchofnewproducts
•OnTimeDelivery-QTAService48hours
•CustomerAccessvia“https://my.isola.de”
•ServiceLaboratories-HighAnalyticalStandard
•Certificates-TS16949:2002-ISO9001:2008-ISO14001:2004-OHSAS18001:2007
•MulticalProgram(MLBDesignTool)seewww.isola.de
Service/Customer Support
MulticalProgram(MLBDesignTool)
Our information and our eventual advice for the application of our products in any form (for instance oral, written or by tests) is given carefully and by the best of our
knowledge but is not binding and is provided without making any representation or warranty, expressed or implied, and without any liability. The user is not released
also in the case of our prior testing or if the use is based on our practical application advice from it’s sole responsibility to use our product and to insure the correct
application, the condition and fitness of our product for this application as well as the condition and fitness of the product itself.
Production ProductionR&D Sales
USAIsola USA S.a.r.l.(Headquarters)3100W.RayRoad,Suite301Chandler,AZ85226,USAPhone:+1/480/8936527Fax:+1/480/8931409E-mail:info@isola-usa.com
EuropeIsola GmbH52353DürenGermanyPhone:+49(0)2421/8080Fax:+49(0)2421/80880E-mail:info-dur@isola-group.com
AsiaIsola Asia Pacific(Hong Kong) Ltd.Unit3512–3522,35/FNo.1HungToRoad,KwunTong,Kowloon,HongKongPhone:+852/2418–1318Fax:852/2418–1533E-mail:asia@isola-group.com
www.isola-group.com
Our sales team is pleased to provide you with further information!
J
Close to the Customer All over the World
BASE FOR ALL INNOVATION
Elk Grove, CAUSA
Chandler, AZGlobal HQ
Global R&DUSA
Ridgeway, SCUSA
GreatBritain
Dueren EU HQGermany
Isola FabricsItaly
Italy
India
JurongSingapore
KuchingMalaysia
HuizhouChina
HongkongAsian HQ
Korea
DalianChina
SuzhouChina
Taoyuan/YangmeiTaiwan
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