Post on 08-Jul-2020
transcript
CHILISIN ELECTRONICS CORP.
Company Presentation 2014
Corporate Overview
Product Introduction
Product Roadmap
2
Outline
Leading Brand in China
3
Company Milestones
A Local Ferrite Producer
Business Expansion
Major Domestic Player
World-class Company
1972 1977 1990 1998 1999
Year
40,000
80,000
120,000
2002
Established
Developed Mn-Zn and Iron Core
Developed SMD Power Inductor
Public listingon TWSE
20012000
60,000
1997 2003
Re
ve
nu
e
K $USD
20072005 20112009 2014
100,000
Established second plant
Developed Wire-Wound and Multilayer
Developed High-Frequency Chip Inductor
Expanded ChinaDongGuan plant
EstablishedChinaSuZhouoffice
Constructed Hukou new HQ and plant
Established China Henan plant
Company established
EstablishedU.S. office
Established China DongGuan plant
EstablishedKorea office
Acquired Belkin Int’l
Formed strategic alliance with Yageo
Developed Moldingand Thin-Film Technology
$64,375
$99,433
$115,000$120,330
$124,556
$141,000
$0
$20,000
$40,000
$60,000
$80,000
$100,000
$120,000
$140,000
$160,000
2009 2010 2011 2012 2013 2014F
Sales Revenue(KUSD )
4
2009~2013 Revenue Growth CAGR
93.49% 17.94%
Asia
6%
America
4%
Europe &
Others
4%
Greater China
86%
Sales Breakdown 2013 – By Region
PC
22%
Mobile
16%
Consumer
13%
Industrial
3%
NB
3%Automotive
2%
Communication 41%
Sales Breakdown 2013 – By Market Segment
6
Major Customers
AutomotivesAutomotives
PC / SystemsPC / Systems Consumer ElectronicsConsumer ElectronicsTelecommunicationTelecommunication
OEMs / EMSsOEMs / EMSs
*Any trademarks or logos used throughout this presentation are the property of their respective owners, Chilisin does not claim ownership or distribution rights of the above logos
FactoryDongguan, China
Est. 1997Employee: 1,199
FactoryHenan, China
Est. 2010Employee: 518
FactorySuzhou, China
Est. 2001Employee: 96
HeadquarterHsinchu, Taiwan
Est. 1972Employee: 751
8
Factory Overview
Molding
Wire-Winding
Multi-layering
Thin-film
Through-hole
Manufacture Site Finished Products Inventory
-----------------------------------All factories are ISO 9001 and TS 16949 certified ----------------------------------
Global Network & Support
9
Chilisin HQ and
Factory
Hsinchu, Taiwan
Powder Factory
Touliu, TaiwanFactory
Dongguan, China
Factory
Suzhou, China
Factory
Henan, China
Distributors and agents
Sales offices
Branch Office
Gwangmyeong, Korea
Branch Office
San Jose, USA
Manufacturing sites with sales offices
Corporate Overview
Product Introduction
Product Roadmap
10
Outline
Leading Brand in China
Appendix
11
MoldingWire-winding Multi-layering Thin-film Process
Power Inductor
• Wide range
• for power solution
Magnetic-resin Power Inductor
• 2016~3030 size
for mobile phone
• 4040~5050 size
for tablet PC
• 6060~8080 sizefor TV/audio
Chip Inductor
• Ferrite core for baseband application
• Ceramic core for RF
application
Common Mode Choke
• for USB2.0/3.0/HDMI
Power Inductor
• DIP type
• for motherboard
Power Inductor
• SMD type
• for notebook & tablet PC
New - Power Inductor
• SMD Miniature type:
3225~2012 size, t: 0.8mm
• for handset & ultrabook
Ferrite Bead
• Up to GHZ band• Downsize from 0402 to
0201
Chip Inductor
• For RF application
• 0201 size +/-0.1nH
Product Line and Technology
Power Inductor
• 2520~1608 size, t: 0.55mm
• for handset & ultrabook
Common-mode Choke
• 0805 package
• for USB2.0
Chip Inductor
• Baseband &RF application
• Downsize from 0402 to
0201
Production Capacity
12
Molding Wire-windingMulti-layering
Thin-film Through-hole
Total: 40 Total: 100
Total: 2,600 Total: 130 Chip Inductor Total: 140
(Million Pcs/month)
Common Mode Total: 30
Power Inductor Total: 110
LED Home Appliances
Computing / Mobile
Display DSC
Diversified Applications
Graphic CardAlternative EnergySet Top Box
Game Console
Automotive
Server
Mother Board
14
Miniaturization
High Current
Low ProfileLow Rdc
Green Compliance
RoHsREACH
40A
20A
60A
1.5mm
1.0mm
0.5mm
0402
020101005
< 1mΩΩΩΩ
<5mΩΩΩΩ
<10mΩΩΩΩ
Product Development Trend
HF
14
Corporate Overview
Product Introduction
Product Roadmap
15
Outline
Leading Brand in China
Appendix
16
2014 1H 2014 2H 2015 2H2015 1H
3.2*1.6*1.0
(Array 4 in 1)
2.5*2.0*1.0
L shape Termination
RDC down 15%
2016
2.5*2.0*1.0
(Array 2 in 1)
2.5*2.0*1.00.47~1.0uH2.1~2A 50-63mΩΩΩΩ
2.5*2.0*1.2
0.24~22uH
2.5*2.0*0.6
0.47~2.2uH
6-3.2A 110-30mΩΩΩΩ
2.5*2.0*1.02.2uH1A 138mΩΩΩΩ
2.5*2.0*1.0Array Type
2.0*1.6*1.0
0.24-2.2uH
9-3.2A 13-18mΩΩΩΩ
2.0*1.6*1.0
L shape Termination
RDC down 15%
2.0*1.6*1.0L+C Module
2.0*1.6*1.00.24~1.0uH4.800~1.6A 25~80mΩΩΩΩ
2.0*1.6*1.2
0.24~10uH
2.0*1.6*1.02.2uH1A 260mΩΩΩΩ
3.2*2.5*1.2
0.24~22uH
4.0*4.0*1.2
0.24~22uH
Metal-Molding
Metal Magnetic-Wire Wound
Ferrite-Multilayer
Power Inductor Product Roadmap(I)
17
2014 1H 2014 2H 2015 2H2015 1H
2.0*1.6*0.6
0.47~2.2uH
4-2.2A 45-170mΩΩΩΩ
2016
2.0*1.6*0.80.24~2.2uH2~0.4A 36~110mΩΩΩΩ
1.6*0.8*0.8
0.1-1.0uH
3.2-1.5A 20-150mΩΩΩΩ
1.6*0.8*0.82.2uH0.4A 390mΩΩΩΩ
Metal-Molding
Ferrite-Multilayer
Power Inductor Product Roadmap(II)
2.0*1.2*1.0
0.33~1uH
4.2-2.3A 58-100mΩΩΩΩ
2.0*1.2*1.0
L shape Termination
RDC down 15%
2.0*1.2*1.0
Array 2 in 1
2.0*1.2*1.00.16~2.2uH2~0.7A 38~165mΩΩΩΩ
1.6*0.8*0.5
0.47~2.2uH
0.4~0.2A 150~300mΩΩΩΩ
18
2014 1H 2014 2H 2015 2H2015 1H 2016
0.6*0.3*0.3(0201)L:27~82nHQ:10~6IDC:120~50mA
Multilayer
Chip Inductor Product Roadmap
1.8*1.15*0.61(0603)
1-56nH
160-420mA
45-700 ΩΩΩΩ
2.92*2.79*1.9(1008)
0.9-10nH
1300-0.55mA
0.1-0.48 ΩΩΩΩ
0.58*0.46*0.45(0201)
0.5-14nH
1250-270mA
0.2-0.44ΩΩΩΩ
Wire Wound
Thin Film
0.6*0.3*0.3(0201)L:100nHQ:6IDC:40mA
0.4*0.2*0.2(01005)L:0.6~10nHQ:8IDC:200~100mA
19
2014 1H 2014 2H 2015 2H2015 1H 2016
1.6*0.8*0.5Z:26~330ΩΩΩΩRDC:0.007~0.07ΩΩΩΩIDC:6000~1500mA
General-Signal
Low DCR-Power
Chip Bead Product Roadmap
1.0*1.5*0.5Z:33~220ΩΩΩΩRDC:0.022~0.1ΩΩΩΩIDC:3000~1400mA
0.6*0.3*0.3Z:22~33ΩΩΩΩRDC:0.04~0.055ΩΩΩΩIDC:1800~1500mA
1.0*0.5*0.5Z:330~600ΩΩΩΩRDC:0.15~0.23ΩΩΩΩIDC:1200~900mA
0.6*0.3*0.3Z:80ΩΩΩΩ/600ΩΩΩΩRDC:0.1ΩΩΩΩ/0.85ΩΩΩΩIDC:1000mA/250mA
0.6*0.3*0.3Z:1000ΩΩΩΩRDC:2.5ΩΩΩΩIDC:100mA
0.6*0.3*0.3GHz BandZ:600~1800ΩΩΩΩRDC:1.5~3.8ΩΩΩΩIDC:160~90mA
0.4*0.2*0.2Z:10~120ΩΩΩΩRDC:0.1~0.53ΩΩΩΩIDC:540~240mA
0.4*0.2*0.2Z:10~120ΩΩΩΩRDC:0.07~0.5ΩΩΩΩIDC:750~250mA
20
2014 1H 2014 2H 2015 2H2015 1H 2016
1.2*1.0*0.55Z: 40~120ΩΩΩΩIDC:100mA
Thin Film
Multilayer
Common Mode Choke Product Roadmap
1.0*1.0*0.5Z: 40~120ΩΩΩΩIDC:100mAwith ESD
0.8*0.6*0.4Z:12~90ΩΩΩΩIDC:100mAwith ESD
0.6*0.5*0.3Z:12~36ΩΩΩΩIDC:50mA
Corporate Overview
Product Introduction
Product Roadmap
21
Outline
Leading Brand in China
Appendix
Best Supplier Award from New Kinpo (2010)(2013)
Best “Cooperate To Win” Award from Lenovo (2011)
Outstanding Supplier Award from SerNet (2011)
Best Supplier Award from Asus (2005)(2007)
Best Supplier Award from Solectron (2007)
Best Supplier Award from Zyxel (2006)(2007)
TS16949 Certification (Since 2005)
Samsung Eco-Partner Certificate (Since 2005)
ISO 14001 Certification (Since 2004)
Sony Green Partner Certificate (Since 2003)
22
Certificates and Awards
2323
Technical Service
Value-added Service
RFQ Response24hrs
Delivery Response48hrs
Logistic VMI
Capacity Fully
Support 100%CustomerSatisfaction
24
Customer Design-in
Circuit Simulation
Material Research & Developmet
Technical Seminar
Product Development
Teams:EE & Material
R/L/C Know-how
Technical ServiceWork Frame for Engineering Support
2525
Trustworthy Supplier Competitive Products
Full Range of Magnetics Series Sufficient Capacity Support Vertical integration from powder mixing to inductor manufacturing World-class Quality Cost Competitiveness Quick Delivery & Flexible Logistic Support
Value-added Service
Total Solution Provider for EMI, power and RF Design-in Capability Professional Engineering Support Material Research & Development Concurrent Product Innovation
25
Appendix
26
Product Selection Guide - SMD Type
27
ChipChip
MultilayerMultilayer Thin FilmThin FilmWire-woundWire-wound
BeadsBeads InductorsInductors InductorsInductors Common Mode
Chokes
Common Mode
Chokes
Common Mode Chokes
Common Mode Chokes
General (Signal)SB 0201~1812
5~2700Ω / ~0.6AGB 0603~1812
7~2000Ω / ~1A
Large Current (Power)PB 0201~1812
7~1500Ω / ~6AxPB 0603~1812
10~600Ω / ~9A
High Speed(Power/Signal)NB 0402~1206
5~2700Ω / ~3A
High Freq. (Power/Signal)HF 0402~0603
120~1800Ω /~1.5ASBH 0402~0603
20~44Ω / ~0.4A
High Freq. (Signal)CHQ 0201
0.6~22nH /~0.9A
High Freq. (Signal)CLH 0201~0805
0.2~390nH /~0.6A
General (Signal)CL 0402~1206
0.01~33uH/~0.3A
USB2.0CMF210805 67~120Ω
InductorsInductors
USB2.0IEEE1394CMM11050460~160Ω/~0.3ACMM21/310805~120630~2200Ω/~3.7ACMDH21080567~120Ω~0.4AUSB3.0HDMICMMI21080550~130Ω/~0.5ACMMI110504
50~130Ω/~0.5A
High Freq.TFL 0201
0.6~22nH~0.45A
High Freq. General CS / LCNLow Profile CTHigh Q HQLarge Current HCHighQ&Current HP/PM/HPH0402~12061~15000nH / ~2.4A
General Signal/Decoupling NL/Lx 0805~1210
0.005~680uH / ~2A
SQV 1210~18120.1~2200uH / ~0.7A
SQC 0805~22200.15~10000uH / ~6A
General Power)MP 0603~1008
0.47~4.7uH/~1.8A
SCD 3.5*3.0~13.0*13.0mmH: 1.1~7.0mm0.82~8200uH / ~9.5A~0.2mΩ
Ultra Large CurrentCPUN 8.8*8.4~12.3*11.7mm
H: 7.0~10.0mm0.22~6.8uH/~37A
SFx 7.7*6.9~14.7*6.7mmH: 5.0~7.3mm0.1~0.51uH/~87A
Product Selection Guide - SMD Type (Con.)
28
Power InductorsPower Inductors
MoldedMoldedWire-woundWire-wound
Un-shieldedUn-shielded ShieldedShielded Magnetic (Metal)-resin Shielded
Magnetic (Metal)-resin Shielded
MHCx 040 H: 1.2~2.0mm050 H: 1.2~3.0mm060 H: 1.2~3.0mm100 H: 3.0~4.0mm125 H: 3.5~4.0mm0.1~22uH / ~46A~0.6mΩ
MHSC 040 H: 1.5~3.0mm060 H: 3.0mm080 H: 6.0mm0.22~10uH / ~40A~1.6mΩ
LVx 2016 H: 1.0mmMRSC 2520 H: 1.0~1.2mm
3030 H: 1.0~1.5mm4040 H: 1.0~2.6mm5050 H: 2.0~4.0mm6060 H: 2.0~4.5mm8080 H: 4.0mm 0.47~1000uH / ~13.8A~0.01mΩ
SSL/SSL-HC 6.5*5.6~16.26*22.35mmH: 1.0~8.0mm1.0~1000uH / ~20A~0.009mΩ
SCDS 3.2*3.2~12.5*12.5mmH: 1.0~8.0mm0.8 ~1000uH/~9.8A
SLPS 4.0*4.0~5.0*5.0mmH: 1.8~2.5mm1.0 ~47uH/~3.9A
SLF 6.0*6.0~12.5*12.5mmH: 2.8~7.5mm1.2uH ~1500uH/~13A
SDS 6.6*4.45~18.54*15.24mmH: 2.92~7.62mm1.0~10000uH/~5.0A
ShieldedUltra Large Current
ShieldedUltra Large Current
MHCD 2.0*1.2~3.2*2.5mmHEI H:0.8~1.2mm
0.24~2.2uH / ~9.5A~27mΩ
DMI 0807~1210H: 7.5~12.0mm0.22~4.7uH / ~45A~0.7mΩ
CPU 0806~1210H: 7.0~10.0mm0.22~120uH / ~40A~0.78mΩ
Product Selection Guide - DIP(PTH)
29
Coils & Power Chokes Coils & Power Chokes
MoldedMoldedWire-woundWire-wound
Customized specBC
MB
Un-shieldedUn-shielded
Customized specTDH
TD/SL
TC
Common Mode ChokesBCx
ShieldedUltra Large Current
ShieldedUltra Large Current
Customized specRxH
ShieldedUltra Large Current
ShieldedUltra Large Current
Customized specEMI Filter (Power/Data Line)
Product Selection Guide - Soft Ferrite Cores
30
CoresCores
EMI FilterNi-Zi Series
Iron/Ferrite power Toroid Ferrite Series
31
Product Application – Graphic Card
31
Vcore(CPU) (SFx)
(DMI) (MHCx)
(CPUN)
EMI Filter for Signal(CL) (CS)
DC-DC Converter(SCD) (LVS/LVF)
(SSL) (MB)
(DMI)
EMI Filter for Power(GBK)(SBK)(SBY)(PBY)(NBQ)
USB2.0/USB3.0/HDMI(CMM)
32
Product Application - Motherboard
32
Vcore (CPU)(CPU) (SFx)
(DMI) (MHCx)
(CPUN)
South Bridge(CP, PBY)
Video Chip(CLH) (PBU)
(DMI) (MHCx)
(CPU)
AC Adapter(RH) (TFU)
(ET/UT)
HDMI/DVI/Analog RGB(CMM)
USB/IEEE1394/LAN Interface(PBY) (CMM)
DC-DC Converter(PBY) (LVS/LVF)
(DMI) (MHCx)
(CPU) (SFx)
(SCD/SCDS)
33
WiFi / Bluetooth(CLH) (NBQ,SBJ,HFJ)
Camera Unit(SBY,CL,MPB)
3G(CS) (CLH)
DC-DC Converter(PBY) (CMM)
(LVS) (MHCC)
(LVS)
Product Application – Tablet PC
(MPB)(LVF)
Back Lighting
(LVF)
Product Application - Server
Baseband Processing
(Bead-NBI)(CS)(LVS/LVF)(CMM)
Control & Clock
(Bead-NBI)(LVS/LVF)
AC Adapter
(SCD)(RH)
Power Management
(Bead-PBY)(SQV)(LVS/LVF)(SCD/SCDS)(MHCC)(DMI/CPU)(SF)
Remote Radio
(CLH)(CS)(LVS/LVF)
Filter Switch
(CLH)(CS)(LVS/LVF)
34
35
Product Application - Smart Phone
Camera Unit(SBY,CL,MPB)
RF Circuit(CLH) (NBQ,SBJ,HFJ, CHQ)(TFL)
(LVF)
DC-DC Converter(LVS) (MPB)
(CM)Analog TV Circuit(CLH) (CS)
(LD) (CMM11)
35
LCD Panel(LVS)
36
Product Application – Digital Camera
Analog Front End(NBI, PBY)
(BA)
Lens Motor(NBI)
Speaker/Microphone(BA)
USB/HDMI(PBY)
(CMM)
Image Processing IC(NBI)
(BA)
Power Supply Unit(CL)(LVS)
Strobe Light(NBI)
AC Adapter
(TFU) (ET/UT)(RH)
(LVF)
(LVF)
36
(SCDS)
Product Application - Game Console
CPU
(PBY)
Controller I/F
(NBI)
USB/1394/LAN/HDD Interface
Wireless LAN(NBQ)(CLH)(CL)(CS,LCN)(BPF)(Balun)
Blu-ray Disc/DVD(BA)
( NBI)
(SQV)
DC-DC Converter(PBY)
(CMM)
(SCDS)
AC Adapter(RH)
(TFU)
(ET/UT)
GraphicProcessing
(MHCC)
(NBI,NBQ)
Controller(NBI)(CMM)(SLF)(SCDS)(LVS)(RH)
(CMM)(PBY)
(LVF)
37
Product Application - LCD TV
(NBI, CL) (CLH)
(CS, LCN)(SQV)
Tuner(NBI,CL) (BA)
(LVS)(SQV)
DSP
(PBY) (CMM)
USB/1394/HDMI Interface
AC Adapter(RH)
(TFU)
(ET/UT)
WiFi(MPB)
DC-DC Converter(PBY) (CMM)(SCDS)
Clock(NBI)
Memory Card Interface(NBI) (CMM)
(LVF)
LCD Back Lighting
(LVS) (SCDS)
(LVF)
(LVF)
Audio(LVS) (SCDS)
38
Product Application – Set Top Box
39
Power ManagementDC-DC Converter(Bead-PBY)(CMM)(LVS/LVF)(LVC/LVT)(SCDS104R)(MHCC)
RF Modulator(Bead)(CL/CLH)(CS)
Video/Audio InterfaceUSB/IEEE1394/HDMI/DVI(PBY)(CMM)
Digital Signal Processing(Bead-NBI)(CL)(LVS/LVF)(LVC/LVT)(SQV)(SCDS10xR)
AV Decorder(Bead Array-BA)(Bead-NBI/PBY)(SQV)
Power Management SystemDC-DC Converter(Bead-PB)(SQV)(LVS/LVF)(SCD/SCDS)(MHCC)(DMI/CPU)
Product Application – Femtocell Base Station
RF Modulator(Bead)(CL/CLH)(CS)
Baseband Processing(Bead-NBI)(CS)(LVS/LVF)(CMM)
AntennaWiFi Cellular(CLH)(CS)(LVS/LVF)
Network InterfaceUSB(CMM)
Product Application - Solar Inverter
41
DC-DC ConverterDC-AC Converter(BC)
Product Application - Automotive
42
Electronic Control Units(ECU for climate control, lighting, communication…)
Controller ASICS-Filtering AEC Q200Power Supply-SMPS Buck AEC Q200
-EMI Filtering AEC Q200-Switching Mode Power AEC Q200-Air Flow Control AEC Q200
(Bead)(MHCC)(SCDS5D2x)
DC-DC Converter(MHCC)(LVS/LVF)(SCDS5D2x)
Standard: AEC-Q200
Soldering Temp.: JEDEC-202-C
Product Application - Automotive
43
Safety & Amenity
ETC System(Bead)(CLH)(CS/HQ)(MP)(SLF)(SCDS)
HID Head-lightingBallast-EMI FilteringLED Daylighting-Power Switch
-SMPS Buck/Boost-Current Regulated
(Bead)(MHCC)(SL)(LVS/LVF)(MP)(SLF06xx/07xx/10xx/12xx)(CLH)(CS/HQ)
Power Seat/Window(Bead)(CLH)(CS/HQ)(CL)
Keyless Entry(Bead) (CS/HQ)(CL)(NL)
Power Antenna(Bead) (CLH)(CL)(CS/HQ)
Air Conditioner (Bead) (CL)
Application - Automotive
44
Car Entertainment Device
Audio/Stereo SystemEMI Filtering(Bead)
USB(CMM)
Signal(CS/CT/HQ/HC)
DC-DC Converter(CLH)(SCDS5D2x)(SCDS6D2X)(LVS/LVF)(MHCC)(TC)(BC)(BCB)
Navigation SystemLCD Display/Power Supply Line(Bead)(CL)
DC-DC Converter/Power Supply Unit(Bead)(MP)(SLF)(SCDS6x)(SCDS10x)
45
Product Application – Home Appliances
AC Adapter(RH)
(ET/UT)
(TFU)
Power Management(SQV/SQC)(LVS/LVF)(SCD/SCDS)(MHCC)(DMI/CPU)(SF)
DC-DC ConverterAC-DC Converter(BC)(BCB)
46
Product Application – LED Lighting
EMI Solution (Bead) for Power(SBK)(PBY)(UPB)
DC-DC ConverterAC-DC Converter(BC)(BCB/SBCB)
Power Management
(SQV/SQC)(LVS/LVF)(SCDS)(MHCC)(SL/PDR)
47
Thank you!