Post on 19-Jul-2020
transcript
– 1 –E01410B23-PS
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license byany implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating theoperation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
ICX274AQ
20 pin DIP (Plastic)Description
The ICX274AQ is a diagonal 8.923mm (Type 1/1.8)interline CCD solid-state image sensor with a squarepixel array and 2.01M effective pixels. Progressivescan allows all pixels' signals to be outputindependently within approximately 1/15 second,and output is also possible using various additionand pulse elimination methods. This chip features anelectronic shutter with variable charge-storage timewhich makes it possible to realize full-frame stillimages without a mechanical shutter. High resolutionand high color reproductivity are achieved throughthe use of R, G, B primary color mosaic filters as thecolor filters. Further, high sensitivity and low darkcurrent are achieved through the adoption of SuperHAD CCD technology.
This chip is suitable for applications such aselectronic still cameras, PC input cameras, etc.
Features• High horizontal and vertical resolution• Supports the following modes
Progressive scan mode (with/without mechanical shutter)2/8-line readout mode2/4-line readout mode2-line addition modeCenter scan modes (1), (2) and (3)AF modes (1) and (2)
• Square pixel• Horizontal drive frequency: 28.6364MHz (typ.), 36.0MHz (max.)• Reset gate bias are not adjusted• R, G, B primary color mosaic filters on chip• High sensitivity, low dark current• Continuous variable-speed shutter function• Excellent anti-blooming characteristics• 20-pin high-precision plastic package
Device Structure• Interline CCD image sensor• Image size: Diagonal 8.923mm (Type 1/1.8)• Total number of pixels: 1688 (H) × 1248 (V) approx. 2.11M pixels• Number of effective pixels: 1628 (H) × 1236 (V) approx. 2.01M pixels• Number of active pixels: 1620 (H) × 1220 (V) approx. 1.98M pixels• Recommended number of
recording pixels: 1600 (H) × 1200 (V) approx. 1.92M pixels• Chip size: 8.50mm (H) × 6.80mm (V)• Unit cell size: 4.40µm (H) × 4.40µm (V)• Optical black: Horizontal (H) direction: Front 12 pixels, rear 48 pixels
Vertical (V) direction: Front 10 pixels, rear 2 pixels• Number of dummy bits: Horizontal 28
Vertical 1• Substrate material: Silicon
Optical black position(Top View)
2
10
V
H
Pin 1
Pin 11 4812
∗ Wfine CCD is trademark of Sony corporation.Represents a CCD adopting progressive scan, primary color filter and square pixel.
Diagonal 8.923mm (Type 1/1.8) Progressive Scan CCD Image Sensor with Square Pixel for Color Cameras
– 2 –
ICX274AQ
11 12 13 14 15 16 17 18 19 20
Horizontal register
Note)
VD
D
φRG
Hφ 2
B
Hφ1
B
GN
D
φSU
B
CS
UB VL
Hφ1
A
Hφ2
A
10 9 8 7 6 5 4 3 2 1
VO
UT
GN
D
Vφ1
Vφ2
C
Vφ2
B
Vφ2
A
Vφ3
C
Vφ3
B
Vφ3
A
Vφ4
B
G
B
G
B
G
R
G
R
G
B
G
B
G
B
G
R
G
R
G
GRGR
B
G
G
R
B
G
G
RVert
ical
regi
ster
Note) : Photo sensor
Block Diagram and Pin Configuration(Top View)
Pin Description
∗1 DC bias is generated within the CCD, so that this pin should be grounded externally through a capacitance of0.1µF.
Pin No. Symbol Description Pin No. Symbol Description
1
2
3
4
5
6
7
8
9
10
Vφ4
Vφ3A
Vφ3B
Vφ3C
Vφ2A
Vφ2B
Vφ2C
Vφ1
GND
VOUT
Vertical register transfer clock
Vertical register transfer clock
Vertical register transfer clock
Vertical register transfer clock
Vertical register transfer clock
Vertical register transfer clock
Vertical register transfer clock
Vertical register transfer clock
GND
Signal output
11
12
13
14
15
16
17
18
19
20
VDD
φRG
Hφ2B
Hφ1B
GND
φSUB
CSUB
VL
Hφ1A
Hφ2A
Supply voltage
Reset gate clock
Horizontal register transfer clock
Horizontal register transfer clock
GND
Substrate clock
Substrate bias∗1
Protective transistor bias
Horizontal register transfer clock
Horizontal register transfer clock
– 3 –
ICX274AQ
Absolute Maximum Ratings
∗2 +24V (Max.) is guaranteed when clock width < 10µs, clock duty factor < 0.1%.+16V (Max.) is guaranteed during power-on or power-off.
Item
VDD, VOUT, φRG – φSUB
Vφ2α, Vφ3α – φSUB (α = A to C)
Vφ1, Vφ4, VL – φSUB
Hφ1β, Hφ2β, GND – φSUB (β = A, B)
CSUB – φSUB
VDD, VOUT, φRG, CSUB – GND
Vφ1, Vφ2α, Vφ3α, Vφ4 – GND (α = A to C)
Hφ1β, Hφ2β – GND (β = A, B)
Vφ2α, Vφ3α – VL (α = A to C)
Vφ1, Vφ4, Hφ1β, Hφ2β, GND – VL (β = A, B)
Voltage difference between vertical clock input pins
Hφ1β – Hφ2β (β = A, B)
Hφ1β, Hφ2β – Vφ4 (β = A, B)
Against φSUB
Against GND
Against VL
Between inputclock pins
Storage temperature
Guaranteed temperature of performance
Operating temperature
–40 to +12
–50 to +15
–50 to +0.3
–40 to +0.3
–25 to
–0.3 to +22
–10 to +18
–10 to +6.5
–0.3 to +28
–0.3 to +15
to +15
–6.5 to +6.5
–10 to +16
–30 to +80
–10 to +60
–10 to +75
V
V
V
V
V
V
V
V
V
V
V
V
V
°C
°C
°C
∗2
Ratings Unit Remarks
– 4 –
ICX274AQ
Bias Conditions
∗1 Progressive scan mode, 2/8-line readout mode, 2/4-line readout mode, center scan modes (1) and (3),and AF modes (1) and (2)
∗2 2-line addition mode and center scan mode (2)∗3 VL setting is the VVL voltage of the vertical clock waveform, or the same voltage as the VL power supply
for the V driver should be used.∗4 Substrate voltage (VSUB2) setting value indication
The substrate voltage (VSUB) for modes without line addition is generated internally.The substrate voltage setting value for use with vertical 2-line addition is indicated by a code on thebottom surface of the image sensor. Adjust the substrate voltage to the indicated voltage.
VSUB2 code – 1-digit indication ↑
VSUB2 code
The code and the actual value correspond as follows.
[Example] "h" indicates a VSUB2 setting of 11.6V.
∗5 Do not apply a DC bias to the reset gate clock pin, because a DC bias is generated within the CCD.
DC characteristics
Supply current
Item
IDD
Symbol
10.0
Min. Unit RemarksTyp. Max.
mA13.07.0
J
11.8
K
12.0
L
12.2
m
12.4
N
12.6
P
12.8
R
13.0
S
13.2
U
13.4
V
13.6
W
13.8
X
14.0
Y
14.2
Z
14.4
VSUB2 code
Actual value
1
8.8
2
9.0
3
9.2
4
9.4
6
9.6
7
9.8
8
10.0
9
10.2
A
10.4
C
10.6
d
10.8
E
11.0
f
11.2
G
11.4
h
11.6
VSUB2 code
Actual value
Supply voltage
Protective transistor bias
Substrate voltageadjustment range
Substrate voltage adjustment accuracy
Reset gate clock
Item
VDD
VL
VSUB
VSUB2
ΔVSUB
φRG
Symbol
15.0∗3
Internally generated value
Indicatedvoltage
∗5
Min.
V
V
V
V
Unit
∗4
RemarksTyp. Max.
No line addition∗1
2-line addition∗2
14.55
8.8
Indicatedvoltage – 0.2
15.45
14.4
Indicatedvoltage + 0.2
– 5 –
ICX274AQ
Clock Voltage Conditions
Readout clockvoltage
Vertical transferclock voltage
Horizontal transferclock voltage
Reset gate clockvoltage
Substrate clockvoltage
Item
VVT
VVH1, VVH2
VVH3, VVH4
VVL1, VVL2,VVL3, VVL4
VφV
VVH3 – VVH
VVH4 – VVH
VVHH
VVHL
VVLH
VVLL
VφH
VHL
VCR
VφRG
VRGLH – VRGLL
VRGL – VRGLm
VφSUB
Symbol
14.55
–0.05
–0.2
–8.0
6.8
–0.25
–0.25
4.75
–0.05
0.8
3.0
21.5
Min.
15.0
0
0
–7.5
7.5
5.0
0
2.5
3.3
22.5
Typ.
15.45
0.05
0.05
–7.0
8.05
0.1
0.1
0.5
0.5
0.5
0.5
5.25
0.05
5.25
0.4
0.5
23.5
Max. Unit
1
2
2
2
2
2
2
2
2
2
2
3
3
3
4
4
4
5
Waveformdiagram
VVH = (VVH1 + VVH2)/2
VVL = (VVL3 + VVL4)/2
VφV = VVHn – VVLn (n = 1 to 4)
High-level coupling
High-level coupling
Low-level coupling
Low-level coupling
Cross-point voltage
Low-level coupling
Low-level coupling
Remarks
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
– 6 –
ICX274AQ
Clock Equivalent Circuit Constants
Note 1) Expressions using parentheses such as CφV2 (A,B), 3C indicate items which include all combinations ofthe pins within the parentheses.For example, CφV2 (A, B), 3C indicates [CφV2A3C, CφV2B3C].
CφV1
CφV2A, CφV2B
CφV2C
CφV3A, CφV3B
CφV3C
CφV4
CφV12 (A, B)
CφV12C
CφV13 (A, B)
CφV13C
CφV14
CφV2 (A, B), 3 (A, B)
CφV2 (A, B), 3C
CφV2 (A, B), 4
CφV2C, 3 (A, B)
CφV2C, 3C
CφV2C, 4
CφV3 (A, B), 4
CφV3C, 4
CφH1
CφH2
CφHH
CφRG
CφSUB
R1, R4
R2 (A, B, C), 3 (A, B, C)
RGND
RφH
RφH2
RφRG
Symbol
Capacitance between vertical transfer clock andGND
Capacitance between vertical transfer clocks
Capacitance between horizontal transfer clockand GND
Capacitance between horizontal transfer clocks
Capacitance between reset gate clock and GND
Capacitance between substrate clock and GND
Vertical transfer clock series resistor
Vertical transfer clock ground resistor
Horizontal transfer clock series resistor
Horizontal transfer clock ground resistor
Reset gate clock and series resistor
Item Min.
3300
1200
2700
1000
1800
6800
120
220
150
270
2700
470
680
680
1000
820
1800
820
1500
100
100
47
2
820
30
62
15
7
20
4.7
Typ. Max.
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
Ω
Ω
Ω
Ω
kΩ
Ω
Unit Remarks
– 7 –
ICX274AQ
Horizontal transfer clock equivalent circuit
Reset gate clock equivalent circuitVertical transfer clock equivalent circuit
Note 2) Cφ2α2β and Cφ3α3β (α = A to C, β = A to C other than α) aresufficiently small relative to other capacitance betweenother vertical clocks in the equivalent circuit, so theseare omitted from the equivalent circuit diagram.
Vφ4
Vφ1
Vφ2α (α = A to C)
Vφ3α (α = A to C)
CφV2α4 (α = A to C)
RGND
CφV1
CφV3α (α = A to C)
CφV4 CφV2α (α = A to C)
CφV2α3α (α = A to C)CφV3α4 (α = A to C)
CφV12α (α = A to C)
CφV13α (α = A to C)
CφV14
R4
R3α (α = A to C)
R1
R2α (α = A to C)
Hφ1B Hφ2B
CφH1 CφH2
CφHH
RφH
RφH2
RφH
Hφ1A Hφ2A
RφHRφH
RGφRφRG
CφRG
– 8 –
ICX274AQ
Drive Clock Waveform Conditions
(1) Readout clock waveform
VVH = (VVH1 + VVH2)/2VVL = (VVL3 + VVL4)/2VφV = VVHn – VVLn (n = 1 to 4)
(2) Vertical transfer clock waveform
100%90%
10%0%
tr tf0V
twh
φM2
φM
VVT
VVH1 VVHH
VVHL
VVH
VVLHVVL1
VVLL
VVHL
VVHH
VVL
VVH2
VVHHVVHH
VVHL
VVHL
VVH
VVLHVVL2
VVLL
VVL
VVHHVVH
VVLH
VVLL
VVL
VVHL
VVL3
VVHLVVH3
VVHH
VVH
VVL
VVHL
VVLH
VVLL
VVHLVVH4
VVHH VVHH
VVL4
Vφ1 Vφ3A, Vφ3B, Vφ3C
Vφ2A, Vφ2B, Vφ2C Vφ4
– 9 –
ICX274AQ
VHL
VCR
twl
two
twh
VφH
VφH
2
tr
Hφ2β
90%
10%Hφ1β
tf
RG waveform
VRGLH
VRGH
VRGLVRGLL
VRGLm
tr twh
twl
tf
VφRG
Point A
VSUB
(Internally generated bias)
100%90%
10%0%
tr tftwh
φM2
φM
VφSUB
(3) Horizontal transfer clock waveform
Cross-point voltage for the Hφ1β rising side of the horizontal transfer clocks Hφ1β and Hφ2β waveforms is VCR.The overlap period for twh and twl of horizontal transfer clocks Hφ1β and Hφ2β is two. (β = A, B)
(4) Reset gate clock waveform
VRGLH is the maximum value and VRGLL is the minimum value of the coupling waveform during the period fromPoint A in the above diagram until the rising edge of RG.In addition, VRGL is the average value of VRGLH and VRGLL.
VRGL = (VRGLH + VRGLL)/2Assuming VRGH is the minimum value during the interval twh, then:
VφRG = VRGH – VRGL
Negative overshoot level during the falling edge of RG is VRGLm.
(5) Substrate clock waveform
– 10 –
ICX274AQ
∗1 When two vertical transfer clock drivers CXD3400N are used.∗2 tf ≥ tr – 2ns, and the cross-point voltage (VCR) for the Hφ1β (β = A, B) rising side of the Hφ1β and Hφ2β
waveforms must be VφH/2 [V] or more.
Clock Switching Characteristics (Horizontal drive frequency: 28.6364MHz)
Min.
twh
Typ. Max.Min. Typ. Max. Min. Typ. Max. Min. Typ. Max.
twl tr tf
3.3
10
10
4
3.5
12.5
12.5
7
2.1
10
10
12.5
12.5
24
0.5
5
5
2
7.5
7.5
0.5
15
0.5
5
5
3
400
7.5
7.5
0.5
Unit
µs
ns
ns
ns
µs
Remarks
Duringreadout
∗1
∗2
During draincharge
Item
Readout clock
Vertical transferclock
Horizontaltransfer clock
Reset gate clock
Substrate clock
Symbol
VT
Vφ1, Vφ4,Vφ2α, Vφ3α(α = A to C)
Hφ1β (β = A, B)
Hφ2β (β = A, B)
φRG
φSUB
Min.
two
Typ. Max.
8 10
Unit
ns
RemarksItem
Horizontaltransfer clock
Symbol
Hφ1A, Hφ1B,Hφ2A, Hφ2B
Clock Switching Characteristics (Horizontal drive frequency: 36MHz)
Min.
twh
Typ. Max.Min. Typ. Max. Min. Typ. Max. Min. Typ. Max.
twl tr tf
4.0
8
8
4
4.2
9
9
5.5
1.67
8
8
9
9
8
0.5
5
5
2
6
6
0.25
15
0.5
5
5
3
400
6
6
0.25
Unit
µs
ns
ns
ns
µs
Remarks
Duringreadout
∗1
∗2
During draincharge
Item
Readout clock
Vertical transferclock
Horizontaltransfer clock
Reset gate clock
Substrate clock
Symbol
VT
Vφ1, Vφ4,Vφ2α, Vφ3α(α = A to C)
Hφ1β (β = A, B)
Hφ2β (β = A, B)
φRG
φSUB
Min.
two
Typ. Max.
8 9
Unit
ns
RemarksItem
Horizontaltransfer clock
Symbol
Hφ1A, Hφ1B,Hφ2A, Hφ2B
– 11 –
ICX274AQ
Spectral Sensitivity Characteristics (excludes lens characteristics and light source characteristics)
1.0
Rel
ativ
e R
espo
nse
0.8
B G R
0.6
0.4
0.2
0400 450 500 550
Wave Length [nm]
600 650 700
– 12 –
ICX274AQ
∗1 Vsat2 is the saturation signal level in 2-line addition mode, and is 200mV per pixel.∗2 Progressive scan mode, 2/8-line readout mode, 2/4-line readout mode, and center scan modes (1) and (3).∗3 2-line addition mode and center scan mode (2).∗4 Same for 2-line addition mode and center scan modes (2) and (3).∗5 Same for center scan mode (1).∗6 Same for AF modes (1) and (2).∗7 Excludes vertical dark signal shading caused by vertical register high-speed transfer.
Image Sensor Characteristics (Ta = 25°C)
Item
G Sensitivity
Sensitivitycomparison
Saturation signal
Smear
Video signal shading
Uniformity betweenvideo signal channels
Dark signal
Dark signal shading
Line crawl G
Line crawl R
Line crawl B
Lag
Symbol
Sg
Rr
Rb
Vsat
Vsat2∗1
Sm
SH
ΔSrg
ΔSbg
Vdt
ΔVdt
Lcg
Lcr
Lcb
Lag
Min.
335
0.35
0.45
400
400
Typ.
420
0.5
0.6
–100
–94
–88
Max.
545
0.65
0.75
–92
–86
–80
20
25
8
8
8
2
3.8
3.8
3.8
0.5
Unit
mV
mV
dB
%
%
mV
mV
%
%
%
%
Measurementmethod
1
1
1
2
3
4
5
6
7
8
8
8
9
Remarks
1/30s accumulation
Ta = 60°C
Progressive scan mode∗4
2/4-line readout mode∗5
2/8-line readout mode∗6
Zone 0 and I
Zone 0 to II’
Ta = 60°C, 14.985 frame/s
Ta = 60°C, 14.985 frame/s, ∗7
R
B
No line addition∗2
2-line addition∗3
– 13 –
ICX274AQ
Image Sensor Characteristics Measurement Method
Color coding of this image sensor & Readout
The primary color filters of this image sensor are arranged in the layoutshown in the figure on the left (Bayer arrangement).Gr and Gb denote the G signals on the same line as the R signal and theB signal, respectively.
Gb B Gb B
R Gr R Gr
Gb B Gb B
R Gr R Gr
Horizontal register
Color Coding Diagram
4
V10
4
8
8
Ignored regionEffective pixel region
Zone 0, I
Zone II, II’
V10
H8
H8
1628 (H)
1236 (V)
Zone Definition of Video Signal Shading
Measurement System
CCD C.D.S S/H
S/H
AMP
CCD signal output [∗A]
Gr/Gb channel signal output [∗B]
R/B channel signal output [∗C]
Note) Adjust the amplifier gain so that the gain between [∗A] and [∗B], and between [∗A] and [∗C] equals 1.
– 14 –
ICX274AQ
Note) Blacked out portions in the diagram indicate pixels which are not read out.Output starts from line 1 in 2/8-line decimation mode.
1. Progressive scan modeIn this mode, all pixel signals are output in non-interlace format in 1/14.985s.All pixel signals within the same exposure period are read out simultaneously, making this mode suitablefor high resolution image capturing.
2. 2/8-line readout modeAll effective area signals are output in approximately 1/30s by reading out the signals for only two out ofeight lines (1st and 6th lines, 9th and 14th lines).This readout mode emphasizes processing speed over vertical resolution, making it suitable for AE/AF andother control and for checking images on LCD viewfinders.
3. 2/4-line readout modeAll effective area signals are output in approximately 1/20s by reading out the signals for only two out offour lines (3rd and 4th lines, 7th and 8th lines, and so on).
Readout modes
The diagrams below and on the following pages show the output methods for the following nine readoutmodes.
2/4-line readout modeProgressive scan mode 2/8-line readout mode
16 (V2C/V3C)
15 (V2C/V3C)
14 (V2A/V3A)
13 (V2B/V3B)
12 (V2C/V3C)
11 (V2C/V3C)
10 (V2B/V3B)
9 (V2A/V3A)
8 (V2C/V3C)
7 (V2C/V3C)
6 (V2A/V3A)
5 (V2B/V3B)
4 (V2C/V3C)
3 (V2C/V3C)
2 (V2B/V3B)
1 (V2A/V3A)
VOUT
G
R
G
R
G
R
G
R
G
R
G
R
G
R
R
G
B
G
B
G
B
G
B
G
B
G
B
G
B
G
G
B
16 (V2C/V3C)
15 (V2C/V3C)
14 (V2A/V3A)
13 (V2B/V3B)
12 (V2C/V3C)
11 (V2C/V3C)
10 (V2B/V3B)
9 (V2A/V3A)
8 (V2C/V3C)
7 (V2C/V3C)
6 (V2A/V3A)
5 (V2B/V3B)
4 (V2C/V3C)
3 (V2C/V3C)
2 (V2B/V3B)
1 (V2A/V3A)
VOUT
G
R
G
R
G
R
G
R
G
R
G
R
G
R
R
G
B
G
B
G
B
G
B
G
B
G
B
G
B
G
G
B
16 (V2C/V3C)
15 (V2C/V3C)
14 (V2A/V3A)
13 (V2B/V3B)
12 (V2C/V3C)
11 (V2C/V3C)
10 (V2B/V3B)
9 (V2A/V3A)
8 (V2C/V3C)
7 (V2C/V3C)
6 (V2A/V3A)
5 (V2B/V3B)
4 (V2C/V3C)
3 (V2C/V3C)
2 (V2B/V3B)
1 (V2A/V3A)
VOUT
G
R
G
R
G
R
G
R
G
R
G
R
G
R
R
G
B
G
B
G
B
G
B
G
B
G
B
G
B
G
G
B
– 15 –
ICX274AQ
Note) Blacked out portions in the diagram indicate pixels which are not read out.After reading out the pixels indicated by and transferring two lines, the pixels indicated by are read out and two pixels of the same color are added by the vertical transfer block.
4. 2-line addition modeIn this mode, the signals for only two out of four lines (3rd and 4th lines, 7th and 8th lines, and so on) areread out, the vertical register is shifted by 2 bits, and then the signals of the remaining two out of the fourlines (1st and 2nd lines, 5th and 6th lines, and so on) are read out and added within the vertical register. Alleffective area signals are output in approximately 1/20s.
5. Center scan mode (1)In this mode, the signals for only two out of four lines (3rd and 4th lines, 7th and 8th lines, and so on) areread out. The undesired portions are swept by vertical register high-speed transfer, and the vertical1136-pixel region in the center of the picture is output by the above readout method. The number ofoutput lines is 568 lines at 36MHz, and 434 lines at 28.6364MHz. The frame rate is increased(approximately 30 frames/s) by setting the number of output lines to that of VGA mode, making thismode suitable for VGA moving pictures. (However, the angle of view decreases.)
6. Center scan mode (2)In this mode, the signals for only two out of four lines (3rd and 4th lines, 7th and 8th lines, and so on) areread out, the vertical register is shifted by 2 bits, and then the signals of the remaining two out of the fourlines (1st and 2nd lines, 5th and 6th lines, and so on) are read out and added within the vertical register.The undesired portions are swept by vertical register high-speed transfer, and the vertical 1136-pixel regionin the center of the picture is output by the above readout method. The number of output lines is 568 linesat 36MHz, and 434 lines at 28.6364MHz. The frame rate is increased (approximately 30 frames/s) bysetting the number of output lines to that of VGA mode, making this mode suitable for VGA moving pictures.(However, the angle of view decreases.)
Center scan mode (2)2-line addition mode Center scan mode (1)
16 (V2C/V3C)
15 (V2C/V3C)
14 (V2A/V3A)
13 (V2B/V3B)
12 (V2C/V3C)
11 (V2C/V3C)
10 (V2B/V3B)
9 (V2A/V3A)
8 (V2C/V3C)
7 (V2C/V3C)
6 (V2A/V3A)
5 (V2B/V3B)
4 (V2C/V3C)
3 (V2C/V3C)
2 (V2B/V3B)
1 (V2A/V3A)
VOUT
G
R
G
R
G
R
G
R
G
R
G
R
G
R
R
G
B
G
B
G
B
G
B
G
B
G
B
G
B
G
G
B
16 (V2C/V3C)
15 (V2C/V3C)
14 (V2A/V3A)
13 (V2B/V3B)
12 (V2C/V3C)
11 (V2C/V3C)
10 (V2B/V3B)
9 (V2A/V3A)
8 (V2C/V3C)
7 (V2C/V3C)
6 (V2A/V3A)
5 (V2B/V3B)
4 (V2C/V3C)
3 (V2C/V3C)
2 (V2B/V3B)
1 (V2A/V3A)
VOUT
G
R
G
R
G
R
G
R
G
R
G
R
G
R
R
G
B
G
B
G
B
G
B
G
B
G
B
G
B
G
G
B
16 (V2C/V3C)
15 (V2C/V3C)
14 (V2A/V3A)
13 (V2B/V3B)
12 (V2C/V3C)
11 (V2C/V3C)
10 (V2B/V3B)
9 (V2A/V3A)
8 (V2C/V3C)
7 (V2C/V3C)
6 (V2A/V3A)
5 (V2B/V3B)
4 (V2C/V3C)
3 (V2C/V3C)
2 (V2B/V3B)
1 (V2A/V3A)
VOUT
G
R
G
R
G
R
G
R
G
R
G
R
G
R
R
G
B
G
B
G
B
G
B
G
B
G
B
G
B
G
G
B
– 16 –
ICX274AQ
Note) Blacked out portions in the diagram indicate pixels which are not read out.
7. Center scan mode (3)This is the center scan mode using the progressive scan method.The undesired portions are swept by vertical register high-speed transfer, and the picture center is cut out.The number of output lines is 580 lines at 36MHz, and 444 lines at 28.6364MHz.
8. AF mode (1)In this mode, the undesired portions are swept by vertical register high-speed transfer, and the vertical940-pixel region in the center of the picture is output in approximately 1/60s by reading out the signals foronly two out of eight lines (1st and 6th lines, 9th and 14th lines). The number of output lines is 235 lines at36MHz, and 170 lines at 28.6364MHz. This mode aims for even faster AF control than 2/8-line readoutmode.
9. AF mode (2)In this mode, the undesired portions are swept by vertical register high-speed transfer, and the vertical300-pixel region in the center of the picture is output in approximately 1/120s by reading out the signals foronly two out of eight lines (1st and 6th lines, 9th and 14th lines). The number of output lines is 75 lines at36MHz, and 43 lines at 28.6364MHz. This mode aims for even faster AF control than 2/8-line readoutmode.
AF mode (2)Center scan mode (3) AF mode (1)
16 (V2C/V3C)
15 (V2C/V3C)
14 (V2A/V3A)
13 (V2B/V3B)
12 (V2C/V3C)
11 (V2C/V3C)
10 (V2B/V3B)
9 (V2A/V3A)
8 (V2C/V3C)
7 (V2C/V3C)
6 (V2A/V3A)
5 (V2B/V3B)
4 (V2C/V3C)
3 (V2C/V3C)
2 (V2B/V3B)
1 (V2A/V3A)
VOUT
G
R
G
R
G
R
G
R
G
R
G
R
G
R
R
G
B
G
B
G
B
G
B
G
B
G
B
G
B
G
G
B
16 (V2C/V3C)
15 (V2C/V3C)
14 (V2A/V3A)
13 (V2B/V3B)
12 (V2C/V3C)
11 (V2C/V3C)
10 (V2B/V3B)
9 (V2A/V3A)
8 (V2C/V3C)
7 (V2C/V3C)
6 (V2A/V3A)
5 (V2B/V3B)
4 (V2C/V3C)
3 (V2C/V3C)
2 (V2B/V3B)
1 (V2A/V3A)
VOUT
G
R
G
R
G
R
G
R
G
R
G
R
G
R
R
G
B
G
B
G
B
G
B
G
B
G
B
G
B
G
G
B
16 (V2C/V3C)
15 (V2C/V3C)
14 (V2A/V3A)
13 (V2B/V3B)
12 (V2C/V3C)
11 (V2C/V3C)
10 (V2B/V3B)
9 (V2A/V3A)
8 (V2C/V3C)
7 (V2C/V3C)
6 (V2A/V3A)
5 (V2B/V3B)
4 (V2C/V3C)
3 (V2C/V3C)
2 (V2B/V3B)
1 (V2A/V3A)
VOUT
G
R
G
R
G
R
G
R
G
R
G
R
G
R
R
G
B
G
B
G
B
G
B
G
B
G
B
G
B
G
G
B
– 17 –
ICX274AQ
Center scan and AF modes
Description of Center Scan and AF Mode Operation
The center scan and AF modes realize high frame rates by sweeping the top and bottom of the picture withhigh-speed transfer and cutting out the center of the picture.The various readout modes during center scan and AF operation are described below.
• AF modesAF mode (1), (2): The output method is the same as readout in 2/8-line readout mode.
• Center scan modesCenter scan mode (1): The output method is the same as 2/4-line readout mode.Center scan mode (2): The output method consists of 2-line addition readout whereby the signals for only
two out of four lines (3rd and 4th lines, 7th and 8th lines, and so on) are read out,the vertical register is shifted by 2 bits, and then the signals of the remaining twoout of the four lines (1st and 2nd lines, 5th and 6th lines, and so on) are read outand added within the vertical register.
Center scan mode (3): The output method is the same as progressive scan mode.
The readout method, frame rate, number of output lines and other information for each readout mode areshown in the table below.
Undesired portions (Swept by vertical register high-speed transfer)
Picture center cut-out portion
ModeFrame rate (frame/s)
Progressive scan mode
2/8-line readout mode
2/4-line readout mode
2-line addition mode
Center scan mode (1)
Center scan mode (2)
Center scan mode (3)
AF mode (1)
AF mode (2)
Progressive scan
2/8-line readout
2/4-line readout
2/4-line readout
2/4-line readout
2-line addition readout
Progressive scan
2/8-line readout
2/8-line readout
None
None
None
Vertical 2-line
None
Vertical 2-line
None
None
None
9.99
29.97
19.98
19.98
29.97
29.97
29.97
59.94
119.88
14.985
29.97
19.98
19.98
29.97
29.97
29.97
59.94
119.88
1220
305
610
1220
434
434
444
170
43
1220
305
610
1220
568
568
580
235
75
Number of outputeffective pixel datalinesReadout method Addition
method28.6MHz 36MHz 28.6MHz 36MHz
– 18 –
ICX274AQ
Measurement conditions
(1) In the following measurements, the device drive conditions are at the typical values of the bias and clockvoltage conditions, and the progressive scan readout mode is used.
(2) In the following measurements, spot blemishes are excluded and, unless otherwise specified, the opticalblack level (OB) is used as the reference for the signal output, which is taken as the value of the Gr/Gbsignal output or the R/B signal output of the measurement system.
Definition of standard imaging conditions
(1) Standard imaging condition I:Use a pattern box (luminance: 706cd/m2, color temperature of 3200K halogen source) as a subject.(Pattern for evaluation is not applicable.) Use a testing standard lens with CM500S (t = 1.0mm) as an IRcut filter and image at F5.6. The luminous intensity to the sensor receiving surface at this point is definedas the standard sensitivity testing luminous intensity.
(2) Standard imaging condition II:Image a light source (color temperature of 3200K) with a uniformity of brightness within 2% at all angles.Use a testing standard lens with CM500S (t = 1.0mm) as an IR cut filter. The luminous intensity is adjustedto the value indicated in each testing item by the lens diaphragm.
1. SensitivitySet to the standard imaging condition I. After setting the electronic shutter mode with a shutter speed of1/100s, measure the signal voltages (VGr, VGb) at the center of each Gr and Gb channel screen, andsubstitute the values into the following formulas.
VG = (VGr + VGb)/2
Sg = VG × [mV]
2. Saturation signalSet to the standard imaging condition II. After adjusting the luminous intensity to 20 times the intensity withthe average value of the G channel signal output, 150mV, measure the minimum values of the G, R and Bsignal outputs.
3. SmearSet to standard imaging condition II. With the lens diaphragm at F5.6 to F8, first adjust the average valueof the Gr signal output to 150mV. Measure the average values of the Gr signal output, Gb signal output, Rsignal output and B signal output (Gra, Gba, Ra, Ba), and then adjust the luminous intensity to 500 timesthe intensity with the average value of the Gr signal output, 150mV. After the readout clock is stopped andthe charge drain is executed by the electronic shutter at the respective H blankings, measure the maximumvalue (Vsm [mV]) independent of the Gr, Gb, R and B signal outputs, and substitute the values into thefollowing formula.Smear in modes other than progressive scan mode is calculated from the storage time and signaladdition method. As a result, 2-line addition mode and center scan modes (2) and (3) are the same asprogressive scan mode, 2/4-line readout mode and center scan mode (1) are two times progressive scanmode, and 2/8-line readout mode and AF modes (1) and (2) are four times progressive scan mode.
Sm = 20 × log (Vsm ÷ × × ) [dB] (1/10V method conversion value)
10030
110
1500
Gra + Gba + Ra + Ba4
– 19 –
ICX274AQ
4. Video signal shadingSet to the standard imaging condition II. With the lens diaphragm at F5.6 to F8, adjusting the luminousintensity so that the average value of the G channel signal output is 150mV. Then measure the maximumvalue (Gmax [mV]) and minimum value (Gmin [mV]) of the G signal output and substitute the values intothe following formula.
SH = (Gmax – Gmin)/150 × 100 [%]
5. Uniformity between video signal channelsAfter measuring 4, measure the maximum (Rmax [mV]) and minimum (Rmin [mV]) values of the R signaland the maximum (Bmax [mV]) and minimum (Bmin [mV]) values of the B signal, and substitute the valuesinto the following formulas.
ΔSrg = (Rmax – Rmin)/150 × 100 [%]ΔSbg = (Bmax – Bmin)/150 × 100 [%]
6. Dark signalMeasure the average value of the signal output (Vdt [mV]) with the device ambient temperature of 60°Cand the device in the light-obstructed state, using the horizontal idle transfer level as a reference.
7. Dark signal shadingAfter measuring 6, measure the maximum (Vdmax [mV]) and minimum (Vdmin [mV]) values of the darksignal output and substitute the values into the following formula.
ΔVdt = Vdmax – Vdmin [mV]
8. Line crawlSet to the standard imaging condition II. Adjusting the luminous intensity so that the value of the Gr signaloutput is 150mV, and then insert R, G and B filters and measure the difference between G signal lines(ΔGlr, ΔGlg, ΔGlb [mV]) as well as the value of the G signal output (Gar, Gag, Gab). Substitute the valuesinto the following formula.
Lci = × 100 [%] (i = r, g, b)
9. LagAdjust the Y signal output generated by the strobe light to 150mV. After setting the strobe light so that itstrobes with the following timing, measure the residual signal amount (Vlag). Substitute the value into thefollowing formula.
Lag = (Vlag/150) × 100 [%]
ΔGliGai
VD
Light
Output
Strobe light timing
Vlag (lag)Y signal output 150mV
– 20 –
ICX274AQ
Dri
ve C
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– 21 –
ICX274AQ
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36MHz
28.6MHz
28.6MHz
36MHz
CC
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UT
– 22 –
ICX274AQ
Dri
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1
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– 23 –
ICX274AQ
Dri
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– 24 –
ICX274AQ
Dri
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– 25 –
ICX274AQ
Dri
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4
– 26 –
ICX274AQ
Not
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36MHz
28.6MHz
28.6MHz
36MHz
CC
DO
UT
– 27 –
ICX274AQ
Dri
ve T
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g C
hart
(Hor
izon
tal S
ync)
2/8-
line
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– 28 –
ICX274AQ
Dri
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(Ver
tical
Syn
c)2/
8-lin
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ode
"a"
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H1A
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4
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– 29 –
ICX274AQ
Dri
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(Ver
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Syn
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36MHz
28.6MHz
28.6MHz
36MHz
CC
DO
UT
"a"
"a"
– 30 –
ICX274AQ
Dri
ve T
imin
g C
hart
(Hor
izon
tal S
ync)
2/4-
line
Rea
dout
Mod
e
RG
CLK
SH
P
SH
D
H1A
/H1B
H2A
/H2B
12070 152
11
121
2835
4
446
14
V1
V2A
/V2B
/V2C
V3A
/V3B
/V3C V
4
SU
B
154
1
901
54
181
1 1 1 1
154
90
1
1
54
138
541
154
154
901
102
190
1
154
1
361
84120
90
1
112
60
282
– 31 –
ICX274AQ
Dri
ve T
imin
g C
hart
(Ver
tical
Syn
c)2/
4-lin
e R
eado
ut M
ode
"a"
enla
rged
H1A
/H1B V
1
V2C
V2A
/V2B
V3C
V3A
/V3B V
4
1854
1818
1818
1818
1818
1818
1818
1818
5415
018
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
66
600
750
– 32 –
ICX274AQ
Dri
ve T
imin
g C
hart
(Ver
tical
Syn
c)2-
line
Add
ition
Mod
e
HD V1
VD
V2C
V2A
/V2B V
4
V3C
V3A
/V3B
"a"
"a"
871
693
625
123456789
10
871
693
625
123456789
10
43
78
1256
65
9103478
12301229
12331234
12
12321231
12351236
1229
43
78
1256
65
9103478
123012331234
12
1231123212351236
36MHz
28.6MHz
28.6MHz
36MHz
CC
DO
UT
Not
e)T
he 8
71H
hor
izon
tal p
erio
d at
36M
Hz
is 9
00cl
k; t
he 6
93H
hor
izon
tal p
erio
d at
28M
Hz
is 8
10cl
k.
– 33 –
ICX274AQ
Dri
ve T
imin
g C
hart
(Hor
izon
tal S
ync)
2-lin
e A
dditi
on M
ode
RG
CLK
SH
P
SH
D
H1A
/H1B
H2A
/H2B
12070 152
11
121
2835
4
446
14
V1
V2A
/V2B
/V2C
V3A
/V3B
/V3C V
4
SU
B
154
1
901
54
181
1 1 1 1
154
90
1
1
54
138
541
154
154
901
102
190
1
154
1
361
84120
90
1
112
60
282
– 34 –
ICX274AQ
Dri
ve T
imin
g C
hart
(Ver
tical
Syn
c)2-
line
Add
ition
Mod
e
"a"
enla
rged
H1A
/H1B V
1
V2C
V2A
/V2B
V3C
V3A
/V3B V
4
1854
1818
1818
1818
1818
1818
1818
1818
5415
018
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
66
600
750
– 35 –
ICX274AQ
Dri
ve T
imin
g C
hart
(Ver
tical
Syn
c)C
ente
r S
can
Mod
e (1
)/(28
.6M
Hz)
HD V1
VD
V2C
V2A
/V2B V
4
V3C
V3A
/V3B
"d"
"a"
"b"
"a"
"b"
"d"
462461
459458
460
452451
453
450
123456789
10
15
17
462461
459460
453
451452
450
123456789
10
15
17
188191192195
10551052
1048
188191192
105110521055
CC
DO
UT
Not
e)T
he 4
62H
hor
izon
tal p
erio
d is
123
0clk
.
– 36 –
ICX274AQ
Dri
ve T
imin
g C
hart
(Ver
tical
Syn
c)C
ente
r S
can
Mod
e (1
)/(36
MH
z)
Not
e)T
he 5
81H
hor
izon
tal p
erio
d is
601
clk.
HD V1
VD
V2C
V2A
/V2B V
4
V3C
V3A
/V3B
"d"
"a"
"b"
"a"
"b"
"d"
581580
578577576
579
123456789
10
581580
578579
577576
123456789
10
60
555659
1188
1183
11871184
55565960
1183118411871188
CC
DO
UT
– 37 –
ICX274AQ
Dri
ve T
imin
g C
hart
(Ver
tical
Syn
c)C
ente
r S
can
Mod
e (1
)
"a"
enla
rged
H1A
/H1B V
1
V2C
V2A
/V2B
V3C
V3A
/V3B V
4
1854
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1866
600
750
– 38 –
ICX274AQ
Dri
ve T
imin
g C
hart
(Ver
tical
Syn
c)C
ente
r S
can
Mod
e (1
)/(28
.6M
Hz)
"b"
enla
rged
H1A
/H1B V
1
V2C
V2A
/V2B
V3C
V3A
/V3B V
4
1818
1818
1818
1818 #5
#6#1
8718
1818
1818
1818
18
2793
6 bi
ts
2898
0 bi
ts =
14H
– 39 –
ICX274AQ
Dri
ve T
imin
g C
hart
(Ver
tical
Syn
c)C
ente
r S
can
Mod
e (1
)/(36
MH
z)
"b"
enla
rged
H1A
/H1B V
1
V2C
V2A
/V2B
V3C
V3A
/V3B V
4
1818
1818
1818
1818 #5
#6#5
218
1818
1818
1818
18
8784
bits
1035
0 bi
ts =
5H
– 40 –
ICX274AQ
Dri
ve T
imin
g C
hart
(Ver
tical
Syn
c)C
ente
r S
can
Mod
e (2
)/(28
.6M
Hz)
Not
e)T
he 4
62H
hor
izon
tal p
erio
d is
123
0clk
.
HD V1
VD
V2C
V2A
/V2B V
4
V3C
V3A
/V3B
"d"
"a"
"b"
"a"
"d"
"b"
462461
459458
460
454453
455456457
452
123456789
10
15
18
462461
459460
458
456457
455
453454
452
123456789
10
15
18
186189190193
10531050
10551052
1046
186189190
188191192
104910501053
188191192195
1048105110521055
CC
DO
UT
– 41 –
ICX274AQ
Dri
ve T
imin
g C
hart
(Ver
tical
Syn
c)C
ente
r S
can
Mod
e (2
)/(36
MH
z)
Not
e)T
he 5
81H
hor
izon
tal p
erio
d is
601
clk.
HD V1
VD
V2C
V2A
/V2B V
4
V3C
V3A
/V3B
"d"
"a"
"b"
"a"
"b"
"d"
581580
578577576
579
123456789
10
581580
578579
577576
123456789
10
58
535457
60
555659
1188
1183
11871184
53545758
55565960
1183118411871188
1186
1181
11851182
1181118211851186
CC
DO
UT
– 42 –
ICX274AQ
Dri
ve T
imin
g C
hart
(Ver
tical
Syn
c)C
ente
r S
can
Mod
e (2
)
"a"
enla
rged
H1A
/H1B V
1
V2C
V2A
/V2B
V3C
V3A
/V3B V
4
1854
1818
1818
1818
1818
1818
1818
1818
5415
018
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1866
600
750
– 43 –
ICX274AQ
Dri
ve T
imin
g C
hart
(Ver
tical
Syn
c)C
ente
r S
can
Mod
e (2
)/(28
.6M
Hz)
"b"
enla
rged
H1A
/H1B V
1
V2C
V2A
/V2B
V3C
V3A
/V3B V
4
1818
1818
1818
1818
# (3
+ 5
)#
(4 +
6)
# (1
85 +
187
)18
1818
1818
1818
18
2793
6 bi
ts
2898
0 bi
ts =
14H
– 44 –
ICX274AQ
Dri
ve T
imin
g C
hart
(Ver
tical
Syn
c)C
ente
r S
can
Mod
e (2
)/(36
MH
z)
"b"
enla
rged
H1A
/H1B V
1
V2C
V2A
/V2B
V3C
V3A
/V3B V
4
1818
1818
1818
1818
# (3
+ 5
)#
(4 +
6)
# (5
0 +
52)
1818
1818
1818
1818
8784
bits
1035
0 bi
ts =
5H
– 45 –
ICX274AQ
Dri
ve T
imin
g C
hart
(H
oriz
onta
l Syn
c)C
ente
r S
can
Mod
es (
1) a
nd (
2)
RG
CLK
SH
P
SH
D
H1A
/H1B
H2A
/H2B
12070 152
11
121
2835
4
446
14
V1
V2A
/V2B
/V2C
V3A
/V3B
/V3C V
4
SU
B
154
1
901
90
181
1 1 1 1
154
90
1
1
54
138
541
154
154
901
102
190
1
154
1
361
84120
90
1
112
60
282
– 46 –
ICX274AQ
Dri
ve T
imin
g C
hart
(Ver
tical
Syn
c)C
ente
r S
can
Mod
es (1
) and
(2)/(
28.6
MH
z)
"d"
enla
rged
H1A
/H1B
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
#2#1
#3#2
22
1656
0 bi
ts
1
V1
V2C
V2A
/V2B
V3C
V3A
/V3B V
4
– 47 –
ICX274AQ
Dri
ve T
imin
g C
hart
(Ver
tical
Syn
c)C
ente
r S
can
Mod
es (1
) and
(2)/(
36M
Hz)
"d"
enla
rged
H1A
/H1B
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
#2#1
#3#6
3
6210
bits
1
V1
V2C
V2A
/V2B
V3C
V3A
/V3B V
4
– 48 –
ICX274AQ
Dri
ve T
imin
g C
hart
(Ver
tical
Syn
c)C
ente
r S
can
Mod
e (3
)/(28
.6M
Hz)
HD V1
VD V2
V4
V3
478479
497496
"a"
"d"
"b"
"a"
"b"
"d"
498123456
32333435
478479
497496
498123456
32333435
839
397398
840
839
397398
840
CC
DO
UT
Not
e)T
he 4
98H
hor
izon
tal p
erio
d is
126
0clk
.
– 49 –
ICX274AQ
Dri
ve T
imin
g C
hart
(Ver
tical
Syn
c)C
ente
r S
can
Mod
e (3
)/(36
MH
z)
HD V1
VD V2
V4
V3
609610
625624
"a"
"d"
"b"
"a"
"b"
"d"
626123456
2728293031
609610
625624
626123456
27282930
907
329330
908
907
329330
908
CC
DO
UT
Not
e)T
he 6
26H
hor
izon
tal p
erio
d is
120
0clk
.
– 50 –
ICX274AQ
Dri
ve T
imin
g C
hart
(Hor
izon
tal S
ync)
Cen
ter
Sca
n M
ode
(3)
RG
CLK
SH
P
SH
D
H1A
/H1B
H2A
/H2B
11920 152
11
121
2820
4
296
14
V1
V2A
/V2B
/V2C
V3A
/V3B
/V3C V
4
SU
B
1
90
181
541
541
154
190
136
1
91
7811496132
60
135
1 1 1 1 1
– 51 –
ICX274AQ
Dri
ve T
imin
g C
hart
(Ver
tical
Syn
c)C
ente
r S
can
Mod
e (3
)
"a"
enla
rged
H1A
/H1B V
1
V2A
/V2B
/V2C
V3A
/V3B
/V3C V
4
1818
1818
1818
1818
6018
1818
1818
1100
1250
– 52 –
ICX274AQ
Dri
ve T
imin
g C
hart
(Ver
tical
Syn
c)C
ente
r S
can
Mod
e (3
)/(28
.6M
Hz)
"b"
enla
rged
H1A
/H1B V
1
V2C
V2A
/V2B
V3C
V3A
/V3B V
4
1818
1818
1818
1818
1818
1818
1818
1818
5860
8 bi
ts
5952
0 bi
ts =
31H
– 53 –
ICX274AQ
Dri
ve T
imin
g C
hart
(Ver
tical
Syn
c)C
ente
r S
can
Mod
e (3
)/(36
MH
z)
"b"
enla
rged
H1A
/H1B V
1
V2C
V2A
/V2B
V3C
V3A
/V3B V
4
1818
1818
1818
1818
1818
1818
1818
1818
4881
6 bi
ts
4992
0 bi
ts =
26H
– 54 –
ICX274AQ
Dri
ve T
imin
g C
hart
(Ver
tical
Syn
c)C
ente
r S
can
Mod
e (3
)/(28
.6M
Hz)
"d"
enla
rged
H1A
/H1B
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
#2#1
#3#3
98
3456
0 bi
ts
1
V1
V2C
V2A
/V2B
V3C
V3A
/V3B V
4
– 55 –
ICX274AQ
Dri
ve T
imin
g C
hart
(Ver
tical
Syn
c)C
ente
r S
can
Mod
e (3
)/(36
MH
z)
"d"
enla
rged
H1A
/H1B
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
#2#1
#3#3
30
2880
0 bi
ts
1
V1
V2C
V2A
/V2B
V3C
V3A
/V3B V
4
– 56 –
ICX274AQ
Dri
ve T
imin
g C
hart
(Ver
tical
Syn
c)A
F M
ode
(1)/(
28.6
MH
z)
HD V1
VD
V2A
V2B
/V2C V
4
CC
DO
UT
V3A
V3B
/V3C
"a"
"b"
"d"
"a"
"d"
"b"
204203202201
191190
12345678
19202122
204203202201
191190
123456789
19202122
286289
958953
286289
958953
Not
e)T
he 2
03 a
nd 2
04H
hor
izon
tal p
erio
ds a
re 1
323c
lk.
– 57 –
ICX274AQ
Dri
ve T
imin
g C
hart
(Ver
tical
Syn
c)A
F M
ode
(1)/(
36M
Hz)
HD V1
VD
V2A
V2B
/V2C V
4
CC
DO
UT
V3A
V3B
/V3C
"a"
"b"
"d"
"a"
"d"
"b"
256255254
249248
123456789
1110
121314
256255254
249248
123456789
1011121314
153158
10891086
153158
10891086
Not
e)T
he 2
56H
hor
izon
tal p
erio
d is
840
clk.
– 58 –
ICX274AQ
Dri
ve T
imin
g C
hart
(Ver
tical
Syn
c)A
F M
ode
(1)/(
28.6
MH
z)
"b"
enla
rged
H1A
/H1B V
1
V2C
V2A
/V2B
V3C
V3A
/V3B V
4
1818
1818
1818
1818
1818
1818
1818
1818
4190
4 bi
ts
4233
6 bi
ts =
18H
– 59 –
ICX274AQ
Dri
ve T
imin
g C
hart
(Ver
tical
Syn
c)A
F M
ode
(1)/(
36M
Hz)
"b"
enla
rged
H1A
/H1B V
1
V2C
V2A
/V2B
V3C
V3A
/V3B V
4
1818
1818
1818
1818
1818
1818
1818
1818
2289
6 bi
ts
2352
0 bi
ts =
10H
– 60 –
ICX274AQ
Dri
ve T
imin
g C
hart
(Ver
tical
Syn
c)A
F M
ode
(1)/(
28.6
MH
z)
"d"
enla
rged
H1A
/H1B
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
#2#1
#3#3
39
2587
2 bi
ts
1
V1
V2C
V2A
/V2B
V3C
V3A
/V3B V
4
– 61 –
ICX274AQ
Dri
ve T
imin
g C
hart
(Ver
tical
Syn
c)A
F M
ode
(1)/(
36M
Hz)
"d"
enla
rged
H1A
/H1B
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
#2#1
#3#1
80
1411
2 bi
ts
1
V1
V2C
V2A
/V2B
V3C
V3A
/V3B V
4
– 62 –
ICX274AQ
Dri
ve T
imin
g C
hart
(Ver
tical
Syn
c)A
F M
ode
(2)/(
28.6
MH
z)
HD V1
VD
V2A
V2B
/V2C V
4
CC
DO
UT
V3A
V3B
/V3C
"a"
"b"
"d"
"a"
"d"
"b"
102101100
8081
123456789
35363738
102101100
8081
123456789
35363738
537542
702705
537542
702705
Not
e)T
he 1
02H
hor
izon
tal p
erio
d is
132
3clk
.
– 63 –
ICX274AQ
Dri
ve T
imin
g C
hart
(Ver
tical
Syn
c)A
F M
ode
(2)/(
36M
Hz)
HD V1
VD
V2A
V2B
/V2C V
4
CC
DO
UT
V3A
V3B
/V3C
"a"
"b"
"d"
"a"
"d"
"b"
128127126
108109
123456789
31323334
128127126
108109
123456789
31323334
473478
766769
473478
766769
Not
e)T
he 1
28H
hor
izon
tal p
erio
d is
159
6clk
.
– 64 –
ICX274AQ
Dri
ve T
imin
g C
hart
(Ver
tical
Syn
c)A
F M
ode
(2)/(
28.6
MH
z)
"b"
enla
rged
H1A
/H1B V
1
V2C
V2A
/V2B
V3C
V3A
/V3B V
4
1818
1818
1818
1818
1818
1818
1818
1818
7819
2 bi
ts
7996
8 bi
ts =
34H
– 65 –
ICX274AQ
Dri
ve T
imin
g C
hart
(Ver
tical
Syn
c)A
F M
ode
(2)/(
36M
Hz)
"b"
enla
rged
H1A
/H1B V
1
V2C
V2A
/V2B
V3C
V3A
/V3B V
4
1818
1818
1818
1818
1818
1818
1818
1818
6897
6 bi
ts
7056
0 bi
ts =
30H
– 66 –
ICX274AQ
Dri
ve T
imin
g C
hart
(Ver
tical
Syn
c)A
F M
ode
(2)/(
28.6
MH
z)
"d"
enla
rged
H1A
/H1B
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
#2#1
#3#6
40
4704
0 bi
ts
1
V1
V2C
V2A
/V2B
V3C
V3A
/V3B V
4
– 67 –
ICX274AQ
Dri
ve T
imin
g C
hart
(Ver
tical
Syn
c)A
F M
ode
(2)/(
36M
Hz)
"d"
enla
rged
H1A
/H1B
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
#2#1
#3#5
64
4233
6 bi
ts
1
V1
V2C
V2A
/V2B
V3C
V3A
/V3B V
4
– 68 –
ICX274AQ
Dri
ve T
imin
g C
hart
(Hor
izon
tal S
ync)
AF
Mod
es (
1) a
nd (
2)
RG V1
V2A
V2B
/V2C V3A
V3B
/V3C V
4
SU
B
CLK
SH
P
SH
D
H1A
/H1B
H2A
/H2B
154
1
11
9018
190
190
172
541
541
541
60
154
1
154
154
154
154
901
901
901
160
36
154
1
154
154
154
154
901
901
901
160
36
190
1
154
154
154
154
901
901
90
160
190
1
154
154
154
154
901
901
90
160
190
1
154
1 1
361
541
541
118
901
901
90
60
11
960
567
12352 152
11
121
2863
6
728
14
– 69 –
ICX274AQ
Dri
ve T
imin
g C
hart
(Ver
tical
Syn
c)A
F M
odes
(1)
and
(2)
"a"
enla
rged
H1A
/H1B V
1
V2A
V2B
/V2C V3A
V3B
/V3C V
4
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1842
1100
1250
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1818
1860
1818
1818
1818
1818
1818
1818
1818
1818
– 70 –
ICX274AQ
Notes of Handling
1) Static charge preventionCCD image sensors are easily damaged by static discharge. Before handling be sure to take the followingprotective measures.a) Either handle bare handed or use non-chargeable gloves, clothes or material.
Also use conductive shoes.b) When handling directly use an earth band.c) Install a conductive mat on the floor or working table to prevent the generation of static electricity.d) Ionized air is recommended for discharge when handling CCD image sensors.e) For the shipment of mounted substrates, use boxes treated for the prevention of static charges.
2) Solderinga) Make sure the package temperature does not exceed 80°C.b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a ground 30W
soldering iron and solder each pin in less than 2 seconds. For repairs and remount, cool sufficiently.c) To dismount an image sensor, do not use a solder suction equipment. When using an electric
desoldering tool, use a thermal controller of the zero-cross On/Off type and connect it to ground.
3) Dust and dirt protectionImage sensors are packed and delivered by taking care of protecting its glass plates from harmful dust anddirt. Clean glass plates with the following operations as required, and use them.a) Perform all assembly operations in a clean room (class 1000 or less).b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should
dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionizedair is recommended.)
c) Clean with a cotton bud and ethyl alcohol if grease stained. Be careful not to scratch the glass.d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when
moving to a room with great temperature differences.e) When a protective tape is applied before shipping, just before use remove the tape applied for
electrostatic protection. Do not reuse the tape.
4) Installing (attaching)a) Remain within the following limits when applying a static load to the package. Do not apply any load
more than 0.7mm inside the outer perimeter of the glass portion, and do not apply any load or impact tolimited portions. (This may cause cracks in the package.)
b) If a load is applied to the entire surface by a hard component, bending stress may be generated and thepackage may fracture, etc., depending on the flatness of the bottom of the package. Therefore, forinstallation, use either an elastic load, such as a spring plate, or an adhesive.
Plastic package
Cover glass
Compressive strength
50N50N 1.2Nm
Torsional strength
– 71 –
ICX274AQ
c) The adhesive may cause the marking on the rear surface to disappear, especially in case the regulatedvoltage value is indicated on the rear surface. Therefore, the adhesive should not be applied to this area,and indicated values should be transferred to other locations as a precaution.
d) The notch of the package is used for directional index, and that can not be used for reference of fixing.In addition, the cover glass and seal resin may overlap with the notch of the package.
e) If the leads are bent repeatedly and metal, etc., clash or rub against the package, the dust may begenerated by the fragments of resin.
f) Acrylate anaerobic adhesives are generally used to attach CCD image sensors. In addition, cyano-acrylate instantaneous adhesives are sometimes used jointly with acrylate anaerobic adhesives.(reference)
5) Othersa) Do not expose to strong light (sun rays) for long periods, as color filters will be discolored. When high
luminous objects are imaged with the exposure level controlled by the electronic iris, the luminance ofthe image-plane may become excessive and discoloring of the color filter will possibly be accelerated. Insuch a case, it is advisable that taking-lens with the automatic-iris and closing of the shutter during thepower-off mode should be properly arranged. For continuous using under cruel condition exceeding thenormal using condition, consult our company.
b) Exposure to high temperature or humidity will affect the characteristics. Accordingly avoid storage orusage in such conditions.
c) Brown stains may be seen on the bottom or side of the package. But this does not affect the CCDcharacteristics.
d) This package has 2 kinds of internal structure. However, their package outline, optical size, and strengthare the same.
The cross section of lead frame can be seen on the side of the package for structure A.
Structure A Structure B
Chip
Metal plate(lead frame)
Package
Cross section oflead frame
– 72 –
ICX274AQ
Sony Corporation
20 p
in D
IP
B
~
B'
M
A
11
C
HV
D
12.2
PAC
KA
GE
STR
UC
TUR
E
PAC
KA
GE
MAT
ER
IAL
LEA
D T
RE
ATM
EN
T
LEA
D M
ATE
RIA
L
PAC
KA
GE
MA
SS
DR
AWIN
G N
UM
BE
R
Pla
stic
GO
LD P
LATI
NG
42 A
LLO
Y
AS
-B6-
02(E
)
0.95
g
1.“A
” is
the
cent
er o
f the
effe
ctiv
e im
age
area
.
2.Th
e tw
o po
ints
“B
” of
the
pack
age
are
the
horiz
onta
l ref
eren
ce.
The
poin
t “B
'” o
f the
pac
kage
is th
e ve
rtic
al re
fere
nce.
3.Th
e bo
ttom
“C
” of
the
pack
age,
and
the
top
of th
e co
ver g
lass
“D
”ar
e th
e he
ight
refe
renc
e.
4.Th
e ce
nter
of t
he e
ffect
ive
imag
e ar
ea re
lativ
e to
“B
” an
d “B
'”is
(H, V
) = (6
.9, 6
.0) ±
0.0
75m
m.
5.Th
e ro
tatio
n an
gle
of th
e ef
fect
ive
imag
e ar
ea re
lativ
e to
H a
nd V
is ±
1˚.
6.Th
e he
ight
from
the
botto
m “
C”
to th
e ef
fect
ive
imag
e ar
ea is
1.4
1 ±
0.10
mm
.Th
e he
ight
from
the
top
of th
e co
ver g
lass
“D
” to
the
effe
ctiv
e im
age
area
is 1
.49
± 0.
15m
m.
7.Th
e til
t of t
he e
ffect
ive
imag
e ar
ea re
lativ
e to
the
botto
m “
C”
is le
ss th
an 5
0µm
.Th
e til
t of t
he e
ffect
ive
imag
e ar
ea re
lativ
e to
the
top
“D”
of th
e co
ver g
lass
is le
ss th
an 5
0µm
.
8.Th
e th
ickn
ess
of th
e co
ver g
lass
is 0
.5m
m, a
nd th
e re
fract
ive
inde
x is
1.5
.
9.Th
e no
tche
s on
the
botto
m o
f the
pac
kage
are
use
d on
ly fo
r dire
ctio
nal i
ndex
, the
y m
ust
not b
e us
ed fo
r ref
eren
ce o
f fix
ing.
~ ~
0.25
1.7
1.7
1.7
1120
1.7
10
12.0 ± 0.12.9 ± 0.15 3.5 ± 0.3
13.8
± 0
.1
12.7
10
2011
6.9
10.9
0˚ to 9˚
6.0
2.40.5
0.8
2.5 9.0
2.5 0.5
0.8
1.27
0.3
0.310
.02.
5
Pack
age
Out
line
U
nit:
mm