Post on 23-Dec-2015
transcript
Diamond
ILJIN DIAMOND Co., Ltd.
IRD seriesIljin Resin & Vitrified bond Dia-mond
Diamond
IRD - series
Application Tungsten Carbide, WC/Steel, Ceramic Grind-ing PCBN, PCD, WC Tool Grinding Granite Tile Grinding Resin Bond Wheel Vitrified Bond Wheel
Physical Properties Bare Diamond Density : 3.52g/cc 30wt% Nickel Coated Density : 4.22g/cc 56wt% Nickel Coated Density : 5.20g/cc
Available Mesh Size From 80/100 to 400/500
56wt% Nickel Coat-ing
30wt% Nickel Coat-ing
IRD-III
IRD-F
IRD-II
Diamond
Toughness Index
0
10
20
30
40
50
60
70
60/ 70 80/ 100 120/ 140 170/ 200 230/ 270 325/ 400
IRD-F
IRDⅡ
IRDⅢ
TI valu
e
Mesh Size
Comparison of tough-ness
Mesh size 140/170 230/270 325/400
IRD-F 20.0 30.0 43.0
PDA-211 22.0 27.0 25.8
RVG-810 23.4 28.8 42.3
PDA-321 27.4 32.0 34.8
IRDⅡ 37.0 41.0 48.0
RVG 40.0 43.8 50.0
IRDⅢ 40.0 47.0 53.0
Diamond
Crystal Shape
Poly vs Single crystal
(140/170mesh)
IRD-II
IRD-III
IRD-F
IRD-H
10%
27%48%
95%
90%
73%
52%
5%
IRD-F IRDⅡ IRDⅢ IRD-H
Single Crystal
Poly Crystal
Diamond
RVG-810 PDA-211
IRD-F
Morphology (IRD-F)
Diamond
Forma
RVG
SinglePoly
Du
rezz
aTe
nace
Fri
ab
ile
CSG
RVG-810
SPR
RVG-800PDA-321
PDA-211
IRD-II
IRD-III
IRD-F
IRD-HWC+ Steel
Cermets, Ceramics
PDA-433
PDA-446
WC, PCD/PCBN
PDA-311
WC + PCD
Applicazioni
Diamond
Products Metal wt % Density (g/cc)
IRD-II, III, F, H - 3.52
IRD-II N30Nickel 30 % 4.22
IRD-III N30
IRD-II N56
Nickel 56 % 5.20IRD-III N56
IRD-FN
IRD-HN
Net (ct) Gross (ct)
1,000 1,000
1,000 1,429
1,000 2,273
Coated IRD
Item N NS New coating
Element Ni Ni Cu, Ag..
Morphology Cluster Spiky Cluster
Metal Weight % 30, 56, 60 56 50
Available mesh size 80/100 ~ 400/500 80/100 ~ 400/500 80/100 ~ 400/500
Products
Nickel coatings
Diamond
Cluster typeCluster type
Spiky typeSpiky type
N coating & NS coating
N
NS
IRD II N56 IRD II N56
IRD II NS56 IRD II NS56
Diamond
80/100 D181 ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎
100/120 D151 ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎
120/140 D126 ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎
140/170 D107 ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎
170/200 D91 ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎
200/230 D76 ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎
230/270 D64 ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎
270/325 D54 ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎
325/400 D46 ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎
400/500 D40 ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎
US MESH FEPA
IRD Ⅱ IRD III IRD-F IRD-H
BARE N30 N56 BARE N30 N56 BARE N BARE N
Available size
Diamond
Case Study
Diamond
100%95%
98%
111%104%
100%
51% 50%43%
31%
IRD II-N56 IRD III-N56 RVG-W IRV-NP PDA-311NX
G-ratio
Power Performance
Tungsten Carbide Grinding
Area Korea
Industry
Part Name
Operation Surface Grinding
Workpiece Material
P20E (Tool Grade, HRc 76~78, WC 2 ㎛ )51WC-8(2TaC-1NbC)-32(7WC-3TiC)-9Co
Wheel Spe-cific
Resin (Phenol)1A1, Φ150mm, Concentration 100
Diamond & cBN
170/200
Process Pa-rameters
Wheel Vs : 1,696m/min (28.3m/s)Table speed : 14m/minDepth of cut : 0.025mmFeed rate : 80m/min
Results
Remark
Diamond
143%
113%101%100% 100% 100%
G-ratio Removal Rate Power
IRD-II N56 IRD-III N56
Tungsten Carbide Die Grind-ingArea Korea
Industry
Part Name Die
Operation Cylindrical Grinding
Workpiece Material
WC + 13%Co, Φ320mm
Wheel Spe-cific
Resin (Polyimide)1A1, Φ305mm
Diamond & cBN
IRD-III N56 140/170
Process Pa-rameters
Wheel Vs : 1,500m/minWorkpiece Vs : 30~38m/minDepth of cut : 0.07mmFeed rate : 40m/min
Results
Remark
Diamond
100%
111%
100%
78%
IRD II-N56 RVG-W
G-ratio
Power Performance
Tungsten Carbide Die Grind-ing
Area Korea
Industry
Part Name Die
Operation Cylindrical Grinding
Workpiece Material
WC + 13%Co, Φ320mm
Wheel Spe-cific
Resin (Phenol)1A1, Φ305mm
Diamond & cBN
IRD-III N56 140/170
Process Pa-rameters
Wheel Vs : 1,724m/minWorkpiece Vs : 32.2m/minDepth of cut : 0.05mmFeed rate : 80m/min
Results
Remark
Diamond
IRD III-N56 PDA-321 N55 RVG-W50
75
100
125
150
175
Gri
nd
ing
Ra
tio
Customer Test Result
0 2 4 6 8 10 1220
30
40
50
60
70
80
IRD III-N56 PDA-321 N55 RVG-W
Grin
ding
For
ce (
N)
The amount of accumulated material removal (cm 3
)
Area Japan
Industry
Part Name
Operation Traverse Grinding
Workpiece Material
Tungsten Carbide (K-20)
Wheel Spe-cific
Resin (Phenol)175D – 3X – 6T – 50.8H
Diamond & cBN
IRD-III 230/270
Process Pa-rameters
Wheel Speed Vs : 1,540m/minDepth a : 0.020mmTable Speed F : 10m/min
Results
Remark
Diamond
PCD Insert Grinding
Area Korea
Industry
Part Name PCD Insert
Operation Tool Grinding
Workpiece Material
PCD (coarse Grade)
Wheel Spe-cific
Vitrified
Diamond & cBN
IRD-II, IRD-III 400/500
Process Pa-rameters
Wheel Speed= 1,800rpmDepth a= 1.5mm/minTable Speed F=N/A
ResultsIRD-III : Long tool lifeIRD-II : High grinding speed & low chip-ping
Remark
31
25
22
30
15
2019
15
18
STD IRD-II IRD-III
Wheel Wear (um/ea) Grinding Speed (sec/ea)
Chipping (um)
Diamond
Customer Performance Test
Area Japan
Industry
Part Name
Operation Plunge Grinding
Workpiece Material
Tungsten Carbide
Wheel Spe-cific
Resin (Phenol)175D – 3X – 6T
Diamond & cBN
IRD-FN 230/270 vs. RVG890
Process Pa-rameters
Wheel Vs = 1,540m/minDepth a=0.02mm/path Table Speed F=10m/min
Results
Remark
0 5 10 1530
40
50
60
70
Grin
ding
For
ce (
N)
Volume Removed (cm 3 )
IRD-FN
RVG 890
50
100
150
200
RVG-890IRD-FN
Grin
ding
Rat
io
Diamond
Customer Performance TestArea Japan
Industry
Part Name Tungsten Carbide
OperationMachine : Okamoto PSG52DXVertical
Workpiece Material
Tungsten Carbide (K20)120*100*4mm
Wheel SpecificResinΦ150-8U-Φ50.8H, SDC140N100BS40
Diamond & cBN
IRD-III N56 140/170* Competitor : PDA311N55
Process Pa-rameters
Wheel Vs = 1600m/minDepth a=0.02mm/path Traverse speed F=15m/minCoolant = Chemical solution 5%
Results
연삭저항 : 정상상태에서 IRD-III 가 기존품(standard) 대비 10% 높다 .휠마모 : 연삭비로 IRD-III 가 50% 높다표면조도 : IRD-III 가 25% 작다가공후 지립관찰 IRD-III 의 파쇄 지립이 적다
Remark
Diamond
Cermet Grinding (Cu Coating)
52
100
144
Competitive IRD-C50
97
치수변화 Wheel WearGrinding Power
Area Japan
Industry Cutting Tool
Part Name Cermet Insert
OperationTool Grinding AP-50 (WAIDA MFG Co., Ltd)
Workpiece Ma-terial
High Toughness Cermet (TNMA331)
Wheel SpecificResin BondCup Wheel Type
Diamond & cBN
IRD-C50
Process Pa-rameters
Wheel Vs = 1500m/minTraverse Speed : 10mm/min
Results
10 개의 Tip 가공 . #1~#10 가공 시 , 연삭력이 저하되면서 Δ(d0-d) 가 증가함 . 기존 Cu 코팅 사용 Wheel 은 Δ 가 지속적으로 증가하지만 , 당사 Cu 코팅 사용시 Δ 가 거의 없이 , 일정한 연삭력 유지
Remark
#1: d=A#2: d+ Δ(d2-d)=B#3: d+ Δ(d3-d2)=C…#10: d+ Δ(d10-d9)=J
A<B<C<…<J A≒B≒C≒ … ≒J
Δd
Δd
Competitor IRD-C50