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RT9399®
DS9399-00 February 2018 www.richtek.com1
©Copyright 2018 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
Applications Applications for Power Conversion
Ordering Information
Note :
Richtek products are :
RoHS compliant and compatible with the current require-
ments of IPC/JEDEC J-STD-020.
Suitable for use in SnPb or Pb-free soldering processes.
General Description
The RT9399 is a highly integrated step-up charge pump
and inverting charge pump to generate positive and negative
output voltage. The RT9399 is available in the XDFN-12SL
3x1.5 package to achieve optimized solution for PCB
space.
Features 2.5V to 4.5V Supply Voltage Range
Over 80% Average Efficiency of Battery Life
Support up to 50mA Output Current
Low 1μμμμμA Shutdown Current
Internal Soft-Start Function
Short Circuit Protection Function
x2 Mode for Positive Voltage and x−−−−−1 Mode for
Negative Voltage
Low Input Noise and EMI
Available in 12S-Lead XDFN Package
RoHS Compliant and Halogen Free
Simplified Application Circuit
Dual Channel Charge Pump Controller
Pin Configuration
(TOP VIEW)
XDFN-12SL 3x1.5
VOPVON
MDEN
C3PC3NC2P
C1PC2N
GND
VIN C1N
GN
D
13 7
8
9
10
11
121
6
5
4
3
2Marking Information
C2N
GND
CF3
VIN
C1P C1N C2P
RT9399
EN
C3P
CF2CF1
CINC3N
VOP
VIN
COP
VOP
VONCON
VONMD
Package TypeQX : XDFN-12SL 3x1.5 (X-Type)
Lead Plating SystemG : Green (Halogen Free and Pb Free)
RT9399
0EW
0E : Product Code
W : Date Code
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Functional Pin Description
Functional Block Diagram
Pin No. Pin Name Pin Function
1 VOP Positive terminal output.
2 VON Negative terminal output.
3 GND Ground.
4 EN Charge pump enable.
5 MD Charge pump mode selection. (Connect to GND for X2 mode)
6 VIN Power input.
7 C1N Fly capacitor 1 negative connection.
8 C1P Fly capacitor 1 positive connection.
9 C2N Fly capacitor 2 negative connection.
10 C2P Fly capacitor 2 positive connection.
11 C3N Fly capacitor 3 negative connection.
12 C3P Fly capacitor 3 positive connection.
13 (Exposed Pad) GND Ground exposed paddle (Bottom). Connect to ground.
Operation
The RT9399 is a highly integrated step-up charge pump
and inverting charge pump to generate positive and negative
output voltages. It can support input voltage range from
2.5V to 4.5V and the output current up to 50mA. During
start-up procedure, the RT9399 provides soft-start function
to avoid inrush current. It also provides Over-Temperature
Protection (OTP) and Short-Circuit Protection (SCP)
mechanisms to prevent the device from damage with
abnormal operations. When the EN voltage is logic low
for more than 1ms, the IC will be shut down. In shutdown
mode, the input supply current for the device is less than
1μA.
VIN
VON
Soft-Start
x2Charge Pump
UVLO
OTP
VOP
x-1 Charge Pump
Bandgap Reference
VREF
GND
C1P C2PC1N C2N
ENMD
+
- VREFCurrent Limit
(SCP)
C3P C3N
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Electrical Characteristics
Parameter Symbol Test Conditions Min Typ Max Unit
Input Supply
Input Voltage Range VIN 2.5 -- 4.5 V
Under-Voltage Lockout Threshold Voltage
VUVLO 1.9 2 2.1 V
Under-Voltage Lockout Hysteresis Voltage
VHYS -- 100 -- mV
Switching Frequency fSW -- 1000 -- kHz
VIN Shutdown Current ISHDN EN = MD = 0V -- -- 1 A
General
System Efficiency
η1 VIN = 3.3V, IOP = ION = 15mA -- 84 --
% η2 VIN = 3.3V, IOP = ION = 30mA -- 86 --
η3 VIN = 3.3V, IOP = ION = 50mA -- 85 --
VOP Output Ripple VOP VIN = 3.3V, IOP = ION = 10mA (Note 5)
-- 10 -- mV
VON Output Ripple VON VIN = 3.3V, IOP = ION = 10mA (Note 5)
-- 10 -- mV
Logic Interface
EN/MD Input Voltage
Logic-High VIH VIN = 2.5V to 4.5V 1 -- -- V
Logic-Low VIL VIN = 2.5V to 4.5V -- -- 0.4
Absolute Maximum Ratings (Note 1)
Supply Input Voltage, VIN ------------------------------------------------------------------------------------------------ −0.3V to 6V
Output Voltage, VOP, VON ---------------------------------------------------------------------------------------------- −0.3V to 7V
Other Pins-------------------------------------------------------------------------------------------------------------------- −0.3V to 6V
Power Dissipation, PD @ TA = 25°C
XDFN-12SL 3x1.5 ---------------------------------------------------------------------------------------------------------- 2.88W
Package Thermal Resistance (Note 2)
XDFN-12SL 3x1.5, θJA ----------------------------------------------------------------------------------------------------- 34.7°C/W
XDFN-12SL 3x1.5, θJC ---------------------------------------------------------------------------------------------------- 11°C/W
Junction Temperature ------------------------------------------------------------------------------------------------------ 150°C Lead Temperature (Soldering, 10 sec.) -------------------------------------------------------------------------------- 260°C Storage Temperature Range --------------------------------------------------------------------------------------------- −65°C to 150°C ESD Susceptibility (Note 3)
HBM (Human Body Model) ----------------------------------------------------------------------------------------------- 2kV
Recommended Operating Conditions (Note 4)
Junction Temperature Range--------------------------------------------------------------------------------------------- −40°C to 125°C Ambient Temperature Range--------------------------------------------------------------------------------------------- −40°C to 85°C
(VIN = 3.3V, CIN = COP = CON = 4.7μF, CF1 = CF2 = CF3 = 1μF, Test in X2 mode, TA = 25°C, unless otherwise specification)
RT9399
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Parameter Symbol Test Conditions Min Typ Max Unit
EN/MD Input Current IEN/IMD EN = MD = 4.5V -- 2.5 10 A
EN/MD Low to Shutdown Delay
tSHDN EN = MD = high to low 2 -- -- ms
EN/MD Rising Time tR 1 -- 100 ns
EN/MD Falling Time tF 1 -- 100 ns
EN/MD High Pulse Width tWH 0.1 -- -- s
EN/MD Low Pulse Width tWL 0.1 -- -- s
Output Voltage
Positive Output Voltage VOP VIN = 3.3V to 4.5V -- 6 -- V
Negative Output Voltage VON VIN = 3.3V to 4.5V -- 6 -- V
Maximum VOP Output Current
IOP_MAX VIN = 3.3V to 4.5V 50 -- -- mA
Maximum VON Output Current
ION_MAX VIN = 3.3V to 4.5V 50 -- -- mA
Static Line Regulation 1 VOP_LNR1 VIN = 3.3V to 4.5V, IOP = ION = 5mA -- 0.1 -- %
Static Line Regulation 2 VOP_LNR2 VIN = 3.3V to 4.5V, IOP = ION = 10mA -- 0.1 -- %
Static Line Regulation 1 VON_LNR1 VIN = 3.3V to 4.5V, IOP = ION = 5mA -- 0.1 -- %
Static Line Regulation 2 VON_LNR2 VIN = 3.3V to 4.5V, IOP = ION = 10mA -- 0.1 -- %
Static Load Regulation 1 VOP_LDR1 VIN = 3.3V, IOP = ION = 1mA to 30mA -- 0.5 -- %
Static Load Regulation 2 VON_LDR2 VIN = 3.3V, IOP = ION = 1mA to 30mA -- 5 -- %
Output Voltage Undershoot/Overshoot @ TDMA Noise Test
VOPN_TDMA1 IOP = ION = 3mA to 15mA, 0.5V pulse signal apply to VIN w/ 217Hz frequency (Note 5)
-- ±40 -- mV
Protection
Input Current Limit 1 ISCP1 VOP short to GND -- 200 -- mA
VOP Soft-Start Time tSSP No load -- 1 -- ms
VON Soft-Start Time tSSN No load -- 1 -- ms
Soft-Start Inrush Current ISS VIN = 3.3V, load = 10mA (Note 5) -- 400 -- mA
Over-Temperature Protection
TOTP (Note 5) -- 140 -- C
Over-Temperature Protection Hysteresis
TOTP_HYST (Note 5) -- 15 -- C
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Note 1. Stresses beyond those listed “Absolute Maximum Ratings” may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in
the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may
affect device reliability.
Note 2. θJA is measured under natural convection (still air) at TA = 25°C with the component mounted on a high effective-
thermal-conductivity four-layer test board on a JEDEC 51-7 thermal measurement standard. θJC is measured at the
exposed pad of the package.
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
Note 5. Specifications are guaranteed by design.
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Typical Application Circuit
X2 Mode Application
Timing Diagram
C2N
GND
CF3VIN
C1P C1N C2P
RT9399
EN
C3P
CF2 1µF
CF1 1µF
CIN4.7µF
8
6
4
7 910
3, 13 (Exposed Pad)
12
1µFC3N
VOP 1
11
VIN3.3V to 4.5V
COP4.7µF
VOP6V
VON 2CON4.7µF
VON-6VMD5
TSHDN > 1ms
EN
MD = L
0
VOP
VON
6V
0
-6VTssp < 1ms Tssn < 1ms
Hi-Z
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Typical Operating Characteristics
VON vs. Input Voltage
-6.5
-6.0
-5.5
-5.0
-4.5
-4.0
-3.5
-3.0
2 2.5 3 3.5 4 4.5 5
Input Voltage (V)
VO
N (
V)
VIN = 2.5V to 4.5V
IOP = 50mAIOP = 30mAIOP = 15mAIOP = 0mA
VOP vs. Input Voltage
4.0
4.5
5.0
5.5
6.0
6.5
2.3 2.8 3.3 3.8 4.3 4.8
Input Voltage (V)
VO
P (
V)
VIN = 2.5V to 4.5V
IOP = 0mAIOP = 15mAIOP = 30mAIOP = 50mA
VON vs. Output Current
-6.3
-6.2
-6.1
-6.0
-5.9
-5.8
-5.7
0 10 20 30 40 50 60
Output Current (mA)
VO
N (
V)
ION = 0 to 50mA
VIN = 3.3VVIN = 3.7VVIN = 4.5V
VOP vs. Output Current
5.97
5.99
6.01
6.03
6.05
6.07
6.09
0 10 20 30 40 50 60
Output Current (mA)
VO
P (
V)
IOP = 0 to 50mA
VIN = 4.5VVIN = 3.7VVIN = 3.3V
Efficiency vs. Output Current
0
10
20
30
40
50
60
70
80
90
100
0 10 20 30 40 50 60
Output Current (mA)
Effi
cie
ncy
(%
)
VOP = 6V, VON = −6V, IOUT = 0 to 50mA
VIN = 2.9VVIN = 3.3VVIN = 3.7VVIN = 4.5V
Quiescent Current vs Input Voltage
0
1
2
3
4
5
6
7
2.5 3 3.5 4 4.5 5
Input Voltage (V)
Qu
iesc
en
t Cu
rre
nt (
mA
)
VIN = 2.5V to 4.5V, EN = 0V
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Quiescent Current vs. Temperature
0
1
2
3
4
5
6
7
-50 -25 0 25 50 75 100 125
Temperature (°C)
Qu
iesc
en
t Cu
rre
nt (
mA
)
Time (500μs/Div)
Power Off
VIN = 3.3V, EN = 3.3V to 0V,VOP = 6V, VON = −6V, No Load
VOP(5V/Div)
EN(2V/Div)
IIN(200mA/Div)
VON(5V/Div)
Time (500μs/Div)
Power On
VIN = 3.3V, EN = 0V to 3.3V,VOP = 6V,VON = −6V, No Load
VOP(5V/Div)
EN(2V/Div)
IIN(200mA/Div)
VON(5V/Div)
Shutdown Current vs. Temperature
0.0
0.2
0.4
0.6
0.8
1.0
1.2
-50 -25 0 25 50 75 100 125
Temperature (°C)
Sh
utd
ow
n C
urr
en
t (μ
A) 1
VIN = 3.3V, EN = 0V, Temp = −40°C to 100°CVIN = 3.3V, Temp = −40°C to 100°C
Shutdown Current vs. Input Voltage
0.00
0.05
0.10
0.15
0.20
0.25
2.5 3 3.5 4 4.5 5
Input Voltage (V)
Sh
utd
ow
n C
urr
en
t (μ
A) 1
VIN = 2.5V to 4.5V
Input Voltage vs. Temperature
1.86
1.88
1.90
1.92
1.94
1.96
1.98
2.00
2.02
-50 -25 0 25 50 75 100 125
Temperature (°C)
Inp
ut V
olta
ge
(V
)
Temp = −40°C to 100°C
UVLO Rising
UVLO Falling
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Time (1ms/Div)
VON Ripple Voltage
VIN = 3.3V, ION = 15mA
VON(10mV/Div)
Time (1ms/Div)
VON Ripple Voltage
VIN = 3.3V, ION = 10mA
VON(10mV/Div)
Time (1ms/Div)
VOP Ripple Voltage
VIN = 3.3V, IOP = 50mA
VOP(10mV/Div)
Time (1ms/Div)
VOP Ripple Voltage
VIN = 3.3V, IOP = 30mA
VOP(10mV/Div)
Time (1ms/Div)
VOP Ripple Voltage
VIN = 3.3V, IOP = 10mA
VOP(10mV/Div)
Time (1ms/Div)
VOP Ripple Voltage
VIN = 3.3V, IOP = 15mA
VOP(10mV/Div)
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Load Transient Response
Time (100μs/Div)
Load Transient Response
VIN = 3.3V, IOP = 1mA to 30mA
VON(50mV/Div)
VOP(50mV/Div)
IOP(20mA/Div)
Time (100μs/Div)
VIN = 3.3V, ION = 10mA to 50mA
VON(50mV/Div)
VOP(50mV/Div)
ION(50mA/Div)
Time (500μs/Div)
Line Transient Response
VIN = 3.3V to 3.8V,IOPON = 5mA, Rise/Fall time = 10μs
VON(50mV/Div)
VOP(50mV/Div)
VIN(500mV/Div)
Time (100μs/Div)
Load Transient Response
VIN = 3.3V, IOP = 10mA to 50mA
VON(50mV/Div)
VOP(50mV/Div)
IOP(50mA/Div)
Time (1ms/Div)
VON Ripple Voltage
VIN = 3.3V, ION = 50mA
VON(10mV/Div)
Time (100μs/Div)
Load Transient Response
VIN = 3.3V, ION = 1mA to 30mA
VON(50mV/Div)
VOP(50mV/Div)
ION(20mA/Div)
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Time (500μs/Div)
Line Transient Response
VIN = 3.7V to 4.2V,IOPON = 30mA, Rise/Fall time = 10μs
VON(50mV/Div)
VOP(50mV/Div)
VIN(500mV/Div)
Time (500μs/Div)
Line Transient Response
VIN = 3.7V to 4.2V,IOPON = 15mA, Rise/Fall time = 10μs
VON(50mV/Div)
VOP(50mV/Div)
VIN(500mV/Div)
Time (500μs/Div)
Line Transient Response
VIN = 3.7V to 4.2V,IOPON = 5mA, Rise/Fall time = 10μs
VON(50mV/Div)
VOP(50mV/Div)
VIN(500mV/Div)
Time (500μs/Div)
Line Transient Response
VIN = 3.3V to 3.8V,IOPON = 40mA, Rise/Fall time = 10μs
VON(50mV/Div)
VOP(50mV/Div)
VIN(500mV/Div)
Time (500μs/Div)
Line Transient Response
VIN = 3.3V to 3.8V,IOPON = 30mA, Rise/Fall time = 10μs
VON(50mV/Div)
VOP(50mV/Div)
VIN(500mV/Div)
Time (500μs/Div)
Line Transient Response
VIN = 3.3V to 3.8V,IOPON = 10mA, Rise/Fall time = 10μs
VON(50mV/Div)
VOP(50mV/Div)
VIN(500mV/Div)
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Time (500μs/Div)
Line Transient Response
VIN = 3.7V to 4.2V,IOPON = 40mA, Rise/Fall time = 10μs
VON(50mV/Div)
VOP(50mV/Div)
VIN(500mV/Div)
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Application Information
The RT9399 is a highly integrated step-up charge pump
and inverting charge pump to generate positive and negative
output voltages for TFT-LCD bias. It can support input
voltage range from 2.5V to 4.5V and the output current up
to 50mA. Positive and negative output voltages are fixed
±6V.
Under-Voltage Lockout
To prevent abnormal operation of the IC in low voltage
condition, an under-voltage lockout is included which shuts
down the device when input voltage is lower than 1.9V. All
functions will be turned off in this state.
Soft-Start
The RT9399 provides an internal soft-start feature to avoid
high inrush current during start-up. An internal current
source charges a capacitor to build the soft-start ramp
voltage. The reference voltage will track the ramp voltage
during soft-start interval. The typical soft-start time is 1ms.
Over-Temperature Protection (OTP)
The RT9399 equips an over-temperature protection circuitry
to prevent overheating due to excessive power dissipation.
The OTP will shut down IC when junction temperature
exceeds 140°C. Once the junction temperature cools
down by approximately 15°C, IC will resume normal
operation automatically. To maintain continuous operation,
the maximum junction temperature should be prevented
from rising above 125°C.
Short-Circuit Protection (SCP)
The RT9399 has an advanced short-circuit protection
mechanism which prevents the device from damage by
unexpected applications. When the output VOP becomes
shorted to ground, the device will limit the input current to
maximum 200mA.
Shutdown Delay
When the EN voltage is logic low for more than 1ms, the
IC will be shut down with an internal fast discharge resistor.
In shutdown mode, the input supply current for the device
is less than 1μA.
Headroom Voltage of VON
Due to the negative voltage VON is supplied from the
positive voltage VOP.
There is a voltage drop on the negative charge pump (-1x
Mode) which equivalent resistance is about 5Ω (typ.). The
headroom voltage can be calculated depending on output
load ION as below equation.
ON OP ON
OP ON ON
V = V + I Req
Headroom = V + V = I Req
-1x Mode Charge PumpVON
ION
VOP
Equivalent resistance ~5ohm (typ.)
Thermal Considerations
The junction temperature should never exceed the
absolute maximum junction temperature TJ(MAX), listed
under Absolute Maximum Ratings, to avoid permanent
damage to the device. The maximum allowable power
dissipation depends on the thermal resistance of the IC
package, the PCB layout, the rate of surrounding airflow,
and the difference between the junction and ambient
temperatures. The maximum power dissipation can be
calculated using the following formula :
PD(MAX) = (TJ(MAX) − TA) / θJA
where TJ(MAX) is the maximum junction temperature, TA is
the ambient temperature, and θJA is the junction-to-ambient
thermal resistance.
For continuous operation, the maximum operating junction
temperature indicated under Recommended Operating
Conditions is 125°C. The junction-to-ambient thermal
resistance, θJA, is highly package dependent. For a XDFN-
12SL 3x1.5, the thermal resistance, θJA, is 34.7°C/W on
a standard JEDEC 51-7 high effective-thermal-conductivity
four-layer test board. The maximum power dissipation at
TA = 25°C can be calculated as below :
PD(MAX) = (125°C − 25°C) / (34.7°C/W) = 2.88W for a
XDFN-12SL 3x1.5 package.
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Figure 2. PCB Layout Guide
Layout Consideration
Figure 1. Derating Curve of Maximum Power Dissipation
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0 25 50 75 100 125
Ambient Temperature (°C)
Ma
xim
um
Po
we
r D
issi
pa
tion
(W
) 1 Four-Layer PCB
1
2
3
4
5
12
11
10
9
8
GND
XDFN-12SL 3x1.5
C1P
C3N
C3P
C2N
C2P
VON
VOP
MD
EN
GND
6VIN 7 C1N
Battery
CIN
GND Plane
CF
1
CF
2
CF
3
VON
VOP
GND Plane
GND Plane
COP
CON
Layout Consideration
For the best performance of the RT9399, the following
PCB layout guidelines should be strictly followed.
The traces should be wide and short especially for the
high current output loop.
The input and output bypass capacitors should be placed
as close to the IC as possible and connected to the
round plane of the PCB.
Connect the exposed pad to a strong ground plane for
maximum thermal dissipation.
The maximum power dissipation depends on the operating
ambient temperature for the fixed TJ(MAX) and the thermal
resistance, θJA. The derating curves in Figure 1 allows
the designer to see the effect of rising ambient temperature
on the maximum power dissipation.
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Richtek Technology Corporation14F, No. 8, Tai Yuen 1st Street, Chupei City
Hsinchu, Taiwan, R.O.C.
Tel: (8863)5526789
Richtek products are sold by description only. Richtek reserves the right to change the circuitry and/or specifications without notice at any time. Customers should
obtain the latest relevant information and data sheets before placing orders and should verify that such information is current and complete. Richtek cannot
assume responsibility for use of any circuitry other than circuitry entirely embodied in a Richtek product. Information furnished by Richtek is believed to be
accurate and reliable. However, no responsibility is assumed by Richtek or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Richtek or its subsidiaries.
Outline Dimension
X-Type 12SL DFN 3x1.5 Package
Min. Max. Min. Max.
A 0.400 0.500 0.016 0.020
A1 0.000 0.050 0.000 0.002
A3 0.100 0.175 0.004 0.007
b 0.150 0.250 0.006 0.010
b1 0.350 0.450 0.014 0.018
D 2.900 3.100 0.114 0.122
D2 2.750 2.850 0.108 0.112
E 1.400 1.600 0.055 0.063
E2 0.650 0.750 0.026 0.030
e
L 0.150 0.250 0.006 0.010
L1 0.050 0.150 0.002 0.006
SymbolDimensions In Millimeters Dimensions In Inches
0.450 0.018