EE 365 CMOS gates Electrical characteristics and timing TTL gates.

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EE 365

CMOS gatesElectrical characteristics and timing

TTL gates

CMOS NAND Gates

• Use 2n transistors for n-input gate

• CMOS NAND -- switch model

• CMOS NAND -- more inputs (3)

• Inherent inversion. • Non-inverting buffer:

• 2-input AND gate:

CMOS NOR Gates

• Like NAND -- 2n transistors for n-input gate

NAND vs. NOR

• For a given silicon area, PMOS transistors are “weaker” than NMOS transistors.

NAND NOR

• Result: NAND gates are preferred in CMOS.

Limited # of inputs in one gate

• 8-input CMOS NAND

Fancy stuff

• CMOS AND-OR-INVERT gate

CMOS Electrical Characteristics

• Digital analysis works only if circuits are operated in spec:– Power supply voltage– Temperature– Input-signal quality– Output loading

• Must do some “analog” analysis to prove that circuits are operated in spec.– Fanout specs– Timing analysis (setup and hold times)

DC Loading

• An output must sink current from a load when the output is in the LOW state.

• An output must source current to a load when the output is in the HIGH state.

Output-voltage drops

• Resistance of “off” transistor is > 1 Megohm, but resistance of “on” transistor is nonzero,– Voltage drops across “on” transistor, V = IR

• For “CMOS” loads, current and voltage drop are negligible.

• For TTL inputs, LEDs, terminations, or other resistive loads, current and voltage drop are significant and must be calculated.

Example loading calculation

• Need to know “on” and “off” resistances of output transistors, and know the characteristics of the load.

Calculate for LOW and HIGH state

Limitation on DC load

• If too much load, output voltage will go outside of valid logic-voltage range.

• VOHmin, VIHmin

• VOLmax, VILmax

Output-drive specs

• VOLmax and VOHmin are specified for certain output-current values, IOLmax and IOHmax.– No need to know details about the output circuit,

only the load.

Input-loading specs

• Each gate input requires a certain amount of current to drive it in the LOW state and in the HIGH state.– IIL and IIH

– These amounts are specified by the manufacturer.

• Fanout calculation– (LOW state) The sum of the IIL values of the driven

inputs may not exceed IOLmax of the driving output.

– (HIGH state) The sum of the IIH values of the driven inputs may not exceed IOHmax of the driving output.

– Need to do Thevenin-equivalent calculation for non-gate loads (LEDs, termination resistors, etc.)

Manufacturer’s data sheet

TTL Electrical Characteristics

TTL LOW-State Behavior

TTL HIGH-State Behavior

TTL Logic Levels and Noise Margins

• Asymmetric, unlike CMOS

• CMOS can be made compatible with TTL– “T” CMOS logic families

CMOS vs. TTL Levels

CMOS levels TTL levels

CMOS with TTL Levels-- HCT, FCT, VHCT, etc.

Fig 3-84

TTL differences from CMOS

• Asymmetric input and output characteristics.• Inputs source significant current in the LOW

state, leakage current in the HIGH state.• Output can handle much more current in the

LOW state (saturated transistor).• Output can source only limited current in the

HIGH state (resistor plus partially-on transistor).• TTL has difficulty driving “pure” CMOS inputs

because VOH = 2.4 V (except “T” CMOS).

AC Loading

• AC loading has become a critical design factor as industry has moved to pure CMOS systems.– CMOS inputs have very high impedance, DC loading

is negligible.– CMOS inputs and related packaging and wiring have

significant capacitance.– Time to charge and discharge capacitance is a major

component of delay.

Transition times

Circuit for transition-time analysis

HIGH-to-LOW transition

Exponential fall time

t = RC time constantexponential formulas, e-t/RC

LOW-to-HIGH transition

Exponential rise time

Transition-time considerations

• Higher capacitance ==> more delay• Higher on-resistance ==> more delay• Lower on-resistance requires bigger

transistors• Slower transition times ==> more power

dissipation (output stage partially shorted)• Faster transition times ==> worse

transmission-line effects (Chapter 11)• Higher capacitance ==> more power

dissipation (CV2f power), regardless of rise and fall time

Open-drain outputs

• No PMOS transistor, use resistor pull-up

What good is it?

• Open-drain bus

• Problem -- really bad rise time

Open-drain transition times

• Pull-up resistance is larger than a PMOS transistor’s “on” resistance.

• Can reduce rise time by reducing pull-up resistor value– But not too much

Important Tables in Chapter 3