Post on 30-May-2018
transcript
Electroplating TechnologyMaking New Connections
Adding Value, Improving performance, Reducing Environmental Impact
Dow Electronic Materials
2
Dow Electroplating Technology
Electronic Finishing markets are experiencing many forces for change, being driven by performance, cost and legislation. Dow has responded to such drivers to create unique electroplating products for diverse applications, to offer users measurable value. In this brochure we highlight tin, silver, silver alloy, gold and masking products developed to provide valuable solutions for changing market requirements.
New Electroplating Technology
White BronzeRONALLOY™ GT-250 Cyanide Free White BronzeAQUALLOY™ GT-640 Cyanide Free White Bronze
TinSOLDERON™ BHT-350 Bright TinSOLDERON™ ST-300T Matte Tin
Silver SILVERON™ GT-101 Bright SilverSILVERON™ GT-820 Silver Tin
GoldRONOVEL™ CS-200 Electrolytic Gold
MaskingLITHOjET™ 200 Series Inks
Post TreatmentNO TARN PM-3 Post TreatmentPORE BLOCkER 200 Post TreatmentNO TARN SN-2 Post TreatmentSOLDERGUARD™ 100 Post Treatment
3
Dow Electroplating Technology
RONALLOY™ GT-250 White Bronze is a cyanide, lead and cobalt free acidic bronze product producing bright, white, copper-tin deposits which provide corrosion and tarnish resistance. RONALLOY™ GT-250 White Bronze deposits are suitable for finishing as well as for under layers, making it a first choice as nickel replacement in both decorative and functional applications. Long term tarnish resistance is improved using over plate with silver, palladium, chromium or a combination thereof. AQUALLOY™ GT-640 White Bronze has been designed and developed specifically for the replacement of nickel in the sanitary ware markets, where drinking water regulation restricts the use of nickel for such sanitary ware applications
•Freeofcyanide,leadandcobalt•Mirror-like,bright,whiteCu/Snalloydeposit• Sulfate-based,acidicelectrolytewithorganic
additive system•Suitableforrackandbarrelplating (CDrange:1–5ASD)
•Depositionratehigherthanbrightnickelprocesses•Usedwithsolublebronzeanodes•Corrosionresistantdeposit,especiallywith
top coat layer.•CompatiblewithacidcopperandTri-Chrome
Process µm/min.
Conventional Bright Nickel Process 0.6 µm/min. at 3 ASD
RONALLOY™ & AQUALLOY™ White Bronze
0.75 µm/min. at 3 ASD
Conventional CN-based White Bronze 0.3 µm/min. at 2 ASD
Deposit Hardness (HV)
RONALLOY™ & AQUALLOY™ White Bronze
~ 400 HV
Ni Ref. 1 ~ 530 HV
Ni Ref. 2 ~ 400 HV
Ni Ref. 3 ~ 630 HV
Cyanide and Lead Free White Bronze
4
Dow Electroplating Technology
SOLDERON™ST-300TMatteTinisanorganicsulfonateelectroplatingproduct for the high-speed deposition of uniform, matte tin deposits over a wide current density range. It is specifically designed for use in high-speed magazine-to-magazine and reel-to-reel electroplating equipment, where the process versatility is particularly well-suited for semiconductor leadframe application.
•Uniformmattetindeposit•Anti-burnagentpreventsburningin highCDareas
•Singleadditivesystem,easytocontrol•Widecurrentdensityrange•Excellentthicknessdistribution•Excellentsolderabilityperformance
SOLDERON™ ST-300T High Speed Matte Tin
General Matte Tin
SOLDERON™ ST-300T Matte TinSmoother and smaller grain size (3–7 μm)
SOLDERON™ ST-300TUniform High Speed Matte Tin
5
Dow Electroplating Technology
SOLDERON™BHT-350BrightTinisahighspeed,sulphonate-basedtinelectroplatingproductformulatedforcontinuouselectroplatingofwireandconnectorstripinreel-to-reelmachines.TheSOLDERON™BHT-350BrightTinelectrolyteisfreeofvolatilealdehydesandmaybeoperatedattemperaturesupto50°C.
TheSOLDERON™BHT-350BrightTinelectrolyteprovidesbrightdepositsoverawidecurrentdensityrange.Its propriety formulation controls both grain size and carbon content in deposits which results in a very ductilebrightdeposit.SOLDERON™BHT-350BrightTinproductsdonotcontainmethanolensuringamoreenvironmentally friendly electrolyte compared to other conventional bright tin processes. Analytical procedures are available for all bath components.
•Fullybrightdepositoverthewholecurrentdensityrange•LowCarbon-contentinthedeposit(<0.2%upto40ASD)•Highdepositductility(>11%)•Verylowwhiskergrowthtendency•Lowdegreeofreflowdiscoloration•Operatingtemperatureupto50°C:nocoolingsystemrequired•Highplatingcurrentdensity:5–40ASD•Easybathcontrolandfullyanalyzablecomponents•Lowfoamingelectrolyte:suitableforhighspeedapplications•Noblackfoamline:suitableforselectiveplatingandfullstripplating•Alsosuitedtolowspeedrackandbarrelapplications
SOLDERON™ BHT-350 High Speed Bright Tin
0
20
40
60
80
100
0 10 20 30 40 50
BHT-350, 40°C
Bright Sn A, 40°C
Bright Sn B, 22°C
Cat
hode
Effi
cien
cy (%
)
Current Density (A/dm2)
High Cathode Efficiency
SOLDERON™ BHT-350 SOLDERON™ BHT-35011% Ductility
Bright Tin A Bright Tin A2% Ductility
High DuctilityBefore Bending After Bending
6
Dow Electroplating Technology
SILVERON™GT-101BrightSilverisanalkalinenon-cyanidepuresilverelectroplatingproductdesignedtoproducebright silver deposits for various applications. The product can be used in conventional plating equipment and high speed reel-to-reel, jet or wire plating equipment. The silver deposits can be applied to both copper and nickel alloy substrates.
•Cyanide-freeelectrolyte,pH9–10•Chemicallystablesolution•White,brightsilverdepositoverabroadCD range(0.5–15ASD)
•Cathodeefficiencyca.100%•Excellentadhesionovercopperorcopperalloys•Platingovernickelrequiresastrikelayer•Nometallicadditives•Depositcomposition:ca.100%silver•Mattedepositpossible(optional)•Suitableforelectrical/electronicand
decorative applications•Excellentcontactresistanceandsolderability•Harderthancyanidesilverdeposits,especially afterannealingat155°C
SILVERON™ GT-101 Bright Cyanide Free Silver
0
0.5
1.0
1.5
2.5
2.0
3.0
0 20 40 60 80 100
mO
hm
Loading (cN)
SILVERON™ GT-101 Contact ResistanceSILVERON™ GT-101 Contact Resistance
0
2
4
6
10
8
12
SILVERON GT-101 Cyanide Silver Hard Gold
Wea
r Rat
e (m
m3 /N
/m x
10-6
)
Wear Rate (Silver vs. Steel)
Room Temp
1 hr. @ 150°C
Wear Rate (Silver vs. Steel)
Nano-Hardness
0
50
100
150
200
250
SILVERON GT-101 Cyanide Silver Hard Gold
Har
dnes
s (H
V)
Nano-Hardness
Room Temp
1 hr. @ 150°C
7
Dow Electroplating Technology
SILVERON™GT-820SILVER-TINisanacidicnon-cyanidesilver-tin electroplating product designed to deposit bright silver-tin alloy for electrical applications. The product can be used in conventional plating equipment at low speed and high speed. The silver-tin alloy can be applied to both nickel and copper or copper alloys. The electroplated silver-tinalloycontains19–23%oftin,theremainingfraction is silver
•Cyanide-freeelectrolyte•ReplacementforTinforwhiskercontrolonpress
fit connectors•Chemicallystablesolutionwithoutmetallicadditives•White,brightsilverdepositoverabroadCDrange (0.5–15ASD)
•Cathodeefficiencyca.100%•Excellentadhesionovercopperorcopperalloys•Platingovernickelrequiresastrikelayer•Depositcomposition:ca.80%silver•Suitableforelectrical/electronicapplications•Excellentcontactresistanceandsolderability
SILVERON™ GT-820 Cyanide Free Silver Tin
0
5
10
15
25
20
30
35
40
45
0 20 40 60 80 100
Res
ista
nce
(mO
hm)
Force (cN)
SILVERON GT-820
Silver Tin
Silver
Hard Gold
0
50
100
150
250
200
300
SILVERON GT-101 Hard Gold Silver-tin
Nan
o-H
ardn
ess
(HV)
Plot 2
Room Temp
1 hr. @ 150°C
0
200
400
600
1000
800
1200
0.5 N 1 N 2 N
Num
ber o
f wea
r cyc
les
Applied Load on 3.5 µm sample
Plot 3
Silver
Silver-tin
8
Dow Electroplating Technology
9
RONOVEL™CS-200isacobalt-alloyedgoldplatingproductdesignedforhighspeedselectiveplating,achievingauniform appearance over a wider current density range and minimizing gold bleed plating, saving money.
•Minimizedbleedgolddeposition• Improveddepositionrate• Improvedbathstability•MinimizedimmersiondepositionofAuonNi•Maintainsdepositperformanceofconventionalproducts
RONOVEL™ CS-200 Low Bleed Gold For Connector Plating
Schematic of equipment Image of deposit
Measuring point Mask Spacer Substrate(Ni plated)Plating solution
Nano-Hardness
0
20
40
80
60
120
100
140
Pore Count
RONOVEL CM-97 4 g/L Au
RONOVEL CS-200 10 g/L Au
RONOVEL CS-200 8 g/L Au
RONOVEL CS-200 6g/L Au
RONOVEL CS-200 4g/L Au
RONOVEL CS-100 4 g/L Au
Bleed Gold Thickness
-4.16E-17
0.010
0.020
0.030
0.040
0.050
0.005
0.015
0.025
0.035
0.045
40 50 60 70
RONOVEL CS-200 10 g/L
RONOVEL C 10 g/L
µm
ASD
Bleed Gold Thickness
Dow Electroplating Technology
10
Dow Electroplating Technology
SelectiveMetallisationoretchingcanberealisedbyusingLITHOJET™ 200 SeriesInksinsingleormultipleselectiveplatingapplications.Digitaloffcontact masking allows for rapid design change or prototyping as well as shorter processes and higher yields.
•Compatiblewithplatingchemistries.•Designedtomaskareasforhighresolutionplating•Veryhighchemicalresistancetoalkaliandacidsolutions•UVcurable•AlkalineStrippable
LITHOJET™ 200 Series Inks
Plated Cu
LITHOJET™ Mask
Plated Cu
11
Dow Electroplating Technology
NO TARN PM-3 Post Treatment• Immersionpassivationtreatment•Protectssilverfromtarnishing•Tarnishprotectionforcopper,palladium
and thin gold layers•Noadverseeffectonresistance,solderability
or bondability•Noimpactonbrightnessorcolour
NO TARN SN-2 Post Treatment•Posttreatmentfortintoprovideuniform
grain structure•Reducesoxidelayerformation•Enhancessolderability•Reducesdiscolourationafterheattreatment
PORE BLOCKER 200 Post Treatment• Immersionpassivationtreatment•ShortImmersiontreatment•Corrosionprotectionofunderlayerthroughpores•Noadverseeffectonresistance,solderability
or bondability•Noimpactonbrightnessorcolour
Post Treatment Products
SOLDERGUARD™ 100 TreatmentBefore Heat Treatment
No SOLDERGUARD™ 100 TreatmentAfter 1 hour @ 155°C
With SOLDERGUARD™ 100 TreatmentAfter 1 hour @ 155°C
SOLDERGUARD™ 100 Post Treatment•Createsahydrophobicsurfaceontindepositsrepellingmoisture•Protectsagainstcorrosionanddiscolourationafterreflow•Enhancessolderability•Protectionagainstwhiskerformation
®™Trademark of The Dow Chemical Company (“Dow”) or an affiliated company of Dow Notice: No freedom from infringement of any patent owned by Dow or others is to be inferred. Because use conditions and applicable laws may differ from one location to another and may change with time, the Customer is responsible for determining whether products and the information in this document are appropriate for the Customer’s use and for ensuring that the Customer’s workplace and disposal practices are in compliance with applicable laws and other governmental enactments. Dow assumes no obligation or liability for the information in this document. No warranties are given; all implied warranties of merchantability or fitness for a particular purpose are expressly excluded. This document is intended for global use.
dowelectronicmaterials.com