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LM49270
www.ti.com SNAS384B –DECEMBER 2006–REVISED MARCH 2007
LM49270 Filterless 2.2W Stereo Class D AudioSubsystem with OCL Headphone Amplifier, 3D Enhancement, and Headphone Sense
Check for Samples: LM49270
1FEATURES – Headphone Amplifier:– RL = 16Ω, THD+N = ≤ 1% 155 mW
2• Stereo Filterless Class D Amplifier– RL = 32Ω, THD+N = ≤ 1% 90 mW• Selectable OCL/CC Headphone Amplifier
• Shutdown Current 0.02μA• Headphone Sense Ability• TI’s 3D Enhancement
DESCRIPTION• RF Suppression
The LM49270 is a fully integrated audio subsystem• I2C Control Interface designed for stereo multimedia applications. The• 32-Step Digital Volume Control LM49270 combines a 2.2W stereo Class D amplifier
with a 155mW stereo headphone amplifier, volume• 6 Operating Modescontrol, headphone sense, and TI’s unique 3D sound
• Output Short Circuit Protection and Thermal enhancement into a single device. The LM49270Shutdown Protection uses flexible I2C control interface for multiple
application requirements.• Minimum External Components• Click and Pop Suppression The filterless stereo class D amplifiers delivers
2.2W/channel into a 4Ω load with less than 10%• Micro-Power ShutdownTHD+N with a 5V supply. The headphone amplifier• Independent Speaker and Headphone Volumefeatures Output Capacitor-less (OCL) architectureControls that eliminates the output coupling capacitors
• Available in Space-Saving 28 Pin WQFN required by traditional headphone amplifiers.Package
The IC features a headphone sense input (HPS) thatautomatically detects the presence of a headphoneAPPLICATIONS and configures the device accordingly. The LM49270
• Portable DVD Players can automatically switch from OCL headphone outputto a line driver output. If the VOC pin is pulled to• Smart PhonesGND, the VOC amplifier is disabled and the VOC pin
• PDAs is internally set to GND. This feature allows the• Laptops LM49270 to be used as a line driver in OCL mode
without a GND conflict on the headphone jack sleeve.Additionally, the headphone amplifier can beKEY SPECIFICATIONSconfigured as capacitively coupled (CC).
• Stereo Class D Amplifier Efficiency:The LM49270 features a 32 step volume control for– VDD = 3.3V, 450mW/Ch into 8Ω 84%the headphone and stereo outputs. The device mode
– VDD = 5V, 1W/Ch into 8Ω 84% select and volume are controlled through an I2C• Quiescent Power Supply Current, VDD = 3.3V compatible interface.
– Speaker Mode 5.5 mA Output short circuit and thermal shutdown protectionprevent the device from being damaged during fault– Headphone Mode (OCL) 4 mAconditions. Superior click and pop suppression• Power Output/Channel, VDD = 5Veliminates audible transients on power-up/down and
– Class D Speaker Amplifier: during shutdown. The LM49270 is available in a– RL = 4Ω, THD+N = ≤ 10% 2.3 W space saving 28-pin, 5x5mm WQFN package.– RL = 8Ω, THD+N = ≤ 1% 106 W
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications ofTexas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2006–2007, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
Bias
Click/Pop
Suppresion
I2C
InterfaceI2C
BUS
VIH
VIL
CIN
CIN
CB
CS
CSCS
VDD
HPVDD
I2CVDD
LIN
L3DIN
R3DIN
RIN
BYPASS
I2CVDD
SDA
SCL
ADR GND HPVDD
VOC
RHP
LHP
LSGND
RLS-
RLS+
LLS-
LLS+
LSVDDVDD
HPS
SPEAKER
VOLUME
CONTROL
HEADPHONE
VOLUME
CONTROL
3D CONTROL
Audio Input
R3D
C3D
R3DADJ
LSVDD
Audio Input
LM49270
SNAS384B –DECEMBER 2006–REVISED MARCH 2007 www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foamduring storage or handling to prevent electrostatic damage to the MOS gates.
Typical Application
Figure 1. Typical Audio Amplifier Application Circuit
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1
2
3
4
5
6
28 27 26 25 24 23
1312111098
20
19
18
17
16
157
14
22
21RHP
VOC
LHP
R3DIN
BYPASS
GND HPS SCL
NC
LLS-LLS+LSVDDSDA
ADR
VDD
RLS-
NC
NC
I2CVDD
LSGND
LIN RIN GND NC RLS+
HPVDD
L3DIN
LSVDD
LM49270
www.ti.com SNAS384B –DECEMBER 2006–REVISED MARCH 2007
Connection Diagram
Figure 2. WQFN Package5mm x 5mm x 0.8mm
Top ViewSee Package Number RSG0028A
Pin DescriptionsPIN NAME DESCRIPTION
1 RHP Right channel headphone output
2 VOC VDD/2 buffer output
3 LHP Left channel headphone output
4 HPVDD Headphone supply input
5 R3DIN Right channel 3D input
6 L3DIN Left channel 3D input
7 BYPASS Bias bypass
8 LIN Left channel input
9 RIN Right channel input
10 GND Analog ground
11 NC No connect
12 LSVDD Speaker supply voltage input
13 RLS+ Right channel non-inverting speaker output
14 RLS- Right channel inverting speaker output
15 NC No connect
16 NC No connect
17 I2CVDD I2C supply voltage input
18 LSGND Speaker ground
19 VDD Power supply
20 ADR Address
21 NC No connect
22 LLS- Left channel inverting speaker output
23 LLS+ Left channel non-inverting speaker output
24 LSVDD Speaker supply voltage input
25 SDA Serial data input
26 SCL Serial clock input
27 HPS Headphone sense input
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SNAS384B –DECEMBER 2006–REVISED MARCH 2007 www.ti.com
Pin Descriptions (continued)
PIN NAME DESCRIPTION
28 GND Headphone ground
Absolute Maximum Ratings (1) (2) (3)
Supply Voltage (1) 6.0V
Storage Temperature −65°C to +150°C
Input Voltage –0.3V to VDD +0.3V
Power Dissipation (4) Internally Limited
ESD Susceptibility (5) 2000V
ESD Susceptibility (6) 200V
Junction Temperature (TJMAX) 150°C
Thermal Resistance θJA 35.1°C/W
(1) All voltages are measured with respect to the ground pin, unless otherwise specified.(2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electricalspecifications under particular test conditions which specify performance limits. This assumes that the device is within the OperatingRatings. Specifications are not ensured for parameters where no limit is given, however, the typical value is a good indication of deviceperformance.
(3) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.(4) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, θJA, and the ambient temperature,
TA. The maximum allowable power dissipation is PDMAX = (TJMAX – TA)/ θJA or the number given in Absolute Maximum Ratings,whichever is lower. For the LM49270 see power derating currents for more information.
(5) Human body model, 100pF discharged through a 1.5kΩ resistor.(6) Machine Model, 220pF–240pF discharged through all pins.
Operating Ratings (1)
Temperature Range TMIN ≤ TA ≤ TMAX −40°C ≤ TA ≤ 85°C
Supply Voltage 2.4V ≤ VDD ≤ 5.5V(VDD, LSVDD, HPVDD)
I2C Voltage (I2CVDD) 2.4V ≤ I2CVDD ≤ 5.5V
(1) All voltages are measured with respect to the ground pin, unless otherwise specified.
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LM49270
www.ti.com SNAS384B –DECEMBER 2006–REVISED MARCH 2007
Electrical Characteristics VDD = 3.3V(1)The following specifications apply for Headphone: AV = 0dB, RL(HP) = 32Ω; for Loudspeakers: AV = 6dB, RL(SP) = 15μH + 8Ω+ 15μH , f = 1kHz, unless otherwise specified. Limits apply for TA = 25°C.
LM49270 UnitsSymbol Parameter Conditions (Limits)Typical (2) Limit (3) (4)
VIN = 0, RL = No Load,Both channels active
IDD Supply Current Speaker ON, HP OFF 5.5 7.6 mA (max)Speaker OFF, CC HP ON 3 4.7 mA (max)Speaker OFF, OCL HP ON 4 5.75 mA (max)
ISD Shutdown Supply Current 0.02 2 μA (max)
Headphone 10 25 mV (max)VOS Output Offset Voltage Speaker 10 60 mV (max)
Speaker Mode, f = 1kHz
THD+N = 1%RL = 4Ω 700 mWRL = 8Ω 450 400 mW (min)
THD+N = 10%RL = 4Ω 870 mWRL = 8Ω 560 mW
CC Headphone Mode, f = 1kHz
THD+N = 1%RL = 16Ω 60 mW
POUT Output Power RL = 32Ω 36 30 mW (min)
THD+N = 10%RL = 16Ω 74 mWRL = 32Ω 55 mW
OCL Headphone Mode, f = 1kHz
THD+N = 1%RL = 16Ω 60 mWRL = 32Ω 36 30 mW (min)
THD+N = 10%RL = 16Ω 73 mWRL = 32Ω 55 mW
Speaker Mode, f = 1kHzPOUT = 100mW, RL = 8Ω 0.02 %
CC Headphone Mode,f = 1kHzTHD+N Total Harmonic Distortion + Noise POUT = 12mW, RL = 32Ω 0.015 %
OCL Headphone Mode,f = 1kHzPOUT = 12mW, RL = 32Ω 0.02 %
Speaker Mode, 47 μVA-Wtg, Input Referred
CC Headphone Mode,eN Noise 10 μVA-Wtg, Input Referred
OCL Headphone Mode, A-Wtg, 11 μVInput Referred
Speaker Modeη Efficiency 84 %RL = 8ΩSpeaker Mode, 71 dBf = 1kHz, VIN = 1Vp-p
CC Headphone Mode,Xtalk Crosstalk 70 dBf = 1kHz, VIN = 1Vp-p
OCL Headphone Mode, 55 dBf = 1kHz, VIN = 1Vp-p
(1) All voltages are measured with respect to the ground pin, unless otherwise specified.(2) Typicals are measured at 25°C and represent the parametric norm.(3) Limits are specified to AOQL (Average Outgoing Quality Level).(4) Data sheet min and max specification limits are specified by design, test, or statistical analysis.
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LM49270
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Electrical Characteristics VDD = 3.3V (continued)(1) The following specifications apply for Headphone: AV = 0dB, RL(HP) = 32Ω; for Loudspeakers: AV = 6dB, RL(SP) = 15μH + 8Ω+ 15μH , f = 1kHz, unless otherwise specified. Limits apply for TA = 25°C.
LM49270 UnitsSymbol Parameter Conditions (Limits)Typical (2) Limit (3) (4)
TON Turn-on Time 30 ms
TOFF Turn-off Time 64 ms
Maximum Gain 23.5 kΩZIN Input Impedance
Minimum Gain 210 kΩMaximum Gain, Speaker Mode 30 dB
Minimum Gain, Speaker Mode –47 dBAV Gain
Maximum Gain, Headphone Mode 18 dB
Minimum Gain, Headphone Mode –59 dB
Speaker Mode,VRIPPLE = 200mVp-p Sinef = 217Hz 68 dBf = 1kHz 68 dB
Headphone Mode,VRIPPLE = 200mVp-p Sine, CCModePSRR Power Supply Rejection Ratio f = 217Hz 73 dBf = 1kHz 73 dB
Headphone Mode,VRIPPLE = 200mVp-p Sine, OCLModef = 217Hz 75 dBf = 1kHz 79 dB
Detect Headphone 2.9 V (min)HPS(Th) Headphone Sense Threshold
Detect no Headphone 1.8 V (max)
Electrical Characteristics VDD = 5.0V(1)The following specifications apply for Headphone” AV = 0dB, RL(HP) = 32Ω,: for Loudspeakers: AV = 6dB, RL(SP) = 15μH + 8Ω+ 15μH, f = 1kHz unless otherwise specified. Limits apply for TA = 25°C.
LM49270 UnitsSymbol Parameter Conditions (Limits)Typical (2) Limit (3) (4)
VIN = 0, RL = No Load,Both channels active
IDD Supply Current Speaker ON, HP OFF 8.5 12.4 mA (max)Speaker OFF, CC HP ON 3.6 5.5 mA (max)Speaker OFF, OCL HP ON 4.7 6.5 mA (max)
ISD Shutdown Supply Current 0.15 2 μA (max)
Headphone 10 25 mV (max)VOS Output Offset Voltage Speaker 10 60 mV (max)
(1) All voltages are measured with respect to the ground pin, unless otherwise specified.(2) Typicals are measured at 25°C and represent the parametric norm.(3) Limits are specified to AOQL (Average Outgoing Quality Level).(4) Data sheet min and max specification limits are specified by design, test, or statistical analysis.
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LM49270
www.ti.com SNAS384B –DECEMBER 2006–REVISED MARCH 2007
Electrical Characteristics VDD = 5.0V (continued)(1) The following specifications apply for Headphone” AV = 0dB, RL(HP) = 32Ω,: for Loudspeakers: AV = 6dB, RL(SP) = 15μH +8Ω + 15μH, f = 1kHz unless otherwise specified. Limits apply for TA = 25°C.
LM49270 UnitsSymbol Parameter Conditions (Limits)Typical (2) Limit (3) (4)
Speaker Mode, f = 1kHz,
THD+N = 1%RL = 4Ω 1.75 WRL = 8Ω 1.06 W
THD+N = 10 %RL = 4Ω 2.2 WRL = 8Ω 1.35 W
CC Headphone Mode, f = 1kHz,
THD+N = 1%RL = 16Ω 155 mW
POUT Output Power RL = 32Ω 90 mW
THD+N = 10%RL = 16Ω 177 mWRL = 32Ω 140 mW
OCL Headphone Mode, f = 1kHz,
THD+N = 1%RL = 16Ω 155 mWRL = 32Ω 90 mW
THD+N = 10%RL = 16Ω 175 mWRL = 32Ω 140 mW
Speaker Mode, f = 1kHzPOUT = 100mW, RL = 8Ω 0.03 %
CC Headphone Mode,f = 1kHzTHD+N Total Harmonic Distortion + Noise POUT = 12mW, RL = 32Ω 0.02 %
OCL Headphone Mode,f = 1kHzPOUT = 12mW, RL = 32Ω 0.03 %
Speaker Mode, 47 μVA-Wtg, Input Referred
CC Headphone Mode,eN Noise 10 μVA-Wtg, Input Referred
OCL Headphone Mode, 11 μVA-Wtg, Input Referred
Speaker Modeη Efficiency 84 %RL = 8ΩSpeaker Mode, –85 dBf = 1kHz, VIN = 1Vp-p
CC Headphone Mode,Xtalk Crosstalk –70 dBf = 1kHz, VIN = 1Vp-p
OCL Headphone Mode, –58 dBf = 1kHz, VIN = 1Vp-p
TON Turn-on Time 43 ms
TOFF Turn-off Time 100 ms
ZIN Maximum Gain 23.5 kΩInput Impedance
Minimum Gain 210 kΩMaximum Gain, Speaker Mode 30 dB
Minimum Gain, Speaker Mode –47 dBAV Gain
Maximum Gain, Headphone Mode 18 dB
Minimum Gain, Headphone Mode –59 dB
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LM49270
SNAS384B –DECEMBER 2006–REVISED MARCH 2007 www.ti.com
Electrical Characteristics VDD = 5.0V (continued)(1) The following specifications apply for Headphone” AV = 0dB, RL(HP) = 32Ω,: for Loudspeakers: AV = 6dB, RL(SP) = 15μH +8Ω + 15μH, f = 1kHz unless otherwise specified. Limits apply for TA = 25°C.
LM49270 UnitsSymbol Parameter Conditions (Limits)Typical (2) Limit (3) (4)
Speaker Mode,VRIPPLE = 200mVp-p Sinef = 217Hz 61 dBf = 1kHz 61 dB
Headphone Mode,VRIPPLE = 200mVp-p Sine, CCModePSRR Power Supply Rejection Ratio f = 217Hz 75 dBf = 1kHz 74 min
Headphone Mode,VRIPPLE = 200mVp-p Sine, OCLModef = 217Hz 78 dBf = 1kHz 75 dB
Detect Headphone 4.4 V (min)HPS(Th) Headphone Sense Threshold
Detect no Headphone 3 V (max)
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100
10
0.1
0.010.01m 0.1m 1m 10m 1
1
100m
OUTPUT POWER/CHANNEL (W)
TH
D+
N (
%)
VDD = 5V
VDD = 3.3V
100
10
0.1
0.010.01m 0.1m 1m 10m 1
1
100m
OUTPUT POWER/CHANNEL (W)
TH
D+
N (
%)
VDD = 5V
VDD = 3.3V
100
10
0.1
0.010.01m 0.1m 1m 10m
1
100m
OUTPUT POWER/CHANNEL (W)
TH
D+
N (
%)
VDD = 5V
VDD = 3.3V
1
100
10
0.1
0.010.01m 0.1m 1m 10m 1
1
100m
OUTPUT POWER/CHANNEL (W)
TH
D+
N (
%)
VDD = 5V
VDD = 3.3V
100
0.01
0.1
1
10
100.1 10.001 0.01
OUTPUT POWER/CHANNEL (W)
TH
D+
N (
%)
VDD = 5V
VDD = 3.3V
0.001
100
0.01
0.1
1
10
101
OUTPUT POWER/CHANNEL (W)
TH
D+
N (
%)
0.001 0.01 0.1
VDD = 5V
VDD = 3.3V
LM49270
www.ti.com SNAS384B –DECEMBER 2006–REVISED MARCH 2007
Typical Performance Characteristics
THD+N THD+Nvs vs
Output Power Output PowerSpeaker Mode Speaker Mode
AV = 6dB, RL = 4Ω, f = 1kHz AV = 6dB, RL = 8Ω, f = 1kHz
Figure 3. Figure 4.
THD+N THD+Nvs vs
Output Power Output PowerOCL Headphone Mode OCL Headphone Mode
AV = 0dB, RL = 16Ω, f = 1kHz AV = 0dB, RL = 32Ω, f = 1kHz
Figure 5. Figure 6.
THD+N THD+Nvs vs
Output Power Output PowerCC Headphone Mode CC Headphone Mode
AV = 0dB, RL = 16Ω, f = 1kHz AV = 0dB, RL = 32Ω, f = 1kHz
Figure 7. Figure 8.
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FREQUENCY (Hz)
TH
D+
N (
%)
0.001
100
0.01
0.1
1
10
20 20k100 1k 10k
FREQUENCY (Hz)
TH
D+
N (
%)
0.001
100
0.01
0.1
1
10
20 20k100 1k 10k
FREQUENCY (Hz)
TH
D+
N (
%)
0.001
100
0.01
0.1
1
10
20 20k100 1k 10k
FREQUENCY (Hz)
TH
D+
N (
%)
0.001
100
0.01
0.1
1
10
20 20k100 1k 10k
FREQUENCY (Hz)
TH
D+
N (
%)
0.001
100
0.01
0.1
1
10
20 20k100 1k 10k0.001
100
0.01
0.1
1
10
20 20k100 1k 10k
FREQUENCY (Hz)
TH
D+
N (
%)
LM49270
SNAS384B –DECEMBER 2006–REVISED MARCH 2007 www.ti.com
Typical Performance Characteristics (continued)THD+N THD+N
vs vsFrequency Frequency
Speaker Mode Speaker ModeVDD = 3.3V, POUT = 300mW, RL = 4Ω VDD = 5V, POUT = 500mW, RL = 4Ω
Figure 9. Figure 10.
THD+N THD+Nvs vs
Frequency FrequencySpeaker Mode Speaker Mode
VDD = 3.3V, POUT = 200mW, RL = 8Ω VDD = 5V, POUT = 350mW, RL = 8Ω
Figure 11. Figure 12.
THD+N THD+Nvs vs
Frequency FrequencyOCL Headphone Mode OCL Headphone Mode
VDD = 3.3V, POUT = 45mW, RL = 16Ω VDD = 5V, POUT = 100mW, RL = 16Ω
Figure 13. Figure 14.
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FREQUENCY (Hz)
TH
D+
N (
%)
0.001
100
0.01
0.1
1
10
20 20k100 1k 10k
FREQUENCY (Hz)
TH
D+
N (
%)
0.001
100
0.01
0.1
1
10
20 20k100 1k 10k
FREQUENCY (Hz)
TH
D+
N (
%)
0.001
100
0.01
0.1
1
10
20 20k100 1k 10k
FREQUENCY (Hz)
TH
D+
N (
%)
0.001
100
0.01
0.1
1
10
20 20k100 1k 10k
FREQUENCY (Hz)
TH
D+
N (
%)
0.001
100
0.01
0.1
1
10
20 20k100 1k 10k
FREQUENCY (Hz)
TH
D+
N (
%)
0.001
100
0.01
0.1
1
10
20 20k100 1k 10k
LM49270
www.ti.com SNAS384B –DECEMBER 2006–REVISED MARCH 2007
Typical Performance Characteristics (continued)THD+N THD+N
vs vsFrequency Frequency
OCL Headphone Mode OCL Headphone ModeVDD = 3.3V, POUT = 25mW, RL = 32Ω VDD = 5V, POUT = 70mW, RL = 32Ω
Figure 15. Figure 16.
THD+N THD+Nvs vs
Frequency FrequencyCC Headphone Mode CC Headphone Mode
VDD = 3.3V, POUT = 45mW, RL = 16Ω VDD = 5V, POUT = 100mW, RL = 16Ω
Figure 17. Figure 18.
THD+N THD+Nvs vs
Frequency FrequencyCC Headphone Mode CC Headphone Mode
VDD = 3.3V, POUT = 25mW, RL = 32Ω VDD = 5V, POUT = 70mW, RL = 32Ω
Figure 19. Figure 20.
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0 500 1000 1500 2000
OUTPUT POWER (mW)
EF
FIC
IEN
CY
(%
)
0
10
20
30
40
50
60
70
80
90
100VDD = 3.3V
VDD = 5V
0
250
500
750
1000
1250
0 1000 2000 3000 4000
OUTPUT POWER (mW)
PO
WE
R D
ISS
IPA
TIO
N (
mW
)
VDD = 3.3V
VDD = 5V
POUT = POUTL + POUTR
0 1000 2000 3000 4000
OUTPUT POWER (mW)
EF
FIC
IEN
CY
(%
)
VDD = 5V
VDD = 3.3V
0
10
20
30
40
50
60
70
80
90
100
-80
-70
-60
-50
-40
-30
-20
-10
0
20 100 1k 10k 20k
FREQUENCY (Hz)
PS
RR
(dB
)
-80
-70
-60
-50
-40
-30
-20
-10
0
20 100 1k 10k 20k
FREQUENCY (Hz)
PS
RR
(dB
)
-90
-80
-70
-60
-50
-40
-30
-20
-10
0
20 100 1k 10k 20k
FREQUENCY (Hz)
PS
RR
(dB
)
LM49270
SNAS384B –DECEMBER 2006–REVISED MARCH 2007 www.ti.com
Typical Performance Characteristics (continued)PSRR PSRR
vs vsFrequency Frequency
Speaker Mode OCL Headphone ModeVDD = 3.3V, VRIPPLE = 200mVP-P, RL = 8Ω VDD = 3.3V, VRIPPLE = 200mVP-P, RL = 32Ω
Figure 21. Figure 22.
PSRR Efficiencyvs vs
Frequency Output PowerCC Headphone Mode Speaker Mode
VDD = 3.3V, VRIPPLE = 200mVP-P, RL = 32Ω RL = 4Ω, f = 1kHz
Figure 23. Figure 24.
Efficiency Power Dissipationvs vs
Output Power Output PowerSpeaker Mode Speaker Mode
RL = 8Ω, f = 1kHz RL = 4Ω, f = 1kHz
Figure 25. Figure 26.
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0 50 100 150 200
OUTPUT POWER (mW)
PO
WE
R D
ISS
IPA
TIO
N (
mW
)
POUT = POUTL + POUTR
VDD = 3.3V
0
50
100
150
VDD = 5V
25
75
125
0
1
2
3
2 2.5 3 3.5 4 4.5 5 5.5
SUPPLY VOLTAGE (V)
OU
TP
UT
PO
WE
R (
W)
THD+N = 1%
THD+N = 10%
0.5
1.5
2.5
0 50 100 150 200
OUTPUT POWER (mW)
PO
WE
R D
ISS
IPA
TIO
N (
mW
)
POUT = POUTL + POUTR
VDD = 5V
VDD = 3.3V
0
100
200
300
400
0 50 100 150 200 250 300 350
OUTPUT POWER (mW)
PO
WE
R D
ISS
IPA
TIO
N (
mW
)
VDD = 3.3V
POUT = POUTL + POUTR0
50
100
150
200
250
VDD = 5V
OUTPUT POWER (mW)
PO
WE
R D
ISS
IPA
TIO
N (
mW
)
VDD = 3.3V
VDD = 5V
POUT = POUTL + POUTR
0
100
200
300
400
500
0 500 1000 1500 2000 25000
150
300
450
600
750
0 50 100 150 200 250 300 350
OUTPUT POWER (mW)
PO
WE
R D
ISS
IPA
TIO
N (
mW
)
VDD = 3.3V
VDD = 5V
POUT = POUTL + POUTR
LM49270
www.ti.com SNAS384B –DECEMBER 2006–REVISED MARCH 2007
Typical Performance Characteristics (continued)Power Dissipation Power Dissipation
vs vsOutput Power Output PowerSpeaker Mode OCL Headphone Mode
RL = 8Ω, f = 1kHz RL = 16Ω, f = 1kHz
Figure 27. Figure 28.
Power Dissipation Power Dissipationvs vs
Output Power Output PowerOCL Headphone Mode CC Headphone Mode
RL = 32Ω, f = 1kHz RL = 16Ω, f = 1kHz
Figure 29. Figure 30.
Power Dissipation Output Powervs vs
Output Power Supply VoltageCC Headphone Mode Speaker Mode
RL = 32Ω, f = 1kHz RL = 4Ω, f = 1kHz
Figure 31. Figure 32.
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2 2.5 3 3.5 4 4.5 5 5.5
SUPPLY VOLTAGE (V)
OU
TP
UT
PO
WE
R (
mW
)
THD+N = 1%
THD+N = 10%
0
25
50
75
100
125
150
-100
-90
-80
-70
-60
-50
-40
-30
-20
-10
0
20 100 1k 10k 20k
FREQUENCY (Hz)
CR
OS
ST
ALK
(dB
)
0
25
50
75
100
125
150
2 2.5 3 3.5 4 4.5 5 5.5
SUPPLY VOLTAGE (V)
OU
TP
UT
PO
WE
R (
mW
)
THD+N = 10%
THD+N = 1%
0
50
100
150
200
250
2 2.5 3 3.5 4 4.5 5 5.5
SUPPLY VOLTAGE (V)
OU
TP
UT
PO
WE
R (
mW
)THD+N = 10%
THD+N = 1%
0
50
100
150
200
250
2 2.5 3 3.5 4 4.5 5 5.5
SUPPLY VOLTAGE (V)
OU
TP
UT
PO
WE
R (
mW
)
THD+N = 10%
THD+N = 1%
OU
TP
UT
PO
WE
R (
W)
0
1
1.5
2 2.5 3 3.5 4 4.5 5 5.5
SUPPLY VOLTAGE (V)
THD+N = 1%
THD+N = 10%
0.5
2
LM49270
SNAS384B –DECEMBER 2006–REVISED MARCH 2007 www.ti.com
Typical Performance Characteristics (continued)Output Power Output Power
vs vsSupply Voltage Supply VoltageSpeaker Mode OCL Headphone Mode
RL = 8Ω, f = 1kHz RL = 16Ω, f = 1kHz
Figure 33. Figure 34.
Output Power Output Powervs vs
Supply Voltage Supply VoltageOCL Headphone Mode CC Headphone Mode
RL = 32Ω, f = 1kHz RL = 16Ω, f = 1kHz
Figure 35. Figure 36.
Output Power Crosstalkvs vs
Supply Voltage FrequencyCC Headphone Mode Speaker Mode
RL = 32Ω, f = 1kHz VDD = 3.3V, VRIPPLE = 1VP-P, RL = 8Ω
Figure 37. Figure 38.
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2 2.5 3 3.5 4 4.5 5 5.5
SUPPLY VOLTAGE (V)
SU
PP
LY C
UR
RE
NT
(m
A)
0
2
4
6
2 2.5 3 3.5 4 4.5 5 5.5
SUPPLY VOLTAGE (V)
SU
PP
LY C
UR
RE
NT
(m
A)
0
2
4
6
5
3
1
2 2.5 3 3.5 4 4.5 5 5.5
SUPPLY VOLTAGE (V)
SU
PP
LY C
UR
RE
NT
(m
A)
0
2
4
6
8
10
12
-100
-90
-80
-70
-60
-50
-40
-30
-20
-10
0
20 100 1k 10k 20k
FREQUENCY (Hz)
CR
OS
ST
ALK
(dB
)
-100
-90
-80
-70
-60
-50
-40
-30
-20
-10
0
20 100 1k 10k 20k
FREQUENCY (Hz)
CR
OS
ST
ALK
(dB
)
LM49270
www.ti.com SNAS384B –DECEMBER 2006–REVISED MARCH 2007
Typical Performance Characteristics (continued)Crosstalk Crosstalk
vs vsFrequency Frequency
OCL Headphone Mode CC Headphone ModeVDD = 3.3V, VRIPPLE = 1VP-P, RL = 32Ω VDD = 3.3V, VRIPPLE = 1VP-P, RL = 32Ω
Figure 39. Figure 40.
Supply Current Supply Currentvs vs
Supply Voltage Supply VoltageSpeaker Mode, No Load OCL Headphone Mode, No Load
Figure 41. Figure 42.
Supply Currentvs
Supply Voltage Turn-OnCC Headphone Mode, No Load Speaker Mode
Figure 43. Figure 44.
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Typical Performance Characteristics (continued)Turn-Off Turn-On
Speaker Mode OCL Headphone Mode
Figure 45. Figure 46.
Turn-Off Turn-OnOCL Headphone Mode CC Headphone Mode
Figure 47. Figure 48.
Turn-OffCC Headphone Mode
Figure 49.
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APPLICATION INFORMATION
I2C COMPATIBLE INTERFACE
The LM49270 is controlled through an I2C compatible serial interface that consists of a serial data line (SDA) anda serial clock (SCL). The clock line is uni-directional. The data line is bi-directional (open-collector), although theLM49270 does not write to the I2C bus. The LM49270 and the master can communicate at clock rates up to400kHz. Figure 51 shows the I2C interface timing diagram. The LM49270 is a transmit/receive slave-only device,reliant upon the master to generate a clock signal.
The master device communicates to the LM49270 by transmitting the proper device address followed by acommand word. Each transmission sequence is framed by a START condition and a STOP condition. Each word(register address + register content) transmitted over the bus is 8 bits long and is always followed by anacknowledge pulse.
To avoid an address conflict with another device on the I2C bus, the LM49270 address is determined by the ADRpin, the state of ADR determines address bit A1 (Table 1). When ADR = 0, the address is 1111 1000. WhenADR = 1 the device address is 1111 1010.
Table 1. Device Address
ADR A7 A6 A5 A4 A3 A2 A1 A0
X 1 1 1 1 1 0 X 0
0 1 1 1 1 1 0 0 0
1 1 1 1 1 1 0 1 0
Table 2. I2C Control Registers
REG Register D7 D6 D5 D4 D3 D2 D1 D0Name
0 Shutdown 0 0 — — HP3DSEL LS3DSEL OCL/CC PWR_ONControl
1 Headphone 0 1 — HP4 HP3 HP2 HP1 HP0GainControl
2 Speaker 1 0 — LS4 LS3 LS2 LS1 LS0GainControl
NOTEOCL/CC = 1 selects OCL mode; OCL/CC = 0 selects cap coupled mode
PWR_ON = 0 puts part in shutdown
BUS FORMAT
The I2C bus format is shown in Figure 50. The “start” signal is generated by lowering the data signal while theclock is high. The start signal alerts all devices on the bus that a device address is being written to the bus.
The 8-bit device address is written to the bus next, most significant bit first. The data is latched in on the risingedge of the clock. Each address bit must be stable while the clock is high.
After the last address bit is sent, the master device releases the data line, during which time, an acknowledgeclock pulse is generated. If the LM49270 receives the address correctly, then the LM49270 pulls the data linelow, generating an acknowledge bit (ACK).
Once the master device has registered the ACK bit, the 8-bit register address/data word is sent. Each data bitshould be stable while the clock level is high. After the 8–bit word is sent, the LM49270 sends another ACK bit.Following the acknowledgement of the data word, the master device issues a “stop” bit, allowing SDA to go highwhile the clock signal is high.
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Figure 50. I2C Bus Format
Figure 51. I2C Timing Diagram
GENERAL AMPLIFIER FUNCTION
Class D Amplifier
The LM49270 features a high-efficiency, filterless, Class D stereo amplifier. The LM49270 Class D amplifiersfeature a filterless modulation scheme known as Class BD. The differential outputs of each channel switch at300kHz from VDD to GND. When there is no input signal applied, the two outputs (LLS+ and LLS-) switch inphase with a 50% duty cycle. Because the outputs of the LM49270 are differential, there is in no net voltageacross the speaker, thus no load current during the idle state conserving power.
When an input signal is applied, the duty cycle (pulse width) of each output changes. For increasing outputvoltages, the duty cycle of LLS+ increases, while the duty cycle of LLS- decreases. For decreasing outputvoltages, the converse occurs. The duty cycle of LLS- increases while the duty cycle of LLS+ decreases. Thedifference between the two pulse widths yields the differential output voltage.
Headphone Amplifier
The LM49270 headphone amplifier features two different operating modes, output capacitor-less (OCL) andcapacitor coupled (CC). The OCL architecture eliminates the bulky, expensive output coupling capacitorsrequired by traditional headphone amplifiers. The LM49270 headphone section uses three amplifiers. Twoamplifiers drive the headphones while the third (VOC) is set to the internally generated bias voltage (typicallyVDD/2). The third amplifier is connected to the return terminal (sleeve) of the headphone jack. In thisconfiguration, the signal side of the headphones are biased to VDD/2, the return is biased to VDD/2, thus there isno net DC voltage across the headphone eliminating the need for an output coupling capacitor. Removing theoutput coupling capacitors from the headphone signal path reduces component count, reducing system cost andboard space consumption, as well as improving low frequency performance and sound quality. The voltage onthe return sleeve is not an issue when driving headphones. However, if the headphone output is used as a lineout, the VDD/2 can conflict with the GND potential that a line-in would expect on the return sleeve. When thereturn of the headphone jack is connected to GND, the LM49270 detects an output short circuit condition and theVOC amplifier is disabled preventing damage to the LM49270 and allowing the headphone return to be biased atGND.
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HPR
HPL
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Capacitor Coupled Headphone Mode
In capacitor coupled (CC) mode, the VOC pin is disabled, and the headphone outputs are coupled to the jackthrough series capacitors, allowing the headphone return to be connected to GND (Figure 52). In CC mode, theLM49270 requires output coupling capacitors to block the DC component of the amplifier output, preventing DCcurrent from flowing to the load. The output capacitor and speaker impedance form a high pass filter with a -3dBroll-off determined by:
f-3dB = 1 / 2πRLCOUT
Where RL is the headphone impedance, and COUT is the output coupling capacitor. Choose COUT such that f-3dB iswell below the lowest frequency of interest. Setting f-3dB too high results in poor low frequency performance.Select capacitor dielectric types with low ESR to minimize signal loss due to capacitor series resistance andmaximize power transfer to the load.
Figure 52. Capacitor Coupled Headphone Mode
Headphone Sense
The LM49270 features a headphone sense input (HPS) that monitors the headphone jack and configures thedevice depending on the presence of a headphone. When the HPS pin is low, indicating that a headphone is notpresent, the LM49270 speaker amplifiers are active and the headphone amplifiers are disabled. When the HPSpin is high, indicating that a headphone is present, the headphone amplifiers are active while the speakeramplifiers are disabled.
POWER DISSIPATION AND EFFICIENCY
The major benefit of Class D amplifier is increased efficiency versus Class AB. The efficiency of the LM49270speaker amplifiers is attributed to the output transistors’ region of operation. The Class D output stage acts ascurrent steering switches, consuming negligible amounts of power compared to their Class AB counterparts.Most of the power loss associated with the output stage is due to the IR loss of the MOSFET on-resistance(RDS(ON)) , along with the switching losses due to gate charge.
The maximum power dissipation per headphone channel in Capacitor Coupled mode is given by:PDMAX(CC) = VDD
2/2π2RL
In OCL mode, the maximum power dissipation increases due to the use of a third amplifier as a buffer. Thepower dissipation is given by:
PDMAX(OCL) = VDD2/π2RL
SHUTDOWN FUNCTION
The LM49270 features a shutdown mode configured through the I2C interface. Bit D0 (PWR_ON) in theShutdown Control register shuts down/turns on the entire device. Set PWR_ON = 1 to enable the LM49270, setPWR_ON = 0 to disable the device.
AUDIO AMPLIFIER GAIN SETTING
Each channel of the LM49270 features a 32 step volume control. The loudspeaker volume has a range of -47dBto 30dB and the headphone has a range of -59dB to 18dB (see Table 3).
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Table 3. Volume Control
Volume Step LS4/HP4 LS3/HP3 LS2/HP2 LS1/HP1 LS0/HP0 LS HPGain (dB) Gain (dB)
1 0 0 0 0 0 –47 –59
2 0 0 0 0 1 –36 –48
3 0 0 0 1 0 –28.5 –46.5
4 0 0 0 1 1 –22.5 –34.5
5 0 0 1 0 0 –18 –30
6 0 0 1 0 1 –15 –27
7 0 0 1 1 0 –12 –24
8 0 0 1 1 1 –9 –21
9 0 1 0 0 0 –6 –18
10 0 1 0 0 1 –3 –15
11 0 1 0 1 0 –1.5 –13.5
12 0 1 0 1 1 0 –12
13 0 1 1 0 0 1.5 –10.5
14 0 1 1 0 1 3 –9
15 0 1 1 1 0 4.5 –7.5
16 0 1 1 1 1 6 –6
17 1 0 0 0 0 7.5 –4.5
18 1 0 0 0 1 9 –3
19 1 0 0 1 0 10.5 –1.5
20 1 0 0 1 1 12 0
21 1 0 1 0 0 13.5 1.5
22 1 0 1 0 1 15 3
23 1 0 1 1 0 16.5 4.5
24 1 0 1 1 1 18 6
25 1 1 0 0 0 19.5 7.5
26 1 1 0 0 1 21 9
27 1 1 0 1 0 22.5 10.5
28 1 1 0 1 1 24 12
29 1 1 1 0 0 25.5 13.5
30 1 1 1 0 1 27 15
31 1 1 1 1 0 28.5 16.5
32 1 1 1 1 1 30 18
3D ENHANCEMENT
The LM49720 features TI’s 3D sound enhancement. 3D sound improves the apparent stereo channel separationwhenever the left and right speakers are located close to each other, widening the perceived sound stage indevices with a small form factor that prohibits proper speaker placement.
An external RC network , shown in Figure 1, enables the 3D effect. R3D sets the level of the 3D effect;decreasing the value of R3D will increase the 3D effect. The 3D network acts like a high pass filter C3D sets thefrequency response; increasing the value of C3D will decrease the low cutoff frequency at which the 3D effectstarts to occur, as shown by this equation:
f3D(-3dB) = 1/2π(R3D)(C3D) (1)
Enabling the 3D effect increases the gain by a multiplication factor of (1 + 20kΩ/R3D). Setting R3D to 20kΩresults in a 6dB increase (doubling) of the gain, increasing the 3D effect. The level of 3D effect is also dependenton other factors such as speaker placement and the distance from the speakers to the listener. The values ofR3D and C3D should be chosen for each application individually, taking into account the physical factors notedbefore.
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POWER SUPPLIES
The LM49270 uses different supplies for each portion of the device, allowing for the optimum combination ofheadroom, power dissipation and noise immunity. The speaker amplifier gain stage is powered from VDD, whilethe output stage is powered from LSVDD. The headphone amplifiers, input amplifiers and volume control stagesare powered from HPVDD. The separate power supplies allow the speakers to operate from a higher voltage formaximum headroom, while the headphones operate from a lower voltage, improving power dissipation. HPVDDmay be driven by a linear regulator to further improve performance in noisy environments. The I2C portion ifpowered from I2CVDD, allowing the I2C portion of the LM49270 to interface with lower voltage digital controllers.
PROPER SELECTION OF EXTERNAL COMPONENTS
Audio Amplifier Power Supply Bypassing/Filtering
Proper power supply bypassing is critical for low noise performance and high PSRR. Place the supply bypasscapacitor as close to the device as possible. Typical applications employ a voltage regulator with 10µF and 0.1µFbypass capacitors that increase supply stability. These capacitors do not eliminate the need for bypassing of theLM49270 supply pins. A 1µF capacitor is recommended.
Bypass Capacitor Selection
The LM49270 generates a VDD/2 common-mode bias voltage internally. The BYPASS capacitor, CB, improvesPSRR and THD+N by reducing noise at the BYPASS node. Use a 1μF capacitor, placed as close to the deviceas possible for CB.
Audio Amplifier Input Capacitor Selection
Input capacitors, CIN, in conjunction with the input impedance of the LM49270 forms a high pass filter thatremoves the DC bias from an incoming signal. The AC-coupling capacitor allows the amplifier to bias the signalto an optimal DC level. Assuming zero source impedance, the -3dB point of the high pass filter is given by:
f(–3dB) = 1/2πRINCIN (2)
Choose CIN such that f-3dB is well below that lowest frequency of interest. Setting f-3dB too high affects the low-frequency responses of the amplifier. Use capacitors with low voltage coefficient dielectrics, such as tantalum oraluminum electrolytic. Capacitors with high-voltage coefficients, such as ceramics, may result in increaseddistortion at low frequencies. Other factors to consider when designing the input filter include the constraints ofthe overall system. Although high fidelity audio requires a flat frequency response between 20Hz and 20kHz,portable devices such as cell phones may only concentrate on the frequency range of the frequency range of thespoken human voice (typically 300Hz to 4kHz). In addition, the physical size of the speakers used in suchportable devices limits the low frequency response; in this case, frequencies below 150Hz may be filtered out.
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REVISION TABLE
Rev Date Description
1.0 12/19/06 Initial release.
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PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status(1)
Package Type PackageDrawing
Pins PackageQty
Eco Plan(2)
Lead finish/Ball material
(6)
MSL Peak Temp(3)
Op Temp (°C) Device Marking(4/5)
Samples
LM49270SQ/NOPB ACTIVE WQFN RSG 28 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 49270SQ
(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substancedo not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI mayreference these types of products as "Pb-Free".RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide basedflame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuationof the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to twolines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on informationprovided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken andcontinues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device PackageType
PackageDrawing
Pins SPQ ReelDiameter
(mm)
ReelWidth
W1 (mm)
A0(mm)
B0(mm)
K0(mm)
P1(mm)
W(mm)
Pin1Quadrant
LM49270SQ/NOPB WQFN RSG 28 1000 178.0 12.4 5.3 5.3 1.3 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 5-Nov-2021
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM49270SQ/NOPB WQFN RSG 28 1000 208.0 191.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 5-Nov-2021
Pack Materials-Page 2
www.ti.com
PACKAGE OUTLINE
C
SEE TERMINALDETAIL
28X 0.30.2
3.6 0.1
28X 0.50.3
0.8 MAX
(A) TYP
0.050.00
24X 0.5
2X3
2X 3
3.6 0.1
A 5.14.9
B
5.14.9
0.30.2
0.50.3
WQFN - 0.8 mm max heightRSG0028APLASTIC QUAD FLATPACK - NO LEAD
4214982/A 08/2016
DIM A OPT 1 OPT 1
(0.1) (0.2)
PIN 1 INDEX AREA
0.08
SEATING PLANE
1
715
21
8 14
28 22(OPTIONAL)
PIN 1 ID 0.1 C A B0.05
EXPOSEDTHERMAL PAD
29 SYMM
SYMM
NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
SCALE 2.600
DETAILOPTIONAL TERMINAL
TYPICAL
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EXAMPLE BOARD LAYOUT
0.07 MINALL AROUND
0.07 MAXALL AROUND
28X (0.25)
28X (0.6)
( 0.2) TYPVIA
24X (0.5)
(4.8)
(4.8)
4X(1.55)
(3.6)
(R0.05)TYP
4X (1.55)
(1.23)TYP
(1.23) TYP
WQFN - 0.8 mm max heightRSG0028APLASTIC QUAD FLATPACK - NO LEAD
4214982/A 08/2016
SYMM
1
7
8 14
15
21
2228
SYMM
LAND PATTERN EXAMPLESCALE:15X
29
NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271).5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented.
SOLDER MASKOPENING
METAL UNDERSOLDER MASK
SOLDER MASKDEFINED
METAL
SOLDER MASKOPENING
SOLDER MASK DETAILS
NON SOLDER MASKDEFINED
(PREFERRED)
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EXAMPLE STENCIL DESIGN
28X (0.6)
28X (0.25)
24X (0.5)
(4.8)
(4.8)
9X (1.03)
(1.23)TYP
(1.23) TYP
(R0.05) TYP
WQFN - 0.8 mm max heightRSG0028APLASTIC QUAD FLATPACK - NO LEAD
4214982/A 08/2016
NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations.
SYMM
METALTYP
SOLDER PASTE EXAMPLEBASED ON 0.125 mm THICK STENCIL
EXPOSED PAD 29
73.7% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGESCALE:20X
SYMM
1
7
8 14
15
21
2228
29
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