Post on 22-Jan-2018
transcript
MECHANISM ENABLING
RETROFIT FOR COOLING OF
DATA CENTER COMPONENTS
Greg Meyer
Chenell York
Matthew Kaminski
Naji Alibeji
Advisor: Dr. Mark Kimber
AGENDA
Background
Thermal Analysis
Design
Construction
Testing
Results/Conclusion
Future Work
DATA CENTER BACKGROUND
โข Data Centers house server trays for computer
systems and other supporting infrastructure
GLOBAL IMPACT
61 billion kilowatt-hours annually
Similar to amount of electricity consumed by 5.8 million average U.S. households
1.5 percent of the country's entire electricity consumption.
4
SCOPE OF PROJECT
Demonstrate feasibility of retrofitting a data center with liquid-cooled thermal management solution
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Factory Installed Air-Cooled
Solution
Liquid-Cooled Retrofit
SERVER BOARD LAYOUT
Foxconn G41MXE Series
Motherboard
1. Core 2 Duo Processor
Max temp. = 72ยฐC
TDP = 65 W
2. South Bridge Intel ICH7
Max temp. = 99ยฐC
TDP = 3.3 W
3. North Bridge Intel G41
Max temp. = 102ยฐC
TDP = 25 W
*TDP= Thermal Design Power
12
3
๐ป
๐๐โ
๐ป๐โ
๐๐ ๐๐โ๐๐
L
W
t
MICROCHANNEL HEAT SINK
Arrangement of channels and fins which are used to increase the area available for heat transfer from the component to the fluid
Assuming:
โข Hydro-dynamically Fully Developed
โข Thermally Fully Developed
โข Fin efficiency = 100%
โข All heat is conducted through channel
base and fins
OPTIMIZATION
The best heat transfer performance requires the
smallest hydraulic diameter
A smaller hydraulic diameter increases the pressure
drop and pumping power
This competition will yield an optimal value
CALCULATING FLOW RATE
Pump Curve
ฮ๐ = ๐0 โ๐0 ๐
๐0
System Curve
ฮ๐ =32 ๐ฮผ
โโ (
๐ฟ1
๐๐โ1๐ท12 +
๐ฟ2
๐๐โ2๐ท22 +
๐ฟ3
๐๐โ3๐ท32 )
JUNCTION TEMPERATURE CALCULATION
โข Convert ๐ to ๐ and substitute ๐ into equation below
๐๐๐ =๐๐ท๐๐
๐๐ท๐๐ โ ๐๐ ๐ก๐๐_๐ก๐๐ก๐๐ โ โ๐ โ ๐ด๐ค๐๐ก๐ก๐๐๐+๐๐ท๐๐ โ ๐ก
๐ โ ๐ด๐+
๐๐ท๐๐ ๐ โ ๐๐
+ ๐๐ค๐๐ก๐๐๐๐
Where,
๐๐๐ = Junction Temperature of chip i
๐๐ท๐๐ = Thermal Design Power of chip i
๐๐ ๐ก๐๐_๐ก๐๐ก๐๐ = Expression relating number of channels to TDP
โ๐ = Convective heat transfer coefficient for water through heat sink i
๐ด๐ค๐๐ก๐ก๐๐๐= Wetted area of a channel in heat sink i
๐ก = Thickness of copper base
๐ = Thermal conductivity of copper
๐ด๐ = Area of component i
๐ = Total mass flow rate through all heat sinks
๐๐ = Specific heat of water
๐๐ค๐๐ก๐๐๐๐ = Temperature of water entering heat sink i
DETERMINING RATIO OF CHANNEL NUMBER
TO THERMAL DESIGN POWER
โข Plot ๐๐1, ๐๐2, ๐๐3vs. Nstar_total
โข Find Nstar_total that corresponds to hottest of the minimum
junction temperatures
0.41
0.45
0.40
MATLAB GUI
DESIGN CONSIDERATIONS
Challenge: This product is intended to be a retrofit so it must be
designed around existing server boards.
Assumption: We based our design around a server board accessible
to us, but it should still fit others.
FUNCTIONAL REQUIREMENTS
Must dissipate required heat and keep junction
temperature below limit for all components requiring
cooling
Must be universal for any server board
Must apply required static load
Must fit in confined space
Must be waterproof
FINAL DESIGN
Spring
Header Microchannel
Heat Sink
Locator
Bracket
Elbow
Fitting
Lid
Dowel Pin
USING ๐PARTS AND ๐ASSEMBLIES
Through the use of parametric tables, iParts
and iAssemblies allow quick modifications to
parts and assemblies. Each row in the table will
correspond to a new part with its own part
number and altered features.
METHOD OF FABRICATION
Part: Microchannel Base
Material: Machinable
Copper
Method: CNC Machine
Notes: purchased a .026โ
bit to machine
microchannels
Part: Headers, Lid, and
Bracket
Material: Acrylic
Method: CNC Machine
ASSEMBLY
2-56 UNC bolts are used to mount the
lid and headers to the micro channel
base
Silicon is used to seal the mating faces
Teflon tape is used on the fitting
threads to keep it sealed
Dowel pins were press fitted into the
locator bracket plate
Challenge: Sealing the cooling block.
BILL OF MATERIALS
Part Description Part # Vendor Unit Price
($)
QTY
6" X 6" ultra-conductive Copper 89675K15 McMaster 62.94 1
Clear Cast Acrylic Slat 8560K191 McMaster 7.04 1
.026" End Mill, square end, long flute 8915A28 McMaster 23.61 3
302 SS precision Compression Spring 9435K82 McMaster 7.36 1 pack (5)
10-32 UNF thread elbow barb fitting KL230-1 Value
Plastics
Sample 2 packs
(5)
Corrosion Resistant Dowel Pin, type
316 SS
97395A453 McMaster 4.77 2 packs
(5)
Flexible PVC tubing 1/8" inner
diameter
5233K52 McMaster 0.25 1ft
General Purpose double sided Tape 77185A21 McMaster 15.44 1
Adapter fitting, Tube to male threaded
pipe
2974k124 McMaster 5.26 1 pack
(10)
Threading Adapter, NPT 1/8 M to G 1/4
F
ADT-N18M-
G14F
Koolance 2.17 5
TOTAL: $195.51
TESTING
RESULTS/DISCUSSION
RESULTS/DISCUSSION
Thermal Resistance for CPU
Cooling Block
Thermal Resistance for South
Bridge Cooling Block
CONCLUSIONS
Goal: Design a mechanism that enables a retrofit
for cooling of data center components
The design was successful in that it provided a
solution for retrofitting current air cooled server
boards with a universal water cooled mechanism.
Testing of the cooling blocks yielded insufficient
results.
North Bridge cooling block not tested
Thermal Resistance too high for tested cooling blocks
RECOMMENDATIONS FOR FUTURE WORK
Redesign to allow for less parts/mating faces in the
assembly
Less hardware
Less machining time
Creates a more effective seal
Improvement for mounting mechanism
More sophisticated GUI
Link between GUI results and Solid Model
Additional testing to evaluate cooling block
performance
REFERENCES
Scheihing, DOE Data Center Efficiency Program, 2008.
Intelยฎ I/O Controller Hub 7 (ICH7) Datasheet. Thermal Design Guidelines. Document 307015-001. Initial Release. April 2005. Intel. 4 April 2012. http://www.intel.com/content/www/us/en/io/intel-io-controller-hub-7-guide.html
Intelยฎ Coreโข2 Extreme Quad-Core Processor QX6000ฮ Sequence and Intelยฎ Coreโข2 Quad Processor
Q6000ฮ Sequence Datasheet. Document 315592-005. Rev. 5. August 2007. Intel. 4 April 2012. http://download.intel.com/design/processor/datashts/31559205.pdf
Intelยฎ G45, G41, Q45, Q35 and Q965 Chipsets for Embedded Applications Datasheet. Thermal Design Guide. Document 415360. Revision 1.5. February 2009. Intel. 4 April 2012. http://download.intel.com/embedded/chipsets/designgd/415360.pdf
Incropera, Frank P. Fundamentals of Heat and Mass Transfer / Frank P. Incropera ... [et Al.]. Hoboken, NJ: John Wiley, 2007. Print.
"Pump, PMP-300 [no Nozzles] - Water Cooling Systems, Pc Liquid Cooling Kit, Cpu, Video Card, Hard Drive." Koolance.com. Web. 02 Apr. 2012. <http://www.koolance.com/water-cooling/product_info.php?product_id=950>.
42u Data Center Cooling. N.p., n.d. Web. 24 Jan. 2012. <http://www.42u.com/42u-rack-cooling.htm>.
Pingdom Blog. Pingdom AB, 25 July 2008. Web. 24 Jan. 2012. <http://royal.pingdom.com/2008/07/25/us-data-centers-consuming-as-much-power-as-5-million-houses/>.
Graybar: works to your advantage. N.p., 2012. Web. 9 Apr. 2012. <http://www.graybar.com/applications/data-centers>.
THANK YOU FOR YOUR TIME!
Special thanks to Dr. Kimber, Ricardo Riviera, and
Andy Holmes & his machine shop crew
Questions?