PlX'l'URiNG APPARATUSU.S. Patent 5,871,629. Feb. 16, 1999K. W. Watts, assignor to IBM Corp.,Armonk, N. Y.A method of releasably securingand electrically grounding a pingrid array during electrolyticplating, the pin grid aray havingadjacent rows of pins each sepa­rated by a gap.

.UCIIIODlPOsmoN PIIOCUSU.S. Patent 5,871,630. Feb. 16, 1999R.N. Bhattacharya et aI., assignorsto Davis, Joseph & Negley, Austin,TexasA method for preparation of cop­per-indium-galli urn-diselenideprecursor films by electrodeposi­tion for fabricating high efficiencysolar cells.

ACIDIC 'liN PLA'II_ BA'IMU.S. Patent 5,871,631. Feb. 16, 1999M. Ichiba et al., assignors to NKKCorp. and LeaRonal Japan Inc.,TokyoAn acidic bath for electroplatingtin to a continuously moving steelsheet, the bath comprising a diva­lent tin salt of an organic sulfonicacid using at least one organicsulfonic acid selected from thegroup consisting ofalkanesulfonicacid and alkanolsulfonic acid; anantioxidant; and a brighteningagent comprising additive ingre­dients prepared by adding oxypro­pylene to polyoxyethylene glycol.

WAS'nWAnil TllUTMIINTPROCESSU.S. Patent 5,871,648. Feb. 16, 1999S.D. Allen and L.R. Lyman,

assignors to EnvironmentalChemistries Inc., Salt Lake CityA process for removing metal con­taminants from large volumes ofwastewater comprising treating awastewater stream containing ametal contaminant with an or­ganic or inorganic coagulant,wherein the coagulant reacts withthe metal contaminant to form aparticulate having a size greaterthan 5 microns; passing thetreated wastewater through a mi­crofiltration membrane having apore size in the range from 0.5 to5 microns, wherein the treatedwastewater flow rate is in therange from 700 to 1,500 gallonsper square foot of membrane perday such that the metal contami­nant is removed from water pass-

ow you canEliminate Racking ofSemi-Conductors,Electronic Parts etc.by Barrel Platingwith C ·\ttc CopperPlated Plastic Balls.Ball are reu able ­de igned for alltype of metal.

• Campi tely Copper Plated • Contains 0 Lacquer• Every Ball is Perfectly Round - Has 0 Hole• Ball are Lightweight Ea ily Sifted Out

MC opper-Plated Plastic Ball replace heavy plating or bur­nishing media and mak barrel plating of small or d licate partpo ible. Highly condudive and light in weight, CMC balls rush.ion the produd to prevent damag , re triO interlocking, andhelp to keep flat parts from sticking together. Features includeprecision round, sizes from 1.1 to 18 mm diameters, and easysifting. The balls are ideal for barrel plating, semiconductor andprecision pa~s, !ncr~ase eleorical contad to fine articles for('ven metal distribution, are reusable and can be refined for pre­CiOUS metal. Sample on reuqest.

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