I/O PADS In, Out, InOut, Gnd, Vdd, Source follower.

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I/O PADSI/O PADS

In, Out , InOut , In, Out , InOut , Gnd , Vdd,Gnd , Vdd,

Source followerSource follower

Bidirectional Pad -Bidirectional Pad -Digital Component.Digital Component.

•Operates as Pad_in or Pad_out:

•EO high => pad out.

•EO low => pad in.

pad

dataInUnBuff

dataOut

EO

DataIn

DataInB PadBidirHE_SCMOS

Pad LayoutPad Layout

DataIn OE DataOu

tDataInUnBufDataInBu

f

Pad In DC AnalysisPad In DC Analysis

DataInB, after one inverter, has less gain than dataIn

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

vpad (V)

-0.5

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

5.5

Vol

tage

(V

)

v(dataInB)v(dataIn)v(pad)

simIn

Max frequency 100MhzMax frequency 100Mhz

•Dx = 4.11nsec (>80%*5=4nsec)

•Cursers mark position where output exceed 80% of max input value

0 1 2 3 4 5 6 7 8 9 10 11

Time (ns)

-0.5

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

5.5

Vol

tage

(V

)

v(dataInB)

3.98

v(dataIn)

122.11m

v(Pad)

0.00

x1= x2= dx=6.05n 10.16n 4.11nsimIn

•VinBar

•Vin

•Vpad

Pad out Dc AnalysisPad out Dc Analysis

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

vdataout (V)

-0.5

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

5.5

Vol

tage

(V

)

v(pad)v(dataout)

simOut

DataOut

Pad

Data

InB DataIn

Data

InUn

Buf

OE

OE

OEB

OEB

R=10

0

T0L=2u

W=22uT0L=2u

W=22uT0L=2u

W=22uT0L=2u

W=22u

T0L=2u

W=22u

T0L=2u

W=22u

BONDING

PAD

T0L=2u

W=22uT0L=2u

W=22uT0L=2u

W=22uT0L=2u

W=22u

T0L=2u

W=22u

T0L=2u

W=22u

•Response similar to dataIn.

•Explanation: It has two levels of amplifying, as the dataIn node.

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

vpad (V)

-0.5

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

5.5

Vol

tage

(V

)

v(dataInB)v(dataIn)v(pad)

simIn

0 5 10 15 20 25 30 35 40

Time (ns)

-0.5

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

5.5

Vol

tage

(V

)

v(Pad)4.10

v(dataout)0.00

x1= x2= dx=4.81n 18.87n 14.06nsimOut

Max frequency 30Mhz Max frequency 30Mhz with 10pF capacitor as with 10pF capacitor as

loadload•Vpad

•DataOut

Dx = 14.06nsec (> 80%*17=13.6nsec)Cursors mark position where output exceed 80% of max input value

SfSf with no ideal current with no ideal current sourcesource

•Function: Pad follows Signal, with DC offset.

SFSF LayoutLayout

Signal

Vdd

Vss

SF behavior (with the pmos SF behavior (with the pmos as current source) as current source)

•Current source values -190 to -150 uA

•0<Vin<4 volt, the SF follow the input with 0.85 V offset.

3.5V

4 V

0 .0 0 .5 1 .0 1 .5 2 .0 2 .5 3 .0 3 .5 4 .0 4 .5 5 .0

vs (V)

0 .0

0 .5

1 .0

1 .5

2 .0

2 .5

3 .0

3 .5

4 .0

4 .5

5 .0

Volta

ge (V

)

v (sig n al)

v (Pad )

simSF_no_ideal_current

0 .0 0 .5 1 .0 1 .5 2 .0 2 .5 3 .0 3 .5 4 .0 4 .5 5 .0

vs (V)

-1 5 0

-1 0 0

-5 0

-0

Curre

nt (u

A)

i1 (M1 )

i1 (M2 )

i1 (M0 )

simSF_no_ideal_current

Let’s have a closer look

Vpad – Vsignal = 0.85 constant when 0 < Vsignal <= 4

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

vs (V)

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

Vol

tage

(V

)

v(signal)

v(Pad)

c-b

simSF_no_ideal_current

Slew Rate of the SFSlew Rate of the SF

0.0 0.5 1.0 1.5 2.0

Time (us)

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

Vol

tage

(V

)

v(Signal)

3.92

v(pad)

4.72

c-b

802.11m

x1= x2= dx=670.33n 1.22u 546.41nsimSF_no_ideal_current_slewRate_good

•Vsignal

•Vpad

•Vpad-Vsignal

Vsignal = ramp from 0 to 5v in 1usec

The SF still follow the step in the range of 0<VSignal<4volt

Pad I/O With ESDPad I/O With ESD

•Two diodes are placed to protect the chip, and are normally at reverse charge.

•When signal exceeds 5+Vb volts, then D2 is forward biased and discharges the excess voltage.

•When signal is below –Vb, then a similar discharging process occurs through D1.

D2

D1

PadIOEsd LayoutPadIOEsd Layout

Diode 1 D1 in schematic

Diode 2 D2 in scehematicsignal

Modeling the PadModeling the Pad

The modeling was The modeling was done by attaching a done by attaching a capacitor, and a capacitor, and a resistor, to the pad. resistor, to the pad. They reperesent They reperesent the capacitance the capacitance and resistance of and resistance of three main models: three main models: Human, machine, Human, machine, and package.and package.

SIGNALSIGNAL

vinit

Gnd

V=5.0

R=1.5K

BONDING

PAD

Dpdiff

Dndiff

C=100pF

To run simulation, an initial voltage was To run simulation, an initial voltage was initialized on the model.initialized on the model.

Human model.Human model.

R=1.5kΩ, C=100pF,Initial Voltage = 2kV

0 50 100 150 200 250 300 350 400 450 500

Time (ns)

0.5

1.0

1.5

2.0 V

olta

ge (

kV)

v (v in it)

simPadWithESD_human_modelnew

0 50 100 150 200 250 300 350 400 450 500

Time (ns)

0.0

0.2

0.4

0.6

0.8

1.0

1.2

Cur

rent

(A

)

i1 (R4 )

simPadWithESD_human_modelnew

Machine Model.Machine Model.

R=25Ω, C=200pF,Initial Voltage = 200V

0 5 10 15 20 25 30 35 40 45 50

Time (ns)

0

50

100

150

200

Vol

tage

(V

)

v (v in it)

simPadWithESD_human_modelnew

0 5 10 15 20 25 30 35 40 45 50

Time (ns)

0

1

2

3

4

5

6

7

8

Cur

rent

(A

)

i1 (R4 )

simPadWithESD_human_modelnew

Package ModelPackage Model

R=1Ω, C=1.5pF,Initial Voltage = 2kV

0 10 20 30 40 50 60 70 80 90 100

Time (ps)

0.0

0.5

1.0

1.5

2.0

Vol

tage

(kV

)v (v in it)

simPadWithESD_human_modelnew

0 10 20 30 40 50 60 70 80 90 100

Time (ps)

0.0

0.5

1.0

1.5

2.0

Cur

rent

(kA

)

i1 (R4 )

simPadWithESD_human_modelnew