Post on 07-Jan-2016
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ISI BGA Reballing Process September 2012
www.isipkg.com
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Founded in 1987 Advanced electronic design and manufacturing facility in the U.S. 200 full-time employees, including 70 with engineering degrees, and 9 technicians 25+ patents Broad and diversified manufacturing capabilities Thousands of solutions designed Millions of products shipped each year Subsidiaries: Nallatech and Innovative Integration
ISI Company Overview
Pioneered Next Level Integration by blending high density packaging with advanced interconnect technologies to quickly deliver optimized modular solutions
Multi-discipline approach improves performance, reduces size and cost, and accelerates time-to-market
Delivering Next Level Integration
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The Need for Reballing Components
Lead-free is not compatible with a tin-lead assembly process; likewise tin-lead is not compatible with a lead-free assembly process
Industry is predominantly supplying lead-free packages
Customers need to reball components to alloy that is compatible with the rest of its assembly process
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ISI Solution: Reballing
ISI has an advanced process for removing and reballing solder spheres that is compatible to the assembly process criteria, whether it requires: Tin-lead (Sn63Pb37 eutectic) Lead-free Or any specialty alloys
Qualified by leading commercial, military and aerospace companies Processes are tailored to each part. Specific control parameters are clearly
defined and indicated for: Handling Production Controls for temperature Humidity ESD protection Ball size/position tolerance specifications Automation Cleanliness Inspection Repackaging
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ISI Certification and Statement Of Work
All processes done in accordance with IPC/JEDEC
J-STD sensitivity levels.
The component temperature exposure is minimized during the ball
removal process.
All parts are reballed using a custom temperature
profile in a nitrogen environment.
Parts are 100% optically inspected to ensure the
device meets the specifications for flatness
and co-planarity.
ISI Reball Certification
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ISI Certification and Statement Of Work
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Reballing Process Flow
Packaging: either customer supplied, JEDEC trays or tape and reel per EIA-481 with nitrogen purged dry pack bags
Final inspection per QAP
True position, co-planarity and flatness are measured using Nikon Nexis or RVSI model LS6000
Part marking available per customer specifications on request
Post ball attach cleaning procedures are monitored and measured using an Ionograph
Reflow solder profiles customized for each component
Reballing utilizes high accuracy assembly tooling for ball placement
Deballing process is specified based on the component
Moisture Sensitivity Level (MSL) requirements are observed and followed
Incoming inspection procedures per Quality Assurance Procedures (QAP)
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Reballing Flux Dispense
Ekra Screen Printer
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Reballing
Ball Placement
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Reflow Ovens Integrated Electronic Assembly
Sikama Conduction Convection Oven
Heller Reflow Ovens
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Inspection and Test
Ionograph Cleanliness Testing
Nikon Automated Optical Inspection
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Automated Optical Inspection
RVSI 100% Automated Optical Inspection
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Operations and Quality
ISO 9001:2008 certified ISO certified since July 2000 ITAR Registered Comprehensive Quality and Process Controls Material traceability In-process controls Automated test, measurement, and inspection systems All work is performed at the ISI facilities in Camarillo, CA
ITAR registered
North American
facilities ISO9001:2008 certified by Perry
Johnson Registrars
IPC Class III compliant soldering Certified IPC Specialist inspectors and key operators
In-house Certified IPC Trainer
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The ISI Difference
ISIs reballing process has been audited and approved for production by several Tier 1 defense suppliers
ISI process is designed and optimized to minimize stress on IC
100% automated optical assembly of reballed components
ISI has reballed over 1,000,000 components Any pitch, any package, any quantity Fast turn-around conversion of any alloy to any alloy
including Pb-free to Sn/Pb Get a reballing quote in less than 24 hours
Thank you! For more information, please visit www.isipkg.com
Copyright 2012 Interconnect Systems, Inc. All rights reserved.