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LS Y876
1 Version 1.2 | 2018-02-12
Produktdatenblatt | Version 1.1 www.osram-os.com
LS Y876
Micro SIDELED® 3010 Micro SIDELED is a SMT LED with side emission. Due to its low package height it is ideal for applica-tions in limited space environments.
Applications — Electronic Equipment — White Goods
Features: — Package: white SMT package, colorless clear resin
— Chip technology: InGaAlP
— Typ. Radiation: 120° (Lambertian emitter)
— Color: λdom = 633 nm (● super red)
— Optical efficacy: 5 lm/W
— Corrosion Robustness Class: 3B
LS Y876
2 Version 1.2 | 2018-02-12
Ordering Information Type Luminous Intensity 1) Ordering Code
IF = 20 mAIv
LS Y876-P2S1-1-Z 56 ... 224 mcd Q65110A2412
LS Y876
3 Version 1.2 | 2018-02-12
Maximum RatingsParameter Symbol Values
Operating Temperature Top min. max.
-40 °C 100 °C
Storage Temperature Tstg min. max.
-40 °C 100 °C
Junction Temperature Tj max. 125 °C
Forward current TS = 25 °C
IF max. 30 mA
Surge Current t ≤ 10 µs; D = 0.005 ; TS = 25 °C
IFS max. 500 mA
Reverse voltage 2) TS = 25 °C
VR max. 12 V
ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM)
VESD 2kV
LS Y876
4 Version 1.2 | 2018-02-12
CharacteristicsIF = 20 mA; TS = 25 °C
Parameter Symbol Values
Peak Wavelength λpeak typ. 645 nm
Dominant Wavelength 3) IF = 20 mA
λdom min. typ. max.
627 nm 633 nm 639 nm
Spectral Bandwidth at 50% Irel,max ∆λ typ. 16 nm
Viewing angle at 50 % IV 2φ typ. 120 °
Forward Voltage 4) IF = 20 mA
VF min. typ. max.
1.80 V 2.00 V 2.30 V
Reverse current 2) VR = 12 V
IR typ. max.
0.01 µA 10 µA
Temperature Coefficient of Peak Wavelength -10°C ≤ T ≤ 100°C
TCλpeak typ. 0.14 nm / K
Temperature Coefficient of Dominant Wavelength -10°C ≤ T ≤ 100°C
TCλdom typ. 0.05 nm / K
Temperature Coefficient of Forward Voltage -10°C ≤ T ≤ 100°C
TCVF typ. -2 mV / K
Real thermal resistance junction/ambient 5), 6) RthJA real max. 630 K / W
Real thermal resistance junction/solderpoint 5) RthJS real max. 350 K / W
LS Y876
5 Version 1.2 | 2018-02-12
Brightness Groups Group Luminous Intensity 1) Luminous Intensity. 1) Luminous Flux 7)
IF = 20 mA IF = 20 mA IF = 20 mAmin. max. typ.Iv Iv ΦV
P2 56 mcd 71 mcd 190 mlm
Q1 71 mcd 90 mcd 240 mlm
Q2 90 mcd 112 mcd 300 mlm
R1 112 mcd 140 mcd 380 mlm
R2 140 mcd 180 mcd 480 mlm
S1 180 mcd 224 mcd 610 mlm
LS Y876
6 Version 1.2 | 2018-02-12
Group Name on Label Example: P2-1Brightness Wavelength
P2 1
LS Y876
7 Version 1.2 | 2018-02-12
OHL00235
4000
20
40
60
80
100
450 500 550 600 650 700nm
%Irel
λ
Vλ
yelloworangeambersuper-red
Relative Spectral Emission 7) Irel = f (λ); IF = 20 mA; TS = 25 °C
0
0.2
0.4
1.0
0.8
0.6
ϕ
1.0 0.8 0.6 0.4
0˚10˚20˚40˚ 30˚ OHL01660
50˚
60˚
70˚
80˚
90˚
100˚0˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚
Radiation Characteristics 7) Irel = f (ϕ); TS = 25 °C
LS Y876
8 Version 1.2 | 2018-02-12
I
OHL10233
F
V (20 mA)IIV
010 110 102mA
110
-210
100
10-1
super-redyelloworange/amber
Relative Luminous Intensity 7), 8)Iv/Iv(20 mA) = f(IF); TS = 25 °C
OHL00232
10 -11.4 1.8 2.2 2.6 3 V 3.4
010
110
10 2
5
5
mA5
1
FV
FI
Forward current 7)IF = f(VF); TS = 25 °C
LS Y876
9 Version 1.2 | 2018-02-12
T
OHL00238
0
VI
-20 0 20 40 60 ˚C 100
orange
j
0.4
0.8
1.2
1.6
2.0IV(25 ˚C)
yellowambersuper-red
super-redamberyellow
orange
Relative Luminous Intensity 7)Iv/Iv(25 °C) = f(Tj); IF = 20 mA
LS Y876
10 Version 1.2 | 2018-02-12
0
OHL00090
IF
˚C0 20 40 60 80 100
T
temp. solder pointtemp. ambientTA
TS
TS
AT
mA
5
10
15
20
25
30
35
Max. Permissible Forward CurrentIF = f(T)
OHL00687
10-5
pt
FI
10-4 10-3 10-2 10-1 100 1010
A
210s
DtPT=
T
PtIF
0.01
0.05
0.20.1
0.005
0.02
0.5
D =
1
0.1
0.2
0.3
0.4
0.6
0.5
Permissible Pulse Handling CapabilityIF = f(tp); D: Duty cycle; TS = 25 °C
LS Y876
11 Version 1.2 | 2018-02-12
Dimensional Drawing 9)
GPLY6058
0 ... 0.1 (0 ... 0.004)
3.1
(0.1
22)
2.9
(0.1
14)
0.7 (0.028)
0.5 (0.020)
1.0 (0.039)
1.2 (0.047)
Cathode
0.3
(0.0
12)
0.5
(0.0
20)
(15˚
)
2.3
(0.0
91)
2.1
(0.0
83)
1.3 (0.051)
1.1 (0.043)
(0.4 (0.016))
(0.6 (0.024))
0.25 (0.010)
0.20 (0.008)
Light emitting areatyp. 1.7 × 0.7
A
C
Approximate Weight: 6.0 mg
Corrosion test: Class: 3B Test condition: 40°C / 90 % RH / 15 ppm H2S / 14 days (stricter then IEC 60068-2-43)
LS Y876
12 Version 1.2 | 2018-02-12
For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for ultra sonic cleaning.
Recommended Solder Pad 9)
OHPY1315
0.8 (0.031)
2.2
(0.0
87)
0.7
(0.0
28)
Component location on padBauteil positioniert
Padgeometrie für
C A
verbesserte Wärmeableitung
heat dissipationPaddesign for improved
LötstopplackSolder resist
C
A
LS Y876
13 Version 1.2 | 2018-02-12
Reflow Soldering ProfileProduct complies to MSL Level 2 acc. to JEDEC J-STD-020D.01
00
s
OHA04525
50
100
150
200
250
300
50 100 150 200 250 300t
T
˚C
St
t
Pt
Tp240 ˚C
217 ˚C
245 ˚C
25 ˚C
L
Profile Feature Symbol Pb-Free (SnAgCu) Assembly UnitMinimum Recommendation Maximum
Ramp-up rate to preheat*)25 °C to 150 °C
2 3 K/s
Time tSTSmin to TSmax
tS 60 100 120 s
Ramp-up rate to peak*)TSmax to TP
2 3 K/s
Liquidus temperature TL 217 °C
Time above liquidus temperature tL 80 100 s
Peak temperature TP 245 260 °C
Time within 5 °C of the specified peaktemperature TP - 5 K
tP 10 20 30 s
Ramp-down rate*TP to 100 °C
3 6 K/s
Time25 °C to TP
480 s
All temperatures refer to the center of the package, measured on the top of the component* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range
LS Y876
14 Version 1.2 | 2018-02-12
Taping 9)
OHAY1515
1.5 (0.059)
4 (0.157)
2 (0.079)
3.5
(0.1
38)
1.75
(0.0
69)
8.1
(0.3
19)
0.9 (0.035)
2.4
(0.0
94)
3.3
(0.1
30)
1.25 (0.049)
0.3 (0.012) max.1.4 (0.055)
LS Y876
15 Version 1.2 | 2018-02-12
Tape and Reel 10)
Reel dimensions [mm]A W Nmin W1 W2 max Pieces per PU
180 mm 8 + 0.3 / - 0.1 60 8.4 + 2 14.4 3000
330 mm 8 + 0.3 / - 0.1 60 8.4 + 2 14.4 10000
LS Y876
16 Version 1.2 | 2018-02-12
Barcode-Product-Label (BPL)
Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.
Dry Packing Process and Materials 9)
OHA00539
OSRA
M
Moisture-sensitive label or print
Barcode label
Desiccant
Humidity indicator
Barcode label
OSRAM
Please check the HIC immidiately afterbag opening.
Discard if circles overrun.Avoid metal contact.
WET
Do not eat.
Comparatorcheck dot
parts still adequately dry.
examine units, if necessary
examine units, if necessary
5%
15%
10%bake units
bake units
If wet,
change desiccant
If wet,
Humidity IndicatorMIL-I-8835
If wet,
Moi
stur
e Le
vel 3
Flo
or ti
me
168
Hou
rs
Moi
stur
e Le
vel 6
Flo
or ti
me
6
Hou
rs
a) H
umid
ity In
dica
tor C
ard
is >
10%
whe
n re
ad a
t 23
˚C ±
5 ˚C
, or
reflo
w, v
apor
-pha
se ref
low
, or eq
uiva
lent
pro
cess
ing
(pea
k pa
ckag
e
2. A
fter th
is b
ag is
ope
ned,
dev
ices
that
will
be
subj
ecte
d to
infrar
ed
1. S
helf
life
in s
eale
d ba
g: 2
4 m
onth
s at
< 4
0 ˚C
and
< 9
0% rel
ativ
e hu
mid
ity (R
H).
Moi
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a
at fa
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:
Bag
sea
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Moi
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Moi
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Moi
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a4. If
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This
bag
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Flo
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72
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Flo
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48
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LS Y876
17 Version 1.2 | 2018-02-12
Transportation Packing and Materials 9)
OHA02044
PACK
VAR:
R077Ad
ditiona
l TEXT
P-1+Q
-1
Multi T
OPLE
D
Muste
r
OSRA
M Opto
Semic
ondu
ctors
(6P) B
ATCH
NO:
(X) PR
OD NO
:
10
(9D) D
/C:
11(1T) LOT
NO:
21002199
8
123GH
1234
024 5
(Q)QT
Y:200
0
0144
(G) GR
OUP:
260 C
RT240
C R
3
220 C
R
MLBin
3:Bin2: Q
-1-20
Bin1: P
-1-20
LSY T
6762
2a
Temp
ST
R18
DEMY
PACK
VAR:
R077Ad
ditiona
l TEXT
P-1+Q
-1
Multi T
OPLE
D
Muste
r
OSRA
M Opto
Semic
ondu
ctors
(6P) B
ATCH
NO:
(X) PR
OD NO
:
10
(9D) D
/C:
11(1T) LOT
NO:
21002199
8
123GH
1234
024 5
(Q)QT
Y:200
0
0144
(G) GR
OUP:
260 C
RT240
C R
3
220 C
R
MLBin
3:Bin2: Q
-1-20
Bin1: P
-1-20
LSY T
6762
2a
Temp S
T
R18
DEMY
OSRAM
Packing
Sealing label
Barcode label
Moi
stur
e Le
vel 3
Flo
or ti
me
168
Hou
rs
Moi
stur
e Le
vel 6
Flo
or ti
me
6
Hou
rs
a) H
umid
ity In
dica
tor C
ard
is >
10%
whe
n re
ad a
t 23
˚C ±
5 ˚C
, or
reflo
w, v
apor
-pha
se ref
low
, or e
quiv
alen
t pro
cess
ing
(pea
k pa
ckag
e
2. A
fter th
is b
ag is
ope
ned
, de
vice
s th
at w
ill b
e su
bjec
ted
to in
frar
ed
1. S
helf
life
in s
eale
d ba
g: 2
4 m
onth
s at
< 4
0 ˚C
and
< 9
0% rel
ativ
e hu
mid
ity (R
H).
Moi
stur
e Le
vel 5
a
at fa
ctor
y co
nditi
ons
of
(if b
lank
, sea
l dat
e is
iden
tical
with
dat
e co
de).
a) M
ount
ed w
ithin
b) S
tore
d at
body
tem
p.
3. D
evic
es req
uire
bak
ing,
bef
ore
mou
ntin
g, if
:
Bag
sea
l dat
e
Moi
stur
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vel 1
Moi
stur
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vel 2
Moi
stur
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a4. If
bak
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d,
b) 2
a or
2b
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Dat
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:
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renc
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C/J
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J-S
TD-0
33 fo
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If bl
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bar
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Flo
or ti
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> 1
Yea
r
Floo
r tim
e
1 Y
ear
Flo
or ti
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4
Wee
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RH
.
_<
Moi
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Moi
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˚C).
OPT
O S
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ONDU
CTO
RS
MO
ISTU
RE S
ENSI
TIVE
This
bag
con
tain
s
CAUT
ION
Flo
or ti
me
72
Hou
rs
Flo
or ti
me
48
Hou
rs
Flo
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Hou
rs
30 ˚C
/60%
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.
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If bl
ank,
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bar c
ode
labe
l
Barcode label
Dimensions of transportation box in mmWidth Length Height
200 ± 5 mm 195 ± 5 mm 30 ± 5 mm
352 ± 5 mm 352 ± 5 mm 33 ± 5 mm
LS Y876
18 Version 1.2 | 2018-02-12
Chip Technology: 6: Standard InGalP C: ATON F: Thinfilm InGaAlP G: ThinGaN (Thinfilm InGaN)
(Subcon: Sapphire) S: standard InGaN low current
´ Encapsulant Type / Lens Properties 7: Colorless clear or white volume conversion
(resin encapsulation) S: Silicone (with or without diffuser)
Wavelength Emission Color Color coordinates according (λdom typ.) CIE 1931/Emission color: B: 470 nm blue W: white S: 633 nm super red T: 528 nm true green Y: 587 nm yellow R: 625 nm red O: 606 nm orange G: 570 nm green CP: 560 nm pure green L: Light emitting diode
Package Type Y: Micro SIDELED
Lead / Package Properties 1: 2808 height: 0,8 mm 8: Reflector Standard
Type Designation System
L B Y 8 7 C
LS Y876
19 Version 1.2 | 2018-02-12
NotesThe evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the LED specified in this data sheet fall into the class exempt group (exposure time 10000 s). Under real circumstances (for expo-sure time, eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light sources have a high secondary exposure potential due to their blinding effect. As is also true when viewing other bright light sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irrita-tion, annoyance, visual impairment, and even accidents, depending on the situation.
Subcomponents of this LED contain, in addition to other substances, metal filled materials including silver. Metal filled materials can be affected by environments that contain traces of aggressive substances. There-fore, we recommend that customers minimize LED exposure to aggressive substances during storage, pro-duction, and use. LEDs that showed visible discoloration when tested using the described tests above did show no performance deviations within failure limits during the stated test duration. Respective failure limits are described in the IEC60810.
For further application related informations please visit www.osram-os.com/appnotes
LS Y876
20 Version 1.2 | 2018-02-12
Disclaimer
DisclaimerLanguage english will prevail in case of any discrepancies or deviations between the two language word-ings.
Attention please!The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances.For information on the types in question please contact our Sales Organization.If printed or downloaded, please find the latest version on the OSRAM OS webside.
PackingPlease use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred.
Product safety devices/applications or medical devices/applicationsOSRAM OS components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices.
In case Buyer – or Customer supplied by Buyer– considers using OSRAM OS components in product safety devices/applications or medical devices/applications, Buyer and/or Customer has to inform the local sales partner of OSRAM OS immediately and OSRAM OS and Buyer and /or Customer will analyze and coordi-nate the customer-specific request between OSRAM OS and Buyer and/or Customer.
LS Y876
21 Version 1.2 | 2018-02-12
Glossary1) Brightness: Brightness values are measured during a current pulse of typically 25 ms, with an internal
reproducibility of ±8 % and an expanded uncertainty of ±11 % (acc. to GUM with a coverage factor of k = 3).
2) Reverse Operation: Reverse Operation of 10 hours is permissible in total. Continuous reverse opera-tion is not allowed.
3) Wavelength: The wavelength is measured at a current pulse of typically 25 ms, with an internal repro-ducibility of ±0.5 nm and an expanded uncertainty of ±1 nm (acc. to GUM with a coverage factor of k = 3).
4) Forward Voltage: The forward voltage is measured during a current pulse of typically 8 ms, with an internal reproducibility of ±0.05 V and an expanded uncertainty of ±0.1 V (acc. to GUM with a coverage factor of k = 3).
5) Thermal Resistance: Rth max is based on statistic values (6σ).6) Thermal Resistance: RthJA results from mounting on PC board FR 4 (pad size 16 mm² per pad)7) Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data
or calculated correlations of technical parameters can only reflect statistical figures. These do not nec-essarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice.
8) Characteristic curve: In the range where the line of the graph is broken, you must expect higher differ-ences between single LEDs within one packing unit.
9) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and dimensions are specified in mm.
10) Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.
LS Y876
22 Version 1.2 | 2018-02-12
Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved.