Method for recycling of plating solutions

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imines, alkoxylated aromatic alco- hols, and combinations thereof. Also, methods of depositing a tin alloy on a substrate and methods of forming an interconnect bump on a semiconductor device.

M e t h o d f o r R e c y c l i n g o f P l a t i n g

S o l u t i o n s

U.S. 2004256235 Kameyama, K. In the c o n v e n t i o n a l p l a t i ng process , p l a t i n g so lu t ions a re

newly prepared and the plat ing solutions used previously are dumped as effluent. The spent plating solution can be recycled to prepare a new plat ing solution, for example, in the following order: a process for prepar ing a tin bismuth alloy plating solution ($1); a process for an active car- bon t rea tment to remove the com- plexing agent ($2); a process for removing Bi ($3); a process for a sedimenting t rea tment ($4); and

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a process for analyzing and cor- recting the Sn plating solution.

Synthesis of Iron-Based Alloy Nanoparticles WO 2004105985 (Seagate Technology LLC) Liu, C., et al. A method of forming iron-based alloy nanoparticles uses a solution

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