Post on 11-Feb-2018
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SDX-MSC IISDX-MSC IIHardware Architecture
By
Syed Muhammad Munavvar
Hussain
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MSC Specifications
Capacity
Telephony Specifications
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Hardware Architecture
The SDX-MSC II consists of followingsubsystems:
Access Switching Subsystem (ASS)Centralized Control Subsystem (CCS)
Interconnection Network Subsystem (INS)
Location Registration Subsystem (LRS)
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Access Switching Subsystem(ASS)
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Access Switching Subsystem(ASS)
The ASS consists of following functionblocks:Digital Trunk Interface (DTI)
Time Switch & Link (TSL)Digital Service Circuit (DSC)
Signaling system No.7 protocol Handler (S7H)
Mobile Voice Quality Test (MVQT)
Access Switching Processor/Access SwitchPeripheralProcessor (ASP/ASPP)
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DTI & TSL Cards
The DTI block consists of:
Digital Trunk Back Panel Assembly (DTBPA)
CEPT Digital Trunk Interface board Assembly (CDTIA)
The TSL block consists of:
Time Switch Back Panel Assembly (TSBPA)
Sub-highway Multiplex & De-multiplex Assembly(SMDXA)
Time Switch Control & Maintenance Assembly (TSCMA)
Local optic Transceiver Interface Assembly (LTRIA)
Optic Transceiver Module Assembly (OTRMA)
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DSC & S7H Cards
The DSC block consists of: Digital Service circuit Back Panel Assembly (DSBPA) Digital Service circuit for Voice Message Assembly
(DSVMA)
Digital Service circuit for Call Mixer Assembly (DSCMA) Digital Service circuit for Multi-frequency Signaling
Assembly (DSMSA)
S7H Block consists of: The S7H block consists of: SS7 Protocol Handler Back Panel Assembly (SPBPA) Signaling System No.7 Handler Assembly (SSPHA)
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MVQT & ASSP Cards
The MVQT block consists of: Digital Service circuit Back Panel (DSBPA) Mobile Voice Quality Test Assembly (MVQTA)
ASS Processor block consists of: Main Processor Back Panel Assembly (MPBPA) Main Processor Duplication Manager Assembly
(MPDMA)
Telephony Device Control Master Assembly (TDCMA)
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Interconnection Network Subsystem
(INS)
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Interconnection Network Subsystem
(INS)
The INS consists of:Space Switch & Link (SSL)
Communication Inter-working Network (CIN)
Network Synchronization (NES)
Interconnection Network Processor (INP)
Inter Network Peripheral Processor (INPP)
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SSL & CIN Cards
The SSL block consists of: Space Switch Back Panel Assembly (SSBPA) Central Optic Transfer & Receiver Interface Assembly
(CTRIA)
Clock Distribution & Processor Interface Assembly(CDPIA) Space Switch Matrix Assembly (SSMXA) Optic Transceiver Module Assembly (OTRMA)
The CIN block consists of: CI Back Panel Assembly (CIBPA) CI Node Interface Assembly (CINIA) CI Node Maintenance Assembly (CINMA)
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NES & INP Cards
NES block consists of:
Network Synchronization Back Panel Assembly (NSBPA)
Network Synchronization Clock Generation Assembly(NSCGA)
Network Synchronization Clock Maintenance Assembly(NSCMA)
INP consists of:
Main Processor Back Panel Assembly (MPBPA) Main Processor Duplication Manager Assembly
(MPDMA)
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Centralized Control Subsystem(CCS)
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Centralized Control Subsystem(CCS)
The CCS consists of the followingblocks :
Alarm Panel Control (APC)Operation & Maintenance Processor
(OMP)
Central Control Peripheral Processor(CCPP)
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APC & OMP Cards
APC Block consists of:
Remote Control Back Panel Assembly (RCBPA)
Alarm Panel Control Interface Assembly (APCIA)
OMP consists of:
Operation & Maintenance processor Back Panel(OMBPA)
Main Processor SCSI-bus Interface (MSBIA) Main Processor Duplication Manager (MPDMA)
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CCPP Cards
CCPP consists of following boards:
Telephony Device Control Master Back Panel(TMBPA)
Telephony Device Control Master (TDCMA)
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Location Registration Subsystem(LRS)
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Location Registration Subsystem(LRS)
performs the VLR functions
&
consists of following function block:Location Register Processor (LRP)
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LRP Cards
LRP block consists of following:
Main Processor Back Panel (MPBPA)
Main Processor Duplication Manager(MPDMA)
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Processor Structure
The SDX-MSC II Processors are
classified as follows depending uponthe functions :
Main Processor (MP)
Peripheral Processor (PP)
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Thank You..!