New Product New Product Commercialization Commercialization

John GlenningJohn Glenning

July 23, 2009July 23, 2009

John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:

1. Identify and resolve fundamental problems

John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:

1. Identify and resolve fundamental problems

2. Repeatability Studies for both product and process measurement systems

John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:

1. Identify and resolve fundamental problems

2. Repeatability Studies for both product and process measurement systems

3. Identify and resolve processing problems: Capability Analysis Study

• Cp and Cpk by location for all product specification

John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:

1. Identify and resolve fundamental problems

2. Repeatability Studies for both product and process measurement systems

3. Identify and resolve processing problems: Capability Analysis Study

• Cp and Cpk by location for all product specification

• Identify accuracy and precision problems

Accurate but not precise Precise but not accurate

John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:

1. Identify and resolve fundamental problems

2. Repeatability Studies for both product and process measurement systems

3. Identify and resolve processing problems: Capability Analysis Study

• Cp and Cpk by location for all product specification

• Identify accuracy and precision problems

Accurate but not precise Precise but not accurate

• Precision Problems: Excessive variability with incoming material, processing conditions and equipment conditions in space and time

John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:

1. Identify and resolve fundamental problems

2. Repeatability Studies for both product and process measurement systems

3. Identify and resolve processing problems: Capability Analysis Study

• Cp and Cpk by location for all product specification

• Identify accuracy and precision problems

Accurate but not precise Precise but not accurate

• Precision Problems: Excessive variability with incoming material, processing conditions and equipment conditions in space and time

• Accuracy Problems: 1 or 2 processing conditions are not at the optimum (Designed Experiments)

John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:

1. Identify and resolve fundamental problems

2. Repeatability Studies for both product and process measurement systems

3. Identify and resolve processing problems: Capability Analysis Study

• Cp and Cpk by location for all product specification

• Identify accuracy and precision problems

Accurate but not precise Precise but not accurate

• Precision Problems: Excessive variability with incoming material, processing conditions and equipment conditions in space and time

• Accuracy Problems: 1 or 2 processing conditions are not at the optimum (Designed Experiments)

• Cp & Cpk will identify the accuracy & precision problems

John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:

1. Identify and resolve fundamental problems

2. Repeatability Studies for both product and process measurement systems

3. Identify and resolve processing problems: Capability Analysis Study

• Cp and Cpk by location for all product specification

• Identify accuracy and precision problems

Accurate but not precise Precise but not accurate

• Precision Problems: Excessive variability with incoming material, processing conditions and equipment conditions in space and time

• Accuracy Problems: 1 or 2 processing conditions are not at the optimum (Designed Experiments)

• Cp & Cpk will identify the accuracy & precision problems

• Precision problems must be solved before accuracy problems

John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:

4. Consistently meet product specifications

John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:

4. Consistently meet product specifications

5. Optimize the manufacturing process using Designed Experiment

• Resolution IV Experiment

John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:

4. Consistently meet product specifications

5. Optimize the manufacturing process using Designed Experiment

• Resolution IV Experiment

• Optimized Conditions

John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:

4. Consistently meet product specifications

5. Optimize the manufacturing process using Designed Experiment

• Resolution IV Experiment

• Optimized Conditions

• SPC

• Measure interim product conditions mid-stream

John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:

4. Consistently meet product specifications

5. Optimize the manufacturing process using Designed Experiment

• Resolution IV Experiment

• Optimized Conditions

• SPC

• Measure interim product conditions mid-stream

• Correlate interim product conditions to final product conditions

John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:

4. Consistently meet product specifications

5. Optimize the manufacturing process using Designed Experiment

• Resolution IV Experiment

• Optimized Conditions

• SPC

• Measure interim product conditions mid-stream

• Correlate interim product conditions to final product conditions

• These are the mid-stream measurements that identify that a process adjustment is required

John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:

4. Consistently meet product specifications

5. Optimize the manufacturing process using Designed Experiment

• Resolution IV Experiment

• Optimized Conditions

• SPC

• Measure interim product conditions mid-stream

• Correlate interim product conditions to final product conditions

• These are the mid-stream measurements that identify that a process adjustment is required

• Correlate process conditions to interim product conditions

John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:

4. Consistently meet product specifications

5. Optimize the manufacturing process using Designed Experiment

• Resolution IV Experiment

• Optimized Conditions

• SPC

• Measure interim product conditions mid-stream

• Correlate interim product conditions to final product conditions

• These are the mid-stream measurements that identify that a process adjustment is required

• Correlate process conditions to interim product conditions

• This identify the process adjustments to be made

John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:

4. Consistently meet product specifications

5. Optimize the manufacturing process using Designed Experiment

• Resolution IV Experiment

• Optimized Conditions

• SPC

• Measure interim product conditions mid-stream

• Correlate interim product conditions to final product conditions

• These are the mid-stream measurements that identify that a process adjustment is required

• Correlate process conditions to interim product conditions

• This identify the process adjustments to be made

• Correlate incoming material conditions to final product conditions

John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:

4. Consistently meet product specifications

5. Optimize the manufacturing process using Designed Experiment

• Resolution IV Experiment

• Optimized Conditions

• SPC

• Measure interim product conditions mid-stream

• Correlate interim product conditions to final product conditions

• These are the mid-stream measurements that identify that a process adjustment is required

• Correlate process conditions to interim product conditions

• This identify the process adjustments to be made

• Correlate incoming material conditions to final product conditions

• Incoming material specifications

John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:

6. Develop High Capability

• Cp & Cpk

• Cp = (USL – LSL)/6σ

• Cpk = lesser of (USL - µ)/3σ and (µ- LSL)/3σ

John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:

6. Develop High Capability

• Cp & Cpk

• Cp = (USL – LSL)/6σ

• Cpk = lesser of (USL - µ)/3σ and (µ- LSL)/3σ

• Cp & Cpk < 1.00: Process is “Not Capable”

John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:

6. Develop High Capability

• Cp & Cpk

• Cp = (USL – LSL)/6σ

• Cpk = lesser of (USL - µ)/3σ and (µ- LSL)/3σ

• Cp & Cpk < 1.00: Process is “Not Capable”

• Cp & Cpk ≥ 1.00 for features at all locations: Process is “Capable”

John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:

6. Develop High Capability

• Cp & Cpk

• Cp = (USL – LSL)/6σ

• Cpk = lesser of (USL - µ)/3σ and (µ- LSL)/3σ

• Cp & Cpk < 1.00: Process is “Not Capable”

• Cp & Cpk ≥ 1.00 for features at all locations: Process is “Capable”

• Cp & Cpk ≥ 2.00 for features at all locations: Elimination of mass inspection

John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:

6. Develop High Capability

• Cp & Cpk

• Cp = (USL – LSL)/6σ

• Cpk = lesser of (USL - µ)/3σ and (µ- LSL)/3σ

• Cp & Cpk < 1.00: Process is “Not Capable”

• Cp & Cpk ≥ 1.00 for features at all locations: Process is “Capable”

• Cp & Cpk ≥ 2.00 for features at all locations: Elimination of mass inspection

• Cp & Cpk ≥ 3.00 for features at all locations: World Class Manufacturer

John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:

6. Develop High Capability

• Cp & Cpk

• Cp = (USL – LSL)/6σ

• Cpk = lesser of (USL - µ)/3σ and (µ- LSL)/3σ

• Cp & Cpk < 1.00: Process is “Not Capable”

• Cp & Cpk ≥ 1.00 for features at all locations: Process is “Capable”

• Cp & Cpk ≥ 2.00 for features at all locations: Elimination of mass inspection

• Cp & Cpk ≥ 3.00 for features at all locations: World Class Manufacturer

• High Yields

John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:

6. Develop High Capability

• Cp & Cpk

• Cp = (USL – LSL)/6σ

• Cpk = lesser of (USL - µ)/3σ and (µ- LSL)/3σ

• Cp & Cpk < 1.00: Process is “Not Capable”

• Cp & Cpk ≥ 1.00 for features at all locations: Process is “Capable”

• Cp & Cpk ≥ 2.00 for features at all locations: Elimination of mass inspection

• Cp & Cpk ≥ 3.00 for features at all locations: World Class Manufacturer

• High Yields

• Eliminate Mass Inspection

• Buckbee-Mears: 70% of the manufacturing costs occurred after the product was made

John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:

6. Develop High Capability

• Cp & Cpk

• Cp = (USL – LSL)/6σ

• Cpk = lesser of (USL - µ)/3σ and (µ- LSL)/3σ

• Cp & Cpk < 1.00: Process is “Not Capable”

• Cp & Cpk ≥ 1.00 for features at all locations: Process is “Capable”

• Cp & Cpk ≥ 2.00 for features at all locations: Elimination of mass inspection

• Cp & Cpk ≥ 3.00 for features at all locations: World Class Manufacturer

• High Yields

• Eliminate Mass Inspection

• Buckbee-Mears: 70% of the manufacturing costs occurred after the product was made

• IBM: “It cost 10 times more to solve problems in manufacturing than in development and it cost 10 times more to solve problems in development than in R & D”

John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:

7. Qualify the manufacturing process

• Four Level Qualification Process (IBM, HTI, GE, Motorola, Intel…)

John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:

7. Qualify the manufacturing process

• Four Level Qualification Process (IBM, HTI, GE, Motorola, Intel…)

• Stress the manufacturing line

John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:

7. Qualify the manufacturing process

• Four Level Qualification Process (IBM, HTI, GE, Motorola, Intel…)

• Stress the manufacturing line

• More product is made in a shorter period of time to higher standards

John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:

7. Qualify the manufacturing process

• Four Level Qualification Process (IBM, HTI, GE, Motorola, Intel…)

• Stress the manufacturing line

• More product is made in a shorter period of time to higher standards

• Identify high volume manufacturing problems early

John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:

7. Qualify the manufacturing process

• Four Level Qualification Process (IBM, HTI, GE, Motorola, Intel…)

• Stress the manufacturing line

• More product is made in a shorter period of time to higher standards

• Identify high volume manufacturing problems early

8. Transfer the process into manufacturing

John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:

7. Qualify the manufacturing process

• Four Level Qualification Process (IBM, HTI, GE, Motorola, Intel…)

• Stress the manufacturing line

• More product is made in a shorter period of time to higher standards

• Identify high volume manufacturing problems early

8. Transfer the process into manufacturing

9. Continuous Improvement by constantly tracking:

• Product Quality (Cp & Cpk)

John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:

7. Qualify the manufacturing process

• Four Level Qualification Process (IBM, HTI, GE, Motorola, Intel…)

• Stress the manufacturing line

• More product is made in a shorter period of time to higher standards

• Identify high volume manufacturing problems early

8. Transfer the process into manufacturing

9. Continuous Improvement by constantly tracking:

• Product Quality (Cp & Cpk)

• Cycle Time

John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:

7. Qualify the manufacturing process

• Four Level Qualification Process (IBM, HTI, GE, Motorola, Intel…)

• Stress the manufacturing line

• More product is made in a shorter period of time to higher standards

• Identify high volume manufacturing problems early

8. Transfer the process into manufacturing

9. Continuous Improvement by constantly tracking:

• Product Quality (Cp & Cpk)

• Cycle Time

• Equipment Up-time

John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:

7. Qualify the manufacturing process

• Four Level Qualification Process (IBM, HTI, GE, Motorola, Intel…)

• Stress the manufacturing line

• More product is made in a shorter period of time to higher standards

• Identify high volume manufacturing problems early

8. Transfer the process into manufacturing

9. Continuous Improvement by constantly tracking:

• Product Quality (Cp & Cpk)

• Cycle Time

• Equipment Up-time

• Manufacturing Costs

John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:

7. Qualify the manufacturing process

• Four Level Qualification Process (IBM, HTI, GE, Motorola, Intel…)

• Stress the manufacturing line

• More product is made in a shorter period of time to higher standards

• Identify high volume manufacturing problems early

8. Transfer the process into manufacturing

9. Continuous Improvement by constantly tracking:

• Product Quality (Cp & Cpk)

• Cycle Time

• Equipment Up-time

• Manufacturing Costs

• WIP

John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:

7. Qualify the manufacturing process

• Four Level Qualification Process (IBM, HTI, GE, Motorola, Intel…)

• Stress the manufacturing line

• More product is made in a shorter period of time to higher standards

• Identify high volume manufacturing problems early

8. Transfer the process into manufacturing

9. Continuous Improvement by constantly tracking:

• Product Quality (Cp & Cpk)

• Cycle Time

• Equipment Up-time

• Manufacturing Costs

• WIP

• Identify trends early

John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:

7. Qualify the manufacturing process

• Four Level Qualification Process (IBM, HTI, GE, Motorola, Intel…)

• Stress the manufacturing line

• More product is made in a shorter period of time to higher standards

• Identify high volume manufacturing problems early

8. Transfer the process into manufacturing

9. Continuous Improvement by constantly tracking:

• Product Quality (Cp & Cpk)

• Cycle Time

• Equipment Up-time

• Manufacturing Costs

• WIP

• Identify trends early

• Maintain high quality and low costs

John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechManufacturing Philosophy:

• Hold your suppliers to meet your material specifications in space & time

John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechManufacturing Philosophy:

• Hold your suppliers to meet your material specifications in space & time

• Track & identify incoming material lots to your product

John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechManufacturing Philosophy:

• Hold your suppliers to meet your material specifications in space & time

• Track & identify incoming material lots to your product

• Retain samples of incoming material for future analysis

John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechManufacturing Philosophy:

• Hold your suppliers to meet your material specifications in space & time

• Track & identify incoming material lots to your product

• Retain samples of incoming material for future analysis

• Capture time-stamped processing data in a database

John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechManufacturing Philosophy:

• Hold your suppliers to meet your material specifications in space & time

• Track & identify incoming material lots to your product

• Retain samples of incoming material for future analysis

• Capture time-stamped processing data in a database

• Time stamp product when run in each process

John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechManufacturing Philosophy:

• Hold your suppliers to meet your material specifications in space & time

• Track & identify incoming material lots to your product

• Retain samples of incoming material for future analysis

• Capture time-stamped processing data in a database

• Time stamp product when run in each process

• Measure product mid-stream

John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechManufacturing Philosophy:

• Hold your suppliers to meet your material specifications in space & time

• Track & identify incoming material lots to your product

• Retain samples of incoming material for future analysis

• Capture time-stamped processing data in a database

• Time stamp product when run in each process

• Measure product mid-stream

• Continuously track key product parameters to reduce variability, identify

problems and trends early

• Capability

• Cost

• Cycle Time

• Equipment Up-time

• WIP

John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTech

End of Presentation