OVONIC UNIFIED MEMORY

transcript

Sarath Kumar SS7 ECE

Roll no:68

Government Engineering CollegeSreekrishnapuram ,Palakkad

October 29, 2010

Sarath Kumar S S7 ECE Roll no:68 ( Government Engineering College Sreekrishnapuram ,Palakkad)OVONIC UNIFIED MEMORY October 29, 2010 1 / 21

CONTENTS

Introduction

Present memory scenario

OUM operation

Characteristics of OUM

Advantages of OUM

Disadvantages OUm

Conclusion

Introduction

25percent of world wide chip markets are memory devices

Day by day the user needs are increasing exponentially

Memory objectives

Adequate storage capacityAcceptable level of performanceReasonable cost

Ovonic unified memory (OUM) is an advanced memory technology,which stores data via the phase change characteristics of its basematerial, which provides 3 times faster data storage performance perword than NOR chips

Present memory scenario

Volatile

SRAMDRAM

Non Volatile

PROMEPROMEEPROMFlash Memory

Review of memory basics

The memory components of a computer can be subdivided into three maingroups

Internal processor memory

Main memory

Secondary memory

Memory device characteristics

Access time and access rate

Access mode-random and serial

Cycle time and data transfer rate

Size and Cost

Limitations of present memory technologies

DRAMs are difficult to integrate

SRAMs are expensive

FLASH memory can have only a limited number of read and writecycles

EPROMs have high power requirement and poor flexibility

OVONIC UNIFIED MEMORY

Principle

Reversible structural phase change

Applying read or write pulses

Reset state and Set state

Memory structure

Figure: memory structure of OUM

Temperature Vs Time graph

Technology and performance

I-V characteristics

R-I characteristics

Production Process

Melting of the raw material and subsequent milling

Achieves the defined particle size distribution

Powders are processed to discs through Hot Isotactic Pressing

Chalcogenide alloy

Comparison of the two states of OUM

Advantages of OUM

High density

Read-write performance

Low programming energy

Process simplicity

CMOS embeddability

Scalability

Disadvantages of OUM

High temperatures involved in the manufacturing process.

Higher voltages are required to write data.

CONCLUSION

Non volatile OUM with fast read and write speeds,low voltage/low energyoperation,ease of integration and competitive cost structure is suitable forultra high density , stand alone and embedded memory applications. Itsunique combination of features collectively provide a high-density,low-power.Is still a futuristic memory

References

OUM a a 180 nm non volatile memory cell element technology forstand alone and embedded applications a Stefan Lai and Tyler Lowrey

Current status of Phase change memory a Stefan Lai

Computer Organization a V Carl Hamacher, Zvonko G Vranesic,Safwat G Zaky

Computer Architecture and Organization - John P Hayes.

Solid State Devices- Ben G Streetman,Sanjay Banerjee

http://en.wikipedia.org/wiki/EnergyConversionDevices

http://www.ieee.xplore.org/ovonicunifiedmemory

Thank you

...........THANK YOU...........

OVONIC UNIFIED MEMORY

Documents