Rotating electrodeposition system

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rinse of the wet autodeposi ted coating film.

CURING OF A PAINT ON A LOCALIZED AREA U.S. Patent 6,033,517. Mar. 7, 2000 D.M. Chenetski, assignor to Honda of America Mfg. Inc., Marysville, Ohio

A method of protecting at least one component on an object from excessive heating during curing of paint on a localized area of the object by exposure of the localized area to a heat source, the method including forming an airpocket adjacent the at least one compo- nent; forming an inlet and an out- let in the airpocket; and circulat- ing air through the air pocket by feeding in cold air through the inlet.

PLATING APPARATUS U.S. Patent 6,033,540. Mar. 7, 2000 K. Kosaki and M. Tamaki, assignors to Mitsubishi Denki KK, Tokyo

A plating apparatus comprising a plating tank suitable for holding a wafer so that a plating surface of the wafer faces upward; plating solution supply means for causing a plating solution supplied to the plating surface of the wafer to flow from a center of the plating surface of the wafer toward a pe- riphery of the plating surface of the wafer; and an annular mesh anode electrode having a central aperture and a plurality of open- ings surrounding the central ap- erture, the annular anode elec- trode being disposed opposite the wafer for generating an electric

field between the anode electrode and the wafer, using the wafer as a cathode, the electric field having a lower density in a central por- tion of the wafer than at an edge of the wafer.

ROTATING ELECTHODEPOSITION SYSTEM U.S. Patent 6,033,548. Mar. 7, 2000 S. Akram, and D.R. Hembree, assignors to Micron Technology Inc., Boise, Idaho

A rotating system and method for e lec t rodepos i t ing ma te r i a l s on semiconductor wafers.

HIGH TEMPERATURE RESISTANT COATING U.S. Patent 6,034,178. Mar. 7, 2000 O.H. Decker, and C.P. Tarnoski, assignors to Morton International Inc., Chicago

• Ultrasonic cleaning / ultrasonic rinsing / hot air drying • Multiple rinses - Tap & DI or Counter-Flowing • Combine with Pump/Filter Systems • Powerful squarewave ultrasonics available in 40 or 80 Khz • Compact - 12" x 18" x 46" (power generator in separate cabinet) • 4 Chambers 10" x 12" x 8" ea • Stainless steel construction • 1 yr /2 yr/Ufe Warranty • Over 25 years of Service

P.O. Box 734 450 W. Taft Drive, South Hol land, IL 60473 800-276-2466 esmainc @ amer i tech.net www.esmainc .com

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J X-MET ® 970 • For fast and accurate real-time analysis

~ f thin and ultra-thin cn~tin~, films or paper Rugged syster~ in harsh, even For on-site, or

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• For fast monitoring and automatic precise control of plating baths

• Rugged and durable construction

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April 2001 97