A New Trends in Integration Technologies

Dr. Ravi Shankar Mishra

Prof. & HOD

•The growth of electronics industry has increased

rapidly mainly due to advances in integration

technologies, large-scale systems design - due to the

advent of VLSI.

•The number of applications of integrated circuits are

in high-performance computing, telecommunications,

and consumer electronics.

VLSI TECHNOLOGY AND DESIGN DRIVERS

• Less Area, More Compactness At All System Levels

• Less Power Consumption

•Fewer Chips/components Per Board And System

• Higher Reliability, Due To Improved On-chip

Interconnects

• Higher Speed Due To Reduced Interconnect Length

Manufacturing Cost Reductions

CLASSIFICATION OF ICS

Based onApplication

Based on

Fabrication Techniques Based on Technology

Based on Device Count

Linear

ICDigital IC

Monolithic IC

Hybrid IC

BJT MOSFET

SSI

MSI

LSI

VLSI

ULSI

19471906

Audion (Triode), 1906

Lee De Forest

First point contact transistor (germanium), 1947

John Bardeen and Walter Brattain

Bell Laboratories

IC Evolution

First integrated circuit (germanium), 1958Jack S. Kilby, Texas Instruments

Contained five components, three types:transistors resistors and capacitors

Intel Pentium II, 1997Clock: 233MHz

Number of transistors: 7.5 MGate Length: 0.35

19581958 19971997

Pentium® III28M transistors / 733MHz-1Gz / 13-26W

L=0.25µm shrunk to L=0.18µm

Pentium® 4 “Northwood”55M transistors / 2-2.5GHz

L=0.13µm

IC Evolution

SSI – Small Scale Integration (early 1970s)contained 1 – 10 logic gates

MSI – Medium Scale Integration logic functions, counters

LSI – Large Scale Integrationfirst microprocessors on the chip

VLSI – Very Large Scale Integrationnow offers 64-bit microprocessors,complete with cache memory,floating-point arithmetic unit(s), etc.

Bipolar technology

TTL (transistor-transistor logic)

ECL (emitter-coupled logic)

MOS (Metal-oxide-silicon)

NMOS (n-channel MOS) technology developed in 1970s required fewer masking steps, was denser, and consumed less power than equivalent bipolar ICs an MOS IC was cheaper than a bipolar IC and led to investment and growth of the MOS IC market.

Aluminum gates for replaced by polysilicon by early 1980

CMOS (Complementary MOS): n-channel and p-channel

MOS transistors =>

lower power consumption, simplified fabrication process

Bi-CMOS - hybrid Bipolar, CMOS (for high speed)

GaAs - Gallium Arsenide (for high speed)

Si-Ge - Silicon Germanium (for RF)

“Moore’s Law”

The number of transistors that can be integrated on a single IC grows exponentially with time.

“Integration complexity doubles every three years”

Gordon MooreFairchild Corporation - 1965

Design Abstraction Level

A complex digital system can be subdivided in a hierarchical manner using abstraction.

System Design

logic Design

Circuit Design

Layout Design

Blocks, sub-blocks Logic gates FETs Geometric

structures

DESIGN PROCESS

• Behavioral design

It deal with function of the system & register input and output.

• Data path design

In this flow of data through buses between registers and logic unit are controlled.

• Logic design

Data path units are replaced with primitive gates & flip flop.

• Physical design

It replaces the gates and flip flop using transistors.

DESIGN AUTOMATION

The function or operations for transforming design or one stage into other stage and verification of the out put done by the software known as design automation the tool use for this.

• Simulation tools or simulators.

• Synthesizers.

Simulation

It is the process of verifying the conduction of model for the given

circuit without implementing practically.For this purpose Modelsim simulator used output of simulator is wave form or timing diagram.

Synthesis

The process of transforming design description from one form two another form is called synthesis.

DESIGN METHODOLOGIES

Fully Custom Semi Custom

Standard Cells Gate Arrays Programmable Logic

FPGA PLD

•Customers decide the design methodology

• Full Custom Each And Every Component design as per designer interest.

• Semi Custom Designer can design part of the project and part of thing can be

taken from others.

• Standards cells Predefined logic cells are called standards cells. Pre design

modules e.g. AND gate,OR gate,Multiplexers, Flip Flop.

• Gate Array In this standard logic elements or present for the designer to the interconnect to achieve the desire function.

• Field Programmable Devices

It is prefabricated, the logic is implemented by electrically

programming the interconnects.

Application-Specific Integrated Circuit (ASIC)

A kind of semi custom integrated circuit, often referred to as

"gate-array" or "standard-cell" products, developed & designed

to satisfy a specific application requirement as opposed to a

general purpose circuit, such as a microprocessor.

•ASICs are customized or tailored to perform specific functions to a

particular system or application

• ASICs are typically employed as bus interfaces, glue

logic,functional accelerators, and/or a System-On-Chip (SoC).

ASIC – Benefits

•Improve performance

• Reduce power consumption

• Reduce production costs

• Mix Analog and Digital Designs

• Design optimization through IC manufacturing process

• Development Tools support HDL and Schematic design approach

System-on-a-chip (SOC)

Idea: combine several large blocks

Pre design custom cores

(e.g.,microcontroller) - “intellectual property” (IP)

ASIC logic for special-purpose hardware

Programmable Logic (PLD, FPGA)

VLSI Design Tools

Front End Design tools:

With the help of these tools simulation & synthesis of circuit can be performed on PC.E.g. XILINX, Altera etc.

Back End Design Tools:

These tools are used to fabrication purpose.The layout of circuit is design and simulate with the help of these tools. E.g. TANNER,MICROWIND

.

Application of VLSI

Ultra Low power Image & Video Compression.

Encryption Chip/Smart Card

CMOS Image Sensor

Medical electronic systems.

Real time Tele communication and Data

Processing application

Process control industry etc……