SUPERIOR FLUX & MFG. CO.

SUPERIOR FLUX & MFG. SUPERIOR FLUX & MFG. ELECTRONICS ELECTRONICS

PRODUCTSPRODUCTS Superior Flux & Mfg. Co. founded in

1932. A complete line of primary assembly,

touch-up, and maintenance products for electronics.

1949 Superior Supersafe® No. 30, first Battelle formula flux, introduced.

1995 SyberGelTM and SyberLiquidTM introduced for repair/rework and hand-soldering.

SUPERIOR PRODUCT SUPERIOR PRODUCT LINELINE

Solder Pastes Tacky Fluxes Wave Solder Fluxes Component Tinning Fluxes Wire Tinning Fluxes Hand Solder Fluxes Copper and Nickel Pre-Cleaners Detergent/Saponifier Descaler Dross Reduction Powder Omega Meter Test Solution

SOLDER PASTESOLDER PASTE 3000 Series Conventional No-

Clean 4000 Series Synthetic, Low-

Residue No-Clean 8000 Series Water-Soluble 9000 Series Rosin Mildly

Activated (RMA) Solders: Tin/Lead,

Lead-Free

3000 SERIES NO-CLEAN 3000 SERIES NO-CLEAN SOLDER PASTESOLDER PASTE

Classification: IPC ANSI-J-STD 004, Type ROL0

Meets and exceeds Bellcore standards.

Pin-testable post-solder joints. Translucent residue. Capable of printing 12 mil pitch.

4000 SERIES SYNTHETIC 4000 SERIES SYNTHETIC NO-CLEAN SOLDER PASTENO-CLEAN SOLDER PASTE Classification: IPC ANSI J-STD-004,

Type REL0. Meets and exceeds Bellcore

standards. Translucent, protective post-solder

residue. Pin-testable post-solder joints.

General residue levels of 2.5 – 3.3%. In proper conditions, can be as low as 1.1%.

Capable of printing 12 mil pitch.

8000 SERIES WATER-8000 SERIES WATER-SOLUBLE SOLDER PASTESOLUBLE SOLDER PASTE

Passes Bellcore Passes IPC Residues are truly water-soluble. Post-reflow residues can be left on

boards for extended time and NOT reduce SIR values.

Post-solder residues do not foam in aqueous cleaning systems.

Capable of printing 12 mil pitch.

9000 SERIES RMA 9000 SERIES RMA SOLDER PASTESOLDER PASTE

Exceptional reflow profiling characteristics.

Capable of printing 16 mil pitch. Superior wetting characteristics. Residues can be aqueous cleaned

using SyberKleen 2000 Saponifier.

RECOMMENDED REFLOW RECOMMENDED REFLOW PROFILE: 63Sn/37Pb and PROFILE: 63Sn/37Pb and

62Sn/36Pb/2Ag62Sn/36Pb/2Ag

REFLOW PROFILE FOR REFLOW PROFILE FOR LEAD-FREELEAD-FREE

APPLICATION METHODSAPPLICATION METHODS

Screen printing Cartridge printing Dispensing

WHAT SETS SUPERIOR WHAT SETS SUPERIOR SOLDER PASTES SOLDER PASTES

APART?APART?1. All are non-halide.2. All have a minimum 12 hour open-time

between printing, placement, and reflow.3. All are formulated for high-speed dispensing.4. All No-Clean and RMA pastes can be aqueous

cleaned in Superior SyberKleen 2000 Saponifier .

5. NO slumping.6. NO tomb-stoning when stencil and reflow

profile are properly set.7. NO white residues on PCBs.8. All Paste should be frozen or refrigerated

for storage.

WHAT SETS SUPERIOR WHAT SETS SUPERIOR SOLDER PASTES APART? SOLDER PASTES APART?

(cont.)(cont.)9. Consistent rheology, thixotropy, and viscosity from lot-to-lot.

10. Consistent, clear, pin-testable residues with all No-Cleans.

11. Consistent metal-load due to no pre-thinning or post-thinning manufacturing process.

12. 4000 Series Synthetic No-Clean residues act as protective barrier against humidity and outside elements.

13. 8000 Series Water-Soluble residues can be washed any time after reflow. SIR values remain the same when PCBs are cleaned three (3) minutes or three (3) days after reflow.

SOLDER PASTE SOLDER PASTE STORAGESTORAGE

Shelf life for all solder pastes extended

with freezer-storage first formulations.

Freezer Storage (0ºC and below): 9-12 months.

Refrigerator Storage (1-12ºC): 3-9 months. Room temperature storage (18-23ºC): 3 months.

TACKY FLUXESTACKY FLUXES

4000 Synthetic No-Clean 3000 Conventional No-Clean 8000 Water-Soluble 9500 High Temperature

Applications:BGA Attachment and RepairCustom manufacturing applicationsDispensable applicationsPreform soldering

WAVE SOLDERING WAVE SOLDERING FLUXESFLUXESFlux-types

No-Clean Water-Soluble RMA

Flux-base VOC-FREE Alcohol-based

Applications 63Sn/37Pb, 96.5Sn/3.5Ag,

99.3Sn/0.7Cu and other alloys.

WAVE SOLDERING FLUX WAVE SOLDERING FLUX APPLICATION METHODSAPPLICATION METHODS Spray Foam Drag Wave

NO-CLEAN NO-CLEAN WAVE SOLDERING FLUXESWAVE SOLDERING FLUXES

VOC-Free: No. 420 (Spray or Foam) No. 425

Alcohol-based No. 312 No. 325 No. 340 RFE 14Y3N

All No-Clean fluxes classified as: IPC ANSI J-STD 004 Type ORL0

When post-solder cleaning is specified, all No-Clean fluxes are

water-soluble. No white residues or water-stains.

WATER-SOLUBLE WATER-SOLUBLE WAVE SOLDER FLUXESWAVE SOLDER FLUXES

Alcohol-based No. 84 RFE 301-26C

VOC-Free No. 32

All Water-Soluble fluxes classified as:

IPC ANSI J-STD 004 Type ORM1

ROSIN FLUXESROSIN FLUXES

Type R: No. 97 Type RMA: No. 99 Type RA: No.100

Solids content variations are available

for all fluxes.

ADDITIONAL PCB ADDITIONAL PCB ASSEMBLY PROCESS ASSEMBLY PROCESS

PRODUCTSPRODUCTS SyberGel

TM and SyberLiquid

TM

Hand solder, repair and rework gel or liquid that act as flux and cleaner.

Superior SyberKleen 2000 Saponifier Detergent/saponification solution for aqueous cleaning

systems. Superior Descaler

A descaling solution for removing scale residual build-up in batch and in-line aqueous cleaners.

Superior OMTS A test solution of IPA and DI water for PCB testing in Omega

Meters. Superior Dross Reducer

Powder for dross and oxidation removal from solder bath to extend solder life.

COMPONENT TINNING COMPONENT TINNING PRECLEANERS & FLUXESPRECLEANERS & FLUXES

Lead tinning for semiconductor, component, and fuse leads.

Fluxes formulated for Tin/Lead, Lead-Free, and fusible alloys.

Base Metals:CopperNickelAlloy 42Alloy 51KovarOther specialty alloys

SEMICONDUCTOR AND SEMICONDUCTOR AND COMPONENT LEAD COMPONENT LEAD

PRE-CLEANERSPRE-CLEANERS Copper Pre-Cleaner

VOC-Free, non-hazardous, OA formulation.

Light, pink color that changes if pH exceeds a 3.5 reading.

Nickel Pre-CleanerA high activity nickel cleaner that

contains no sulfuric acid.

DIFFERENT FLUXES FOR DIFFERENT FLUXES FOR DIFFERENT APPLICATIONSDIFFERENT APPLICATIONS VOC-FREE, HALIDE

No. 30, No. 30DS, No. 40MM4, No. 43

ALCOHOL-BASED HALIDE No. 45, No. 48, No. 48S

VOC-FREE, NON-HALIDE 430 Series

ALCOHOL-BASED, NON-HALIDE No. 435, No. 435 3:1, No. 91

WIRE TINNING WIRE TINNING FLUXESFLUXES

No-Clean: Small gage (14-22) automatic or manual cut/strip/tin operations. VOC-Free: No. 425Alcohol-based: No. 325, No. 334.

Water-soluble: Large gage (2-12) wires; Copper and brass crimped terminal wires. VOC-Free: No. 30 Alcohol-based: No. 45

Applications: Automotive, Industrial, and Appliances.

SUPERIOR MANUFACTURES

QUALITY SOLDER PASTES AND FLUXES.

OUR BUSINESS IS SOLVING PROBLEMS