TE-MPE-EMDesign Office

William Billereau

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Fine-pitch photolithography facility -

PCB manufacturin

g

Industry

Design Office

Assembly Workshop

Planning and subcontractingTechnological and commercial choices

Ordering, collecting components, tracking Invoicing

RepairMPGD

Design, manufacturing and assembly

Structure

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2 staff/ 2 FSU

1 staff / 10 FSU

4 Staff8 staff/ 12 FSU

Design Office Mission Ressources Workload Quality Documents

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Mission Design of products

Standard PCB 2 to 16 layers, rigid, flex, flex-rigid

Related mechanical parts front panels, boxes

Crates and racks Readout for MPGD

Design of CAD libraries Schematic diagram Footprints

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1 team leader (staff) 8 technicians: the design of standard and

special PCB (FSU) 2 technicians: in CAD libraries (100% FSU

since 2010)

5

Resources

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Equipment

CAD stations (Cadence, Altium) AutoCAD CAD to CAM software (Fabmaster, Aegis)

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Workload

7

2008 2009 2010 2011 2012 (11m)

050

100150200250300350400

General situation25 jobs in progress,15 in the pipelineVisibility max 2 months

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230*220mm 2-sided, PTH, BGA,

QFN, 0402 1325 components 5500 solder joints

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BE/RF - LHC 1 Turn Delay Feedback

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EN/EL Incomer Crate

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Quality Design rules: IPC standard

Layout Librairies

Crosschecks (librairie and layout) Internal reviews Feedback from manufacturing EDMS Release system

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Documentation

PCB manufacturing files (Gerber, drilling) PCB specification Detailed drawing of all mechanical parts Detailed drawing of harnesses Assembly documents for PCB (Drawing,

BOM) Assembly documents for crates (3D drawing,

BOM)

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PCB manufacturing files (Gerber, drilling)PCB specification

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Detailed drawing of mechanical parts

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Detailed drawing of harnesses

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Assembly documents for PCB (Drawing, BOM)

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Assembly documents for crates (3D drawing, BOM)

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Assembly documents for crates (3D drawing, BOM)

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EDMS Release system

Released statusNo more change possibleProduction allowedAvailable to subcontractor

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Any question?

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