Post on 19-Jan-2016
transcript
Transistor Counts
1,000,000
100,000
10,000
1,000
10
100
11975 1980 1985 1990 1995 2000 2005 2010
8086
80286i386
i486Pentium®
Pentium® Pro
K1 Billion 1 Billion
TransistorsTransistors
Source: IntelSource: Intel
ProjectedProjected
Pentium® IIPentium® III
Courtesy, Intel
Design Abstraction Levels
n+n+S
GD
+
DEVICE
CIRCUIT
GATE
MODULE
SYSTEM
Not Only Microprocessors
Digital Cellular Market(Phones Shipped)
1996 1997 1998 1999 2000
Units 48M 86M 162M 260M 435M Analog Baseband
Digital Baseband
(DSP + MCU)
PowerManagement
Small Signal RF
PowerRF
(data from Texas Instruments)(data from Texas Instruments)
CellPhone
Frequency
P6Pentium ® proc
486386
28680868085
8080
80084004
0.1
1
10
100
1000
10000
1970 1980 1990 2000 2010Year
Fre
qu
ency
(M
hz)
Lead Microprocessors frequency doubles every 2 yearsLead Microprocessors frequency doubles every 2 years
Doubles every2 years
Courtesy, Intel
Die Size Growth
40048008
80808085
8086286
386486 Pentium ® proc
P6
1
10
100
1970 1980 1990 2000 2010Year
Die
siz
e (m
m)
~7% growth per year~2X growth in 10 years
Die size grows by 14% to satisfy Moore’s LawDie size grows by 14% to satisfy Moore’s Law
Courtesy, Intel
Power DissipationP6
Pentium ® proc
486
3862868086
80858080
80084004
0.1
1
10
100
1971 1974 1978 1985 1992 2000Year
Po
wer
(W
atts
)
Lead Microprocessors power continues to increaseLead Microprocessors power continues to increase
Courtesy, Intel
Power will be a major problem5KW
18KW
1.5KW 500W
40048008
80808085
8086286
386486
Pentium® proc
0.1
1
10
100
1000
10000
100000
1971 1974 1978 1985 1992 2000 2004 2008Year
Po
wer
(W
atts
)
Power delivery and dissipation will be prohibitivePower delivery and dissipation will be prohibitive
Courtesy, Intel
Power density
400480088080
8085
8086
286386
486Pentium® proc
P6
1
10
100
1000
10000
1970 1980 1990 2000 2010Year
Po
wer
Den
sity
(W
/cm
2)
Hot Plate
NuclearReactor
RocketNozzle
Power density too high to keep junctions at low tempPower density too high to keep junctions at low temp
Courtesy, Intel
9
Challenges in Digital Design
“Microscopic Problems”• Ultra-high speed design• Interconnect• Noise, Crosstalk• Reliability, Manufacturability• Power Dissipation• Clock distribution.
Everything Looks a Little Different
“Macroscopic Issues”• Time-to-Market• Millions of Gates• High-Level Abstractions• Reuse & IP: Portability• Predictability• etc.
…and There’s a Lot of Them!
DSM 1/DSM
?
Productivity Trends
1
10
100
1,000
10,000
100,000
1,000,000
10,000,000
200
3
198
1
198
3
198
5
198
7
198
9
199
1
199
3
199
5
199
7
199
9
200
1
200
5
200
7
200
9
10
100
1,000
10,000
100,000
1,000,000
10,000,000
100,000,000
Logic Tr./ChipTr./Staff Month.
xxx
xxx
x
21%/Yr. compoundProductivity growth rate
x
58%/Yr. compoundedComplexity growth rate
10,000
1,000
100
10
1
0.1
0.01
0.001
Lo
gic
Tra
nsi
sto
r p
er C
hip
(M)
0.01
0.1
1
10
100
1,000
10,000
100,000
Pro
du
ctiv
ity
(K)
Tra
ns.
/Sta
ff -
Mo
.
Source: Sematech
Complexity outpaces design productivity
Co
mp
lexi
ty
Courtesy, ITRS Roadmap
Advanced Metallization
Die Cost
Single die
Wafer
From http://www.amd.com
Going up to 12” (30cm)
Yield%100
per wafer chips ofnumber Total
per wafer chips good of No.Y
yield Dieper wafer Dies
costWafer cost Die
area die2
diameterwafer
area die
diameter/2wafer per wafer Dies
2
Defects
area dieareaunit per defects
1yield die
is approximately 3
4area) (die cost die f
Summary• Digital integrated circuits have come a long way
and still have quite some potential left for the coming decades
• Some interesting challenges ahead– Getting a clear perspective on the challenges and
potential solutions is the purpose of this book
• Understanding the design metrics that govern digital design is crucial– Cost, reliability, speed, power and energy dissipation