Post on 23-Feb-2016
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Tube-to-Chip soldering
Georg Nüßle
µcool weekly 2November 8, 2012
Paper
Following the recipe from:
“Solder-based chip-to-tube and chip-to-chip packaging for microfluidic devices”Edward R. Murphy et al., The Royal Society of Chemistry, 2007
µcool weekly 3November 8, 2012
Soldering to PCB
• Tube 1/16” stainless steel, Swagelok ferrule: big part stainless steel, small part brass • Was successful, no solder around at the tube
µcool weekly 4November 8, 2012
Soldering to Chip with Goldlayer• Chip: 100µm Si with 20nm Ti and 200nm Au• Was successful too• Reinforcement for pressure test, chip was glued on thick Si piece
µcool weekly 5November 8, 2012
Pressure Test• NanoPort/steel tube combination failed at 78 bar• Test object was ejected, which led to a brake off of the Si chip from the reinforcement• Si part under the the soldering seemed to be intact• Second pressure test, Si chip breaks at 37 bar, solder is unharmed, no solder in tube
µcool weekly 6November 8, 2012
Outlook
Test soldering with microfluidic device and prove that the tube is not blocked by solder.