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Wooden suspended fl oors
U P O N O R P E X
P R O D U C T I O N
U N D E R F LO O R H E AT I N G
W O O D E N S U S P E N D E D
F LO O R S
08 | 2006
2 U p o n o r U n d e r f l o o r H e a t i n g – W o o d e n s u s p e n d e d f l o o r s
Wooden suspended fl oors
The term suspended fl oors in this
brochure refers to a fl oor construc-
tion mainly consisting of wood
products where a load-bearing fl oor
surface of wood, chipboard, etc.
rests on wooden fl oor joists, either
solid wood or I-beams with fl anges
of wood, board etc.
The dimensions and recommen-
dations are according to common
use in the Nordic countries. Local
standards and regulations must
always be considered.
How to heat a suspended fl oor
Underfl oor heating in timber joist
fl oors generally requires more
thorough planning than instal-
lations in concrete. In concrete
screeded fl oors or wet installations,
the screed spreads the heat and
provides an even fl oor surface
temperature. Wooden suspended
fl oors do not conduct heat as
effi ciently. Heat diffusion plates
are required in order to distribute
the heat from the pipe to the fl oor
surface. In order to prevent the
surface temperature of the fl oor be-
ing uneven and to keep the supply
water temperature at a reasonable
level, the plates must have good
contact with the fl oor surface, and
as large a proportion of the fl oor as
possible must be covered by plates.
Uponor Underfl oor Heating in Wooden suspended fl oors
The loops are to be laid in sinuous
pattern and the temperature drop
in the loops at calculated tempe-
ratures should be no more than
5°C. The space between the fl oor
joists should be insulated to limit
downward heat loss through the
void below the joists.
In certain cases underfl oor heating
alone will not be adequate and
some form of supplementary hea-
ting may be required. Where high
heat fl ow density is required, the
surface temperature to obtain the
desired effect may be far too high.
A fl oor surface temperature of up
to 29°C is generally accepted, but
materials used in suspended fl oor
constructions may require lower
temperatures. Thick fl oor materi-
als with low heat conductivity will
require high fl ow temperatures.
Temperatures exceeding 60°C
should be avoided.
General information on wood
materials and
underfl oor heating
Wood is a hygroscopic material,
so its dimensions fl uctuate with
variations in atmospheric humi-
dity. When the humidity increases,
moisture is absorbed and the wood
swells. High moisture content may
also have a negative effect on the
adhesives used, e.g. in the manu-
facture of parquet fl ooring. At low
atmospheric humidity the wood will
shrink and cracks may appear bet-
ween the boards. In order to reduce
these fl uctuations, relative humidity
of 30-60% should be maintained in
the room where the wooden fl oor
is laid, both during and after instal-
lation. Types of wood that display
substantial fl uctuation (e.g. beech
and hard maple) should be avoided
unless they have been specially
treated to reduce this.
If the joists in a timber joist fl oor
have a high moisture content from
the start, the effective dehumidifi -
cation that the underfl oor heating
brings about will mean dimensional
changes in the joists. If under-
fl oor heating has been installed,
we therefore recommend that the
fl oor joists be dried to a maximum
moisture content of 10% before
the fl oor is laid. Measurements are
taken on the top side of the joists.
In newly-built houses, the building
materials normally contain a large
amount of moisture. This moisture
must be dried out as soon as the
house has been insulated. Under-
fl oor heating has been selected
as the heating system, it must be
taken into account that the process
of drying out the joist fl oor is ac-
celerated as soon as the underfl oor
heating is started up. It is necessary
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for the underfl oor heating to remain
on during the drying-out process,
even in summer.
How to choose an installation
method
Uponor can offer several different
solutions for installing underfl oor
heating in wooden fl oors. Choo-
sing the most suitable system will
depend on factors such as whether
it is a new building or an installation
in an existing fl oor, the distance
between the joists and the fi nal
fl ooring covering material. Descrip-
tion of the various installation met-
hods specifi es the most important
prerequisites for each system. It is
generally a good idea to consult the
structural engineer before choosing
an installation method. If the fl oor
is resting on I-beams, where cutting
notches in the beams’ fl anges is not
normally permitted, it is particularly
important that the installation
be designed correctly from the
beginning in consultation with the
structural engineer and that any
installation work be in line with his
instructions.
When comparing prices for the
various alternatives, always compare
the total installed cost, as the price
of the individual materials for the
underfl oor heating installation does
not generally provide a true picture.
Room regulation
An underfl oor heating system
should ideally be equipped with
room thermostats and actuators to
achieve maximum indoor comfort
in each room or zone. Regulating
the fl ow of warm water in the
underfl oor heating system can then
optimise the room temperature.
Overheating of the room may be
caused by extra heat generated by
sunlight, lighting, heat-generating
equipment and human activity.
Room thermostats maintain the
desired room temperature in a
particular room regardless of fl oor
structure and fl oor type. To protect
sensitive wooden fl ooring from
being exposed to temperatures that
are too high, it may be advisable
to use a room thermostat with an
external fl oor sensor that limits the
maximum permitted temperature
of the fl oor. A comfort controlling
system will reduce the amount of
wasted energy and provide environ-
mental benefi ts.
4 U p o n o r U n d e r f l o o r H e a t i n g – W o o d e n s u s p e n d e d f l o o r s
This alternative can be used regardless of the joist spa-
cing as long as the distance between the joists does not
exceed 600mm. The fl oor surface will be raised and the
pipe direction will be perpendicular to the fl oor joists.
Uponor Heat Emission Plate 20 on fl oor joists
Installation
• Nail or screw the battens (21 x
120 or 28 x 120 mm) using 2 nails
(screws) for each joist. When nailing
use galvanised fl uted wire nails.
The fi rst batten should be nailed
approx. 50 mm from the wall so
that the heat emission plate can be
positioned correctly.
• Leave half the distance between
the last two joists free of battens,
but nail a batten along the crossing
wall to support the chipboard.
Ensure that there is enough room
left to allow for the positioning of
the pipe coils.
• Lay the heat emission plates star-
ting from the outer wall. Leave 300
mm by the cross wall to allow room
for the turning loops. Cover as large
an area as possible with plates (70-
90%). The gap between the plates
must be at least 10 mm but not
more than 100 mm. The plates can
be divided at the break notches to
adapt the plate length to the room
length. Any leftover plates from the
fi rst groove can be used as the fi rst
plate in the second groove to mini-
mise wastage. The plates should be
A = Laminated parquet or laminated fl oor, min 7 mm
B = Chipboard, 22 mm
C = Possible vapour barrier
D = Underfl oor heating plate
E = Underfl oor heating pipes Wirsbo-pePEX, 20 x 2 mm
F = Secondary spaced boarding (battens), 21 x 120 mm or 28 x 120 mm
G = Floor joist
A B C D E GF
Installation with battens fi nishing above the last joist
Note! If the fl ooring is 15 mm laminated parquet
(with-out chipboard), use 28 x 120 mm battens.
The battens should fi nish above the last joist, 3
cm from the cross wall. The battens should not be
nailed to the last joist until the coil has been laid.
The parquet is laid on top, across the battens.
nailed fi rmly to the battens at one
side so the groove for the pipe runs
in a straight line.
• Position the pipes according to
the layout pattern. Mark the rou-
ting of the pipes in order to prevent
accidental perforation with screws.
• Lay vapour barrier as required.
• After pressure testing, the fl oo-
ring material can be laid.
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This alternative can be used if the distance between
the joists is 600 or 300 mm. If ceramic tiles are used as
fl ooring, the joists must be at a maximum of 300 mm
c/c. The fl oor surface will not be raised, and the pipe
direction will be the same direction as the fl oor joists.
Installation
• Nail cross bars at intervals of 600
mm between the joists and nail or
screw the battens to these. The
top edge of the secondary spaced
boarding should be on a level with
the top edge of the joists. Leave an
opening for the turning loops for
the underfl oor heating pipes. Make
notches for the pipes where they
cross the joists, next to the crossing
wall. Always consult the structural
engineer before this is done.
Uponor Heat Emission Plate 20 between fl oor joists
• Lay the heat emission plates. Co-
ver as large an area as possible with
plates (70-90%). The gap between
the plates must be at least 10 mm
but not more than 100 mm. The
plates can be divided at the break
notches to adapt the plate length
to the room length. Any plating
remaining from the fi rst groove
can be used as the fi rst plate in the
second groove to minimise wastage.
The plates should be nailed fi rmly
A = Laminated parquet, 22 mm, or chipboard, 22 mm
B = Possible vapour barrier
C = Underfl oor heating plate
D = Underfl oor heating pipes Wirsbo-pePEX, 20 x 2 mm
E = Secondary spaced boarding (battens), 21 x 120 mm or 28 x 120 mm
F = Cross bar, 45 x 45 mm with partition 600 mm
G = Insulation
H = Floor joist
A B C D E GF H
A = Tiles
B = Sealing layer
C = Flooring plaster 13 mm
D = Flooring chipboard 22 mm
E = Underfl oor heating plate
F = Underfl oor heating pipes Wirsbo-pePEX, 20 x 2 mm
G = Secondary spaced boarding, 21 x 95 mm
H = Cross bar, 45 x 45 mm with c/c 600 mm
I = Insulation
J = Floor joist
A B C E F HG I JD
to the battens at one side so the
groove for the pipe is in a straight
line.
• Position the pipes according to
the layout pattern. Mark the rou-
ting of the pipes in order to prevent
accidental perforation with screws.
• Lay vapour barrier as required.
• After pressure testing, the fl oo-
ring material can be laid.
6 U p o n o r U n d e r f l o o r H e a t i n g – W o o d e n s u s p e n d e d f l o o r s
This alternative can be used when the distance between
the joists is 600 mm. It can be combined with heat
emission plates where the distance between the joists
varies. The fl oor surface will not be raised and the pipes
will be in the same direction as the joists.
Uponor Cassettes are not recommended where tile
fl ooring is laid.
Installation
• The cassettes should be laid out
from wall to wall. Cassettes can be
split so that the length is 385 or
770 mm. Cover as large an area as
possible, leaving a gap between
cassettes of at least 10 mm but not
more than 100 mm. The distance
between the wall and the fi rst and
last cassettes in each line must be
at least 250 mm to allow room for
the turning loops.
• After setting out and centring the
cassette, nail one side to the joist.
Then check, using a spirit level, that
the cassette is level with the upper
edge of the joists. Once the cas-
sette is level, nail the other side.
• Make notches for the pipes where
they cross the joists, next to the
crossing wall. Always consult the
structural engineer before this is
done.
• The underfl oor heating pipes
should be laid in the cassette groo-
ves according to the layout pattern.
Uponor Cassette 20 between fl oor joists
The central groove in the cassette is
to allow for movement of the cas-
sette in the event of temperature
variations, and should not be used
for the pipe.
• Lay vapour barrier as required.
• After pressure testing, the fl oo-
ring material can be laid.
Underfl oor heating in underfl oor
heating cassettes for 20 mm pipes
A = Laminated parquet, 22 mm, or chipboard, 22 mm
B = Possible vapour barrier
C = Underfl oor heating pipes Wirsbo-pePEX, 20 x 2 mm
D = Underfl oor heating cassette
E = Floor joist
A B C D E
Note! The fl ooring should be
nailed or screwed to the fl oor
joists. Some parquet suppliers
recommend laying a fl oating
fl oor, but in this case a
construction with battens and
underfl oor heating plates must
be used.
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Installation
• Lay out the panels crosswise to
the direction of the joists. Begin by
laying out the fi rst turning plate at
the furthest point from the under-
fl oor heating manifold. Lay out un-
derfl oor heating chipboard panels
in the fi rst row. Adjust the length
of the panels so that any joints
between two panels are always
exactly above a joist. Crosscut so
that each panel spans at least two
joist voids. If any panel only spans
one void, it must be supported by
an extra cross bar in the middle of
the compartment.
• Begin the next and subsequent
rows with a turning plate in the
same way as the fi rst row. The joint
line between the turning plates and
the fi rst underfl oor heating plate
will be the same, but the underfl oor
heating plates are cut and laid in
Uponor Underfl oor Heating Chipboard 17
This alternative can be used regardless of the joist spa-
cing as long as the distance between the joists does not
exceed 600mm. The board is designed to be used ins-
tead of fl oor boards or fl oor deck and the fl oor surface
will be raised. The pipe direction will be perpendicular to
the fl oor joists.
For ceramic tiles, the joists must be at a maximum of
300 mm c/c.
A lower water temperature than with the other alterna-
tives can be used, as it is possible to use thinner fl oor
coverings, and the turning plate with pre-glued alumi-
nium plates will enlarge the active heated area. On the
other hand, with the 17 mm pipe the fl ow rate and the
pressure drop will be greater than in the 20 mm pipe.
A B C D E F
A = Laminated parquet, chipboard or laminated fl oor
B = Possible vapour barrier
C = Underfl oor heating plate
D = Underfl oor heating pipes Wirsbo-pePEX, 17 x 2 mm
E = Underfl oor heating chipboard, 22 mm
F = Floor joist
such a way that the joints on the
fl oor surface will be offset. (fi g)
• The chipboard panels should be
carefully glued along the tongue
and groove and against joists and
cross bars.
• Glue and screw the panels to
the joists. Countersink the screws
at least 5 mm. Do not fi ll the
countersink hole. Note! Do not glue
chipboard/turning plates where the
pipe passes beneath until the pipe
has been installed. See also the
section on making holes, page 8.
• Carefully clean the chipboard
of all chips and debris. Push the
heat emission plates down into the
chipboard grooves. Cover as large
an area as possible with plates. The
gap between the plates must be
at least 10 mm but not more than
100 mm. The plates can be divided
at the break notches to adapt the
plate length to the room length.
Any plates leftover from the fi rst
groove can be used as the fi rst plate
in the second groove to minimise
wastage.
• Position the pipes according to
the layout pattern. Begin by con-
necting one end of the loop to the
underfl oor heating manifold, then
draw the pipe to the beginning of
the loop fi eld. Use the holes in the
turning plate for coming up from
or dropping down into a joist fl oor
compartment.
• Lay vapour barrier as required.
• After pressure testing, the fl oo-
ring material can be laid.
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1 The turning plates must have
support by the wall
2 Plates laid over a single
compartment must be centrally
supported from below by an
extra cross bar
3 The plates should always be
jointed on top of a joist and laid
so that the joints are offset.
Mounting pipeMounting Heat Emission Plate
Uponor underfl oor heating 17 is laid directly onto the fl oor joists and replaces the usual subfl oor.
Mounting underfl oor heating chipboard
3
2
1
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When installing underfl oor heating
in timber joist fl oors the work must
be planned so that the loops do not
obstruct subsequent work. Always
begin by installing the underfl oor
heating manifold. Then decide
which loop is to be connected to
each outlet on the manifold and
how the feeder lines to the various
rooms are to be positioned.
In order for pipes to pass crosswise
to the direction of the joist holes
must be made. This must always
be done in consultation with the
structural engineer. In cases where
the underfl oor heating is installed
on top of the fl oor joists, ensure
that the support for each batten
and chipboard is not impaired.
For installations using fl ooring chip-
board that covers the entire fl oor
area, it is particularly important
for all crossing pipes to be in place
before the fl ooring panels are fi tted.
In order to allow a feeder pipe to be
laid under the chipboard, the gap
between the panels and the wall
must be at least 10 mm and the pa-
90 mm
40 mm
130 mm
Max 250 mm
20 mm
Assembly, making holes – general information
nels closest to the wall must remain
loose until installation is complete.
The notch in the joists for the
feeder pipe should be around 40
mm from the wall, with a maximum
width of 50 mm. If space is required
for several pipes, leave a support
under the grooved section of the
chipboard and make a new notch
so that it ends up under the non-
grooved section of the board. (see
fi gure).
1 0 U p o n o r U n d e r f l o o r H e a t i n g – W o o d e n s u s p e n d e d f l o o r s
Before the fl oor surface is laid the underfl oor heating installation must be pressure-tested, and the moisture content
of the fl oor joists checked. Always follow the fl oor manufacturer’s instructions with regard to maximum permitted
fl oor temperature, vapour barrier, installation method, etc.
Flooring
Vinyl or wall-to-wall carpet
If the fi nal surface material is to
be vinyl, wall-to-wall carpet, etc,
chipboard should be laid over the
underfl oor heating system as a bed
for the covering. The chipboard
should be laid across the underfl oor
heating pipes. Tongue and groove
should be fully glued along the
short and long sides. With Uponor
Underfl oor Heating Chipboard 17,
chipboard has to be at least 10 mm.
With 20 mm pipe options, 22 mm
Underfloor heating plate
Underfloor heating pipe
Vinyl or wall-to-wall carpet
Flooring chipboard
Laminated parquet
If parquet is required, 7-15 mm
laminated parquet can be laid direc-
tly on Uponor Underfl oor Heating
Chipboard 17. The boards should
be laid fl oating across the pipes.
Follow the parquet fl oor supplier’s
recommendations regarding pos-
sible gluing or whether the fl ooring
is to be snapped together.
15 - 22 mm laminated parquet can
be used directly on Uponor Heat
Emission Plate 20 on fl oor joists if
battens across the joists are 28 x
120 mm. The parquet is laid on top,
across the battens.
With cassettes or battens between
the joists, 7-15 mm parquet is laid
on 22 mm chipboard.
22 mm laminated parquet fl ooring
can be laid across the joists with
the cassettes or heating plates on
battens between the joists. The
boards should be nailed using gal-
vanized fl uted wire nails 60 x 23. In
addition, the fl oor manufacturer’s
Laminated parquet
Vapour barrier
Underfloor heating pipe
Flooring chipboard
Underfloor heating plate
instructions must be followed regar-
ding gluing of end joints, etc.
Some parquet suppliers recommend
laying a fl oating fl oor on the whole.
As the fl ooring should be nailed or
screwed to the joist if cassettes are
used, a construction with battens
and underfl oor heating plates must
be used in this case.
chipboard should be used, and the
boards should be screwed to the
joists at intervals of approximately
600 mm.
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Tiles
Tile adhesive
Possible sealing layer
Underfloor heating plate
Underfloor heating pipe
Flooring plaster
Flooring chipboard
Uniform timber fl ooring
Uniform timber fl ooring (fl oor-
boards) with a minimum thickness
of 22 mm may be used without
supporting chipboard with all 20
mm suspended fl oor options. With
a heat demand of approx 50 W/m2,
fl oor boards with a thickness up to
30 mm can be used without excee-
ding a water temperature of 60°C,
giving a fl oor surface temperature
of approximately 27ºC. The boards
Underfloor heating pipe
Underfloor heating pipe
Floorboard
Vapour barrier
Ceramic tiles
Following installation methods
are used in Sweden, but for more
detailed instructions, we recom-
mend that the tile and plasterboard
suppliers are consulted and that
their instructions are followed.
When tiles are to be used as fl oo-
ring material, Uponor Underfl oor
Heating Chipboard 17 is recom-
mended with a distance of 300 mm
between the fl oor joists. Alternati-
vely, Uponor Heat Emission Plates
20 can be used between fl oor joists
at the same distance. The Uponor
Cassette system should not be used
with tiled fl oors.
When laying ceramic tiles, fl oo-
ring plasterboard should be fi tted
fi rst on, perpendicular to, the
underlying fl ooring chipboard. The
plasterboard should be fully glued
to the fl ooring chipboard. With
the underfl oor heating chipboard
17 the length of the plasterboard
must be adjusted so that all joists
can be screwed to the chipboard
without damaging the pipe. Double
plasterboards facilitate construction
of slopes towards fl oor drains, but
the water temperature has to be
raised. Lay the fl ooring plasterboard
with offset long and short edges.
The two plasterboard layers should
be glued together using a suitable
adhesive.
When installing ceramic coverings
over underfl oor heating, damage to
the adhesive during setting should
be avoided by not allowing any
temperature fl uctuations in the
fl oor material during the fi rst month
after tile laying. If heating from the
underfl oor heating system will be
required before and/or during the
period tile laying is to be carried
out, the fl oor material can be supp-
lied with a maximum temperature
of 20°C. The fl oor material must be
kept at this temperature for at least
24 hours before and up to approx-
imately one month after completion
of tile laying. The heat of the fl oor
can then be increased gradually by
a maximum of 5°C per 24 hours
until normal operating temperature
is achieved.
Altering the temperature too
early or too quickly can reduce the
strength of the adhesive and could
thus shorten the useful life of the
ceramic covering.
should be laid across the underfl oor
heating pipes and fastened to the
joists as per the supplier’s instruc-
tions. Uniform timber must be well
dried out before fi tting.
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Technical data
0
2
4
6
8
10
12
20 30 40 50 60 70 80 90 100
Heat demand (W/m2)
Floor temp
Floor cover 14 mm
Chipboard 17
�T
(K
)
Suspended fl oor 17 mm
fi g. 1
0
2
4
6
8
10
12
14
16
18
20
20 30 40 50 60 70 80 90 100
Heat demand (W/m2)
�T
(K
)
Floor temp
Floor cover 22 mm
Cassette 20/ Heat
emission plate 20
Suspended fl oor 20 mm
fi g. 2
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Maximum loop length
Large rooms require more than one pipe loop in order to
limit the dimensioning pressure drop of the installation.
Long loops may also cause problems in maintaining an
even fl oor surface, and big differences in loop lengths
make it diffi cult to balance the system. In most installa-
tions, a pressure drop of up to 20 kPa in the underfl oor
heating pipes is acceptable. With a dimensioning water
temperature drop of 5°C, the maximum loop lengths
and the corresponding approximate heated fl oor areas
in the table can be used as a guideline.
Calculation of mean water temperature
Fig 1 and 2 describe the difference in tempera-
ture between the temperature in the room and
the mean water temperature in the pipe. Fig
3 shows how the required water temperature
increases to maintain the heat output with other
fl oor coverings.
Example with Uponor Cassette (Fig 2): A room
with a heat demand of 70 W/m2 and an air tem-
perature of 20°C needs a fl oor temperature of
26.5°C (20 + 6.5°C). The temperature under 22
mm chipboard will be 39.3°C (26.5 + 12.8°C) and
the mean water temperature in a cassette instal-
lation will be 52.0° (39.3 + 12.7°C).
If a plastic carpet is used (Fig 3), an extra tempe-
rature drop of 0.7°C has to be added, resulting
in a mean water temperature of 52.7°C. For a
temperature drop in the loop of up to approx.
5°C, the fl ow temperature can be calculated
as the mean temperature + half the tempera-
ture drop. With a temperature drop of 5° C the
required fl ow temperature will be approx 55.2°C
(52.7+ 2.5°C).
0
2
4
6
8
10
20 30 40 50 60 70 80 90 100
Heat demand (W/m2)
�T
(K
)
Wall to wall
Parquette 7 mm
Tiles
Plastic
Different fl ooring
fi g. 3
Heat demand 17 mm pipe 20 mm pipe
W/m2 l, m area, m2 l, m area, m2
100 75 13.5 80 23
70 90 17 98 29
50 110 21 120 35
1 4 U p o n o r U n d e r f l o o r H e a t i n g – W o o d e n s u s p e n d e d f l o o r s
Wirsbo-pePEX Underfl oor Heating pipes
Uponor Underfl oor Heating uses Wirsbo-pePEX pipes, a cross-linked poly-
ethylene (PEX) pipe with an oxygen diffusion barrier and the same excellent
characteristics as other Wirsbo-PEX pipes. The oxygen diffusion barrier is
glued to the Wirsbo-PEX pipe using a special adhesive polyethylene fi lm
and prevents oxygen leakage through the pipe walls causing oxidation of
the carbon steel components in the system. The oxygen diffusion barrier in
Wirsbo-pePEX pipes easily complies with the requirements of the applicable
DIN standard (DIN 4726). A mechanical protective layer of PEX is applied to
the outside of the diffusion barrier.
Allow at c/c 200 mm (17x2.0) mm is approx. 6 m/m2.
Allow at c/c 300 mm (20x2.0) mm is approx. 4 m/m2.
Uponor Cassette 20
Uponor Cassettes measure 1150 x 530 (excluding fastening band) x 0.6 mm
and are supplied with break notches for dividing into 380 and 770 mm long
sections.
Allow approx. 1.1 cassettes/m2.
Uponor Heat Emission Plate
The Uponor Heat Emission Plate 17 measures 1150x190x0.5 mm and is
supplied with two break notches for dividing into 190, 390 and 570 mm
long sections. Allow approx. 4 plates/m2 or 6 underfl oor heating plates per
underfl oor heating chipboard panel 2400x600 or 4 underfl oor heating plates
per underfl oor heating chipboard panel 1200x800.
The Uponor Heat Emission Plate 20 measures 1150x280x0.6 mm and is
supplied with two break notches for dividing into 190, 390 and 570 mm
long sections.
Allow approx. 2.5 plates/m2.
Uponor Chipboard 17
Uponor Underfl oor Heating chipboard is chipboard with grooves for instal-
lation of Wirsbo-pePEX pipes 17x2.0 mm. The panels are available in two
sizes, 2400x600x22 mm and 1200x800x22 mm. The grooves have a c/c
distance of 200 mm. Panels are supplied without underfl oor heating plates.
Allow at 2400x600 approx. 0,6 chipboards/m2
Allow at 1200x800 approx. 1,2 chipboards/m2
Uponor Turning Plate 17
The turning plate is equipped with grooves for the underfl oor heating pipes.
Underfl oor heating plates are pre-fi tted (pre-glued) in the groove on the
turning plate.
The grooves have a c/c distance of 200 mm and match the grooves in the
underfl oor heating chipboard. The turning plate constitutes a load-bearing
structure in areas where the underfl oor heating chipboard cannot be laid.
The dimensions of the turning plate are 600x400x22 mm.
Allow 1-2 plates per 2 pipe lengths.
Material data
1 5U p o n o r U n d e r f l o o r H e a t i n g – W o o d e n s u s p e n d e d f l o o r s
Uponor AB T +46 (0)223 380 00
Box 101 F +46 (0)223 387 15
SE-730 61 Virsbo W www.uponor.se
Sweden
In keeping with our policy of continuous
improvement and development, Uponor
reserves the right to change specifi cations
without prior notice.