Post on 20-Dec-2014
description
transcript
SUPER SPEED USB3.0
1
Made by :Shirish O.
Bhrade
Guided By :Ms. Dipti Umalkar
INTRODUCTION
• The USB 3.0 Promoter Group announced on November 17, 2008, version 3.0 and submitted to USB-IF
• The first certified USB 3.0 consumer products were announced January 5, 2010
2
UNIVERSAL SERIAL BUS
• Designed to allow many peripherals to be connected using a single standardized interface socket.
• Consists of a host, USB ports, and peripheral devices connected in a tiered-star topology
3
How Communication
• Endpoint built into device by manufacturer• Endpoint addressable by (device address ,
endpoint number)as specified in packet sent by host
• If data from host to endpoint an OUT packet sent
• If data from device to an IN packet sent by host
4
How Communication Established
Device Connected
Enumeration starts by sending reset signal
Data rate of device determined Device Assigned a unique address
If host supports device, driver loaded
5
Past----->Present1 USB-IF formed
2 USB 1.0 specification 12 Mbit/s
3 USB 2.0 specification 480 Mbit/s
4 USB 3.0 specification 5 Gbit/s
2010 USB 3.0 devices in market
6
WHY USB 3.0
• Popularity• Transfers HD data in short time• Superior than its competitors
7
FEATURES
• Dual bus architecture• Cable sructure supporting full duplex
transmission• Connector supporting cable structure • Power • Link level power management• Asynchronous notify
8
DUAL BUS ARCHITECTURE• USB 3.0 is a
physical SuperSpeed bus combined in parallel with a physical USB 2.0 bus
9
CABLE STRUCTURE
• One power pair• One twisted signal pair for USB 2.0 data path• Two twisted signal pairs for the SuperSpeed
data path.• Supports full duplex mode
10
CONNECTOR PINS
11
Power
• 50% more power provided(100-150mA)for unconfigured device.• 80%more power provided(500-900mA)for configured device.• Link level power management• Continous device polling eliminated
12
SUPER SPEED ARCHITECTURE
Physical layer
Link layer
Protocol layer
13
PHYSICAL LAYER
• Physical connection between downstream port and upstream port
• If connected reciever termination enabled• No signalling occurs generates LFPS• 8 bit data scrambled and encoded to 10
bit,sends to link layer• Link layer to physical
14
LINK LAYER• Link level power management• Insertion of packet delimiters• Receive and manage packets• Interface between protocol layer
15
PROTOCOL LAYER
• End to end communication• Deals with protocols• Reliable delivery
16
SUPER SPEED CONNECTION
Device notifies it is connected
Host makes request
Device ready notifies this with ERDY
Else tells host unavailable to process by sending NRDY
17
SUPER SPEED TRANSFER• Two channels • No propagation delay• Data bursting• OUT-data packet contains address information• IN-sends packet with sequence number that
host tells
18
USB 3.0 vs USB2.0
USB 3.0 USB 2.0• Super speed High speed• Asynchronous notify Polling• Link level power management No such properties• 900 mA power 500 mA• Full duplex Half duplex
19
ADVANTAGES
• Super speed• Power efficiency• Efficient when compared to its competitors• Backward compatibility
21
DRAWBACK
• Intel at present not supporting• Cable length limited to 3m
22
FUTURE
• Twisted pair cable replaced by optical fibre
23
CONCLUSION
• USB 3.0 wil also be popular like earlier versions.
• Will replaces firewire etc• As it is backward compatible it will be used in
the new computers and devices
24
QUESTIONS??
THANK YOU
26