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...New Delhi, the 27th July 2012 Subject: Modified Special Incentive Package Scheme (M - SIPS) to...

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Page 1: ...New Delhi, the 27th July 2012 Subject: Modified Special Incentive Package Scheme (M - SIPS) to offset disability and attract investments in Electronics Systems Design and Manufacturing

Page 2: ...New Delhi, the 27th July 2012 Subject: Modified Special Incentive Package Scheme (M - SIPS) to offset disability and attract investments in Electronics Systems Design and Manufacturing

Page 3: ...New Delhi, the 27th July 2012 Subject: Modified Special Incentive Package Scheme (M - SIPS) to offset disability and attract investments in Electronics Systems Design and Manufacturing

Page 4: ...New Delhi, the 27th July 2012 Subject: Modified Special Incentive Package Scheme (M - SIPS) to offset disability and attract investments in Electronics Systems Design and Manufacturing

Page 5: ...New Delhi, the 27th July 2012 Subject: Modified Special Incentive Package Scheme (M - SIPS) to offset disability and attract investments in Electronics Systems Design and Manufacturing

Page 6: ...New Delhi, the 27th July 2012 Subject: Modified Special Incentive Package Scheme (M - SIPS) to offset disability and attract investments in Electronics Systems Design and Manufacturing

Page 7: ...New Delhi, the 27th July 2012 Subject: Modified Special Incentive Package Scheme (M - SIPS) to offset disability and attract investments in Electronics Systems Design and Manufacturing

Page 8: ...New Delhi, the 27th July 2012 Subject: Modified Special Incentive Package Scheme (M - SIPS) to offset disability and attract investments in Electronics Systems Design and Manufacturing

Page 9: ...New Delhi, the 27th July 2012 Subject: Modified Special Incentive Package Scheme (M - SIPS) to offset disability and attract investments in Electronics Systems Design and Manufacturing

Page 10: ...New Delhi, the 27th July 2012 Subject: Modified Special Incentive Package Scheme (M - SIPS) to offset disability and attract investments in Electronics Systems Design and Manufacturing

Page 11: ...New Delhi, the 27th July 2012 Subject: Modified Special Incentive Package Scheme (M - SIPS) to offset disability and attract investments in Electronics Systems Design and Manufacturing

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