024210 SIM ThermalAnalysis WP ENG

8/23/2019 024210 SIM ThermalAnalysis WP ENG

1/17

Ta Aa

w h i t e p a p

ispiatio

s u m m a r y

I this whit pap w d ad th oti th opt o tha

aasis as it ats to podt dsi. W disss th piips

o odtio, otio, ad adiatio si a-i podts as

aps. W wi aso dsi was to po tha aasis,

spia how o a s dsi aidatio sotwa to siat

tha oditios. W wi aso ist th dsid apaiitis i tha

dsi aidatio sotwa ad dostat thoh aps how

o a so dsi has si SoidWoks podts.


2/17

inodcon o l nl

To d podt dopt ost ad ti, taditioa pototpi ad ts

i has a pad i th ast dad a siatio-di dsi

poss. Sh a poss, whih ds th d o psi ad ti-

osi phsia pototps, aows is to sss pdit pod

poa with as-to-odi opt ods (Fi 1).

Dsi iatio toos a osidd iaa i stdi sh st-

ta pos as dftios, doatios, stsss, o ata is.

How, th stta poa o w podts is o o o a h

s ai dsi is. Oth oo pos a tha at

idi ohati, th ak o disioa staiit, ssi tha

stsss, ad oth has atd to hat fow ad th tha haattis o thi podts.

Tha pos a oo i tois podts. Th dsi o

ooi as ad hat siks st aa th d o sa si with ada

hat oa. At th sa ti, tiht opot pakai st sti s

sit ai fow so that pitd iit oads do ot do o ak d

ssi tha stss (Fi 2).

T H e r m A l A n A l y S I S

Figure 1:

TrAdiTionAl versus simulATion-driven producT design processes

Figure 2:

elecTronic pAckAging requires cAreFul AnAlysis oF how heAT

produced by elecTronic componenTs is removed To Th e

environmenT.


3/17T H e r m A l A n A l y S I S

Figure 3:

POTenTIAl OverHeATIng OF An InDuSTrIAl SHreDDer IS An ImPOrTAnT

cOnSIDerATIOn In THe DeSIgn OF ITS TrAnSmISSIOn AnD beArIngS.

Figure 4:

DenTAl ImPlAnTS muST nOT

AFFecT THermAl cOnDITIOnS OF

THe SurrOunDIng TISSue AnD

muST AlSO WITHSTAnD THermAl

STreSSeS.

Figure 5:

ADequATe cOOlIng OF A HIgH

cAPAcITy bATTery On A cOrDleSS

TOOl requIreS unDerSTAnDIng

THe THermAl cOnDITIOnS.

Tha has aso aod i taditioa ahi dsi. Oios a

ps o podts that st aad o tpat, hat dissipatio, ad

tha stsss a is, hdai ids, ti otos o pps

i shot, a ahi that ss to po so kid o s wok.

Phaps ss oios adidats o tha aasis a atiaposs-

i ahis wh haia ts ito hat ati ot o thahid pi t aso th ahi its. This sitatio is ipotat ot o

i pisio ahii ipt, wh tha pasio a at th

disioa staiit o th tti too, t aso i hih pow ahis sh

as shdds, wh opots a s o ssi tpat ad

tha stsss (Fi 3).

As a thid ap, ost dia dis shod aad o tha p

oa. D-di ssts st ass pop tpat o th adistd ssta whi sia dis st ot st th tiss to th

poit o ssi tha shok. Siia, od ipats st ot dispt h

fow isid th od, whi dta ipats st aso withstad s t

haia ad tha oads (Fi 4).

Fia, a tia appias sh as stos, iatos, is, ios, a

o aksi shot, athi that s o tiitshod aad

o tha poa to aoid ohati. This appis ot o to os

podts that o Ac pow, t aso to att-opatd dis sh as

ot-otod tos ad odss pow toos (Fi 5).



ung dgn vldon fo l nl

A o th ao tha dsi pos ad a o a siatd

with dsi aidatio sotwa. most dsi is a aad aiia w

this appoah o stta aasis, so padi its sop to tha aas

is itt additioa taii. Stta ad tha siatios a

asd o at th sa opts, oow th sa w-dd stps, adsha tip aaois (Fi 6).

Ftho, tha aass a pod o cAD ods th sa wa

stta aass so, o a cAD od has atd, a tha i

tio a optd with itt ta ot.

Tha aass a td to d tpat distitio, tpat

adit, ad hat fowi i th od, as w as th hat had tw

th od ad its iot.

Figure 6:

AnAlOgIeS beTWeen STrucTurAl

AnD THermAl DeSIgn vAlIDATIOn

Figure 8:

mAIn cHArAcTerISTIcS OF THree

HeAT TrAnSFer mecHAnISmS

Tha ts sh as tpats a as to siat, t a it

dit to as, spia isid pats o assis, o i tpats

a hai apid. This ot as that sotwa-asd dsi aidatio

a idd th o thod aaia to is itstd i th dtai

tha oditios o thi podts.

h nf fndnl

Conduction and convection

Th a th haiss sposi o hat tas: odtio, o

tio, ad adiatio. codtio dsis hat fowi isid a od, with th

att ost ot odd as a cAD pat o ass. cotio ad adiati

oth io hat ha tw th soid od ad th iot.

Figure 7:

TyPIcAl reSulTS PrOvIDeD by THermAl DeSIgn vAlIDATIOn



A ap o hat tas odtio is hat fow aoss a wa. Th

aot o tasd hat is popotioa to th tpat di

tw th hot sid THOT ad th od sid TcOlD o th wa, to th aa

o th wa, ad to th ipoa o th wa thikss l. Th popotioait a

to K, ad tha odtiit, is a w-kow atia popt (Fi 9)

Figure 9:

HeAT IS cOnDucTeD THrOugH THe

WAll FrOm THe HIgHer TO THe

lOWer TemPerATure.

Figure 10:

cOnDucTIOn cOeFFIcIenTS FOr DIFFerenT mATerIAlS

Figure 11:

HeAT DISSIPATeD by cOnvecTIOn

AlWAyS requIreS mOvemenT OF

THe FluID SurrOunDIng THe bODy.

Tha odtiit K ais wid o dit atias; this ato is wha

ditiats tw hat odtos ad isatos (Fi 10).

Th hais o hat ha tw a ta a o a soid od a

th sodi fid sh as ai, sta, wat, o oi is ad otio. Th

aot o hat od otio is popotioa to th tpat di

tw th soid od a TS ad th sodi fid TF, ad to th

aa A o th a hai (dissipati o aii) hat. Th popotioa

ato h is ad th otio oit, aso kow as a oit.

Hat ha tw th sa o a soid od ad its sodi fid

is ot o th fid (Fi 11).



Th otio oit sto dpds o th di (.., ai, sta,

wat, oi) ad th tp o otio: ata o od. nata otio a

o tak pa i th ps o ait as fid ot is dpd

o th di tw th spi ait o od ad hot fids. Fod

otio is ot dpdt o ait (Fis 12, 13).

Figure 12:

nATurAl cOnvecTIOn IS InDuceD by A DIFFerence In HOT AnD cOlD FluID Den

SITy. In FOrceD cOnvecTIOn, FluID mOvemenT IS FOrceD, FOr exAmPle, by A

cOOlIng FAn.

Figure 13:

HeAT cOnvecTIOn cOeFFIcIenTS FOr DIFFerenT meDIA AnD FOr DIFFerenT TyP

OF cOnvecTIOn.

To s how odtio ad otio wok toth, osid a hat-sik

ass (Fi 14). A iohip ats hat thohot its ti o

Hat os withi

Figure 14:

A cerAmIc mIcrOcHIP generATIng HeAT IS embeDDeD In An AlumInum rADIAT

THe rADIATOr IS cOOleD by THe SurrOunDIng AIr.



Figure 15:

TemPerATure DISTrIbuTIOn AnD HeAT Flux In THe HeAT-SInK ASSembly

th iohip odtio th is tasd to a ai adiato wh

it aso tas odtio. As hat tas o th poai iohip to

th ai adiato, it st oo a tha sista a od

iptios at th poai-ai ita. Fia, hat is dissipatd

otio o th otsid as o th adiato to th sodi ai.

Addi a ooi a o isi th adiato i wat dos ot ha th

hais o hat tas. Hat is sti od o th adiato as

otio. Th o di tw ai ad wat ati as ooats

ad tw ata ad od otios is a dit a o otio

oit.

Th tpat d i th hat-sik ass is show i Fi 15. Th

ot o hat o th adiato a to th ait ai a pitd

potti hat-f tos (Fi 15, iht). Hat f tos oi ot o

th adiato as isai hat od to th sodi fid. no tos

oss th otto a as i th od th otto as o th adiato

ad iohip a isatd.

not that odi th hat fowi i th hat-sik ass is

aoti o a sista to hat fow at th ita tw th ai

iohip ad th ai adiato. I so dsi iatio poas, th

tha sista a st odd piit; i oths, ik SoidWoks

it a td i a sipid wa as a tha sista oit.



Conduction, convection and radiation

So a this disssio o hat tas i th hat-sik ass osids o

two hat-fow haiss: odtio (sposi o oi hat isid th

soid odis: iohip ad adiato) ad otio (whih dissipats hat

o th ta as o th adiato to th ait ai). Hat tas

adiatio a iod as at th opati tpat o hat-sikadiatio, hat tas is ow. Th t ap hihihts a hat tas

po wh adiatio at iod.

radiatio a o hat tw two odis o dit tpats o it

a adiat hat ito spa. It dos ot dpd o whth o ot th odis

a isd i a fid o a sodd a a (Fi 16).

Figure 16:

HeAT IS excHAngeD by rADIATIOn beTWeen Any TWO bODIeS OF DIFFerenT

TemPerATureS. HeAT cAn AlSO be rADIATeD by A SIngle bODy OuT TO SPAce

Th aot o hat had adiatio tw th as o two soid

odis with tpats T1 ad T2 is popotioa to th di o th

oth pow o asot tpats to th aa A o th as patiipati

i th hat tas, ad to th issiit o th adiati sa. eissiit i

dd as th atio o th issi pow o th sa to th issi pow

o a akod at th sa tpat. matias a assid a issiit

a tw 0 ad 1.0. A akod, tho, has a issiit o 1.0 ad

a pt fto has a issiit o 0. bas hat tas adiatio

popotioa to th oth pow o th asot tpat, it os

siiat at hih tpats.



cosid a spotiht poidi iiatio i a a a ha. Ass

that th a ha is so a that a hat ftd o th ha-

was ak to th spotiht a iod. Th iht ad fto a

posd to a a, whi th ak sid o th ai hosi is so

d ai (Fi 17).

Figure 17:

In THe SPOTlIgHT mODel, THe reFlecTOr AnD lIgHT bulb Are exPOSeD TO

A vAcuum AnD THe bAcK SIDe OF THe HOuSIng IS exPOSeD TO AIr

Th hat atd th iht is patia adiatd ot to spa, whi

th st is id th paaoi a (fto) o th hosi. O a

sa potio o hat ts th hosi odtio wh th iht is

attahd to th hosi. Th adiatd hat id th hosi is aai

spit ito two potios: th st is adiatd ot, ad th sod is od isid

th hosi o o th a sid to th ai sid. O it ahs th

a posd to ai, it is dissipatd otio.

As aasis sts idiat, th tpat o th ai hosi is pa

a io as hat is odtd asi i ai d to its hih

odtiit (Fi 18).

not that si adiatio hat-tas os ti o at hih t-

pats, th iht st hot to dissipat a th hat it pods

Figure 18:

TemPerATure DISTrIbuTIOn In A SPOTlIgHT



Transient thermal analysis

Th aass o oth th hat sik ad th spotiht dat with hat tas

a stad stat, asd o th assptio that oh ti has passd o h

fow to staii. Aasis o a stad-stat hat tas is idpdt o th

ti it took o th hat fow to ah that stad stat, whih i pati a

tak sods, hos, o das.

A aasis o hat fow hai with ti is ad tasit tha aas

as o ap, th aasis o a o pot kpt hot a hati pat. Th

tpat o th hati pat is otod a thostat adi th t

pat o th o. Th thostat ts th pow o i th tpat

o th o dops ow a ii tpat, ad ts it o wh th

tpat ds a ai, pst a. Tpat osiatios o

spid piod o ti a show i Fi 19.

Thermal stresses

Hat fowi thoh a soid od wi as a ha i tpats i this

od. cost th od wi pad o shik. Stsss asd this

pasio o shika a ad tha stsss.

Tha stsss o i a wh hot o is pod ito it. A tha

aasis o sh stsss is idtii th tpat distitio; o

th isid as o th , th tpat is that o th hot o, whi

o th otsid as s-dd otio oits oto hat oss to

th sodi ai. Si ooi is a ati sow poss, a stad-stat

tha aasis is appid to aat th stat tpat distitio

th o . Th tpat distitio is o-io, asi thastsss that a asi aatd i SoidWoks i a stati aa

si th tpat sts o th tha aasis (Fi 20).

Figure 19:

TemPerATure verSuS TIme PlOT FOr A THermOSTAT-cOnTrOlleD POT OF cOFF

Figure 20:

nOnunIFOrm TemPerATure FIelD,

FOunD by STeADy-STATe THermAlAnAlySIS (leFT), InDuceS THermAl

STreSSeS cAlculATeD In A STruc-

TurAl STATIc AnAlySIS (rIgHT).



Desired capabilities of thermal design validation software

cosidi th tpia pos if itodd h, tha aasis ds

aidatio sotwa sd i a podt-dsi poss st a to od:

Hat fow odtio

Hat fow otio Hat fow adiatio

Th t o a tha sista a

Ti-dpdt tha ts sh as hati o ooi

(tasit tha aass)

Tpat-dpdt atia poptis, hat pow, otio

oits, ad oth oda oditios

Th a aso oth its that a aidatio poa sd as a dsi

too shod satis that a ot o spi to tha aasis t app as

w to stta o toati aass. Si w podts a isa dsid o cAD, th it s o a tp o aidatio sotwa as

dsi too aso pas th oowi its o cAD sotwa:

Th cAD sst shod :

A at-asd, paati, assoiati soid-od

A to at a ot, oth aati spi ad aasis spi

A to o tw dsi ad aasis pstatios o th

od whi kpi otis ikd

Th ao its a o a adad siatio sst whih o-

is as o s with hih optatioa pow, sh as th SoidWokssiatio poa itatd with SoidWoks cAD (a adi 3D paati

at-asd cAD sst).

Stat-o-th-at sotwa itatio aows ss to tha ad stt

aass si th sa aiia SoidWoks ita, ths iiii th

d to a aasis-spi tasks ad s (Fi 21) .

Figure 21:

AnAlySIS SucH AS THermAl AnAlySIS OF A cIrcuIT bOArD IS cOnDucTeD uSIn

THe FAmIlIAr SOlIDWOrKS InTerFAce, mInImIzIng THe neeD FOr uSerS TrAInIn



Dgn pobl cn b olvd soldwok

Th oowi stios pst so aps o dsi pos sod s

th tha ad stta aasis apaiitis o SoidWoks.

Sizing the cooling fins of a heat sink

A iohip adiato st dsid to poid oh ooi to kp thiohip ow 400 K. Th iohip sits o a as pat. bas o th

tha sista a spaati th pat o th st o th ass, t

as pat poids o ii ooi.

ri a tha aasis o th iitia dsi with a ooi- hiht o 2

shows a tpat o 461 K (Fi 22, top). chai th ooi

to 40 hih iass th ooi, t ot oh to t th spiatio

Figure 22:

HeAT SInK WITH THree DeSIgn cOnFIgurATIOnS

th iohip tpat is ow 419 K (Fi 22). A thid itatio with

60 -hih s pos sss, as th iohip tpat is ow 400

K, a apta a (Fi 22).

cotio oits, whih a a ipotat osidatio i this std,

od i ii ttooks o a aatd si wasd a

atos. Atati, a std o fid fow aod th adiato a odt

si SoidWoks Fow Siatio to dti ths as.

Designing a heating element

A hati t osists o a ai pat with a ddd hati

oi. Th -shapd oi dsi show i Fi 23 is pd o its ow osHow, tha aasis pos that it ats a oio tpat

o th otsid o th pat as show i Fi 23.

Figure 23:

A SImPle DeSIgn OF A HeATIng elemenT embeDDeD In An AlumInum PlATe



A dsid hati pat ats th hati t oi a spia as

show i Fi 24. rpati th tha aass o th odid dsi

dostats that th distitio o tpat is ow aost io

(Fi 24).

Figure 24:

A reDeSIgneD HeATIng PlATe IS SHOWn WITH unIFOrm DISTrIbuTIOn OF

TemPerATureS.

Figure 25:

A SPOTlIgHT IS SuPPOrTeD AS SHOWn In THe TOP PIcTure. THe mIDDle PIcTure

PreSenTS STeADy-STATe TemPerATure DISTrIbuTIOn, AnD THe bOTTOm One

SHOWS In reD WHere STreSSeS exceeD THe yIelD STrengTH.

Finding thermal stresses in a spotlight housing

A spotiht (Fi 17) is iid sppotd ao th i as show

i Fi 25. Th hosi dops tha stsss as it aot

pad whi its tpat iass.

Fidi tha stsss is a oiatio o tha ad stta a

ss, wh tpat sts (Fi 25) a potd to a stati aasis

i od to aat tha stsss. Dsi aidatio is dd to ai

whth th tha stsss d th id stth o th ai ho

i. Th stss pot i Fi 25 shows i d thos aas o th hosi wh

stss dos idd d th id stth. Ths stss sts po that

th hosi as dsid wi id.

not that tha stsss dop ot as th tpat o th hos

is oio t as th stait pts th hosi o padi. Aso, ot that ths stsss dop i th as o a stta

oads.


14/17

Finding thermal stresses in a flexible pipe

Sppos that a oatd pip, whi to do, is std to di

tpats at its two ds. This sts i th tpat d show i

Fi 26. Th stio o itst is whth it wi dop a tha st

s d to ths dis.

usi th tpat sts i a stati aasis, th sotwa aats th

p t o oio tpat i th as o a stta oads

sppots. Fi 26 shows i d wh th stss ds th pip atia

id stth.

Figure 26:

Due TO A nOnunIFOrm TemPerATure FIelD, THe PIPe DevelOPS THermAl

STreSSeS exceeDIng THe yIelD STrengTH OF THe PIPe mATerIAl.

Figure 27:

A cOrrugATeD AlumInum PIPe SubjecTeD TO A TenSIle lOAD (TOP) AS Well A

THermAl STreSSeS, DevelOPS cOmbIneD STrucTurAl AnD THermAl STreSSe

(bOTTOm).

I dsid, a stta oad (Fi 27) a appid to th pip to aat

th oid t o tha ad stta stsss.

T H e r m A l A n A l y S I S



Overheating protection of an electronic circuit board

Th pd tpat o a toi iit oad show i Fi 28

is 700c ad shod ot d 1200c. To pt it o ohati, a

oto ts o th pow wh th tpat o th iohip ds

1200c. It ts th pow ak o wh th tpat dops ow 700

How, as o tha itia, th tpat o th iohip a s

d 1200c.

Figure 28:

An elecTrOnIc cIrcuIT bOArD IS PrOTecTeD FrOm OverHeATIng by

A cOnTrOller.

Figure 29:

TemPerATure OF THe mIcrO cHIP FlucTuATeS AS POWer IS cycleD On AnD OFF

becAuSe OF THermAl InerTIA,THe vAlue exceeDS THe mAxImum AllOWeD, 1200

Istiati th a o tpat ftatios ios odti ath

a tasit aasis with th hat pow otod a thostat at

This is siia to th o pot ap i Fi 19. Hai dd th a

ia poptis, otio oits, iitia tpat, ad hat pow, th

aasis is o a piod o 300 sods. Ftatios i iohip tp

t a show i Fi 29.

Th sts o th tasit tha aasis a idiat that th oto

pow t-o tpat st owd ow 1200c to opsat o

th tha itia o th sst. Th dsid stti sod asi od

th t two to th itatios.



Deformation analysis of a composite bearing-housing

A oposit ai-hosi is std to a atd tpat d to

itio i th ais. It is aso std to ai atio oads. Th ha

is to d th doatio o th os wh th ais sit (Fi 3

top), to ak s that th ais wi ot oos th taii pss t. Th

is a oiatio o stad-stat tha ad stati aass. Th ststp is to d th tpat aoss th ai hosi (Fi 30, otto

Figure 30:

beArIng HOuSIng (TOP) IS SubjecTeD TO nOnunIFOrm TemPerATure FIelD Due

TO HeAT generATeD In THe beArIngS (bOTTOm).

Figure 31:

rADIAl DISPlAcemenT cOmPOnenTS OF DeFOrmATIOn OF THe beArIng

HOuSIng eDgeS

basd o ths sts, a stati aasis is pod to aat th do

tio asd th oid t o tha doatios ad stta oFi 31 shows th adia dispat opots o oth os.


17/17

w w w . s o l i d w o r k s . c

daat st sw c.300 ba Ac, mA 01742 usAp: 1 800 693 9000ot t us: +1 978 371 5011ea: f@.

C o n c l o n

yo shod aa athi that s o tiit o tha poa

aoid pottia daos ohati.

Tha aasis dsi aidatio sotwa sd i th podt-dsi po

st a to od hat fow odtio, otio, ad adiatio.

st aso od th t o a tha sista a, ti-dpdt th

ts sh as hati o ooi, tpat-dpdt atia popti

hat pow, otio oits, ad oth oda oditios.

Si w podts a isa dsid i cAD, a aidatio sotwa

sd as a dsi too st a at-asd, paati, assoiati

soid-od that a at a ot ad o tw dsi ad

aasis pstatios o th od whi kpi otis ikd.

SoidWoks Siatio os a th ao its i a adad si

tio sst whih ois as o s with hih optatioa pow.

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024210 SIM ThermalAnalysis WP ENG

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