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05 Diffusion

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    Atomic Difusion

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    A thought experiment

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    Typo on HW 05

    ______ 23. The process described in question 22is known as:

    A. Grain growth B. Carburizing C. Sintering . i!!usion bonding

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    Beore heating

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    Ater short time inurnace

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    Ater additional time inurnace

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    Ater very long time inurnace

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    Difusion:

    Difusionis the movement ofatoms within a material

    usually to reduce aconcentration gradient, or inresponse to an applied force

    or voltage

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    el difusion: atoms move aboutwithin a material, exchanging latticesites

    Alloy difusion: in an alloy, atomsof the various components willdiuse until a homogeneous

    distribution is achieved

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    What is difusion!

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    The important role o difusion: Eliminate concentration dierences

    Heat treat metals

    Manufacture ceramics, transistors andsolar cells

    Electrical conductivity in ceramics

    Alter surface chemistry

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    "ossi#le $echanisms oDifusion

    acancy

    !nterstitial

    !nterstitialcy "ing

    #ote: acancy and interstitial aremost important$

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    Difusion mechanisms

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    Difusion mechanisms%contd&'

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    (irst )a* o tudent"erormance:

    %uccess & Ability x Motivatio

    where %uccess is graduation'

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    (ic+s (irst )a* o Atomic

    Difusion:

    (ic)s (irst *aw+rate of atommovement

    & -. /dc0dx1

    & 2ux /rate of net 2ow across aninterface1

    . & diusion coe3cientdc0dx & concentration gradient

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    Difusion ,oe-cient:. & .

    oe-40"5

    .o& diusion constant

    4 & activation energy

    " & gas constant

    5 & absolute temp

    . has strong temperature dependence'

    T D

    500C 10-14

    600C 10-13

    1000C 10-9

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    The .ole o Temperature:

    5he higher the temperature, thegreater the rate of atomic diusion

    .iusion becomes signi6cant whenthe temperature reaches orexceeds 7$8 times the meltingpoint /on an absolute temperaturescale'1

    5 9 7$8 5mp/o1

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    Activation /nergy 1:

    4 is lower for:

    *ow M;

    Metals /vs$ ceramics1 %maller atoms

    More open structures

    !nterstitial vs$ vacancy

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    Activation /nergy

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    Difusion ,oe-cients

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    Types o Difusion:

    rain boundary diusion

    ?$ olume diusion

    Examples: Values of Q

    Th in W Ag in Ag

    Surface 66,400 8900

    Grain Boundary 90,000 22,750

    Volume 120,000 45,700

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    /fect o time 2 (ic+s

    econd )a*:(or the same result:

    .

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    Applications o Difusion

    arburiBing a gear High arbon & wear resistant

    *ow arbon & fracture resistant

    >rain growth

    %intering of ;0M or ceramic Csed to fuse together particles

    .iusion bondingoins material w0o welding

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    ,ar#uri3ing

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    ,ar#uri3ing

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    4rain 4ro*th

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    intering

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    Difusion Bonding


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