■ Superior electrical performance – very low signal attenuation upto 1.9 GHz for 0.50mm pitch or 3.5 GHz for 0.65mm pitch
■ Advanced’s field-proven screw-machined terminals withmulti-finger contacts, arranged in an interstitial male/female pinpattern are gold plated for gold/gold interconnect
■ Small overall size – only 2.00mm larger than device
■ Same footprint as device
■ No external hold-downs required
■ Standard eutectic Tin/Lead or lead-freeTin/Silver/Copper solder ball terminalsfor RoHS Compliant applications
■ Unique alignment pins protect pin fieldand aid in hand placement with optionalstand-offs available
■ Sockets and Adapters are provided with protective coverswhich facilitate automated pick & place
■ Available in any 0.50mm or 0.65mm pitch footprint
DEVICE
ADAPTER
SOCKET
�Adapter matches footprint of BGA/LGAdevice and plugs into mating socketusing unique male/female terminals in aninterstitial pattern (patented).
�Socket matches footprint of BGA/LGAdevice. Use alignment pins to alignDevice/Adapter assembly duringinsertion into board-mounted Socket.
�Reflow solderdevice toAdapter.
�Reflow solderSocket toPC Board.
Image shown isonly partially matedto show pin field.
Small enough for devicevalidation on production-levelboards. Shown here in cellphone application.
tvc
ermec2
tvc
ermec5
Footprint Dash #If Applicable*
X F M S XXX - 833 G - X X
Packaging Option
Terminal/Contact Plating
Alignment Pin Option CodeBody Type
RoHS Compliant Insulator:
F - FR-4
Number of Positions
No code - Std. alignment pins
1 - Alignment pins & stand-offs
2 - Dual alignment pins
RoHS Compliant:
G - Gold
T - Tape & Reel
PitchM = .0197/(0.50mm)
L = .0256/(0.65mm)
Model Type
A - Adapter (device side)
S - Socket (board side)
*See footprints online or submit device mechanical specs.
Note: If no packaging code is indicated, parts are supplied in standard trays.
Both sockets and adapters are supplied with protective covers.
Extraction Tool is available separately; order P/N 8794.
Terminal TypeSee terminal options
0.50mm and 0.65mm Pitch
BGA Socket Adapter System
5 Energy Way, West Warwick, Rhode Island 02893 USATel: 800.424.9850 | 401.823.5200 | Fax: 401.823.8723E-mail: [email protected] | Web: www.advanced.com
www.advanced.com
Specifications subject to change without notice. Products shown covered by U.S. Pat. 7,179,108. Additional U.S. and international patents pending. Dim. shown: inch/(mm) Item BGA050-TECH07 (Rev. 3/07)
Performance
Code 2Dual alignment pins(4 on top; 3 onbottom with stand-off in A1)
STANDARD & SMT ADAPTERS TERMINAL OPTIONS
Adapter (A)with Standard Terminals
Mates with Socket (S) for:
■ BGA device socketing
Table of Models
FMA
FMS
Socket (S)with SMT Terminals
Mates w/either Adapter for:
■ BGA/LGA socketing
■ Board to board connector
Type -834Gold plated pad
Type -833Sn/Ag/Cu Solder Ball
Type -832Sn/Pb Solder Ball
How To Order
Body SizeDevice + 0.079/(2.00mm)
Mated Height0.214/(5.44mm)* approx. (*will vary based onreflow profile, paste volume and PC board pad size)
Code 1Four alignment pins(top) with fourstand-offs (bottom).
No CodeAlignment pin ineach corner.
Superior Electrical PerformanceEven with adjacent aggressor excitation,our socket system provides a DifferentialData path of +/- 175mV @ 100psec and aSingle-ended Data path of +/- 125mV @140psec.
Patented hybrid design ensures thatadjacent terminal electromagnetic couplingis trivial; greatly reducing NeXT & FeXT,while creating a pseudo-matchedimpedance environment; stabilizing theInsertion & Return Loss response rates.
Differential DifferentialInsertion Loss Return Loss
