1

TEC pilot run status

Goal : test TEC module production rate capabilities

- 15 R6 modules assembled on Brussels Gantry and bonded in Aachen I- 15 R7 modules assembled on Lyon Gantry and bonded in Strasbourg

Detailed presentation given at the Gantry and TEC meetingsBy O. Bouhali, J.M. Brom, R. Haroutunian, T. Franke

CMS Tracker week 2410/03

D. Contardo

2

Assembly of R6 modules at Brussels Gantry :

- 2 real modules (04/09/03): Status valid, presently on DB- 2 dummy modules just before the pilot run: valid - 11 modules between 6/10 and 9/10 (4days): TEC pilot run ended due to a HD crash! 2 positions on 2 plates used 1 plate with leak under sensors (change of kapton thickness)

Pilot run for R6 modules

Monday 2 Plate 61

Tuesday 4 61+62 (leak in pos. 2)

Wednesday 3 61 (2 mod), 62(1 mod)

Thursday 2 61

3

Distribution of all plate 61 modules:

Sensor 1

Sensor 2

Measured-Nominal (m)

All positions are good

4

Measured angles (mdeg)

Sensor 1

Sensor 2

Summary of qualification for 13 glued modules :3 modules glued on plate with leaks out of specifications (plates will be modified)10 modules within specifications

5

• Modules shipped to Aachen I on 15th of October• powerbonds and first module fully bonded on 16th of October after

necessary reprogramming of the bonding machine due to missing fiducials on the pitch adapter

• 17th of October: next 3 modules fully bonded• 20th of October: last 6 modules fully bonded• Pitch adapter bonding: no problems• Sensor–sensor bonding: failures (lift-offs) on source bonds (~1% )

preferentially at the end of the bond row (~ strip number 400)

Bonding and test of R6 modules at Aachen I and III

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IV Curves

• From database

(300V & 450 V)

With powerbond only

Fully bonded

IV Curves 30200020015005

0

1

2

3

4

5

6

7

8

0 50 100 150 200 250 300 350 400 450

Voltage (Volt)

Cu

rre

nt

(mik

roA

mp

)

Sensor Measurements

only Power Bond

ready bonded

IV Curves 30200020015003

0

1

2

3

4

5

6

7

8

0 50 100 150 200 250 300 350 400 450

Voltage (Volt)C

urr

en

t (m

ikro

Am

p)

Sensor Measurements

only Power Bond

ready bonded

IV Curves 30200020015002

0

1

2

3

4

5

6

7

8

0 50 100 150 200 250 300 350 400 450

Voltage (Volt)

Cu

rre

nt

(mik

roA

mp

)

Sensor Measurements

only Power Bond

ready bonded

IV Curves 30200020015006

0

1

2

3

4

5

6

7

8

0 50 100 150 200 250 300 350 400 450

Voltage (Volt)

Cu

rre

nt

(mik

roA

mp

)

Sensor Measurements

only Power Bond

ready bondedIV Curves 30200020015008

0

1

2

3

4

5

6

7

8

0 50 100 150 200 250 300 350 400 450

Voltage (Volt)

Cu

rre

nt

(mik

roA

mp

)

Sensor Measurements

only Power Bond

ready bonded

7

IV Curves II

IV Curves 30200020015014

0

1

2

3

4

5

6

7

8

0 50 100 150 200 250 300 350 400 450

Voltage (Volt)

Cu

rre

nt

(mik

roA

mp

)

Sensor Measurements

only Power Bond

ready bonded

IV Curves 30200020015016

0

1

2

3

4

5

6

7

8

0 50 100 150 200 250 300 350 400 450

Voltage (Volt)

Cu

rre

nt

(mik

roA

mp

)

Sensor Measurements

only Power Bond

ready bonded

IV Curves 30200020015010

0

1

2

3

4

5

6

7

8

0 50 100 150 200 250 300 350 400 450

Voltage (Volt)

Cu

rre

nt

(mik

roA

mp

)

Sensor Measurements

only Power Bond

ready bonded

IV Curves 30200020015012

0

1

2

3

4

5

6

7

8

0 50 100 150 200 250 300 350 400 450

Voltage (Volt)

Cu

rre

nt

(mik

roA

mp

)

Sensor Measurements

only Power Bond

ready bonded

IV Curves 30200020015009

0

1

2

3

4

5

6

7

8

0 50 100 150 200 250 300 350 400 450

Voltage (Volt)

Cu

rre

nt

(mik

roA

mp

)

Sensor Measurements

only Power Bond

ready bonded

• From database

(300V & 450 V)

With Power Bond only

Fully bonded

8

Summary Table

• Almost no bonding faults (candidates for only 2 opens and 3 channels shorted)

• No additional pinholes with respect to sensor tests

• Typical duration of a full module test including the preparation of the module in the testbox is about 25 minutes

All 8 modules of grade A quality

Sensor 1 Sensor 2-

-

111 ISTRIP no -367 ISTRIP no -

108 CAC no253 CAC yes likely pinhole457 CAC no

1 noisy strip172 ISTRIP no -484 ISTRIP no -

336 IDIEL yes likely pinhole511 IDIEL yes likely pinhole512 IDIEL yes likely pinhole

2 opens20 CAC no -

110 ISTRIP no -268 CAC & IDIEL yes likely pinhole269 CAC & IDIEL yes likely pinhole270 CAC & IDIEL yes likely pinhole

173 IDIEL yes likely pinhole435 IDIEL no -

four strips68 CAC no -

447 IDIEL no -491 CAC & IDIEL no -

3 channels shorted

1 IDIEL yes likely pinhole35 CAC & IDIEL yes likely pinhole

281 IDIEL yes likely pinhole356 ISTRIP490 CAC & IDIEL yes likely pinhole507 CAC

Marked as bad Stripin Sensortests

02

03

09

05

06

08

Strip Number

Module 302000200150...

12

14

16

10

detected by ARCS 6.2.1

ARCS 6.2.1Error description

additionally marked byARCS 6.2.1

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Cooling Test of 1 R6 module

black curves room T before cooling blue curves -20°red curves room T after thermal cycle5 more modules in the cold box in Aachen with similar fine behaviour

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Pilot run for R7 modules

Assembly of R7 at the Lyon Gantry :

pre-pilot run : one plate of 3 R7 modules

pilot run : - 1 plate per day using the 3 R7 modules - 5 consecutive days for production (one R7 plate available at that time) only one noticable problem : an hybrid can’t be picked by vacuum with the bridge (still 3 modules where glued uring the process)

Summary :

All 18 modules are wihin the specifications

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XY precision for sensors

Position of sensor markers for the 18 modules compared to their expected positionRed boxes have 10µm side and centered on the expected positions.

XY precision for sensors

Overall shifts for sensor markers wrt exp. Position in µm

X

Y

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Reference axis = frame pins axis a) Initial angle of sensor (m1-m2) on supply plate with reference axis, b) Final angle of sensor (m1-m2) on assembly plate with reference axisc) Angle between sensor : 14 over 15 modules have Dteta < 5m°

Sensors angular positionning precision

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With 1 operator : 1h30’Preparation : 30’- Check sensors and hybrids from DB, Arc test hybrids- Clean frames, Glue 1D label and register module composition in the DB- Put sensors frames and hybrids on plates- prepare glue Gantry assembly : 30’- start assembly prog, glue test by eyes, all other gluiing steps Post-assembly : 30’- position monitoring after curing - update de la DB- mounting modules on support plates- bias glue put by hand- put modules in transport box and initiate DB transfer.

With 2 operators : 3 types of operation in parallels : 45’

Gantry assembly time per plate

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Reception of 15 modules

30200020000278

30200020000279

30200020000280

30200020000281

30200020000282

30200020000283

30200020000284

30200020000285

30200020000286

30200020000287

30200020000288

30200020000289

30200020000290

30200020000291

30200020000292

Searching on Data Base :

data of Si sensors - I V curves

- bad strips

Bonding of R7 modules at Strasbourg

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Bonding

6 modules are bonded

1. ARC tests (5' for fast test only, 10' for all tests) : 5’

2. Bonding of the bias rings for the ARC tests and the IV 15’

curves and bonding of the 11 bonds form Si to Si and 11 bonds from PA to Si. Results : (will be done in the Data Base)

7.0 +/- 0.7 g on Pa – Si 7.0 +/- 0.4 g on Si – Si3. ARC test and IV 5’4. Bonding of the entire Module. 40’ Immediate repair of the obvious unbonded channels. Number of repairs : Si - Si : 12 bonds / 3072 bonds

PA - Si : 15 bonds / 3072 bonds5. ARC test including LED illumination. 30’

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I V curves with temperature compensation

30200020000283

Red and blue sensor currents (nA)pink sum of the 2 sensors currents (nA)black our measurements

30200020000288

Summary :

- Bonding and test time per module 1h30 (test procedure can be reduced)

- All bonded modules are good

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Conclusions from the TEC pilot run

From the Gantry centers :- Few problems related to first experience of production run (R6 plates to be adjusted to final kapton in Brussels)- the full time per plate assembly was measured to be about 1h30, - possibility to do in parallel the preparation tasks and the Gantry gluing when dealing with 2 plates and with 2 operators (reducing the prodution time to less than 1h).A stable production of 4 plates per day to fulfill nominal needs for a 1 year production should be reached in the coming months. There is clear room for yield improvement to 5 plates if 2 operators are working in parallel.

From the Bonding centers :- The bonding time including all qualification steps was found to be 1h30A nominal rate of 6 modules bonded per day was reached in Aachen and Strasbourg. There are ways for rate improvements (depending on failures, plus reduction of the number of tests in the process). The present tests of the 16 first bonded modules : ARC read-out and IV curves showed that the modules are of high grade quality.First 6 modules tested down to -25° with perfect pedestals, noise, pulse shape and no additional dead channels.

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Readiness and next months plan for mass production

Tools preparation status :- Frame assembly jigs are all ready - Bonding jigs are all ready apart for R1, Hambourg will receive R1 prototypes next week to prepare the jigs - Gantry all plates are there, R1, R2, R4, R7 and R6 plates are commissionned

Plan for next months : - Finish commissioning of plate R3 and R5 at the Brussels Gantry, study commissioning of some existing plates on the second gantry for production back-up. - Commission new design with rigidifiers (successfully tested in Aachen) simple grooves milled in the plates at the rigidifier position plus test of procedure on the gantry gluing dummy and real modules. (still production can start for different geometries with gluing of rigidifiers by hand)- Built new modules to complete the TEC system test (8R1, 8R2, 7R3, 4R4, 8R5) (one TEC read-out loop is 2 to 3 petals)

Needs hybrids with pitch (before final version) : 6 x R1N(6D), R1S(6U), R2N(6D), R2S(6U), R4(4U), R5N(6D), R5S(6U) 10 x R6(4U), R7(4U)

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Ring 7