13/09/2006Ron Settles MPI-Munich/DESY 9th WP phonemeeting 13 September 2006 1 LCTPC/LPWP-9th...

13/09/2006 Ron Settles MPI-Munich/DESY 9th WP phonemeeting 13 September 2006

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LCTPC/LPWP-9th phonemeeting

– Date 13 September 2006 – Time

• 7:00 west coast• 10:00 east coast• 16:00 central Europe • 23:00 Japan

– To join, Phone +494089981390 code 52872#


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Agenda for 9th WP phonemeeting(in future the meetings will be managed via http://ilcagenda.cern.ch/)

AGENDA -1.News

Formation of the LCTPC/LP CollaborationWWS-R&D-panel tracking review at Beijing

-2.WP meetingStatus of Paris meeting (Ron,Takeshi,Leif,Jean-

Pierre,Ivor,Akira,Paul,Vincent)WP meeting, other contributions (whoever is

ready) -3.Future meetings -Eudetmeeting at MPI 18-20 October -Valencia European WS 6-10 November -Beijing Asian WS February 3-7 February


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AGENDA -1a.Formation of the LCTPC/LP collaboration

On the next foil are the groups who have replied with the name of their CB representative up to now: marked by

A phonemeeting will be held next week between SP, CB and TB to talk about the organizational structure (and reported to the groups)


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LCTPC/LP Groups (27 August 06)

AmericasCarleton Montreal VictoriaCornellIndianaLBNLMIT

PurdueYale

EuropeEuropeLAL OrsayLAL Orsay IPN OrsayIPN Orsay CEA SaclayCEA Saclay

AachenAachenBonnBonnDESYDESY

UHamburgUHamburgFreiburgFreiburgKarlsruheKarlsruhe

MPI-MunichMPI-MunichRostockRostockSiegenSiegenNIKHEFNIKHEF

UMM KrakowUMM KrakowBucharestBucharest

NovosibirskNovosibirskPNPI PNPI

StPetersburgStPetersburg LundLundCERNCERN

AsiaAsiaTsinghuaTsinghua

CDC:CDC:HiroshimaHiroshima

KEKKEKKinki UKinki USagaSaga

KogakuinKogakuinTokyo UA&TTokyo UA&T

U TokyoU TokyoU TsukubaU Tsukuba

Minadano SU-IITMinadano SU-IIT

…Other groups interested?


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Formation of the LCTPC/LP collaborationThe proposal is to have:1)Three coordinators, one chosen by each region. These spokespersons (SP)coordinate the work of the following two boards:

2)The collaboration board (CB), consisting of one representative from eachgroup or set of groups (the group leader, principle investigator or otherchosen member). Each CB member looks after the resources for its group(s)(money and people).

3)The technical board (TB), consisting of the existing workpackage (WP)conveners. The TB will ensure the technical integrity of their WP andcompatibility with other WPs while maintaining close contact with thecollaboration.

This structure now exists. 1) We are three interim coordinators and areto be replaced by chosen ones in the course of this formation phase.2) The CB is (almost) complete. 3) The workpackages and WP convenerswere identified during the first half of this year. The names of CB andTB members are listed in the next slide.


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The CB members are:==================--Americas-Carleton: Madhu DixitMontreal: Jean-Pierre MartinVictoria: Dean KarlenCornell: Dan PetersonIndiana: Rick Van KootenLBNL: Mike Ronan

--Asia-Tsinghua: Yuanning Gao

For the following CDC groups: Akira SugiyamaHiroshima

KEKKinkiSaga

KogakuinTokyo U A&T

U TokyoTsukuba

Mindanao


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--Europe-Eudet contact: Joachim MnichLAL Orsay/IPN Orsay: Vincent LepeltierCEA Sacly: Paul ColasAachen: Stefan RothBonn: Klaus DeschDesy/UHamburg: Ties BehnkeEudet: Joachim MnichFreiburg: Andreas BambergerMPI-Munich: Ariane FreyRostock: Henning SchroederSiegen: Ivor FleckNikhef: Jan TimmermansNovosibirsk: Alexei BuzulutskovSt.Peterburg: Anatoliy KrivchitchLund: Leif JonssonCERN: Michael Hauschild (deputy: Lucie Linsen)

--Groups with Observer status-TU Munich: Bernhard Ketzer

Purdue: Ian Shipsey

--Replies still missing from:MITYale

KarlsruheKrakow

Bucharest


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The TB members are:==================1) Workpackage Mechanics Ron Settles a) LP design (incl. endplate structure) Dan Peterson b) Fieldcage, laser Ties Behnke c) GEM panels for endplate Akira Sugiyama d) Micromegas panels for endplate Paul Colas e) Pixel panels for endplate Jan Timmermans f) Resistive foil for endplate Madhu Dixit2) Workpackage Electronics Leif Jonsson a)"Standard" RO/DAQ sytem for LP Leif Jonsson+Postdoc b) CMOS RO electronics Harry van der Graaf c) Electronics for LCTPC Luciano Musa3) Workpackage Software Peter Wienemann a) LP SW, simul./reconstr.framework Peter Wienemann b) TPC simulation, backgrounds Stefan Roth c) Full detector simulation Keisuke Fujii4) Workpackage Calibration Dean Karlen a) Field map Lucie Linssen b) Alignment Takeshi Matsuda c) Distortion correction Dean Karlen d) Radiation hardness of materials Anatoliy Krivchitch e) LP Gas/HV Eudet Postdoc


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AGENDA -1b.Tracking review at Beijing:

………no news………


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AGENDA -2a.Paris meeting: status Talks at http://www-dapnia.cea.fr/Spp/Meetings/EndPlate/

1 sentence summaries/main questions up to now…

-Ron (Overview)-Takeshi (PCMAG)-Leif (Elelctronics)-Jean-Pierre (Digital electronics)-Ivor (Fieldcage, German-Gem discussion)-Akira (Gem endplate)-Paul (Micromegas endplate)-Vincent (positive ions)

http://www-dapnia.cea.fr/Spp/Meetings/EndPlate/




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AGENDA

-3.Future meetingsThere are (in addition to bi-weekly phonemeetings):-Paris Endcap meeting organized by Paul/Akira (12-14

September 2006) http://www-dapnia.cea.fr/Spp/Meetings/EndPlate/

-Eudet annual meeting MPI-Munich (18-20 October 2006) withwebsite:

http://www.eudet.org/AnnualMeeting2006/AnnualMeeting2006.html-European LC workshop Valencia (6-10 November 2006), see

http://ific.uv.es/~ilc/ECFA-GDE2006/-Asian LC workshop Beijing (4-7 February 2007)

Website:http://bilcw07.ihep.ac.cn/


http://www.eudet.org/AnnualMeeting2006/AnnualMeeting2006.html

http://ific.uv.es/~ilc/ECFA-GDE2006/

http://bilcw07.ihep.ac.cn/


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AGENDA -4.AOB


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Back up slides,

for reference

Back up slides,

for reference


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Akira Sugiyama – GLD DOD


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RS study - LDC DOD - together with

Joel PouthasPhilippe Rosier

(IPN Orsay)


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Aleph Endplate


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Some features• Zigzag structure prevented loss of tracks > θ~22°• Sectors mounted from inside using a “handling tool” to minimize the dead space between sectors. This straight-forward operation which was performed at least 30 times during the lifetime of Aleph. • Alu sandwich structure stiff, lightweight to

- contain 7mb overpressure- provide forced-air thermal insulation between electronics and TPC volume

• Water cooling of 1kW electronics/side in addition- 22K channels per side

• Combination water/air cooling blocked all heat to TPC• Overall thickness ~ 25%Xo (average) w/o cables• Bending of endplate

- 20 micrometers due to 7mb overpressure- 5 micrometers due to wire tension


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R&D Planning• 1) Demonstration phase

– Continue work with small prototypes on mapping out parameter space, understanding resolution, etc, to prove feasibility of an MPGD TPC. For CMOS/Si-based ideas this will include a basic proof-of-principle.

• 2) Consolidation phase– Build and operate the LP, large prototype, (Ø ≥ 75cm, drift

≥ 100cm), with EUDET infrastructure as pedestal, to test manufacturing techniques for MPGD endplates, fieldcage and electronics. Design is starting---building and testing will take another ~ 3 years.

• 3) Design phase– After phase 2, the decision as to which endplate

technology to use for the LC TPC would be taken and final design started.

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13/09/2006Ron Settles MPI-Munich/DESY 9th WP phonemeeting 13 September 2006 1 LCTPC/LPWP-9th...

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