Time Track 1 Track 2 Track3

1-2 Thermal Management Applications I

2-1 Data Center Cooling 1

8:45- 9:05

IPACK2018-8505: Design of Vapor Chambers with Minimized Thickness

IPACK2018-8370: Characterization of Vertically Split Distribution-Wet Cooling Media Used in Data Centers

9:05-9:25

IPACK2018-8293: Thermal Management of Hybrid Silicon Microring Laser

IPACK2018-8378: A Thermo-mechanical Study on Vertically Split Distribution-Wet Cooling Media Used in Data Centers

9:25-9:45

IPACK2018-8294: Lidded vs. Lidless Package Cooling Assessment

IPACK2018-8436: AIR FLOW PATTERN AND PATH FLOW SIMULATION OF AIRBORNE PARTICULATE CONTAMINANTS IN A HIGH-DENSITY CENTER UTILIZING AIRSIDE ECONOMIZATION

9:45 - 10:15

IPACK2018-8316: Interconnect Design Optimization in Ceramic Quad-Flatpack No-Lead Devices^

IPACK2018-8391: A Review of the State of the Art in Application of Evaporative Cooling Systems to Data Centers

1-1 Fundamentals of Thermal Transport 1

2-7 Advanced Cooling Technology

InterPACK 2018: Technical Program - Tuesday, Augu

10:30 - 10:50

IPACK2018-8426: Phonon Scattering Mechanisms Dictating the Thermal Conductivity of Lead Zirconate Titanate Thin Films Across the Compositional Phase Diagram

IPACK2018-8271: On material modeling and characterization of Thermal Interface Materials under quasi static loading condition

10:50-11:10

IPACK2018-8462: Multiscale and multiphysics computations of thin evaporating films

IPACK2018-8300: Next Gen Test-vehicle to Simulate Thermal Load for IoT FPGA Applications

11:10 -11:30

IPACK2018-8212: Effect of Interfacial Thermal Conductance Between the Nanoparticles

IPACK2018-8421: Investigation on Optimal TIM properties for High Powered Package

11:30-12

IPACK2018-8321: High Resolution, Steady-State Measurements of Interfacial Thermal Resistance

IPACK2018-8246: Mechanisms Governing the Transient Behavior of Vapor Chambers and Performance Relative to Heat Spreading by Conduction

Panel

IPACK2018-8532: Active Thermal Resistance Control for Maximizing Combined Cooling Capability in Mobile Devices

2-2 Data Center Cooling 2

1:30 -1:50

IPACK2018-8253: Weather Analysis Using Neural Networks for Modular Data Centers

1:50-2:10

IPACK2018-8273: An advanced TLS system architecture and design for data center energy efficiency

2:10-2:30

IPACK2018-8305: Improving Energy Efficiency in Data Centers by Controlling Task Distribution and Cooling

2:30-3:00

IPACK2018-8488: CFD Simulation-Based Artificial Neural Network Modeling for Data Center Cooling Prediction

1-7 Fundamentals of Thermal Transport 2 Track 2 Panel

3:15-3:35

IPACK2018-8323: Thermal Conductance at Phase Change Material-Metal Contacts Panel

3:35-3:55

IPACK2018-8204: Thermal Conductance across a-SiO2-a-SiO2 Interfaces

3:55-4:15

IPACK2018-8337: On Thermal Interface Materials With Polydisperse Fillers: Packing Algorithms and Effective Properties

Track 1 Panel

4:15-4:45

Track 4 Track 4

4-1: Wide-Bandgap Electronics

4-5: Power Electronics Packaging - Enhanced Functionality

IPACK2018-8333: Electro-Thermal Characteristics of In Situ Oxide, GaN Interlayer-Based Vertical Trench MOSFETs

IPACK2018-8392: Mechanical Characterization Of Transient Liquid Phase Sintered (TLPS) Cu-Sn

IPACk2018-8256: Analysis of Thermal Properties of Power Multifinger HEMT Devices

IPACK2018-8225: All-Inorganic Multi-Color Converter Based on Eu3+-Doped Phosphor-in-Glass for White Light-Emitting Diodes

IPACK2018-8385: Failure Mechanism Assessment of TO-247 Packaged SiC Power Devices

IPACK2018-8231: Enhanced Light Extraction Efficiency of Deep Ultraviolet LEDs by using Nanolens Arrays

IPACK2018-8440: Improving the Thermal Performance of Etched back GaN-on-Si HEMTs for Power Electronics

IPACK2018-8276: Mechanical Characterization Study of Sintered Silver Pastes Bonded in a Double-Lap Configuration

4-2 :Wide-Bandgap Optoelectronics

4-6: Power Electronics Packaging - Processing

ust 28, 2018

IPACK2018-8205: nterface Anchored Effect on Improving Working Stability of Deep Ultraviolet Light-Emitting Diode Using Graphene Oxide-based Fluoropolymer Encapsulant

IPACK2018-8259: POL-kW - A Wirebond-less Packaging Technology for Power Electronics

IPACK2018-8206: Enhanced the Optical Power of AlGaN-based Deep Ultraviolet Light-Emitting Diode by Optimizing Mesa Sidewall Angle

IPACK2018-8266: Highly Efficient Chip Scale Package LED Based on Surface Patterning

IPACK2018-8222: Electroluminescence from n-ZnO nanowires/GaN QDs/p-GaN heterostructure light-emitting diodes

IPACK2018-8478: Thermal Transport and Thermal Management by Silicon Nanoporous Structures

IPACK2018-8229: High-performance Deep Ultraviolet Light-emitting Diodes with Graphene Oxide Based Fluoropolymer Encapsulant

4-3 Ultra-Wide Bandgap Materials

4-7 Power Electroncis Packaging - Reliability Physics

IPACK2018-8451: Thermal Characterization of Ultra-Wide Bandgap Lateral Power Devices Using 2D Materials

IPACK2018-8262: A critical review on degradation modeling and reliability parameter estimation of capacitors

IPACK2018-8371: Phonon Scattering Effects in the Thermal Conductivity Reduction of Ion Irradiated Diamond

IPACK2018-8275: Interconnect Fatigue Failure Parameter Isolation for Power Device Reliability Prediction

IPACK2018-8315: The influence of N: Al flux ratio on heteroepitaxial AlN: a molecular dynamics simulation

IPACK2018-8491: Microstructural Evolution in SAC Solders Subjected to Isothermal Aging

IPACK2018-8452: The Temperature and Doping Dependences of the Thermal Conductivity of Gallium Nitride

IPACK2018-8394: Comparison of Thermal and Stress Analysis Results for a High Voltage Module Using FEA and a Quick Parametric Analysis Tool

4-4 Ultra-Wide-Bandgap Materials

4-8 Power Electronics Packaging - Reliability Testing

IPACK2018-8317: Thermal Management of Beta-Ga2O3 based Field Effect Transistors (FETs)

IPACK2018-8490: Using Scanning Probe Microscopy to Investigate Aging Induced Microstructural Evolution in Lead Free Solders

IPACK2018-8453: Thermal Management of Ultra-Wide Bandgap Ga2O3 Electronics

IPACK2018-8218: Structural Analysis Of The Integrity Of Power Modules And Assemblies By Thermal Transient Testing

IPACK2018-8326: Thermal Characterization of AlGan/AlN HEMTs for Power Electronics

IPACK2018-8396: Investigation of the Effects of High Temperature Aging on the Mechanical Behavior of Lead Free Solders

IPACK2018-8352: Self-Heating in Ultra-Wide Bandgap AlGaN Channel High Electron Mobility Transistors

IPACK2018-8353: Reliability Characterization of a Packaging Design based on Transient Liquid Phase Bonding

10

Time Track 1 Track 2 Track3

2-6 Reliability in Cooling Systems

3-4 Application and System-Level Challenges

8:45- 9:05

IPACK2018-8254: Fundamental Study of Polymer to Metal Bonding in Integrated Circuit Packaging

IPACK2018-8401: Point-of-Care Nano Biochip for Multiplex Tumor Marker Detection for Enhanced Cancer Care

9:05-9:25

IPACK2018-8334: Experimental Analysis of Chiller Cooling Failure in a Small Size Data Center Environment Using Wireless Instrumentation - Mohammad Tradat Invited Speaker TBD

9:25-9:45

IPACK2018-8338: Experimental and Numerical Investigation of Underfill Materials on Thermal Cycle Fatigue of Second Level Solder Interconnects - Maxim Serebreni Invited Speaker TBD

9:45 - 10:15

IPACK2018-8393: Innovative Test Approach for High End Semiconductor Package Testing of IoT Devices - Mohsen Mardi

IPACK2018-8518: Structural Health Monitoring Systems - A Pathway to Industrial IoT (30 min)

1-3 Thermal Management Applications II Panel

10:30 - 10:50

IPACK2018-8301: Reduced Working Temperature of Quantum Dots-light-emitting Diodes Optimized by QDs@silica-on-chip Structure T

InterPack 2018: Technical Program - Wednesday, Aug

10:50-11:10

IPACK2018-8339: Thermal Switching of Liquid to Vapor Phase Change

11:10 -11:30

IPACk2018-8402: Experimental Validation of Inverse Methods Applied to Microelectronics

11:30-12

IPACK2018-8295: Thermal Characterization of Si Photonic Ring Modulator

1-5 Microfabrication 2-3 Server Cooling I

1:30 -1:50

IPACK2018-8215: Low Temperature Cu-Cu Bonding Using Oxalic Acid Surface-Modified Cu Nanoparticles

IPACK2018-8287: Thermal Challenges in Servers

1:50-2:10

IPACK2018-8226: Low Temperature Fabriction of Three Dimensional Ceramic Substrate by Using Inorganic Alkali Activated Aluminosilicate Cement Paste for UV-LED Packaging

IPACK2018-8432: Measurement of the Therma Performance of a Single-Phase Immersion Cooled Server At Elevated Temperatures for Prolonged Time

2:10-2:30

IPACK2018-8346: Substrate Thermal Conductivity Controls Ability to Manufacture Microstructures via Laser-Induced Direct Write

IPACK2018-8443: Facility Cooling Failure Analysis of Direct Liquid Cooling System in Data Centers

rack 3 Panel

2:30-3:00

IPACK2018-8270: Packaging of a Two-Sided Single Axis Silicon MEMS Accelerometer

IPACK2018-8434: Identification, Characterization and Implications of Particulate Contaminants found at a Data Center Utilizing an Airside Economizer

2-5 Two-Phase Flow

3-1 Design, Materials and Characterization

3:15-3:35

IPACK2018-8247: High-Frequency Thermal-Fluidic Characterization of Dynamic Microchannel Flow Boiling Instabilities

IPACK2018-8299Effect of non-uniform velocity on thermal performance of micro pin heat sink

3:35-3:55

IPACK2018-8248: Visualization of Two-Phase Flow Morphology and Wall Temperature in High-Aspect Ratio Manifold Microchannels

IPACK2018-8350Thermal Characterization of Si BEOL Microelectronic Structures

3:55-4:15

IPACK2018-8249: The Effect of Lateral Thermal Coupling Between Parallel Microchannels on Two-Phase Flow Distribution

IPACK2018-8365An Exposition on Data Scaling, Bounds Selection and Search Algorithms for Fitting Constitutive Model Parameters of Solder Alloys

4:15-4:45

IPACK2018-8250: Liquid-Vapor Interface Reconstruction from High-Speed Stereo Images During Pool Boiling

IPACK2018-8219Design and Calibration of Resistive Stress Sensors on RH Silicon Carbide (30 minutes)

Track 4 Track 4 Track 54-9 Power Electronics Packaging - Functional Materials

4-11 Power Electronics Thermal Management - Embedded Cooling

IPACK2018-8230: High External Quantum Efficiency of Flip-chip UV-LED Via Silicone-intermediate Hemispherical Quartz Lens

IPACK2018-8447: Heat transfer characteristics and flow pattern visualization for flow boiling in a vertical narrow microchannel

IPACK2018-8313: Investigation of the Role of Surface Nanocoating on Two-phase Evaporative Heat and Mass Transfer Using Molecular Dynamic Simulation

IPACK2018-8383: Orientation Effects in Two-Phase Microgap Flow

IPACK2018-8236: Performance Enhancement of PCM-based Heat Sinks Using Gradient Porous Thermal Conductivity Enhancer for Electronics Cooling

IPACK2018-8468: Practical Concerns for Adoption of Microjet Cooling

IPACK2018-8504: Transient Thermal Mitigation Using Package Integrated Phase Change Materials

IPACK2018-8228: Structural and Thermal Study of Self Regulating Flow Control Device for Dynamic Cooling of Electronic Cooling

4-10 Power Electronics Packaging - Thermal Interface Materials

5-4 PHM for Automotive Systems

IPACK2018-8279: Numerical Approach Of Cold Gas Spray Of Ceramic Substrates For Power Electronics

IPACK2018-8356: Assessment of Damage Progression in Automotive Electronics Assemblies Subjected to Temperature and Vibration

gust 29, 2018

IPACK2018-8307: Thermal Interface Materials Enhanced by Micro and Nanostructures

IPACK2018-8368: Thermal Model Based Fault Detection and isolation of Power Inverter IGBT Module

IPACK2018-8324: Low Temperature Transient Liquid Phase Bonding of AlN to CuW and CuMo

IPACK2018-8386: Feasibility of PCB-Integrated Vibration Sensors for Condition Monitoring of Electronics Systems

IPACK2018-8328: An interfacial chemistry study of the influence of titantium adhesion layer oxygen stoichiometry on thermal boundary conductance at gold contacts

IPACK2018-8508: AI and ML for Autonomous Driving

4-12 Power Electronics Thermal Management - Two-Phase Heat Transfer

5-6 Sensors and Components for Harsh Temperature and Harsh Environment

IPACK2018-8309: Experimental Investigation of Microdroplet Evaporation on a Porous Micropillar Structure

IPACK2018-8335: Investigation of Moisture Transport through Housing Materials Used in Automotive Electronics

IPACK2018-8311: Numerical Investigation of Shape Effect on Microdroplet Evaporation

IPACK2018-8382: Packaging of an Optical Dynamic Pressure Sensor for Operation in High Temperatures

IPACK2018-8366: Nanoporous Metals from Block Copolymer Templates for Enhanced Surface Area Boiling

IPACK2018-8214: In-plane Pre-stress Analysis for Automotive Airbag Electronic Control Unit’s Printed Circuit Board Transverse Vibration

IPACK2018-8449: COMPARISON OF EVAPORATION AND CONDENSATION CHARACTERISTICS AMONG THREE ENHANCED TUBES

IPACK2018-8506: Emerging Packaging Technology Challenges for Self Driving Vehicles

4-13 Power Electronics Thermal Management - Heat Exchangers and Heat Pipes

Joint Track 4 and 5 Panel on Vehicular (Power) Electronics

IPACK2018-8448: THERMAL-HYDRAULIC PERFORMANCE AND OPTIMIZATION OF TUBE ELLIPTICITY IN A PLATE FIN-AND-TUBE HEAT EXCHANGER

IPACK2018-8456: Evaporative Wicking Phenomena on Nanotextured Surfaces for Heat Pipe Applications

IPACK2018-8480: Biphilic Jumping-Droplet Condensation

IPACK2018-8454: EXPERIMENTAL STUDY ON FLOW EVAPORATION HEAT TRANSFER CHARACTERISTICS INSIDE HORIZONTAL THREE-DIMENSIONAL ENHANCED TUBES

Time Track 1 Track 2 Track3

2-4 Server Cooling 23-3 Mechanical Reliability I

8:45- 9:05

IPACK2018-8255: Rack-Level Study of Hybrid Cooled Servers Using Warm Water Cooling With Variable Pumping for Cetralized Coolant System

IPACK2018-8325: The Effect of Substract Cracking on the Mechanical Reliability of Barrier Films for Flexible Electronics

9:05-9:25

IPACK2018-8288: Mutli-Die Water-Cooled Heat Sinks with Concentrated Channels

IPACK2018-8263: Fatigue Strength of Lead Free Solder Material Under Various Wave Forms

9:25-9:45

IPACK2018-8422: Impact of Internal Design on the Efficiency of IT Equipment in a Hot Aisle Containment System - An Experimental Study

IPACK2018-8403: Evolution of the Mechanical Properties and Microstructure of SAC305 Lead Solder Joints Subjected to Mechanical Cycling

9:45 - 10:15

IPACK2018-8471: Evaporatively Cooled Condenser in Data Center

IPACK2018-8398: Improved Approaches for FEA Analyses of PBGA Packages Subjected To Thermal Cycling

1-6 Design and Characterization

3-5 Mechanical Reliability II

InerPACK 2018 - Technical Program - Thur

10:30 - 10:50

IPACK2018-8243: Full Chip-Scale Numerical Simulation on Heterogenous Integrated Fan-Out Wafer Level Packaging (nFO-WLP)

IPACK2018-8405: The Effects of Curing Profile, Temperature, and Aging on the Mechanical Behavior of Solder Mask Materials

10:50-11:10

IPACK2018-8272: Evaluation of X-Ray Phase Contrast Imaging for Non-Destructive Testing (NDT) of Plastic Electronic Packages

IPACK2018-8408: Nanoindentation Measurements of the Mechanical Properties of Individual Phases within Lead Free Solder Joints Subjected to Isothermal Aging

11:10 -11:30

IPACK2018-8345: Creep Response of Assemblies Bonded with Pressure Sensitive Adhesives (PSA)

IPACK2018-8410: The Effects of Temperature, Strain Rate, and Againg on the Poisson's Ratio of SAC Lead Free Solders

11:30-12

IPACK2018-8380: Elastic Properties of Few-grained SAC Solder Joints Based on Anisotropic Multi-Scale Predictive Models

IPACK2018-8414: Microstructural Evolution in SAC305 and SAC-BI Solders Subjected to Mechanical Cycling

1-4 Microsystems Packaging Reliability Tutorial

1:30 -1:50

IPACK2018-8367: An Emerging Industry-Scale Ecosystem Based on Package Level Integration

Relia

1:50-2:10

IPACK2018-8257: Quantification of Underfill Influence to Chip Packaging Interactions of WLCSP

2:10-2:30

IPACK2018-8211: Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for COB-LEDs Packaging

2:30-3:00

IPACK2018-8344: Complete Mitigation of Tin Whisker Growth from Electroplated Tin Coatings in Electronic Packages

3:15-3:35

3:35-3:55

bility Tutorial

3:55-4:15

4:15-4:45

Track 4 Track 4 Track 5

4-14 Power Electronics Thermal Management - System Level 5-2 Packaging Materials

IPACK2018-8355: Multifunctional Chip for Use in Thermal Analysis of Power Systems

IPACK2018-8519: Deficiencies in Industry standard component reliability tests and its implications on material and process selection on component manufacturing

IPACK2018-8390: Evaluation of thermal coupling effect with multichip power modules

IPACK2018-8342: Volumetric and isochoric nonlinear viscoelasticity for epoxy-based polymers: Experimental characterization and theoretical modeling

IPACK2018-8413: Characterization of the Thermal Performance of a 3-D Manifold for High-Power Density Inverter Designs

IPACK2018-8357: Viscoplastic Constitutive Model for High Strain Rate Mechanical Properties of SAC-Q Leadfree Solder after High-Temperature Prolonged Storage

IPACK2018-8420: Electrical and Thermal Characterization of a Stacked Power Module with Integrated Double Sided Cooling

IPACK2018-8507: Packaging materials challenges to meet future auto requirements

4-15 Power Electronics Thermal Management - Components and Materials

5-1 Package and Sysem Reliability

rsday, August 30, 2018

IPACK2018-8210: Numerical Study of the Flow Condition of the Hydrodynamic Levitated Mechanical Micropump

IPACK2018-8379: Controlling the Solder Joint Reliability of eWLB packages in Automotive Radar Applications Using a Design for Reliability Approach

IPACK2018-8224: Controlling of Dielectric Liquid Droplet Spreading by Corona Discharge

IPACK2018-8281: Characterization and modeling of the curing process of epoxy based thermoset material using stress measurements

IPACK2018-8322: Experimental Study of Flexible Electrohydrodynamic Conduction Pumping for Electronics Cooling

IPACK2018-8358: Copper, Silver, and PCC Wirebonds Reliability in Automotive Underhood Environments

IPACK2018-8232: Study on Droplet Movement on Super-hydrophobic Surface under Non-uniform Electric Fields

IPACK2018-8500: Thermo-mechanical Reliability of the High-Performance Vehicle Computers Enabling Fully Autonomous Driving

4-16 Power Electronics Thermal Management - Thermoelectrics and Emerging Cooling Techniques

5-3: Electronics for Novel DriveTrain Technologies

IPACK2018-8354: Waste Heat Recovery For Powering Mobile Devices Using Thermoelectric Generators And Evaporatively-cooled Heat Sink.

IPACK2018-8280: Drive Schedule Impacts to Thermal Design Requirements and the Associated Reliability Implications in Electric Vehicle Traction Drive Inverters.

IPACK2018-8424: Tunable thermal transport and reversible thermal conductivity switching in topologically networked bio-inspired materials

IPACK2018-8348: Investigation of active power cycling combined with passive thermal cycles on discrete power electronic devices for automotive applications

IPACK2018-8264: Degradation analysis of solar cells by temperature, humidity and UV stress.

IPACK2018-8372: Understanding the effect of parallel cooling on the thermal and electrical balance of a lithium-ion battery pack for electric vehicles

IPACK2018-8282: Long-Term Effects of Power Quality and Power Cycling On Thermoelectric Module Performance

IPACK2018-8503: European Roadmaps for the Electrification and Automation of Road Transport

4-17 Batteries, Photovoltaics, and Energy Harvesting Devices

4-18 Low-Dimensional Materials and Nanoscale Heat Transfer

IPACK2018-8258: In-Operando Thermal Diagnostics of Lithium-Ion Batteries

IPACK2018-8201: The Effects of Nano-Structuring on the Thermal Conductivity of PbSe/PbTe Superlattice Thin Films

IPACK2018-8336: Wall-Mount Concentrated Solar Co-generation with Self-tracking

IPACK2018-8428: Thermal conductivity of entropy stabilized oxides: approaching the amorphous limit in single crystalline isotropic alloys through mass and strain disorder

IPACK2018-8387: A NOVEL ACTIVATED CARBON ENABLED STEAM GENERATION SYSTEM UNDER SIMULATED SOLAR LIGHT

IPACK2018-8427: Thermal transport in amorphous superlattices of low-k dielectric materials

IPACK2018-8411: Thermal Characterization of Lithium-Ion Batteries

IPACK2018-8425: Ballistic transport of long wavelength phonons in superlattices and nanograined alloys

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