2011 iNEMI Roadmap

Introduction & Selected

Highlights

Bill Bader, CEO

Haley Fu,

Asia Manager

Chuck Richardson,

Director RM

March 29, 2011

Asian Agenda

Time Subject Presenter

8:00 AM iNEMI Welcome/Roadmap Overview Bill Bader, Haley Fu,

8:15 AM Portable, Auto and Medical product sectors Chuck Richardson,

8:30 AM Packaging & Component Substrates Chuck Richardson

8:40 AM Board Assembly Paul Wang, Mitac

8:55 AM Test, Inspection & Measurement Bill Bader

9:05 AM Environmentally Conscious Electronics Haley Fu

9:15 AM Summary Bill Bader

9:25 AM Q & A, Discussion Haley Fu, All

9:30 AM Close

1

European/North American Agenda

2

Time Subject Presenter

11:00 AM iNEMI Welcome/Roadmap Overview Bill Bader, Bob Pfahl

11:15 AM Medical, Auto and Portable product sectors Chuck Richardson

11:30 AM Packaging & Component Substrates Bob Pfahl

11:40 AM Board Assembly Chuck Richardson

11:50 AM Test, Inspection & Measurement Bill Bader

12:00 AM Environmentally Conscious Electronics Bob Pfahl

12:10 AM Summary Bill Bader

12:25 AM Q & A, Discussion All

12:30 AM Close

International Electronics Manufacturing Initiative (iNEMI)• Not for profit, highly efficient R&D consortia since 1994

– Funded by Corporate memberships - Staffed globally in US, China & Ireland

• Membership includes 89 leading industry companies & organizations, representing

a cross section of our electronics manufacturing industry & supply chain

3

iNEMI Mission: Forecast and accelerate improvements in the Electronics Manufacturing

Industry for a sustainable future.

We Accomplish This By:

• Being the recognized leader at projecting future technology needs for the global supply

chain (iNEMI Technology Roadmap).

• Guiding and leveraging the strength of the consortium‟s industry leading international

membership.

• Driving high impact collaborative R&D Results through constantly improving methodologies.

• Defining and implementing science based sustainable solutions in high impact areas

including the environment and health care.

• Influencing and leveraging key government agencies and labs (iNEMI Research Priorities

Document).

• iNEMI has currently 25 collaborative R&D projects and initiatives that address key

technology gaps

• Projects typically have 10-20 member companies/institutions

www.inemi.org

Roadmap Process & Scope

Some Definitions

• TWG - Technical Working Group

– Develops the roadmap technology chapters

– Presently 21 groups and chapters

• PEG – Product Emulator Group

– “Virtual Product”: future product attributes plus key cost and density

drivers

• Portable / Consumer

• Office / Large Business Systems

• Netcom Systems

• Medical Products

• Automotive

• Aerospace/Defense

5

Methodology

6

Product

Needs

Technology

Evolution

GAP

AnalysisResearch

Projects

Competitive

Solutions

Roadmap

Industry Solution

Needed

Academia

Government

iNEMI

Members

Collaborate

No Work

Required

Available

to Market

Place

Global

Industry

Participation Disruptive

Technology

Statistics for the 2011 Roadmap

• > 575 participants -- Big Thanks to All Contributors!!

• > 310 companies/organizations

• 18 countries from 4 continents

• 21 Technology Working Groups (TWGs)

• 6 Product Emulator Groups (PEGs)

• > 1800 pages of information

• Roadmaps the needs for 2011-2021

• Workshops held in Europe (IMEC, Belgium), Asia (TPCA, Taiwan) and North America (ECTC, Las Vegas) in June 2010

• A Full Global Perspective

• Available to iNEMI members on 12/22/10 at: www.inemi.org

• Available to industry beginning March 29 at www.inemi.org

7

2011 Technology Working Groups (TWGs)

8

Organic PCBBoard

Assembly Customer

RF Components &

Subsystems

OptoelectronicsLarge Area, Flexible Electronics

Energy Storage &

Conversion Systems

Modeling, Simulation,

and Design

Packaging

&

Component

Substrates

Semiconductor

Technology

Final

Assembly

Mass Storage (Magnetic & Optical)

Passive Components

Information

Management

Systems

Test, Inspection &

Measurement

Environmentally

Conscious

Electronics

Ceramic

Substrates

Thermal

Management

Connectors

MEMS/

Sensors

Red=Business Green=Engineering Aqua=Manufacturing Blue=Component & Subsystem

Solid State Illumination

Photovoltaics

Roadmap Development

9

Product Emulator GroupsTWGs

Med

ical P

rod

ucts

Au

tom

oti

ve

Defe

nse a

nd

Aero

sp

ace

Semiconductor Technology

Design Technologies

Manufacturing Technologies

Comp./Subsyst. Technologies

Modeling, Thermal, etc.

Board Assembly, Test, etc.

Packaging, Substrates, Displays, etc.

Product Sector Needs Vs. Technology Evolution

Business Processes

Prod Lifecycle Information Mgmt.

Po

rtab

le / C

on

su

me

r

Off

ice / L

arg

eS

yste

ms

Netc

om

Optoelectronics and

Optical Storage

Organic Printed

Circuit Boards

Magnetic and

Optical Storage

Supply Chain

Management

Semiconductors

iNEMI

Information

Management

TWG

iNEMI

Mass Data

Storage TWG

iNEMI / IPC / EIPC

/ TPCA

Organic PWB

TWG

iNEMI / ITRS /

MIG/PSMA

Packaging

TWG

iNEMI

Board Assembly

TWG

Interconnect

Substrates—Ceramic

iNEMI Roadmap

iNEMI

Optoelectronics

TWG

Thirteen Contributing Organizations

10

iNEMI / MIG

/ ITRS

MEMS

TWG

Situation Analysis

• Convergence

– Medical-Consumer

– Automotive-Entertainment

– Communication-Entertainment

• Telecom-Datacom

• Miniaturization and Thinner; Speed of Change Escalating

• Quality, reliability, cost still paramount

• Counterfeit Products a growing issue

• Product Personalization

• Infrastructure (Business Model) changes:

– Fabless Semiconductor Fabrication

– Redundant Elements

– EMS and ODM roles grow; R&D Challenges

• Rare Earth and Conflict Materials

• Carbon foot printing is becoming a requirement

• Energy Storage

– Growth in Consumer electronics

– New transportation market

– Future opportunity for smart grid

11

Highlights of PEGs

ELECTRONICS PRODUCTION

2009 - 2021

Note: Total includes product categories not included in iNemi segmentation

$Bn 2009 2011 2013 2015 2021 CAAGR

„09-„15

CAAGR

„15-„21

Computers and Office $396 $433 $474 $500 $617 4.0% 3.6%

Communications Infrastructure Equipment $157 $174 $192 $213 $281 5.2% 4.7%

Consumer and Portable Electronics $298 $319 $341 $400 $479 5.0% 3.1%

Automotive Electronics $105 $129 $158 $161 $237 7.4% 6.6%

Medical Electronics $77 $85 $93 $103 $134 5.0% 4.5%

Military and Aerospace Electronics $118 $129 $140 $151 $189 4.2% 3.8%

Total Electronics Production $1,242 $1,382 $1,541 $1,679 $2,171 5.2% 4.4%

Courtesy PrismarK Partners LLC

13

2009/11Product Emulator Groups

14

Product Emulator Chair(s) 2011

Automotive Products Jim Spall, Delphi

Medical Products Anthony Primavera, Micro Systems Eng.

Bill Burdick, GE Research

Consumer / Portable Products Shahrokh Shahidzadeh, Intel

Office/Large Business System

Products

David Lober, Intel

Dale Becker, IBM

Network, Data, Telecom Chuck Richardson, iNEMI

Aerospace/Defense William Murphy, Lockheed Martin

Madhu Mahrotra, Raytheon

Consumer / Portable

PEG

Chair: Shahrokh

Shahidzadeh, Intel

1616

Highlights

• Smart phones dominate unit volume growth for portable products, and the overall market volume growth is driving TD areas:

– Increased focus on shrinking form factor and low power

– High level of integration (SoC, SiP)

– 3D packaging and Embedded Die market leaders

• Significant focus on sustainability, eco-design and recycling

• The MEMS/sensor technology for unleashing entertainment, medical, and security as well as perceptual computing

• Convergence of Entertainment, Computing, Communication drives integration

– The world of OS and applications and middleware challenges, will drive major shifts and consolidations to enable seamless computing and interoperability

– The pace of product enhancements is growing rapidly.

17

Automotive PEG

Chair: Jim Spall,

Delphi

• Business Issues

– Reduced North American volume in 2009 (worst year in 30 years)

– Western Europe sales tracking at a full-year rate near 14.7 million units

for 2009, 2010 volume could be reduced to 13.7 million units

– Japan sales declined to the lowest level in 38 years (2.9 million units)

– China exceeding the U.S. in auto output in 2009 (12 million units)

• Up 34 percent from a year earlier

– Increased Corporate Average Fuel Economy to 35.5 mpg by 2016

• Downsizing of engines and increased use of Gas Direct injection

• Increased use of turbo-charging

• Researchers project 14 million electrified vehicles annually by 2020

Situation Analysis

Automotive Product Emulator

19

• Technical Issues

– Shift to Hybrid Electric Vehicles (HEV), Plug-in Hybrid Electric Vehicles (PHEV), and Electric Vehicles (EV)

• Invention required to reach the battery cost target of $250/kWh

– Today‟s cost $1,000 -$1,200/kWh

• Key components that are in need include: power devices, bulk capacitors, inductors and transformers, cooling structures, motor drive microprocessors, high current connectors, current sensors, gate driver ICs, battery management ICs, bus bars, and enclosures.

– Increased use of MEMS in automotive

• Accelerometers

• Gyroscopes

• Pressure

• Air Flow

Situation Analysis (con‘t.)

Automotive Product Emulator

20

– 12.3 inch reconfigurable displays for the instrument panel

– LED lighting used internally and externally

– Connected Vehicle

• Key Drivers: cost, reliability, size

– Cost is still the key driver for automotive

• Competitive cost will get you an opportunity to win a program

– Reliability is a given in the automotive sector

• Failure to deliver will result in no future business

• Toyota situation will test its loyal customer base

– Size is a benefit because some vehicles having 100 electronic

controllers and space is limited

Situation Analysis (con‘t.)

Automotive Product Emulator

21

• Chart 2009 vs. 2011 forecast differences

– Circuit board – use of 8 layer with blind vias

– Lower memory prices in 2011 than forecast

– Increased use of MEMS sensors (Identified the types being used in the

emulator)

– Higher resolution and larger displays being used (12.3” displays for the

instrument cluster)

– Nand Flash used for Hard Drive emulation

– Increased use of Built In Self Test (BIST) and Boundary Scan

– Quicker conversion to lead free solder

– Greater thermal demands due to the electrified vehicle

Situation Analysis (con‘t.)

Automotive Product Emulator

22

Medical PEG

Chair: Anthony

Primavera, Micro

Systems Eng.

Co-chair: Bill Burdick,

GE Research

Medical Market Background

• Global

– 65+ year old population will triple by 2050 .. from 516M (2009) to 1.53B

(2050)

– 80+ year old population will increase from 40M (2009) to 219M (2050)

• Currently, the U.S. (for example) spends 1.75 Trillion dollars

… 15% of 2009 GDP … 25% of GDP 2015

• It is estimated that current annual spending on medical

devices / electronics is 70 to 100 Billion dollars

• The market opportunities are large and are growing

24

Three Major Market Sectors

25

Medical products were grouped into three general categories.

1) Implanted products (devices implanted in a human body)

– Strict regulatory procedures

– Driven by battery life (low power loss) – this limits the use of certain

components such as DRAM due to high energy consumption

– Validation and traceability required

– Long term reliability paramount

– Long development cycles, primary assembly and design by OEMs

2) Portable products (devices that are easily transported)

– Cost parity with consumer / portables

– Dynamic market, needs fast response, 9 to 24 month product cycle time

– Mixed regulatory environment

– Mostly outsourced assembly and design

– Higher Volume; Lower Cost – example – diagnostic ultrasound in PDA size ..

and smaller .. form factors

3) Diagnostic imaging devices and large scale equipment, e.g., MRI, CT

– Larger scale (often similar to servers or telecom equipment)

– Challenging thermal management and heat sinking

– Utilizes commercial off-the-shelf components, when available

– Development cycle is shorter than implantable

– Application and design well suited to EMS environment

Leverage off Other Market Segments

• Implantable market reliability methods can learn from…

– Auto & Military – Learning on harsh environment reliability in shock,

impact and long term low level fatigue

• Portables – wireless medical device systems now becoming

standard

– Personal data device transmits medical monitoring facility and

physician – communication must be flawless

– SIP and POP in consumer products- Some learning but additional

work needed to better correlate with medical product needs

• Imaging Systems rely heavily on high end telecom system

components

– Displays, mass storage, wireless and hard-wire data transfer systems

26

Critical Gaps and Challenges

• Connector technologies that are highly reliable

– Ultra small for implantable products with automated wire attach. Also require

ultra high fidelity signal properties

– Large geometry connectors for imaging systems with superior contact quality –

zero electron loss

• Safety and efficacy in RF traffic wireless telemetry.

– Different frequencies, pulse widths, etc. in medical device settings are not

thoroughly addressed in international standards

• High reliability (10 year life minimum) PCB technologies to support

high density high performance silicon in implantable – major

research need

• High performance energy storage methodologies

– Includes researching and refining energy harvesting the bodies thermal and

motion attributes

• Addressing critical business issues for the medical market:

– Conversion to alternative to leaded solder attach technologies

– Simplifying regulatory and time to market challenges

27

Highlights of TWGs

2011 TWG Leadership Status

29

Business Processes /

Technologies

Chair(s) Co-Chair(s)

Information Management Jeff Pettinato, Intel Eric Simmon, NIST

Design Technologies

Modeling, Simulation &

Design Tools

Yishao Lai, ASE

Andy Tseng, ASE

S.B. Park, Binghamton U.

Environmentally Conscious

Electronics

Jackie Adams, IBM

Ted Reichelt, Intel

(Retired)

Thermal Management Azmat Malik, Consultant

Manufacturing Technologies

Final Assembly John Allen, Celestica Reijo Tuokko, Tampere U.

Board Assembly Paul Wang, Mitac Mitch Holtzer, Bawa Singh,

Cookson Electronics

Test, Inspection &

Measurement

Mike Reagin, Delphi

2011 TWG Leadership (cont.)

30

Component / Subsystem

Technologies

Chair(s) Co-Chair(s)

Semiconductor Technology Paolo Gargini, Intel Alan K. Allan, Intel

Optoelectronics Dick Otte, Promex William Ring, WSR

Photovoltaics Jim Handy Objective-Analysis Alain Harrus, Cross Link Capital

Packaging Bill Bottoms, 3MTS

William Chen, ASE

Passive Components Ed Mikoski, ECA

Connectors John MacWilliams, Consultant

RF Components Ken Harvey, Advantest Eric Strid, Cascade MicroTech

MEMS / Sensors Michael Gaitan, NIST Raffaella Borzi, IMEC

Francois Iker, IMEC

Large Area, Flexible Electronics Dan Gamota, Printovate

Technologies

Andreas Schaller, ASC

Jie Zhang, Institute of Materials

Research and Engineering

Energy Storage & Conversion

Systems

Namid Maluf, QNovo

Tom Newton, IPC

Ravi Bhatkal, Cookson Electronics

Interconnect Substrates (Ceramic) Howard Imhof, Metalor Ton Schless, Sibco

Interconnect PCB John T. Fisher, IPC

Michelle Hung, TPCA Liaison

Henry Utsunomiya, Consultant

Dieter Bergman, IPC

Mass Data Storage Roger F. Hoyt, Consultant Tom Coughlin, Coughlin Associates

Illumination Marc Chason, Consultant Ravi Bhatkal, Cookson Electronics

Packaging & Component

Substrates TWG

Chair: Bill Bottoms,

3MTS

Co-chair: William

Chen, ASE

Packaging and Component Substrate

Technical Working Group

Areas of Focus:

– Materials

– Embedded components

– 3D integration

– Wafer thinning

– Interposers

– Bonding (d-d, w-w, d-w)

– Optical interconnect for SiP

32

33

Source: 2009 Estimates Morgan Stanley

Connectivity is the Key to Consumer Growth

34

Ease of use Improvements Drive Growth

User Interface + Smaller Form Factor + Lower Prices + New Services

Source: 2009 Estimates Morgan Stanley

The Consumer dominates the Market and

The Market makes the decisions

What does the Consumer want?

– Lower cost

– Higher performance

– Longer battery life

– Innovative features

– Connectivity (wireless)

– Smaller size

– Lighter weight

– Less heat generation

– Rapid availability

35

Roadmap of Quantified Key Attribute Needs

36

Functional Diversification (―More than Moore‖) is driving rapid change in Packaging and Component Substrate Technology for Consumer products

New packaging technologies needed to satisfy market requirements include:

• Wafer level packaging

• Wafer thinning

• System in Package (SiP)

• Printed electronics

• Direct bonding interconnect

• New conducting materials

• New dielectric materials

• 3D Integration

3D integration will require a combination of new technologies and materials including some defined above

• Through Silicon Via – active wafer & interposers

• Two side wafer level Processes– RDL and MicroBumping

• Embedded Components (active & passive)

• Wafer thinning & Handling

• Wafer to Wafer Bonding

• Die to Wafer Bonding

• Micro bump assembly

• Design Tools

• Micro fluidics Cooling

• Assembly of TSV die

• Test of TSV Die

Technologies Enabling 3D Integration

Source: Phil Garrou, 2009

37

3D System Integration

38

3D System IntegrationPost Fab Processing for 3D TSV integration

provides key advantages for Consumer

products:

• Reduced power

• Increased performance

• Lighter weight

• Smaller size

39

SiP Packaging reduces cost

and time to market:

• Heterogeneous integration

• Reduced NRE

• Reduced power

• Smaller size

3D System Integration

40

Pushing the Envelope

• All of these new technologies are moving very quickly.

• In today's world the effectiveness of an integrated supply

chain approach is key

• Multiple nodes on the supply chain covering all aspects of

design, materials, assembly, test, etc, etc

• Cooperative roadmap efforts of groups (such as, MIG, iNEMI,

IPC, TPCA and ITRS) are key to clarify timing and needs

• There are many/many opportunities for collaborative R&D

– An iNEMI Strength and Core Capability

41

Board Assembly TWG

Chair: Paul Wang, Mitac

Co-Chair: Mitch Holtzer,

Bawa Singh, Cookson

Miniaturization Credits –

John Lau

43

Key Trends (2011 Roadmap)

Business Environment

• Higher level of service demand placed on EMS

• EMS companies are expanding offerings to include services

in a wider range of a product‘s life cycle

• Increased role of EMS/ODM and materials/equipment

suppliers in R&D and process development

• Continued migration to low cost regions

• Demands on cost reduction and low margins are driving

consolidation among EMS companies

43

44

Key Trends (2011 Roadmap)

Main Drivers for Development in Board Assembly

• Conversion cost reduction

• Increased Component I/O Density (miniaturization)

• Environmental and regulatory requirements

• Reduction in New Product Introduction (NPI) Time

44

45

Key Trends (2011 Roadmap)

Technology Trends (examples of solutions)

• SiP solutions

• Embedded components

• Flexible tooling solutions

• Optimized production equipment sets

• Optimized production line configurations

45

46

• From 2012 onwards the „M0201‟ package will be introduced

• Dimensions: 0.2 x 0.1 mm

• This is half the size of a „01005‟ package!

Sources: Murata, Rohm

Miniaturization: Passive components size

reduction

Ultra thin capacitors

47

• Available in 2 sizes: ‗0402‘ and ‗0201‘

• Enables placement below ICs

– Typical applications: Modules (SiP), mobile phones

– Very thin ultra low placement force

Dimensions 0.6 0.3mm 1.0 0.5mm

Thickness 0.05mm 0.05mm

Capacitance (@1kHz) 0.01μF 0.1μF

Insulation resistance (@4V) ≧10MΩ ≧1MΩ

Nominal voltage 4V 4V

Temperature characteristics X5R X5R

(Murata, October 2009)

3D IC Integration System-in-Package (SiP) is coming!

Is board-level assembly ready?

(No, I don‘t think so!)

Board Assembly of 3D IC Integration

System-in-Package (SiP)

John H. Lau

48

Technology

Ma

turi

ty

Basic

R&D

Applied

R&D

Mass

Production

Commercia-

lization

Die

Stacking

with wire

bonds

Package

on

Package

Stacking

(PoP)

C2C, C2W,

W2W

Stacking

W2W

Stacking

Full swing production for memories.

Every 18 months one layer increase

Testing and yield challenges give

way for Package stacking

Active applied R&D is undertaken

by Research Institutes. System

level challenges are key. In the

phase of industrialization.

Still in Upstream research,

technological challenges such

as yield & device architecture

are key issues.

3D Integration Technology3D IC Packaging 3D IC Integration 3D Si Integration

3D Integration Technology

49

3D Packaging (No

TSV)

3D IC Integration

C2C/C2W/W2W; microbump bonding; 5 ≤ TSV ≤ 30μm;

20 ≤ memory stack ≤ 50μm; 100 ≤ interposers ≤ 200μm

3D Si Integration W2W

pad-pad bonding (TSV

≤ 1.5μm)

3D Stacking

(wirebonds)

PoP

CMOS image sensor

with TSV

Memory (50μm) with

TSV and microbump

Passive TSV interposer to

support high-performance

chips

CMOS image

sensor with DSP

and TSV

32 memory (20μm)

stacked

Active TSV Interposer

(e.g., Memory on Logic

with TSVs)

Mass Production

Low Volume

Production 2008 2010 2012

Don‘t care to guess!Mass

Production2011-13 2013-15 2015-17

Low volume production = only a handful of companies are SHIPPING it;

Mass production = many companies are SHIPPING it.

Cu-Cu bonding

SiO2-SiO2 bonding

3D MEMS; 3D LED

Lau, 3D IC Integration PDC

Bumpless

Bumpless

3D Integration Roadmap

50

What are the Challenges (Opportunities)?

1. Pick and Place of 3D thin chips

2. Pick and place of Bare 3D stacked chips with irregular

shapes

3. Rework processes

4. Heat sink attachment is more difficult

5. Solder joint reliability of large packages

51

Test, Inspection & Measurement TWG

Chair: Mike Reagin,

Delphi

Test Inspection Measurement TWG Chapter Scope

• Technologies which allow for the identification of product

defects and the characterization / improvement of the product

and associated manufacturing process

• Board level TIM

– Automated Optical Inspection (AOI)

– Automated X-Ray inspection

– In-circuit test

– Board level functional test

• Sub-assembly and assembly level

– Functional test

– Vision systems & burn-in

– System level BIST technologies

53

Test Inspection Measurement Critical Issues

• Test Coverage, Defect Detection / Prevention; Growing challenges

– System on Chip

– High Density Interconnect - Smaller Vias, Blind Vias, Buried Vias, Higher layer counts

– Embedded Components

– All the above magnify the reduction in test access

• Increased product complexity discussed in previous roadmap continues to place

upward pressure on the cost of test

– Increasing complexity of System On Chip (SOC) devices is making SOC device test as

well as board level and system level test more difficult and expensive

– Cost of test increasing at an increasing rate

• Global Test Development / Implementation

– Common Solutions versus regional solutions

– Training and support issues

– Impact of tariffs and regulations on test equipment costs challenges test quality

• OEM ownership of DFT Combined with the challenge to proactively evaluate test

coverage effectiveness at supplier / remote site in real-time

• Lead free Impact on Test

54

55

Test Inspection Measurement TWG

Gap AnalysisBoard 2010 2012 2014 2016 Comments

Lack of Test Access (bed of nails) Already no physical test access for mobile products

Lack of Test Access (virtual).How well will emerging standards solve access issues?

For what products is analog boundary scan a solution?

Material Impact on TestImpact of emerging board substrate materials (halogen

free, non-FR4 for high speed applications)

Faster signal speeds

Lack of test solutions for HDI Depends on adoption rate.

Board Layout & DFT Tools

Packaging Hierarchy 3-D ICs? Need input from mobile products

On-Board Power Regulation Have figured out ways to deal with issues.

Functional, System

Testing of Higher Speed Signals

Defect Coverage and Diagnostics

Design for Functional Test

Equipment/Tools/Capabilities

Node count > tester capability

(mid to high PCAs)

Lower overall cost of test

Lack of ODM / CM test expertise

Imaging Technologies

Test TWG Summary

• Clearly test challenges are growing to become more severe with time

• Industry collaboration and alignment on strategies to address these gaps is key

• iNEMI projects on BIST standards and portability , Boundary Scan and Board Flexure Standardization are excellent steps

• INEMI projects on component packaging and HFR free laminates will also ultimately drive lower defect rates

• Test strategy/coverage collaboration definition via a face to face Test TWG session is required to address (priorities):

– DFT requirements for 3D packaging

– Specific TIM requirements and strategies to deal with increasing speeds and lowering voltages of products

– Access challenges growing with rapid evolution of HDI

56

Environmentally Conscious

Electronics TWG

Chairs:

Ted Reichert, Intel

(Retired)

Jackie Adams, IBM

ECE TWG Focus

• TWG Focus Topics – Materials

• Ramping restrictions challenge science based evaluation

• Lead and halogen free challenges

• Conflict and rare earth metals

– Energy• Efficiency – harmonized requirements and metrics

• Carbon footprint

– Recycling• Common approach and infrastructure – closer collaboration

• Harmonize patchwork requirements

• Market incentives for recovered materials

– Eco-Design• Better design tools

• Life cycle impact methodologies and database needs

– Sustainability• Our products as an enabler to address climate change

• Water and manufacturing eco-efficiency are emerging areas

58

ECE Summary

• 2011 Issues

– New issues not in previous roadmap that may impact other TWGs

• Rare earth and conflict metals

• Expanding list of restricted materials via global RoHS, REACH

• Carbon footprint

• Cross Cutting Issues

– Highlighted issues that are cross cutting with other TWGs

• Energy efficiency standards and technologies

• Transition to lead free and low halogen

• Additional restricted materials

• Standards for product data management

• Eco-design standards

59

Concluding Thoughts

• New global environmental requirements continue to multiply –faster than industry can effectively respond

• Industry needs to be more proactive in developing solutions that:

– Are based on science and engineering, delivering value to customers

– Are available in advance of new regulations

– Can influence future regulations and stakeholder groups for more sustainable results

• iNEMI and its members are playing a significant role in preparing industry for these future needs

• Sustainability will be a major undertaking for industry as well as society

• Electronic solutions can help to empower people to live a more sustainable lifestyle

60

Summary/Next Steps

Strategic Infrastructural Changes

• The restructuring of the electronics industry over the last decade

from vertically integrated OEMs to a multi-firm supply chain has

resulted in a disparity in R&D needs versus available resources

• Restructuring has created skill gaps at various nodes of supply

chain

• Critical needs for research and development exist in the middle part

of the supply chain (IC assembly services, passive components and

EMS assembly) and yet these are the firms least capable of

providing the resources

• A partial solution has been the development of vertical teams to

develop critical new technology while sharing the costs

• A major gap in this new model is the rapid evaluation of the

reliability and environmental impact of these new technologies by

the supply chain

62

The Next iNEMI Deliverables Are Key:

Addressing the Gaps

• Technology continues to move at a faster rate of change

• Driven in many cases by short life cycle low cost yet high volume

product

• Many of these ―cool new things‖ don‘t port well or quickly to high

reliability markets such as automotive, medical, or high end

networking

• The next key deliverables from iNEMI are the 2011 Technical Plan

(available only to members) and the 2011 Research Priorities

• Effective usage and coordination behind both these documents will

be key to continued industry progress and growth

• Look for them in August of 2011

– The iNEMI TIG‟s and Research Committee are actively working them NOW!

63

RoadmapAvailability

2011 iNEMI Roadmap

• Available to industry beginning today at www.inemi.org as

follows:

– Free for iNEMI members – If interested in joining contact an iNEMI

staff member

– For Non Members:

• $3100 US (complete roadmap CD) International (includes S&H)

• $3000 US (complete roadmap CD) (North America)

• $500 US (per downloaded PDF chapter) - includes executive summary

• Special Rates of $500 US, $600 International for complete RM for

Universities, Research Institutes, and Non Profit Corporations. - $100 Per

chapter for these organizations

• Please contact Chuck Richardson for quantity discount

requests at crichardson@inemi.org

65

Questions

www.inemi.orgEmail contacts Asia:

Haley FuHaley.fu@inemi.org (Asia)

Chuck Richardson Chuck.richardson@inemi.org

Bob Pfahlbpfahl@inemi.org

Bill BaderBill.bader@inemi.org

www.inemi.orgEmail contacts Europe/NA:

Grace O’Malley (Europe)gomalley@inemi.org

Chuck Richardson Chuck.richardson@inemi.org

Bob Pfahlbpfahl@inemi.org

Bill BaderBill.bader@inemi.org