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MICROSYSTEMSLABORATORY
:
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:
Degree University Year
B. S.Department of Mechanical Engineering,
Chung-Ang Univ.1997.02
M. S.Department of Mechanical Engineering,
Chung-Ang Univ.1999.02
Ph. D. School of Engineering Osaka University2002.03
Degrees
Position Organization Period
T. A. School of Engineering, Osaka University 1999.10 ~ 2000. 7
R. A.Collaborative Research Center for Advanced
Science and Technology, Osaka University2000. 8 ~ 2001. 3
Research Fellow School of Engineering, Osaka University 2002. 4 ~ 2002.10
Designated Professor School of Engineering, Osaka University 2002.11 ~ 2003.12
Assistant Professor School of Engineering, Osaka University 2004. 7 ~ 2004. 8
Associate ProfessorSchool of Mechanical engineering, Chung-Ang
University2004. 9 ~ Present
Experience
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MICROSYSTEMS LABORATORY
Microsystems
Fundamental
Technology
Material Assembly
Design
Manufacturing
Evaluation
Automobile
Ship & Marine
Space & Aircraft
Home electronics &Information Apparatus
Medical
Industry
Applications
System Integration
Technology
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MICROELECTRONIC PACKAGING Field
MICRO SENSOR and ACTUATOR Field
ETC.
MICRO-, NANO ~ Field
Hybrid Interconnection Using Low-Melting-Point Alloy Thermo-Sonic Bonding Technique
3D Stack-Up by Using Solderable ECA
Micro- and Nano-bubble solution and its application
Capacitive Micromachined Ultrasonic Transducer
Micro-mirror
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MICROELECTRONIC PACKAGING Field
Hybrid Interconnection Using Low-Melting-Point Alloy
Redu
ctant
A
Polymer
Substrate
Lead
Cu
electrode
Conduction path
Hybrid Interconnection
Combined with
Metallurgical interconnection (Soldering)
Low process temperature, Simple
process, Fine pitch capability (ECA)
Using Low-Melting-Point Alloy Filler
Bonding process
Wetting test Cross section of solderable ECA joint
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MICROELECTRONIC PACKAGING Field
Thermo-Sonic Bonding Technique
Heating Plate
Flexible substrate
Pad
(a) Flexible substrate fixing on heating plate
Conduction
particleACF
HeatingPlateFlexible substrate
Binder
(b) ACF pre-bonding Flexible substrate
HeatingPlateFlexible substrate
Sichip
Bump
Heating
(c) Chip alignment and pre-heating
Low
Pressure
Ultrasonic vibration
Heating Plate
LCD panel
Si chip
(d)Apply the heating, pressure and Ultrasonic
Heating
Merits of this process
Low process temperature
Reduction of process time
Decreased bonding pressure
Bump
Si chip
Electrode
Substrate Conductive particle
Bonding process
Cross section of bonding joint
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MICROELECTRONIC PACKAGING Field
3D Stack-up by using Solderable ECA
ECA paste
Si wafer
Reflow
Squeegee & Alignment Complete
Substrate
Flip chipPolymer
Polymer (Underfill)
3D Stack-up
Solder
Merits of this process
Low process temperature
Simplify the whole process
Fast filling time
Underfill between the stacked
substrates
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MICRO SENSOR and ACTUATOR Field
Capacitive Micromachined Ultrasonic Transducer
0.0
0.0
Displacement, m
-2.5
0.0
-0.5-1.0
-1.5
-2.0
x10-7Displacement, m
-2.7
(a) 0 V (b) 23 V
Thickness of Post B
Height of Vacuum Gap
Width of Post A
Radius of Plate B
Radius of Plate ARadius of Post B
Thickness of Plate A
Thickness of Plate BRadius of Plate
Thickness of Plate
Heightof Vacuum Gap
Width of Post
Conventional design Novel design
FEM results
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MICRO SENSOR and ACTUATOR Field
Micro-mirror
1861.4 Hz 2644.0 Hz
y
x
Fabricated micro-mirror
FEM results
(a) Natural frequency (b) Air-film damping pressure
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Micro-, Nano- Fields
Micro- and Nano-bubble solution and its application
(c) Concentration and DO meter
of the Oxyzen bubble
(a) Recording image of the bubble (b) Particle size distribution
Bubble
Wide range of application
Medicine
Water treatment
Energy
Agriculture
Food
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THANK YOU FOR YOUR ATTENTION
WELCOME TO
MICROSYSTEMSLAB.