©2012 TT electronics plc 0 Power & Hybrid Business Unit, Microelectronics.

©2012 TT electronics plc 1

Power & Hybrid Business Unit, Microelectronics


Who Are we?

Manufacturers of ultra reliable, high performance discrete semiconductors, power modules & hybrid microelectronic solutions designed to operate in any environment.


Our aimThrough our flexibility and innovation, we aim to be recognised as trusted technology leaders in the aerospace, space, defence, medical and industrial markets.


What we do

We research, design and manufacture an innovative range of MOSFETS, Bipolar Transistors, IGBTS, Power Modules, Diodes, Voltage Regulators and Customised Hybrid Microcircuits.


Aerospace Market Segments Actuation RADAR Engine control Flight subsystems

. Space Market segments Commercial Satellite - Telecoms, Broadcast,

GPS, Weather Exploratory Missions Nano and Cube Satellites

Industrial Market segments RF Energy (oil/gas, renewable) Audio Power conversion & management

• Military Market segments Transportation Communications Homeland Defence Aircraft UAVs

• Motorsport Market segments Formula 1 KERS Touring Car KERS

• Medical Market segments Analytical equipment Oncology equipment De Fib

Customers and markets we serve


6

Product/ Technology

Features Applications Benefits

Discrete Semiconductors • Wide Range of modern & traditional packages

• Screening to International standards

• Down-hole drilling• Satellites• Defence programs

• Choice of silicon to match application

• 35 year pedigree of supply

RF (VDMOS) MOSFETs • High Gain• Excellent linearity

• Jammers• Radios• Broadcast

• Never made a part obsolete

• Higher performance• Very rugged and reliable

Power Modules • IGBT’s, MOSFET’s, Diodes

• High-Rel screening• Hermetic or Plastic Hi-Rel

• Aircraft Actuation• Power Factor Correction• Hybrid Motor Drive

• Extended reliability• Long term supply• Harsh environment

capability

Hybrid Microcircuits • Superior resistor characteristics

• MIL-PRF-38534, Class H certified & MIL-STD-883 screening options

• Fully customized circuits• High temperature

operation

• Aero-engine cooling systems

• Renewable energy – Solar CPV

• Driveline modules• Exhaust after treatment

• Reduced size • Improved circuit

performance• Enhanced thermal

properties• Improved reliability

Our Portfolio

http://imagelibrary.ttetalk.net/gallery2/main.php?g2_itemId=805


Power Modules Space

High Temp Solar

•Power conversion: Inverters for wind & solar•Motor drive: HEV (on and off road), traction•Actuation: Hydraulic replacement, steering

Discrete product for Satellite subsystems:•Nano and Cube satellites•GPS and Communications constellations•Weather/Scientific monitoring in Space

• Motor drive actuation• Control systems• Inverters• Power factor correction

• Concentrated Solar energy collection systems - using photo-voltaic cells


Automotive KERS ModuleCustomer Requirement • Power module solution for racing car Kinetic Energy Recovery System (KERS)

Solution• Custom Power Module

• Custom configuration for application • Enhanced electrical, temperature and mechanical operation

Value Proposition• High temperature capability through using latest available technologies• Customised solution utilising the latest aerospace technologies to deliver high reliability

in a very harsh environment• Reduced weight through utilising latest materials to deliver a solution that is light yet extremely rugged

Core Competence• Flexibility – Closely working with the customer to realise their stringent technical & environmental requirements• Innovation – Utilising cutting edge mechanical and silicon/SiC technologies to achieve the spec• Pedigree - 35 years proven understanding of harsh environment requirements for high temperature and high

reliability applications

Status• Successfully designed, built and winning races• Currently working with teams on the 2013 season• Proven experience and success at the highest performance level• Now looking to move into more race types

Reason for success?• Technical Innovation, experience in ultimate reliability and close engineering to engineering relationship with

customer to understand their application and deliver a winning solution


Why Use Microelectronics

Power & Control

High Power

High Frequency

Braking Resistors/Heaters

High Density & Reliability


Thick Film Circuit

Thick Film Ink Systems

Printing – Firing – Lasering

Gold, Silver, High and low Temperature Copper.

Resistor Printing directly in circuit.

Aspect ratio to 0.1mm track and gap width, +/- 0.03mm registration.

Automatic printing machines cassette to cassette process.

Automatic Laser trimming and continuity testing.

Clean-room facility operating on 3 shifts.


Technologies

Substrates

Thick film on 96% alumina or aluminium nitride

Directly bonded copper (DBC)

Active metal braise on aluminium nitride & silicon nitride

High/Low temperature co-fired ceramic (HTCC/LTCC)

Steel

Aluminium

Thin film

FR4


Technologies Component Attach– Solder Surface Mount– Polymer Component and die attach– Vacuum soldering (Power Die Attach) up to

400oC

Wire Bonding– Fine wire Au 17um to 33um– Fine wire Al 25um to 33um– Large diameter Al >125um

Packaging– Hermetic sealing– Projection weld & Seam Seal– Ceramic lidding– Glob-top / Silicon conformal coat


Microelectronics Assembly

Clean-room assembly operations.

Automated die bonding and wire bonding by pattern recognition.

Re-flow soldering and real time x-ray for void detection.

Aluminium fine wire bonding for high density signal and control circuits.

Large diameter Aluminium wire bonding for power circuits.

Hermetic sealing in inert atmosphere.

Leak detection.

Automatic test facilities.


Test, Burn-In and Screening FacilitiesTest Two General Purpose ATEs in Chip &

Wire Clean Room. One reduced capability, DC only,

ATE. One General Purpose ATE for one

high volume product. Two ATEs for surface mount hybrids. One tray pack system – measure,

accept/reject, pack. One PIC program/test XYZ system.

Screening: Temperature cycling Constant acceleration Burn-in Fine & Gross Leak Test Pin D Bump Limited range vibration


MCM Engine ManagementCharacteristics:

High Temperature Co-fired Ceramic (HTCC) Chip and Wire (>1000 bonds) High Density – Reduced size and Weight Hermetically sealed Engine mounted Qualified –55oC to +150oC Extended high temperature approval testing –

55oC to +205 oC. Completed 1000 hours +205oC Completed 100 cycles –55oC to 205 oC

Function: Engine management (FADEC)

Custom ASIC - CPU, SRAM, EPROM, Oscillator

Hi Reliability >20yrs life


MCM (Linear) Engine Management – Civil Aviation

Function

3 Precision instrumentation amplifiers High common mode rejection Precision gain 3 Precision voltage references General purpose comparator

Characteristics High operating temperature -55oC to +150oC Engine mounted Thin Film provides high accuracy and stability. Active Trimming to <0.01% tolerance. High precision and accuracy achieved with low

cost Commercial Off The Shelf Components. Easily redesigned if amplifiers or reference

become obsolete


DC/DC Converter – Civil Aviation

Function:

3 Fixed DC Outputs from 14 to 36VDC 28 Watts Flight computer System Self Monitoring Self Diagnostics

Characteristics:

Mixed power and control circuits. High reliability >20 years life proven through

extreme temperature cycling (>3,000 cycles) and HALT testing.

Operating temperature -40oC to +95oC High packing density. Relatively low cost.


Safety Critical Fuse

Function: 10 amps continuous current carrying capacity

Fuse activation by external control

Fusing time <5 second @ -40oC to +110oC

Current applications: Wing ice protections system, heater circuit

protection (787 Dreamliner)

Engine de-icing (Joint Strike Fighter) heater protection


Power MCM – Civil Aviation

Function: Part of Wing Ice Protection System

Switching controls power to wing tip or engine heaters (up to 5 amps continuous without heatsinking).

Used in conjunction with thick film solder fuse protection device

Characteristics: Each module contains 8 MOSFETs with low Rdson

(<138m Ohm)

High packing density and low assembly cost (35mm x 20mm)

Good thermal management

High reliability


Sonar Transducer Power Driver – Naval Systems

Function: H Bridge MOSFET Switch to control power to

sonar antenna

Intelligent switch with ASIC control and MOSFET drivers.

Characteristics: Each module contains 4 MOSFETs with low Rdson,

drivers and control ASIC

Uses mixed technologies


High reliability


Flight Controls

Steel Dynamic Braking Resistors

For Aileron, Elevator and Rudder Actuation

Increased power dissipation by the use of bottom and top heat sinking

Low profile, Low Weight

Design-ins on:– Airbus A400M – A330 MRTT– Boeing 787 EBACS


Power Resistor – Motor Speed Control

Design for high temperature environment Design for high reliability Low Profile, fits in motor housing 0.7 Ohm Resistance Curved shape to fit in housing

Test Requirement

Duty Cycle Number

Power On Off Cycles

300W 3 10 100

100W 10 10 50,000


AIN Heater – Toner Fusing

Function: Instantaneous heating with individual control of 3 discrete segments

210°C in 2 seconds (1kW)

Precision Temperature Control

Characteristics: Large size printing

AlN Hi thermal Conductivity Resistance to thermal shock

Developed Inks with Fraunhofer Institute


Hi Frequency Telecoms

Function:Frequencies up to 38GHz

Hi Reliability

Direct feed to antenna

Small Package size

Characteristics: Low loss at high frequency

Gold based ink

0.38mm thick substrate down to 0.1% tolerance


Precise track definition


Automotive – Mass Air Flow Sensor


Industrial – Ink Jet Print Head


Military and Avionics


Industrial – Power Module

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©2012 TT electronics plc 0 Power & Hybrid Business Unit, Microelectronics.

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