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3 d semiconductor packaging

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Published Date: 29-Dec-16 World 3D Semiconductor Packaging Market Opportunities and Forecasts, 2014 – 2022
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Page 1: 3 d semiconductor packaging

Published Date: 29-Dec-16

World 3D Semiconductor

Packaging Market

Opportunities and Forecasts,2014 – 2022

Page 2: 3 d semiconductor packaging

3D semiconductor packaging is an advanced packaging technology to fabricate high-performance chips such as flash memories, DRAMS, NAND, and others, which are highly used in high-performance computers, image sensors, smartphones, and others.

The demand for 3D semiconductor packaging market is globally expected to rise during the forecast period due to increase in demand for miniaturized circuits and short replacement period of electronics products

Surge in the automotive sector and growth in demand for miniature circuits in portable electronic devices provide opportunities in the market. Asia-Pacific dominated the market in 2015, accounting over 50% of the total market revenue, and is expected to maintain its dominance throughout the forecast period.

3D SEMICONDUCTOR PACKAGING MARKET - INTRODUCTION

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3D SEMICONDUCTOR PACKAGING MARKET - KEY FINDINGS

3D wire bonded dominated the market in 2015 with over 43% of market share, however, 3D TSV is expected to witness the highest growth rate of 17% In 2015,

Die attach materials is estimated to be one of the fastest growing segment in coming years, growing at an estimated CAGR of 17.4%,

Asia-Pacific dominated the market in 2015, countries such as China, South Korea and Japan supported the growth in the region

In North America, United States accounts for over 70% of the overall market owing to high penetration of 3D TSV technology.

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TABLE OF CONTENTS

INTRODUCTION EXECUTIVE SUMMARY MARKET OVERVIEW GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET, BY

TECHNOLOGY GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET, BY

MATERIAL WORLD 3D SEMICONDUCTOR PACKAGING MARKET, BY

GEOGRAPHY COMPANY PROFILES

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3D SEMICONDUCTOR PACKAGING MARKET – TOP WINNING STRATEGIES

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3D SEMICONDUCTOR PACKAGING MARKET : SEGMENT REVIEW

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Factors Impacting 3D Semiconductor Packaging Market

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3D SEMICONDUCTOR PACKAGING MARKET - BY GEOGRAPHY

North America, Europe, Asia Pacific, LAMEA

Page 9: 3 d semiconductor packaging

1) Amkor Technology2) ASE group3) Siliconware Precision Industries Co.4) Jiangsu Changjiang Electronics Technology Co.5) SSS MicroTec AG.,6) International Business Machines Corporation (IBM)7) Intel Corporation8) Qualcomm Technologies9) STMicroelectronics10) Taiwan Semiconductor Manufacturing Company

COMPANY PROFILES

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semiconductor-packaging-market


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