APresentation

On“3D ICs”

Presented in partial fulfillment of Bachelor’s Degree in TechnologyRajasthan Technical University

Kota

 

  Session: 2011-2012

PRESENTED TO: PRESENTED BY: Garima Mathur Dinesh Kumar HOD, Deptt. of ECE (EC08033)  

Department of Electronics and Communication Engineering Jaipur Engineering College, Kukas 

CONTENTS

• INTRODUCTION

• IDEA FOR 3D IC

• LIMITED PERFORMANCE OF 3D IC

• 3D ARCHITECTURE

• MANUFACTURING TECHNOLOGY OF 3D ICs

• ADVANTAGES OF 3D ARCHITECTURE

• PERFORMANCE CHARACTERISTICS

• CONCERNS IN 3D CIRCUITS

• PRESENT SCENARIO IN 3D IC INDUSTRY

• CONCLUSION

INTRODUCTION

In electronics, a three-dimensional integrated circuit is a chip in which two or more layers of active electronic components are integrated both vertically and horizontally into a single circuit.

In contrast, a 3D IC is a single chip in which all components on the layers communicate using on-chip signaling, whether vertically or horizontally.

IDEA FOR 3D IC

The large growth of computer and information technology industry is depending on VLSI circuits with increasing functionality and performance at minimum cost and power dissipation and 2D ICs generate various gate delays and interconnection delay.

So to reduce these delays and total power

consumption, 3D IC technology is introduced.

Intel introduced 80 core chip in 2007 which run on the frequency of 1.4GHz.

LIMITED PERFORMANCE OF 2D ICs

As we try to increase the performance and

efficiency of chip, the complexity of chip design increases and this requires more and more transistors. So the final size of the circuit and delays increases.

The losses increases with large interconnection because the capacitance and resistances are generated in between the clad and copper.

3D IC ARCHITECTURE

3D IC is a concept that can significantly :- Improve interconnect performance, Increase transistor packing density,Reduce chip areaPower dissipation In 3D design structure the entire chip ‘Si’

is divided by number of layers of oxide and metal, to form transistors.

MANUFACTURING TECHNOLOGY OF 3D ICs

There are four ways to built 3D ICs :-1. Monolithic2. Wafer on wafer3. Die on wafer4. Die on die

1. Monolithic

Electronic components and their connections (wiring) are built in layers on a single semiconductor wafer, which is then diced into 3D ICs. There is only one substrate, hence no need for aligning, thinning, bonding, or through-silicon vias.

2. Wafer on wafer

Electronic components are built on two or more semiconductor wafers, which are then aligned, bonded, and diced into 3D ICs.

3. Die on waferElectronic components are built on two semiconductor wafers. One wafer is diced aligned and bonded onto die sites of the second wafer.

4.Die on dieElectronic components are built on multiple dice, which are then aligned and bonded.One advantage of die-on-die is that each component die can be tested first, so that one bad die does not ruin an entire stack

AVANTAGES OF 3D ARCHITECTURE

3D integration can reduce the wiring, thereby reducing the capacitances, power dissipation and chip area improves performance.

Digital and analog circuits can be formed with better noise performance.

It more cost effective then 2D integration.

PERFORMANCE CHARACTERISTICS

1. TIMING2. ENERGY

With shorter interconnects in 3D ICs, both switching energy and cycle time are expected to be reduced

1. TIMING

The graph shows the results of a reduction in wire length due to 3D routing.

Reduction in the interconnect lengths reduces RC delays and increase chip timing performance

2. ENERGY PERFOMANCE

The graph shows the reduction in a normalized energy consumption with number of wire layers.

CONCERNS IN 3D CIRCUITThermal Issues in 3D-circuitsReliability Issues

PRESENT SCENARIO IN 3D IC INDUSTRY

Many companies like MIT (USA), IBM are doing research on 3D IC technology and they are going to introduce cheaper chips for certain applications, like memory used in digital cameras, cell phones, handheld gaming devices etc.

The original cost will be 10 times lesser than the current ones.

CONCLUSION 3D ICs will be the first of a new generation

of dense, inexpensive chips having less delay and interconnection losses that will replace the conventional storage and recording media.

QUERIES???