3D PLUS

COMPANY PRESENTATIONTHEMIS Project Review

7th April 2004www.3d-plus.com

641, Rue Hélène Boucher78532 BUC - FRANCE

Agenda – THEMIS ReviewAgenda – THEMIS ReviewAgenda – THEMIS ReviewAgenda – THEMIS Review

• 15.30 15.30 Welcome Welcome

• 15.45 – 16.4515.45 – 16.45 3D PLUS Presentation3D PLUS Presentation

• 16.45 – 17.3016.45 – 17.30 Company Tour (2 groups)Company Tour (2 groups)- Hi-Rel Facility- Hi-Rel Facility- Industrial Facility- Industrial Facility

Company overviewCompany overviewCompany overviewCompany overview• 3D3Dplusplus mission :

Design, manufacture and sell 3D modules for Active, Passive, Opto-electronics and MEMS components packaging in Hi-Rel and harsh environment electronic applications

• 3D3Dplusplus Offer :Standard Products as well as Custom or Semi Custom Solutions.

• Established on 1995, Independent

• Technology and process are based on 3D PLUS's patents portofolio

• 3D3Dplusplus is the only one in Europe to specialise in this technology.

• Worldwide Rep network

• Existing production capability: 20 000 High Rel. modules per year

• Extension to 200 000 modules per year since Mid 2003 for Non Space

Markets

Company – Company – HistoryHistoryCompany – Company – HistoryHistory• Created in 1995 by C. VAL who was previously member of scientist and technical

council of Thomson Group

• In 2001, 3D3Dplusplus set up a subsidiary in Mc Kinney, Texas, USA.The head-quarter’s production Line was successfully evaluated/qualified by CNES, ESA and NASA.

• In 2002, 3D3Dplusplus released a increase of capital and built a new manufacturing plant in BUC, France for medium series manufacturing.

• Quality:

– ESA, CNES and NASA approval

– Customers agreement– ISO 9001-(2000) certified in April 2003

• 3D3Dplusplus will continue to strengthen its position in the following fields :– Space– Military / Aero– Niche Automotive and Industry– Medical– High Performance Computers, embedded Computers, Servers and Workstations, DIMM

on Module Memory boards.

• 3D3Dplusplus will continue to set up partnerships with application specialists like Astrium, Alcatel, Hewlett Packard, Nortel, PNY, … to develop and offer state-of-the-art standard products.

Siparex7,90%

Priam / Siparex 7,20%

Thomson Multimedia

5,50%

ThalesCorporate Ventures 15,00%

Founders and Employees31,80%

Credit Lyonnais7,90%

NIF7,90%

France Telecom / Innovacom Ventures 14,40%

Company – ShareholdersCompany – ShareholdersCompany – ShareholdersCompany – Shareholders

• Capital : 1 139 780 Euros

• 3D PLUS is an independent Company

Company – Company – LocationsLocationsCompany – Company – LocationsLocations

3D3Dplusplus Head-Office, Design and Technology Center,High Rel. Manufacturing line qualified for Space Applications :

641, rue Helene-Boucher78532 Buc, France

3D3Dplusplus Medium Series Manufacturing Line :

423, rue Audemars78532 Buc, France

3D3Dplusplus USA :Marketing and Sales Office for North America

2570 Eldorado Parkway, Suite 150McKinney, TX  75070, USA

Company – Company – Key figuresKey figuresCompany – Company – Key figuresKey figures

Annual Sales ( Million Euro)

78%

12%10%

SPACE

DEFENCE

INDUSTRIAL

Annual Sales Market Split Annual Sales Product Split

80 % Memory

7 % Computer

6 % Camera2 % Sensors

5 % Power Supply and Misc.

0

1

2

3

4

5

6

1998 1999 2000 2001 2002 2003

Company – Company – Organization Chart (1/3)Organization Chart (1/3)Company – Company – Organization Chart (1/3)Organization Chart (1/3)3D +/P M12/01/04 3D PLUS 2004 - Organization

Business UnitHi-Rel

R esponsib ility:Inc. S tatem ent o fthe Business U nit

P .M aurice

Business UnitIndustrial

R esponsib ility:Inc. S tatem ent of

the Business U nit

C .V al

Marketing &Sales Group

R esponsib ility:Book ing of3D + G roup(Fr+U SA)

P .E .Berthet

FinancesGroup

M . B raun

Administration& Human

ResourcesGroup

C . Leb lanc

Research &Innovation

Group

O . L ign ier

QualityAssurance

Group

D . B la in

General Management:P resident: C .V a lG enera l M anager: P . M aurice

R esponsib ility: Shareholders contact: C .Val G enera l C om pany M ngt: P . M aurice Sales G roup: P .M aurice F inances G roup: P .M aurice Adm . & H R G roup: P .M aurice R &I G roup: C .Val Q A G roup: P .M aurice

Business U nits

Business Unit3D+ USA

R esponsib ility:Inc. S tatem ent of

the Business U nit

J. Q u inn

Company – Company – Organization Chart (2/3)Organization Chart (2/3)Company – Company – Organization Chart (2/3)Organization Chart (2/3)

Business UnitHi-Rel

R esponsib ility:Inc. S tatem ent o fthe Business U nit

P .M aurice

New ProjectsGroup

J.F .G oupyM .C . V assa l

Design & ITGroup

R . B ocage

Hi-Rel Process& Purchasing

Group

F.S ouffle t

Test Group

T .D argn ies

Hi-rel SalesGroup

R esponsib ility:H i-R el Book ing -

N on U SA

R .Frank

R attached to sa lesG roup

3D+ USAHi-Rel activity

R esponsib ility:H i-R el Book ing -

U SA

J.Q u inn

Hi-RelManufacturing

line

P .P rieur

Hi-Rel Business Unit Organization

Company – Company – Organization Chart (3/3)Organization Chart (3/3)Company – Company – Organization Chart (3/3)Organization Chart (3/3)

People : 60 persons

3D Plus USASales

R esponsib ility:Book ing U SA -W ithout R &D

J. Q uinn

FieldApplication

Engineer

R esponsib ility:T BD

P . Lartigues

SalesAdministration

R esponsib ility:Sales Adm inistration

M .R ém y

Sales Group

R esponsib ility:Book ing of3D + G roup(Fr+U SA)

P .E .Berthet

Hi-Rel SalesGroup

R esponsib ility:H i-R el Book ing -

N on U SA

R .Frank

Industrial SalesGroup

R esponsib ility:Industria l Book ing -

N on U SA

B . B erne

Sales Group Organization

R&D Sales

R esponsib ility:R &D Book ing W W

C . V a l (A cting)

P .E . B erthet (A cting)

B .H airabetian

3D+/PM 05/01/04

Company – Our Rep NetworkCompany – Our Rep NetworkCompany – Our Rep NetworkCompany – Our Rep Network

FranceFranceFranceFrance

SpainSpainSpainSpain

IsraëlIsraëlIsraëlIsraël

GermanyGermanyGermanyGermany

NetherlandsNetherlandsNetherlandsNetherlands

IndiaIndiaIndiaIndia

JapanJapanJapanJapan

Great BritainGreat BritainGreat BritainGreat Britain

CanadaCanadaCanadaCanada

USAUSAUSAUSA

ItalyItalyItalyItalyKoreaKoreaKoreaKorea

South AfricaSouth AfricaSouth AfricaSouth Africa

ScandinaviaScandinaviaScandinaviaScandinavia

ChinaChinaChinaChina

RussiaRussiaRussiaRussia

BrazilBrazilBrazilBrazil

ArgentinaArgentinaArgentinaArgentina

3D PLUS Standard Products3D PLUS Standard Products3D PLUS Standard Products3D PLUS Standard Products

MEMORY MODULES,COMPUTER MODULES,CAMERA HEADS, SENSORS,DC/DC CONVERTERS.

CD-ROM Menu: Standard Product List, Flyers, Data sheets, User guides,Applications Notes, Starter Kits…

• Custom and Semi-custom Products– System In Package ( S.I.P )

• Hight density packaging with interconnection in 3 dimensions.

• Drastic size, volume, weight reduction

Custom, semi-custom ProductsCustom, semi-custom ProductsCustom, semi-custom ProductsCustom, semi-custom Products

Calculation Core

On this example, gain of : 14 times in weight , 16 times in volume

TechnologyTechnology Flow Charts Flow Charts ( ( Flex Process )TechnologyTechnology Flow Charts Flow Charts ( ( Flex Process )

1 ) - Flex Design

2 ) - Component attachment

3 ) - Circuit Test & Screening

4 ) – Layers Stacking

6 ) – Cube Sawing

5 ) – Cube Molding

7 ) – Cube Plating ( Ni + Au )

8 ) – Circuit interconnection by laser

grooving

9 ) – Cube Test & Screening

TechnologyTechnology Flow ChartsFlow Charts ( TSOP ( TSOP Stacking Process)

TechnologyTechnology Flow ChartsFlow Charts ( TSOP ( TSOP Stacking Process)

1 ) – Package Selection and Procurement( TSOP, CSP…)

2 ) – Modify Component Pins

3 ) – Components Stacking

4 ) – Cube Molding

6 ) – Cube Plating ( Ni + Au )

7 ) – Circuit interconnection by laser

grooving

5 ) – Cube Sawing 8 ) – Cube Test & Screening

The components are stacked up Size reduction on the PCB, weight savings for the application.

The components are fixed into resin High mechanical resistance (vibrations, shocks, …)Humidity resistance enhancement

The interconnection is reduced and Higher electrical performance, simplified electrical signal integrity

The components can be shielded Considerable parasitic effect decrease, EM and Radiation tolerance enhancement

Simplified Manufacturing processes Flexibility and short development time of new designs

Cost effectiveness, short manufacturing lead times due to the use of simple and well proven technologies

‘Cold’ Plating Process compatibility with future lead free soldering processes used for the 3-D interconnection

Main Features and BenefitsMain Features and BenefitsMain Features and BenefitsMain Features and Benefits

Qualification tests withstanded by 3D PLUS ModulesQualification tests withstanded by 3D PLUS Modules

Stress Conditions Test method

Extended Thermal Cycles 500 cycles –55 to 125°C MIL-STD-883 M1010 Cond. B Extended Thermal Cycles 500 cycles –65 to 150°C MIL-STD-883 M1010 Cond. C Thermal Cycles under vacuum

10^-6 torr 10 cycles –40°C/+70°C Specific

Low Temp. Storage -130°C Specific

High Temp. Storage 2000hrs / 150°C MIL-STD-883 M1008J ESD22-A103-A

High Temp. Operating under pressure 1000hrs / 150°C / 1000 bars Specific

Dynamic Life Test 2000hrs / +125°C MIL-STD-883 M1015

Power cycling 30K cycles on/off 120s on (+110°C) 60s off (+40°C)

Specific

THB Test 1000hrs +85°C/85%RH MIL-STD-202 M103 HAST 264 hrs / +110°C J EDEC STD 22TMA110 Salt Atmosphere (varnished modules) 24hrs MIL-STD-883 M1009 Cond.

AJ ESD22-A107-A Cond A Mechanical shock Y1-0.5ms-1500g MIL-STD-883 M2002 Cond. B Peak acceleration 40 000g Specific

Sine Vibrations 20Hz-2000Hz peak acceleration 20g/3axes MIL-STD-883M2007 Condition A

Random Vibrations / / to mating plane 30g/15mn to mating plane 30g/15mn

MIL-STD-883 M2026Condition I level H/ J

Outgassing TML&RML<1% CVCM<0,1% ESA-PSS-01-702 MA

Lead integrity 3d plus MIL-STD-883 M2004 Solderability 3d plus MIL-STD-883 M2003 Marking permanency 3d plus MIL-STD-883 M2015

Thermal Cycling

Endurance Testing

Resistance to Humidity

Temperature Storage

Outgazing

(((

(

(((

Mechanical Resistance

MIL-883 packaging tests for standard

components

• Technology Vehicle Definition :

– Module : test vehicle integrating 4 TSOP 64 Mb, 8 chip capacitors, 8 chip resistors, 2 thermal sensors, 2 mechanical constraint sensors.

– Constitution : 10 internal layers + SMT connexion layer

– Dimensions : 26 * 15 * 16,2 mm

– Number of I/O : 114

– Manufacturing : According to PID 3D PLUS “Process Identification Document – Technologie 3D” Ref. 3300-0546.

– Screening : According to PSS-01-608

– Tests under approval of ESA, CNES and NASA.

TSOP 64Mb DRAM

TSOP 64Mb DRAM

2x C 0805

TSOP 64Mb DRAM

2x CTantal2x C

1210

2x C0805

TSOP 64Mb DRAM

Film 10

Film 9

Film 8

Film 7

Film 6

Film 5

Film 4

Film 3

Film 2

Film 1

Grid 0

3D Technology Evaluation (1/5)3D Technology Evaluation (1/5)3D Technology Evaluation (1/5)3D Technology Evaluation (1/5)

Flex 2

Flex 3

Flex 1

Flex 4

Flex 5 Flex 6

Flex 7

Flex 8

Flex 9

Flex 10

CESAR Module

3D Technology Evaluation (2/5)3D Technology Evaluation (2/5)3D Technology Evaluation (2/5)3D Technology Evaluation (2/5)

• Technology vehicle Description

10x cubes on PCB :THERMAL CYCLES UNDER VACUUM 10-6 Torr

10x Cycles – 40°C / +70°C , 2°C/mn , 1hr par palier

8x cubes on PCB :4x with thermal cycles.

4x without thermal cycles.

Thermal Cycles500x VRT

– 55°C / +125°C10°C/mn , 15mn par palier

External visual inspection & Electrical tests at –55°C/+25°C/+125°C

External visual inspection & Electrical tests at +25°C

4x cubes on PCB :2x with thermal cycles.

2x without thermal cycles.

Temperature &Humidity

under Bias1000hrs

+85°C & 85% RH

4x cubes on PCB :2x with thermal cycles.

2x without thermal cycles.

Life Test or HighTemperature Storage

2000hrs+125°C

4x cubes on PCB :2x with thermal cycles.

2x without thermal cycles.

Power Cycling30000x ON/OFF

120s ON (+110°C)60s OFF (+40°C)

External visual inspection&

Electrical tests–55°C/+25°C/+125°C

at100, 300 & 500 cycles

External visual inspection&

Electrical tests–55°C/+25°C/+125°C

at240, 500 & 1000 hrs

External visual inspection&

Electrical tests–55°C/+25°C/+125°C

at500, 1000 & 2000 hrs

External visual inspection&

Electrical tests–55°C/+25°C/+125°C

at15K & 30K O/O cycles

Final DPA

3D Technology Evaluation (3/5)3D Technology Evaluation (3/5)3D Technology Evaluation (3/5)3D Technology Evaluation (3/5)• Evaluation flow-chart :

• TEST RESULTS

– All test results are satisfactory

– Evaluation successful and huge margins defined versus space qualification level requirements.

Remark : Evaluation report written by ESA, CNES and NASA are available.

• Evaluation approval successfully pronounced by ESA, CNES and NASA

• 3D PLUS was introduced in NASA QPL

• Kick-Off for formal generic qualification

3D Technology Evaluation (4/5)3D Technology Evaluation (4/5)3D Technology Evaluation (4/5)3D Technology Evaluation (4/5)

• Initiated in September 2001 under control of ESA and CNES

• Choice of 3 functional qualification type 3D modules

– Memory stack of 8 TSOP (SDRAM)

– Microcomputer

– DC/DC converter 4W

• Qualification phase :

– Approval of the formal 3D Plus PID

– Manufacturing of 12 modules of each type

– Qualification test sequenceDC/DC Converter 4 W

Memory Cube (8 stacked TSOP)

DSP Computer Core

3D Technology Evaluation (5/5)3D Technology Evaluation (5/5)3D Technology Evaluation (5/5)3D Technology Evaluation (5/5)

3D PLUS Technology Qualification3D PLUS Technology Qualification3D PLUS Technology Qualification3D PLUS Technology Qualification

• Several Project/Product Qualification successfully passed since the beginning of 3D PLUS for COROT, CLUSTER II, PROBA, SMART 1, ROSETTA, MARS EXPRESS, ENVISAT…

• Successful Generic Evaluation by CNES/ESA/NASA on December 2001• See CNES/ESA Evaluation report (ESCCON 2002 – France)• See NASA Evaluation report (ESCCON 2002 – France)

• Generic Qualification by CNES/ESA on 4Q2003• Final Presentation of the 3D qualification (Document ref. 3300-0563-3) will take

place at ESTEC on 28th April 2004.

• Several Customer’s Internal Agreements in the Space Industry

• Successful ISO 9001-2000 Certification on April 2003

3D PLUS Technology, Processes and Products benefit from a large experience and a high quality referential

3D PLUS Quality Manual Generic quality process at 3D PLUS.

Process Identification Document Freeze the qualified technological capability domain of 3D PLUS (i.e Process list, inspection criteria, material list, parts procurement rules, screening test, …)

Product Configuration Management : CADM Module procurement specification Product definition Manufacturing travelers Test specification Product Assurance Plan

End Item Data Package : Include all the traceability information (material, parts, operations, LAT,…) of the manufactured lot As built/As design configuration list for the manufactured modules

Manufacturing and quality assurance of stack productionQuality Assurance Documents

Manufacturing and quality assurance of stack productionQuality Assurance Documents

• Product Identification Document (PID) ref. 3300-0546-2 for :– Parts procurement,– Modules manufacturing,– Modules screening,– Lot Acceptance Test.

The PID is compliant to ESA quality standard for Space applications.

• Quality levels for Space applications :3 quality levels are defined in 3D PLUS PID and described in the

document ref. 3DPA0350 : – Commercial– Industrial => Engineering Models for Space applications– Space => Flight Models for Space applications

Quality levels and screening flow chartQuality levels and screening flow chart

3D PLUS Standard Services For Space Application3D PLUS Standard Services For Space Application3D PLUS Standard Services For Space Application3D PLUS Standard Services For Space Application

• Basic Parts Procurement and Selection (Lot Acceptance Tests)

• Radiation Tolerance Verification Tests (Radiation Hardness Assurance activity of 3D PLUS includes Total Dose and SEU/SEL tests)

• 3D Modules Manufacturing

• 3D Modules Lot Acceptance Tests and DPA

• End-Item-Data Package (full trace for manufacturig, screening, tests results, parts and material …)

3D PLUS is the One-Stop Shop for Space Qualified Parts procurement

• 1997: First order of Memory Modules (Flex process) for Space Applications – Cluster 2 - ASTRIUM GmbH – Cooperation with IBM

Product : Stacks of 10 Die 16Mb DRAM FPM from IBM (4 stacks mounted in an hermetic package) with a total capacity of 640Mb (40Mx16)

~1000 Flight Models manufactured for Cluster-2 / Envisat / Metop projects for ASTRIUM

 

• 1998: First order of Memory Modules (TSOP process) for Space Applications –Microsat Project - CNES

Product : Stacks of 4 TSOPs 64Mb DRAM EDO from Samsung

Capacity: 256Mb (32Mx8)

• 2000: 512Mb SDRAM Development for Space applications

Product : Stacks of 8 TSOPs 64Mb SDRAM From Samsung

~5000 Flight Models manufactured For Radarsat (Canada), Cosmo/Skymed (Italy)

•  2001: Development of a Micro Computer module based on the TSC21020 DSP and replacing a double Euro Computer board

~50 Flight Models manufactured for Rosetta, Mars Express, Smart-1, Net-Lander (ESA)

• 2001 : Development of a micro camera for space applications

~50 Flight Models manufactured for Rosetta and Smart-1

3D PLUS3D PLUS Heritage for Space Applications (1/2)Heritage for Space Applications (1/2)3D PLUS3D PLUS Heritage for Space Applications (1/2)Heritage for Space Applications (1/2)

• 2001: 16 Mb SRAM and 4 Mb EEPROM Development for Space applications ~1000 Flight Models manufactured For USA / Germany / France / Spain ...

• 2001: 2Gb SDRAM Development for Space applications

• 2002 Stacks of 8 TSOPs 256Mb SDRAM From Samsung and Elpida~2000 Flight Models manufactured For Canada / Israel / USA / Argentina / Sweden / France... ~500 Flight Models manufactured for CryoSat & TerraSAR Projects with ASTRIUM GmbH

• 2002: Successful evaluation from CNES / ESA / NASA(GSFC) • 2003 Stacks of 4/8 TSOPs 512 Mb SDRAM From Samsung and Elpida~ 3500 Flight Models manufactured For Israel / Japan …

• 2003: Qualification CNES / ESA  Today: 3D PLUS is involved in the major European space projects with the delivery of memory

modules for Solid State Recorders as well as On-board Computers.

3D PLUS3D PLUS Heritage for Space Applications (2/2)Heritage for Space Applications (2/2)3D PLUS3D PLUS Heritage for Space Applications (2/2)Heritage for Space Applications (2/2)

Company – ReferencesCompany – ReferencesCompany – ReferencesCompany – References

ALCATELALCATELANURAGANURAG

ASIEOASIEOASTRIUMASTRIUMATMELATMEL

BALL AEROSPACEBALL AEROSPACEBRISTOL AEROSPACEBRISTOL AEROSPACE

CALCULEXCALCULEXCNESCNESCNRSCNRS

CONAECONAECONRAD TECHNOLOGIESCONRAD TECHNOLOGIES

CONTRAVESCONTRAVESCSEMCSEMDGADGADLRDLR

DORNIERDORNIEREADS AIRBUSEADS AIRBUS

EADS SIEADS SIEFEREFERESAESA

FORTFORTFRAMATOMEFRAMATOME

GAIA CONVERTERSGAIA CONVERTERSHEWLETT PACKARDHEWLETT PACKARDHIGHWAVE OPTICALHIGHWAVE OPTICAL

IAIIAIIGGIGG

IMECIMECINVAPINVAPISROISRO

LABENLABENLATECOERELATECOERE

MBTMBTMEDIGUSMEDIGUS

MERCURY COMPUTERSMERCURY COMPUTERSNASA (GSFC, JPL)NASA (GSFC, JPL)

NEOGUIDENEOGUIDENORTELNORTEL

NT SPACENT SPACEOPSITECHOPSITECHPHS MEMSPHS MEMS

PNYPNYRICHARD WOLF ENDOSCOPESRICHARD WOLF ENDOSCOPES

SAAB ERICSSON SPACESAAB ERICSSON SPACESATRECISATRECI

SCHLUMBERGERSCHLUMBERGERSOPROSOPRO

SURREY SATELLITE TECHNOLOGYSURREY SATELLITE TECHNOLOGYTECHNO SYSTEMSTECHNO SYSTEMS

TECHNOLOGICATECHNOLOGICATHALESTHALES

UTMC - AEROFLEXUTMC - AEROFLEXVALEOVALEOWEDCWEDC