© 2006 IBM Corporation

Collaborating to Design Power Supplies

Giacomo Catucci Alfredo FappianoRick Fishbune Eric Swenson

ISC Engineering

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ISC Engineering

© 2006 IBM Corporation

IBM Customer Expectations

ValueCompetitive cost

“ Bulletproof ” ReliabilityNo downtime

Leading PerformanceDynamic workload management

Industry leading clustering

QualityFlawless hardware Installation and manufacturing

execution

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© 2006 IBM Corporation

Introduction

Power designs are becoming increasingly complex.

Today’s design requirements span a breadth of expertise not residing in any one group alone.

Multiple issues have surfaced design weaknesses due to component selection and application.

Collaboration is necessary for end product quality and customer satisfaction.

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Objective

To implement a collaborative design process between power assembly supplier, ISC Engineering, and component suppliers.

Proposed methodology will include:– Component selection

– Collaborative team meeting : Critical power train circuit review

– Qualification

Challenges and Benefits

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Power Supply Development Models Over the Years

DefinitionsBlue Box: IBM designed power supply and IBM built power supply. Main model in 1970’s for power supply assemblies.White Box: IBM designed power supply. Supplier built. Components typically consigned by IBM. Main model in 1970’s and early 1980’sGray Box: IBM designed power supply. Supplier built. Components purchased by supplier. Main model from 1980’s to today for high-end power and some mid-range assemblies.Black Box: IBM defines requirements in an engineering specification and mechanical print. Supplier designed power supply. Supplier built. Supplier owns bill of material which is reviewed and approved by IBM. Main model from 1980’s to today for low-end and mid-range power.

Development and Process Steps remain essentially the same for the various development models. Main difference is who is the owner of the step.

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Power TrendsIncreasing Requirements

– Reliability

– Power Density

– Transient Response

– Efficiency

– Current

– Hot Swap / Redundancy

Decreasing Requirements– Voltages

– Cost

– Development Cycles

1998 2000 2002 2004 2006 2008

Low EndHigh End

0

5

10

15

20

25

30

35

40

Year

Power Density (W/cu-in)

Low End High End

Processor Voltage/Current Trends

0

0.5

1

1.5

2

2.5

3

1998 2000 2002 2004 2006 2008

Year

Pro

cess

or V

olta

ge (V

)

020406080100120140160180

Pro

cess

or C

urre

nt (A

)

Voltage Current

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Brand Subsystem Plan• Subsystem Architecture• Power / Packaging Req.• Competitive Analysis

Power Products – “End to End” Process Management

KickOff

Prelim.Docs

CaptureRequirements

AnalysisDesign

Interlock

DevelopmentProcurementQualification

Suppliers

Source

RFI / RFQSuppliers

SupplierResponseEvaluation

DecisionAnalysis

DevelopmentProcurementQualification

Quality

Award ofBusiness

Develop

DesignReview

DevelopmentProcurementQualification

QualitySupplier

DevelopmentProduct Safety

EvaluationFunctionalEvaluationReliability

Plan ReviewPN/FRU Reliability

ME Doc Setup

Qualification Tests(Supplier / IBM)

Test-to-SpecVerificationComponentAssessmentSystem Level

TestingMfg. AssessmentProcess Review

Commodity SafetyAgency Approval

ReliabilityVerification

Qualify

SystemIntegrationTest (SIT)

TUC “B”Checkpoint

Supplier ProductionProcess Review

SystemSafety Approval

FOT / ELP2Support

GeneralAvailability

Track / Improve / ReportSupplier Line Fallout

IBM FFC Mfg. IQL

Customer Returns

Supplier Site Audits

Data Collection andFailure Analysis (SQMS)

Supplier Assessment and Surveillance (QIN)

Problem ManagementSupplier IBM Brand

Management Performance Reviews-Supplier performance Review-Monthly Quality Reviews-Monthly Brand Quality Reviews

Change Management-Supplier Design and Parts Control-IBM Design and Doc. Control-IBM FFC Production Control

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Strengths and Weaknesses of Current Process

StrengthsWell defined sourcing model

– Design, quality, and commercial teams involved

Design reviews early in process– Topology review

– Mechanical and connectors

– Test requirements

Development process– Design analysis checklist process

– Component derating guidelines

– Anti-smoke checklist and testing

Quickly adapting to changes– Schedule shifts

– Requirements changes

State-of-the-art reliability testing– HALT / Guardband

– Thermal imaging

Lessons learned process– Processes updated based on past issues

WeaknessesSchedule maintenance

– Not completing tests on schedule

– Incomplete testing causing extra design passes

– Reliability tests later in design process

New power assembly suppliers have difficult time with established processes

– Design verification process

– Production test requirements

– Spacing guidelines

– Derating guidelines

– Anti-smoke requirements

Limited component evaluation– Supplier sources used in critical applications

– Supplier component qualification process

– Application review

– Continuity of supply / alternate source issues

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Collaboration

IBM

Power Assembly Supplier Component Supplier

Collectively leverage our individual core competencies

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Proposed Methodology (Collaboration)

Component Selection

Use of Preferred SuppliersComponent supply base should be reviewed and agreed upon by the collaborative teamDefine criteria and process to adopt a new supplier

Cost and delivery schedule should not be the only deciding factors in component selection

Component supplier should demonstrate component performance withmeasured electrical, thermal, and reliability data

Reliability stress should simulate worst case application conditionsWell defined quality and reliability support structureField Applications Engineering support

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Proposed Methodology (Collaboration)

Collaborative team meeting : Critical power train circuit reviewIBM, Power Assembly Supplier, and Component Supplier to ensure:

Early involvement to review critical circuits for optimum resultsDerating / Anti-Smoke application requirements are met

IBM Derating Specification 97P3214IBM Anti-Smoke Specification 97P4412 and checklist

Use of lessons learned and judgment based on experienceSingle point of failure eliminationComponents to be selected such that sufficient margin is available with respect to design requirementsComponent application approvalBest technology/best practices are employedTechnology is well matched to the application (suitable)

Topology vs. component technologyRuggedness

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Qualification

Define qualification requirements for critical components and power assembly:Key MOSFETs, Caps (Bulk, Filter, etc.), PCBs, Magnetics, Power ICs (controllers, switching regulator, etc)Requested tests may be in addition to industry standard qualification testingAll component types should have a minimum qualification standardCollaborative FMEA Review and corrective actions for HALT testingIncorporate smoke testing earlier in design processEarly thermal testing using both thermocouples and IR thermal analysis

Qualification matched to system level needsDifferent systems may require different levels of qualificationCorner testing

Testing should be performed under high and low combinations of voltage, temperature, load, etcWorst case component environment should be considered

Voltage, temperature, humidity, elevation (due to cooling effectiveness)

Define the process to review and approve changesPCNs and additional sources

Agreed to definition of a critical PCN or source changeTo test, or not to test?

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ChallengesImplementation

Reviews can be time consuming and it may take time to get final approvalsGetting appropriate component supplier subject matter expert to attend

– Many different key suppliers in a design– Will require many meetings – one per critical component supplier

Alternate sources – How do you deal with multiple suppliers for critical components?Adding tasks to the current design process – change can be hard

Resources

Collecting information for reviewRedirecting the resources in the process

– To perform and/or review component qualification work– To monitor supplier processes and changes

Travel – audits and other supplier visits

Business

Sharing proprietary information – 3 way NDA’sAdded direct cost for qualification and reviewsMay reduce the available approved component supplier setBuy-in… is it really worth the added time and effort?

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Main Benefit – Fewer Component IssuesThe main benefit of all this work is to eliminate field issues like:

Misused MOSFET

Core Material Issue

Good Material Bad Material

Cracked Capacitor – Layout Issue Overstressed Capacitor

Tantalum < 3X Voltage Derating

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Return on Investment

Improved Customer Satisfaction

Improved Customer Satisfaction

Improved Customer Satisfaction

Ongoing successOngoing successOngoing success

Improved relationshipImproved relationshipImproved relationship

Improved reliabilityImproved reliabilityComponent reliability feedback process

Reduced warranty costsReduced warranty costs(reduced RMA requests)

Reduced warranty costs (reduced RMA requests)

Reduced customer returns & expended FA resources

Reduced customer returns & expended FA resources

Reduced customer returns & expended FA resources

Reduced power assembly cost

Reduced BOM cost through optimized component usage

Reduced manufacturing costs by designing in newer technologies/products

IBMPower Assembly Supplier

Component Supplier

Red

uced

Cos

tsC

ustS

at &

Gro

wth

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Summary

Today’s design requirements span a breadth of expertise not residing in any one group alone. We need to leverage the resources we have.

A collaborative design process was reviewed which includes component selection, a collaborative team review meeting of the critical power train circuits, and qualification that would improve end product quality and customer satisfaction.

We acknowledge the investment but recognize the benefits for everyone. Our collective success depends on our ability to collaborate.