5/20/2019 1 · This document contains proprietary and privileged information of Sunshine Global...

5/20/2019 www.sunshinepcb.com 1

2

Notification of Proprietary Information: This document contains proprietary and privileged information of Sunshine Global Circuits, and its release is in accordance with NDA agreements. Its receipt or possession does not convey any permission to reproduce or disclose its contents to any third‐party. Please do not reproduce, disseminate, or disclose this information (in part or in whole) without specific written authorization from Sunshine Global Circuits.

www.sunshinepcb.com

Safe Harbor Statement (for Public Company): The information presented may include predictions, estimates or other forward‐looking statements regarding Sunshine Global Circuits. While these statements represent our current opinion and best estimate on what the future holds, they are subject to uncertainties that could cause actual results to differ. You are cautioned not to place undue reliance on these statements when making investment decisions. We are not obligated to revise or publicly release the results of any revision to these statements.

5/20/2019

Sunshine Global CircuitsCompany Presentation

May 2019


Strategy

High Mix Manufacturing

High Technology and Quality

Prototype to Production

Global Support & World‐Class Service

45/20/2019 www.sunshinepcb.com

Milestones

5

Acquired Rinde PCB in Germany, renamed Sunshine PCB GmbH

Established Sales Subsidiary in Germany. Achieved ISO13485 Certification

Established Sales Subsidiary in USA. Ranked 58 in CPCA China Top 100 List

5 million RMB investment on waste and air treatment facilities

2008

2004 TS16949 and ISO14001 Approved, Capacity 30K m2/month

2001 Shenzhen Sunshine founded, ISO‐9001:2000 Approved

Awarded “China High‐Tech Enterprise and “Green Enterprise 2008”

2009

2011

2012

2013

2014 Began production in new 500K ft2 facility in Jiujiang, China

2016

2018

Annual sales reached $122M, total capacity reached 60K m2 per month

Sales reached $170M USD. Listed on the Shenzhen Stock Exchange, 300739.sz

Global Presence

6

3 Manufacturing Facilities 8 Sales Tech Support Offices 80 Sales Representatives

Sunshine USA

Sunshine Asia

Sunshine Europe

Global teams provide technical support and customer service ‐ “Same Time Zone & Same Language”.

2011Sunshine Circuits USA, LLC

2012Sunshine PCB GmbH

2013Sunshine PCB GmbH

2014Sunshine Jiujiang

2001Sunshine Shenzhen


Complete PCB

Solutions

Wide Product Mix

7

Backplane

Metal Backed

Impedance Controlled PCB’s

Rigid/Flex

HDI

Heavy Copper

Sequential Lamination

High Performance Materials


Sunshine Shenzhen (SZ)• Established in 2001 (Chinese name 明阳电路)

• 2L‐36L Multilayers, HDI/BBV, High Speed PCB’s

• 15,000 m2 (160K ft2) facility with 1150 employees

• 30,000 m2 (350K ft2) monthly capacity

• High Mix and High Technology

• Wide variety of materials with UL approval

• Prototypes in 5 days


• 33‐acre site located near the city of Jiujiang• From Shenzhen: 2 hours by plane + 2 hours by car• From Shanghai: 1.5 hour by plane + 2 hours by car

• Focused on 2L‐10L, Prototype to Production• 46,000 m2 (495K ft2) facility with 1000 employees• 60,000 m2 (650K ft2) monthly capacity• Prototypes in 5 days

Sunshine Jiujiang (JJ)


Sunshine Shenzhen

The city of Jiujiangis located in the northern part of JiangXi Province, near Nanchang.

Sunshine Europe• Located in Remscheid, near Düsseldorf, Germany

• Founded in 1966, acquired by Sunshine in 2013

• 2L‐16L Multilayers, Rigid‐flex, Aluminum‐PCB

• 3,300 m2 (35K ft2) facility with 40 employees

• New equipment and technology upgrades

• Fast support of European customers• Production of small quantities in 2 to 3 weeks• Prototypes in 5 days


0

50

100

150

200

20012002200320042005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017 2018

2 5 8 16 18 20 26 34 3649 58 62 72

90101

122

152170$ Million

Year

Annual Revenue (USD)

Stable Growth


North America30% Europe

41%

Asia24%

R.O.W.5%

Sales by Region

2L19%

4L21%

6L21%

8L15%

10L15%

12L+10%

Sales by Layer

Industrial40 %

Energy Power15%

Automotive14%

Medical13%

Telecom12%

Consumer3%

Others 3%

Sales by Market

<5 m2

53%

5‐10 m2

21%

10‐30 m2

19%

30‐50 m2

4%

50‐100 m2

2%

>100 m2

1%

Sales by Order Size

60 new projects per day.Average 6500 orders/month, 200+ orders/day, 13m2 per order.

95% of products are exportedHDI, Rigid/Flex, and Flex are included

Energy/Power include heavy copper (3oz) boards.Auto/Medical products have high reliability requirements.

Sales Distribution


Customers

13

IndustrialTechnology

Medical

Automotive

Telecom

EMS

Audio/VisualConsumer


Deliverables• Quotes in 24 hours or less

• Standard production leadtime of 20 working days (4 weeks)*

• Prototype leadtime of 5 to 10 working days (1‐2 weeks)*

• Stack‐ups and impedance simulation in 36 hours

• Initial response to technical questions or quality concerns in 36 hours

• DFM and EQ’s prior to PO placement upon request

* Leadtimes are working days (5 days = 1 week), andexclude EQ, material leadtime, and shipping.Leadtimes stated are for limited technologies and finishes, HDI, sequential lam & rigid‐flex will require more leadtime.


Quick Turn Offering• 5 days Quick Turn Service

• 2L to 16L (one lam cycle)• FR4 materials in stock• ENIG/OSP/HAL‐LF/ImmSn• Maximum 10 working panels, ≤ 3 m2 (32 ft2, 18”x24”)

• Lead‐time Adders:• > 16L (1 lam cycle): 7 to 10 days• Non‐Conductive Via Fill: Add 1 to 2 days• HDI: 1+N+1 add 2 days, 2+N+2 add 5 days• Gold Fingers, Mixed Finishes, ImmAg, Backdrill: Add 1 day

• For additional requirements, please contact us for quote


Quality System• Sunshine Global has mature and stringent Quality Systems

• All product are 100% AOI, 100% ET, and 100% FQC+FQA

• SPC and Cpk programs for process control

• Lean Manufacturing and 6S programs

• Advanced inspection and test equipment

• Chemical, Physical, and Failure Analysis Labs• SEM/EDS, CAF, Temp & RH Chamber, etc.

• Standard QA report with every shipment

• AS9102 First Article Reports are available

• RoHS, REACH and Conflict Minerals Compliance


Shenzhen Plant Certs• ISO 9001: 2015• IATF 16949: 2016• ISO 13485: 2016• ISO 14001: 2015• ISO 14067: 2013

Jiujiang Plant Certs• ISO 9001: 2015• IATF 16949: 2016• ISO 13485: 2016• ISO 14001: 2015

Why use Sunshine?• Direct manufacturer with multiple production facilities• Quick‐turn, prototypes and volume production• Local FAE/DFM, tech support, quoting, logistics• Consistent quality and delivery performance• Broad technical capabilities – “1 Stop Shop”• Flexibility and 24/7 service• VMI, consignment stocking available• Financial stability• Long term partnership


Technology


Technology Development• Sunshine is committed to technology development

• Our CTO David Aldape is based in Shenzhen and has over 30+ years of industry experience

• Dedicated R&D Engineers and NPI Prototype Team

• Development projects for 2019 include:• Pulse Plating for Aspect Ratio of 30:1 or higher

• High layer count 40+, Very thin multilayers with Microvias (6L, 0.4 mm thick)

• XACT integrated software system for improved L2L registration

• New materials for HDI, High Speed (Low Dk/Df), Ultra High Speed & Low Loss

• ELIC (Every Layer Inter Connect) and Deep Microvias (L1‐L3)

• Thermal Management Solutions (Metal Core, Copper Coins, Copper Inlay)

• Inkjet soldermask and other printable inks

• Innovative via structures – Ormet copper paste

• Embedded Wires, Embedded Capacitors

19

Copper Filled Micro Viaswith Buried Vias

David Aldape


Material Type Supplier Product Tg (°C)

High‐Tg FR‐4

ShengYi S1000‐2 175

EMC EM‐827 175

Isola 370HR 175

Mid‐Tg FR‐4ShengYi S1000H 160

SHA Nanya NY2150 160

Low‐Tg FR‐4 ShengYi S1141 140

Halogen‐Free FR‐4ShengYi S1155 / S1165 130 / 170

EMC EM‐370(5) / EM‐370(D) 150 / 175

High Speed/Low Loss Special Materials

Isola FR408, FR408HR, IS415, I‐Tera, I‐Speed

Panasonic Megtron 6/6N, Megtron 7/7N

Nelco N4000‐13SI, ‐13EP‐SI, Meteorwave

EMC EM‐828G, EM‐888S, EM888K, EM‐891/891KRogers RO3010, RO4003C, RO4350BTaconic PTFE (RF35, TLX, TLY)

Aluminum ShengYi, ITEQ, Ventec SAR15, SAR20, IT859GTA

Flex Polyimide Panasonic, ShengYi Adhesiveless Polyimide 12 to 100 um thick

Other materials are available. Most materials listed above are UL approved, please contact us for more information.

Base Materials


18 Layer PCQR2 Project


• Completed 3 lots of 10 panels, submitted to Conductor Analysis Technologies• 370HR, 3 Lamination Cycles, Buried vias L3‐16 (via in pad), Line/Space 2 to 5 mils• Laser Stacked & unStacked uVias .1mm & .15mm: 1‐2, 2‐3, 3‐4, 18‐17, 17‐16 & 16‐15 • Laser Stacked & unStacked Deep uVias .15mm & .20 mm: 1‐3 and 18‐16

18L PCQR2 Micro Sections


DMV 1‐3, BV 3‐16, DMVs 18‐16 Staggered MVs Stacked 6 mil MVs Stacked 4 mil MVs Plated THs 1‐18

Deep MicroVia1‐3 & 18‐16

Registration System


• Intuitive user interface for stack‐up construction• Import of stack‐up data from external systems• Accurate scale factor prediction• Integration to CAM systems for design & scaling data transfer• Automatic scale factor calculation for repeat builds• Multi‐user access with configurable control• Calculated press‐out thickness and resin content checks• Upgrade path and add on functionality for future

requirements


Positioning System Repeatability ± 17 micron (± 0.7 mil) Min Panel Size 330 x 335 mm (13”x14”) Max Panel Size 610 x 760 mm (24”x30”) Panel alignment speed 12‐18 seconds/layer average Positioning system X‐Y‐Y axis, cam driven, closed loop CCD cameras Welding Type RF Variable Inductive Heating System Standard 4 sets Computer controlled heat‐up, hold temp, hold time & cooling cycle Welding panel thickness capability up to 8.0 mm (0.315”)

*Note: There is no limit to the maximum number of inner layers, only the total welded panel thickness.

Optical Registration System


Newest Generation Via Mechanics LC‐2Q252

CO2 Laser with direct ablation of copper Line & Space: ≧ 40um (1.6 mil) Cu foil thickness: 9～12um (.35～.47 mil) Surface treatment: Alternative Oxide Min drill diameter, Production: 75um (3 mils) Min drill diameter, R＆D: 50um (2 mils)

75um (3 mils)50um (2 mils)

Laser Drill

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Soldermask Registration Accuracy ±12um (.5 mil)

50μm (2 mil) soldermask dam20μm (.8 mil) copper thickness

100μm (4 mil) soldermask dam,40μm (1.6 mil) copper thickness

Soldermask Defined Pads

Fine Pitch BGAswww.sunshinepcb.com

Soldermask Direct Imaging

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CCD Drill and Rout (SZ Q2 2019)

SCHMOLL PCB CNC/CCD Drilling and Rout MachineEquipment Characteristics:• XY‐axis hi‐speed movement up to 100 m/min.• Drilling spindles with speed up to 250 krpm for different applications• Large table can handle up to 40.5 inch (1030mm)• CCD camera for high accuracy drilling and routing, Tol. +/‐25 um

Drill RoutRigid‐PCB, FPC and HDI Contour routingDepth/Back drilling Depth routingIC substrate CCD routingFlip drillingCCD drilling

www.sunshinepcb.com

Back Drill Systems (SZ & JJ Q2 2019)


State‐of‐the‐art Back Drill System• Depth Tolerance of +/‐.001” • Panel mapping capability to ensure depth consistency and repeatability• Handling techniques are optimized and automated • SZ adding 2 systems, JJ adding 3 BD systems and 2 BVH systems

Ink Jet Solder Mask


• New technology, expected implementation in 2020• Quick, effective and clean using digital imaging• Zero time and expense for photo artwork and screening• Ideal for small lot sizes• Different ink thickness can be done in different regions • Selective printing can be done to minimize cost of ink• 37 sides per hour with 18”x24”• 3 mil SM Dams, +/‐0.5 mil registration

2018 & 2019 Capital Investments


Plant 2018 Actual 2019 Budget

Shenzhen $3,507,031 $5,537,200

Jiujiang $16,126,895 $53,618,526

Total (USD) $19,633,926 $59,155,726

2019 Major Equipment Investments

Shenzhen• 1 CCD Optical Drill and Router

• 1 Plasma System

• 6 NC Routers, 2 Control‐Depth

• 1 Vacuum DES Line

• 1 Vacuum SES Line

• Pin Lam System

• 1 Copper Reduction Line

• Imm‐Silver Corrosion Inhibitor


Jiujiang• XACT system software

• TrueChem Lab software

• 1 DES Line, 6 AOI

• 20 NC Routers, 1 Control Depth Router

• 2 Laser Drills, 50 NC Drills (Currently 75)

• Electroless Copper Line

• LDI System, DI System (SM)

• 3D Measurement System

JJ Rigid‐Flex/FPC• 2 Auto Exposure Units

• 2 LDI Units

• 10 NC Drills, 6 Control‐Depth

• Gold Plating Line

• ENIG/ENEPIG Line

• Microvia Plating Line

• Large Format VCP

8L HDI with 0.4 mm BGA• S1000‐2• 3.3” x 2.1” (85x54mm)• Thickness .047” (1.2mm)• Construction 2+4+2• Stacked Micro Vias (L1‐2, L2‐3, L6‐7, L7‐8)• Buried Vias (L3‐L6)• Micro Via Drill/Pad .005”/.010” (.12/.25mm)• Buried Via Drill/Pad .008”/.016” (.20/.40mm)• Minimum Line/Space .0025” (.064 mm)• ENIG Finish• Controlled Impedance• Application: Telecom

High Tech Products


16L High Speed Linecard• EM888K • 11.0” x 12.7” (280x322mm)• Thickness .094” (2.4mm)• Aspect Ratio 12:1• 6X Backdrill with multiple depths from both sides• Minimum Line/Space .004” (.10 mm)• Smallest Drill/Pad .004”/.010” (.10/25mm)• ENIG

High Tech Products


20L HDI Board• FR408HR• 4.9” x 13.3” (125x337mm)• Thickness .094” (2.4mm)• Construction 8+4+8• Aspect Ratio 12:1• Blind vias L1‐8, L13‐20• Micro vias L1‐2, L19‐20• Via‐in‐Pad (VIPPO)• Minimum L/S .003” (.08mm)• Smallest Drill/Pad .004”/.012”

(.10/.30mm) • 32 Impedance lines (SE/Diff)• ENIG + Hard Gold Finish

High Tech Products


20L Telecom Backplane• EM828• 4.3” x 11.6” (110x294mm)• Thickness .125” (3.2mm)• Aspect Ratio 7:1• Micro vias L1‐2, L19‐20• 5X Backdrill, multiple depths• Minimum L/S .003” (.08mm)• Smallest Drill/Pad .006”/.016”

(.15/.40mm) • 16 Impedance lines (SE/Diff)• Countersink holes• Im Ag (shown in ENIG)

High Tech Products


34L ATE Board• S1000‐2• 14.5”x14.5” (368x368mm)• Thickness .180” (4.6mm)• 18:1 Aspect Ratio• Blind vias from L32‐34• Via‐in‐Pad (VIPPO) • Internal Cu: 1 & 2 oz• Minimum L/S .004”• Drill/Pad .010”/.016” (.25/40mm)• Over 20 impedance controlled lines • Countersink holes• For semiconductor testing

High Tech Products


14 Layer HDI Rigid‐Flex• Construction: 6R – 2F – 6R• Min L/S: 4 mils (.10 mm)• Thickness: .062” (1.6 mm)• Application: Medical

High Tech Products

38

8 Layer Rigid‐Flex• Construction: 3R – 2F – 3R• Min L/S: 5 mils (.13 mm)• Thickness: .040” (1.0 mm)• Application: Industrial


Coin Boards and Copper Inlay


COPPER INLAY• Solid copper embedded into the board• Connection to external layer by Micro Via • Thru‐hole may be connected if required• Excellent for BGA and package thermal relief

Thermal Management Solutions

COPPER COIN• Solid copper pressfit into the board• Can be applied in cavity or top to bottom• Thru‐hole may be connected if required• Excellent for thermal relief

RF (Radio Frequency) Boards

• Layer Count: 2 to 10 Layers• Material Options: Rogers (4350B, 3010, 4003C), Taconic (RF35, TLX, TLY)• Hybrid Option: RO4350B + FR4• Finishes: ENIG, Wire Bondable Gold, Flash Gold• Special Process: Cavities, Selective Plating and Etching• Applications: Radio Trans‐receivers, Antennas, Power Amplifiers

High Tech Products


Shenzhen Facility


Semi‐Auto Exposure using Optical Alignment Glass Phototools

Liquid Photoresist Roller Coating Line

Shenzhen Facility


Lamination Presses

Post‐Etch Punch with Inline AOI

Shenzhen Facility


Laser Drilling Hitachi CO22‐heads

Mechanical Drilling Hitachi 6‐spindles

Shenzhen Facility


ITC Vacuum‐assisted Via Fill (THP35)

Shenzhen Facility


Vertical Continuous

Pattern Plating(VCP)

Vertical Continuous

Panel Plating (VCP)

Shenzhen Facility


www.sunshinepcb.com 47

Copper Fill Plating Line

(VCP)For microvias

Shenzhen Facility

5/20/2019 www.sunshinepcbgroup.com

Direct Imaging for Outerlayer (prior to installation of auto loaders)

Shenzhen Facility


Shenzhen Facility

49

Direct Imaging for SoldermaskSoldermask Cleanroom


Inspection & Test

50

Automated Visual Inspection (AVI) for Finished PCB’s

In‐Line AOI (after Outerlayer Etch)


Nikon Eclipse Microscope Lv100D (max. 1000X)

2 Dimensional CoordinateMeasurement Machine

Inspection & Test


DSC Q20 for Tg and ∆Tg testing Polar CITS 880s TDR

XRF CMI 900 Plating Thickness InstrumentDrill Bit Automatic Re‐Sharp and Inspection

Inspection & Test


Jiujiang Facility


Jiujiang Facility


History & Growth2011

•Start of JiujiangProject•Choosing of Site

2012

•Layout, Planning•Start of Phase I Construction•Train Local Engineers

2014

•Phase I Building Completed•ISO9001 •Start of 2L Production

2015

•Inner‐layer & Lamination•2‐6L Production•TS16949

2017

•IATF16949•2‐8L Production•Capacity reach 40K SqM/month

2018

•ISO13485•Rigid‐Flex & Alum PCB’s•Capacity reach 50K SqM/month


Phase IA: 1st and 2nd FloorsStandard Technology PCB’s (2‐8L)High Mix ‐Medium Volume to High Volume

Phase IB: 3rd Floor Production Line for Rigid‐Flex and Flex (FPC)Production Line for Aluminum Backed PCB’s

Phase 2: Under Construction, production start in 2020Planned for 5G and Automotive Markets

Phase 1 consists of 3F, total area 495,000 Ft 2 (46K m2)Phase 2 consists of 4F, total area 660,000 Ft 2 (61K m2)

Waste Water Treatment

Phase 2

Phase 1

Dormitories

Features of Jiujiang Factory• 2019 Cap‐Ex budget $53.6M for Jiujiang Plant

• State‐of‐the‐Art Equipment ‐‐ examples:• Mitsubishi UV Laser Drill ML706GTW5• MASS Via Fill VCP‐5000‐2• Via Mechanics NC Drill ND‐6JA252B

• Facility designed with smooth process flow

• Extensive use of automation and inline systems

• 100% Direct Imaging for Outer‐layers

• ENIG, HASL, LF‐HAL, OSP, ImmTin, Hard Gold

• Large capacity waste treatment facility, recycling of water and etchants

• Onsite dining and recreational facilities


57

Etchant Cu Recycling

CCL Storage& Cutting

Ground Floor Map

Finished Goods

Packaging

InnerlayerPreclean & Etch

Drilling

LaminationOxide & Lay‐Up

IL AOI

Visitor Corridor

Visitor Corridor

Material Corridor

Entrance

Prepreg Storage

E E

E

E

InnerlayerImaging

5/20/2019

58

Second Floor Map

Routing

HASLLF‐HAL

ENIG

Legend Soldermask OuterlayerDry Filmand AOI

Electrical Test

FQC

VCP

Electroless (PTH)and Panel Plate

Pattern Plate

OL Etch (SES)

Laser Direct Imaging

Electroless (PTH)

Lab

Visitor Corridor

Visitor Corridor

Material CorridorE E

E

E

OSPImmSn

Gold Fingers

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59

Third Floor Map (Rigid-Flex/FPC and AL-PCB Lines)

5/20/2019 Visitor Corridor

Visitor Corridor

Visitor CorridorE E

E

E

Routing Rigid‐Flex and FPC Area

Aluminum PCB AreaFixtures

& Tooling

Warehouse & Storage

Soldermask & Surface Finish

Maintenance & Recycling

Packaging

Punch

Jiujiang Facility

60

AOIInnerlayer Pre‐Clean Lamination Presses


Jiujiang Facility

61

Copper Foil and Prepreg Cutting Lamination Plate Handling System


Jiujiang Facility

62

Drilling Department


Jiujiang Facility

63

Vertical Continuous Copper Plating


Jiujiang Facility

64

Laser Direct Imaging (LDI)


Jiujiang Facility

65

Copper Plating ENIG


Jiujiang Factory


Aluminum PCB Photoresist and Imaging Area

Jiujiang Factory


Rigid‐Flex/FPC VCP Plating Line

Jiujiang Factory


Rigid‐Flex/FPC Laser Cutting Plasma Treatment

Jiujiang Factory


Rigid‐Flex/FPC Coverlay Application and Lamination

Jiujiang Factory


Rigid‐Flex/FPC Pretreat Line Rigid‐Flex/FPC Punch

Jiujiang Facility

71

AVI and Final Inspection


Jiujiang Factory


Jiujiang Phase 2 under construction, located adjacent to Phase 1 Building

Building to be completed Q3‐2019.

Production to start in Q3‐2020 (est).

Sunshine Global Circuits Co., Ltd.ShangXing No.2 Industry District, Bldg B, Xinqiao, BaoAn,ShenZhen, GuangDong, China 518125Telephone: +86 (0) 755‐2724‐3597Fax: +86 (0) 755‐2724‐3609

Jiujiang Sunshine Circuits Technology Co., Ltd.GangCheng Rd, ChengXiGang Economic Development Zone,JiuJiang City, JiangXi, China 332000Telephone: +86 (0) 792‐238‐5678Fax: +86 (0) 792‐2385668

Sunshine PCB GmbH Walter‐Freitag ‐Straße 17 D‐42899Remscheid, GermanyTelephone: +49 (0) 2191‐9573‐0

Sales Subsidiaries:

Sunshine Circuits USA, LLC3400 Silverstone Drive, Suite 139Plano, Texas, USA 75023Telephone: +1‐972‐867‐8886Fax: +1‐972‐867‐8002

Sunshine PCB GmbHWildparkstraße 7 D‐09247Chemnitz, GermanyTelephone: +49 (0) 3722‐59967‐10

www.sunshinepcb.com

Thank you.


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