6 GHz to 26.5 GHz, Wideband I/Q Mixer
Data Sheet HMC8191
Rev. C Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 ©2017–2019 Analog Devices, Inc. All rights reserved. Technical Support www.analog.com
FEATURES Passive, wideband I/Q mixer RF and LO range: 6 GHz to 26.5 GHz Wide IF bandwidth of dc to 5 GHz Single-ended RF, LO, and IF Conversion loss: 9 dB (typical) Image rejection: 25 dBc (typical) Single-sideband noise figure: 9 dB (typical) Input IP3 (downconverter): 24 dBm (typical) Input P1dB compression point (downconverter): 15 dBm
(typical) Input IP2: 55 dBm (typical) LO to RF isolation: 40 dB (typical) LO to IF isolation: 40 dB (typical) RF to IF isolation: 20 dB (typical) Amplitude balance: ±0.5 dB (typical) Phase balance (downconverter): ±5° (typical) RF return loss: 15 dB (typical) LO return loss: 15 dB (typical) IF return loss: 15 dB (typical) Exposed pad, 4 mm × 4 mm, 24-terminal, ceramic, LCC
package
APPLICATIONS Test and measurement instrumentation Military, aerospace, and defense applications Microwave point to point base stations
FUNCTIONAL BLOCK DIAGRAM
13
1
34
2
7
GNDGNDGNDGND
56
GNDGND GND
PACKAGEBASE
14 GND15 GND16 RF17 GND18 GND
NC8
NC9
NC10
IF1
11NC
1219
IF2
GND
20G
ND21
GND
22G
ND23
LO24
NC
HMC8191
1364
5-00
1
Figure 1.
GENERAL DESCRIPTION The HMC8191 is a passive, wideband, I/Q monolithic microwave integrated circuit (MMIC) mixer that can be used either as an image reject mixer for receiver operations or as a single-sideband upconverter for transmitter operations. With a radio frequency (RF) and local oscillator (LO) range of 6 GHz to 26.5 GHz, and an intermediate frequency (IF) bandwidth of dc to 5 GHz, the HMC8191 is ideal for applications requiring a wide frequency range, excellent RF performance, and a simple design with fewer components and a small printed circuit board (PCB) footprint. A single HMC8191 can replace multiple narrow-band mixers in a design.
The inherent I/Q architecture of the HMC8191 offers excellent image rejection and thereby eliminates the need for expensive filtering for unwanted sidebands. The mixer also provides
excellent LO to RF and LO to IF isolation and reduces the effect of LO leakage to ensure signal integrity.
Being a passive mixer, the HMC8191 does not require any dc power sources. It offers a lower noise figure compared to an active mixer, ensuring superior dynamic range for high performance and precision applications.
The HMC8191 is fabricated on a gallium arsenide (GaAs) metal semiconductor field effect transistor (MESFET) process and uses Analog Devices, Inc. mixer cells and a 90-degree hybrid. The HMC8191 is available in a compact, 4 mm × 4 mm, 24-terminal leadless chip carrier (LCC) package and operates over a −40°C to +85°C temperature range. An evaluation board for the HMC8191 is also available from the Analog Devices website.
HMC8191 Data Sheet
Rev. C | Page 2 of 44
TABLE OF CONTENTS Features .............................................................................................. 1 Applications ....................................................................................... 1 Functional Block Diagram .............................................................. 1 General Description ......................................................................... 1 Revision History ............................................................................... 2 Specifications ..................................................................................... 3 Absolute Maximum Ratings ............................................................ 4
Thermal Resistance ...................................................................... 4 ESD Caution .................................................................................. 4
Pin Configuration and Function Descriptions ............................. 5 Interface Schematics..................................................................... 5
Typical Performance Characteristics ............................................. 6 Downconverter Performance: IF = 100 MHz, Lower Sideband (High-Side LO) ............................................................................. 6 Downconverter Performance: IF = 2500 MHz, Lower Sideband (High-Side LO) ............................................................ 8 Downconverter Performance: IF = 5000 MHz, Lower Sideband (High-Side LO) .......................................................... 10 Downconverter Performance: IF = 100 MHz, Upper Sideband (Low-Side LO) ........................................................... 12 Downconverter Performance: IF = 2500 MHz, Upper Sideband (Low-Side LO) ........................................................... 14 Downconverter Performance: IF = 5000 MHz, Upper Sideband (Low-Side LO) ........................................................... 16 Upconverter Performance: IF = 100 MHz, Lower Sideband (High-Side LO) ........................................................................... 18
Upconverter Performance: IF = 2500 MHz, Lower Sideband (High-Side LO) ........................................................................... 20 Upconverter Performance: IF = 5000 MHz, Lower Sideband (High-Side LO) ........................................................................... 22 Upconverter Performance: IF = 100 MHz, Upper Sideband (Low-Side LO) ............................................................................ 24 Upconverter Performance: IF = 2500 MHz, Upper Sideband (Low-Side LO) ............................................................................ 26 Upconverter Performance: IF = 5000 MHz, Upper Sideband (Low-Side LO) ............................................................................ 28 Isolation and Return Loss ......................................................... 30 IF Bandwidth Performance: Downconverter, Lower Sideband (High-Side LO) ............................................................................ 32 Amplitude and Phase Imbalance Performance: Downconverter, Lower Sideband (High-Side LO) ................................................ 33 Amplitude and Phase Imbalance Performance: Downconverter, Upper Sideband (Low-Side LO) ..................... 35 Spurious and Harmonics Performance ................................... 37
Theory of Operation ...................................................................... 40 Applications Information .............................................................. 41
RF and LO Performance Above 26 GHz ................................. 42 IF Bandwidth Above 5 GHz ...................................................... 42 Soldering Information and Recommended Land Pattern .... 43 Evaluation Board Information.................................................. 43
Outline Dimensions ....................................................................... 44 Ordering Guide .......................................................................... 44
REVISION HISTORY 8/2019—Rev. B to Rev. C Changes to Table 4, Figure 5, and Figure 6 ................................... 5 Changes to Ordering Guide .......................................................... 44 5/2018—Rev. A to Rev. B Changes to Applications Information Section ............................ 41 2/2018—Rev. 0 to Rev. A Change to Features Section ............................................................. 1
Change to Single-Sideband Noise Figure Parameter, Table 1 ...... 3 Deleted Figure 13 and Figure 16; Renumbered Sequentially ...... 7 Deleted Figure 25 and Figure 28...................................................... 9 Deleted Figure 47 and Figure 50................................................... 13 Deleted Figure 59 and Figure 62................................................... 15 Changes to Ordering Guide .......................................................... 44 6/2017—Revision 0: Initial Version
Data Sheet HMC8191
Rev. C | Page 3 of 44
SPECIFICATIONS TA = 25°C, IF = 100 MHz, LO drive = 18 dBm, all measurements performed as downconverter with lower sideband selected, external 90° hybrid at the IF ports, and LO amplifier in line with lab bench LO source, unless otherwise noted.
Table 1. Parameter Symbol Min Typ Max Unit RADIO FREQUENCY RF 6 26.5 GHz LOCAL OSCILLATOR FREQUENCY fLO 6 26.5 GHz INTERMEDIATE FREQUENCY IF DC 5 GHz LOCAL OSCILLATOR DRIVE LEVEL 18 dBm RF PERFORMANCE AS DOWNCONVERTER
Conversion Loss 9 11.5 dB Image Rejection 20 25 dBc Single-Sideband Noise Figure SSB NF 9 dB Input Third-Order Intercept IP3 24 dBm Input 1 dB Compression Point P1dB 15 dBm Input Second-Order Intercept IP2 55 dBm Isolation
RF to IF 20 dB LO to RF 30 40 dB LO to IF 27 40 dB
Amplitude Balance1 ±0.5 dB Phase Balance1 ±5 Degrees
RF PERFORMANCE AS UPCONVERTER Conversion Loss 9 dB Sideband Rejection 25 dBc Input Third-Order Intercept IP3 22 dBm Input 1 dB Compression Point P1dB 13 dBm
RETURN LOSS PERFORMANCE1 RF 15 dB LO 15 dB IFx 15 dB
1 Measurements taken without 90° hybrid at the IF ports.
HMC8191 Data Sheet
Rev. C | Page 4 of 44
ABSOLUTE MAXIMUM RATINGS Table 2. Parameter Rating RF Input Power 24 dBm LO Input Power 24 dBm IF Input Power 24 dBm IF Source/Sink Current 3 mA Continuous Power Dissipation, PDISS
(TA = 85°C, Derate 7.29 mW/°C Above 85°C) 657 mW
Maximum Junction Temperature 175°C Maximum Peak Reflow Temperature (MLS3) 260°C Operating Temperature Range −40°C to +85°C Storage Temperature Range −65°C to +150°C Electrostatic Discharge Sensitivity
Human Body Model 750 V Field Induced Charged Device Model 1200 V
Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability.
THERMAL RESISTANCE Thermal performance is directly linked to PCB design and operating environment. Careful attention to PCB thermal design is required.
Table 3. Thermal Resistance Package Type θJA θJC Unit E-24-11 38.3 137 °C/W 1 Refer to JDEC standard JESD51-2 for additional information on optimizing
the thermal impedance (PCB with 4 × 4 vias).
ESD CAUTION
Data Sheet HMC8191
Rev. C | Page 5 of 44
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
13
1
34
2
7
GNDGNDGNDGND
56
GNDGND GND
PACKAGEBASE
14 GND15 GND16 RF17 GND18 GND
NC8
NC9
NC10
IF1
11NC
1219
IF2
GND
20G
ND21
GND
22G
ND23
LO24
NC
HMC8191TOP VIEW
(Not to Scale)
NOTES1. NC = NO CONNECT. THESE PINS MAY BE CONNECTED TO
RF/DC GROUND WITHOUT AFFECTING PERFORMANCE.2. EXPOSED PAD. THE EXPOSED PAD MUST BE CONNECTED
TO RF/DC GROUND. 1364
5-00
2
Figure 2. Pin Configuration
Table 4. Pin Function Descriptions Pin No. Mnemonic Description 1 to 6, 13 to 15, 17 to 22 GND Ground. These pins and the package bottom must be connected to RF/dc ground. See Figure 3 for
the interface schematic. 7 to 9, 11, 24 NC No Connect. These pins can be connected to RF/dc ground without affecting performance. 10, 12 IF1, IF2 First and Second Quadrature Intermediate Frequency Input/Output Pins. These pins are dc-coupled.
For applications not requiring operation to dc, use an off-chip dc blocking capacitor. For operations to dc, these pins must not source/sink more than 3 mA of current; otherwise, the device may not function and may fail. See Figure 4 for the interface schematic.
16 RF Radio Frequency Input/Output. This pin is dc-coupled and matched to 50 Ω when the LO is turned on. See Figure 5 for the interface schematic.
23 LO Local Oscillator Input. This pin is dc-coupled and matched to 50 Ω when the LO is turned on. See Figure 6 for the interface schematic.
EPAD Exposed Pad. The exposed pad must be connected to RF/dc ground.
INTERFACE SCHEMATICS GND
1364
5-00
3
Figure 3. GND Interface Schematic
IF1, IF2
1364
5-00
4
Figure 4. IF1 and IF2 Interface Schematic
RF
1364
5-00
5
Figure 5. RF Interface Schematic
LO
1364
5-00
6
Figure 6. LO Interface Schematic
HMC8191 Data Sheet
Rev. C | Page 6 of 44
TYPICAL PERFORMANCE CHARACTERISTICS DOWNCONVERTER PERFORMANCE: IF = 100 MHz, LOWER SIDEBAND (HIGH-SIDE LO)
0
–20
–18
–16
–14
–12
–10
–8
–6
–4
–2
6 282624222018161412108
CONV
ERSI
ON
GAI
N (d
B)
RF FREQUENCY (GHz)
TA = +85°CTA = +25°CTA = –40°C
1364
5-00
7
Figure 7. Conversion Gain vs. RF Frequency at Various Temperatures,
LO Drive = 18 dBm
50
0
5
10
15
20
25
30
35
40
45
6 282624222018161412108
IMAG
E RE
JECT
ION
(dBc
)
RF FREQUENCY (GHz)
TA = +85°CTA = +25°CTA = –40°C
1364
5-00
8
Figure 8. Image Rejection vs. RF Frequency at Various Temperatures,
LO Drive = 18 dBm
40
0
5
10
15
20
25
30
35
6 282624222018161412108
INPU
T IP
3 (d
Bm)
RF FREQUENCY (GHz)
TA = +85°CTA = +25°CTA = –40°C
1364
5-00
9
Figure 9. Input IP3 vs. RF Frequency at Various Temperatures,
LO Drive = 18 dBm
0
–20
–18
–16
–14
–12
–10
–8
–6
–4
–2
6 282624222018161412108
CONV
ERSI
ON
GAI
N (d
B)
RF FREQUENCY (GHz)
20dBm18dBm16dBm14dBm
1364
5-01
0
Figure 10. Conversion Gain vs. RF Frequency at Various LO Drives,
TA = 25°C
20dBm18dBm16dBm14dBm
50
0
10
20
30
40
6 282624222018161412108
IMAG
E RE
JECT
ION
(dBc
)
RF FREQUENCY (GHz) 1364
5-01
1
Figure 11. Image Rejection vs. RF Frequency at Various LO Drives,
TA = 25°C
40
0
5
10
15
20
25
30
35
6 282624222018161412108
INPU
T IP
3 (d
Bm)
RF FREQUENCY (GHz)
20dBm18dBm16dBm14dBm
1364
5-01
2
Figure 12. Input IP3 vs. RF Frequency at Various LO Drives, TA = 25°C
Data Sheet HMC8191
Rev. C | Page 7 of 44
24
22
0
4
8
12
16
20
2
6
10
14
18
6 282624222018161412108
INPU
T P1
dB (d
Bm)
RF FREQUENCY (GHz)
TA = +85°CTA = +25°CTA = –40°C
1364
5-01
4
Figure 13. Input P1dB vs. RF Frequency at Various Temperatures,
LO Drive = 18 dBm
80
70
20
40
60
30
50
6 282624222018161412108
INPU
T IP
2 (d
Bm)
RF FREQUENCY (GHz)
TA = +85°CTA = +25°CTA = –40°C
1364
5-01
5
Figure 14. Input IP2 vs. RF Frequency at Various Temperatures,
LO Drive = 18 dBm
24
22
0
4
8
12
16
20
2
6
10
14
18
6 282624222018161412108
INPU
T P1
dB (d
Bm)
RF FREQUENCY (GHz)
20dBm18dBm16dBm14dBm
1364
5-01
7
Figure 15. Input P1dB vs. RF Frequency at Various LO Drives, TA = 25°C
80
70
10
20
40
60
30
50
6 2624222018161412108
INPU
T IP
2 (d
Bm)
RF FREQUENCY (GHz)
20dBm18dBm16dBm14dBm
1364
5-01
8
Figure 16. Input IP2 vs. RF Frequency at Various LO Drives, TA = 25°C
HMC8191 Data Sheet
Rev. C | Page 8 of 44
DOWNCONVERTER PERFORMANCE: IF = 2500 MHz, LOWER SIDEBAND (HIGH-SIDE LO) 0
–20
–18
–16
–14
–12
–10
–8
–6
–4
–2
5 27252321191715131197
CONV
ERSI
ON
GAI
N (d
B)
RF FREQUENCY (GHz)
TA = +85°CTA = +25°CTA = –40°C
1364
5-01
9
Figure 17. Conversion Gain vs. RF Frequency at Various Temperatures, LO Drive = 18 dBm
50
0
5
10
15
20
25
30
35
40
45
5 27252321191715131197
IMAG
E RE
JECT
ION
(dBc
)
RF FREQUENCY (GHz)
TA = +85°CTA = +25°CTA = –40°C
1364
5-02
0
Figure 18. Image Rejection vs. RF Frequency at Various Temperatures,
LO Drive = 18 dBm
40
0
5
10
15
20
25
30
35
5 27252321191715131197
INPU
T IP
3 (d
Bm)
RF FREQUENCY (GHz)
TA = +85°CTA = +25°CTA = –40°C
1364
5-02
1
Figure 19. Input IP3 vs. RF Frequency at Various Temperatures,
LO Drive = 18 dBm
0
–20
–18
–16
–14
–12
–10
–8
–6
–4
–2
5 27252321191715131197
CONV
ERSI
ON
GAI
N (d
B)
RF FREQUENCY (GHz)
20dBm18dBm16dBm14dBm
1364
5-02
2
Figure 20. Conversion Gain vs. RF Frequency at Various LO Drives,
TA = 25°C
50
0
5
10
15
20
25
30
35
40
45
5 27252321191715131197
IMAG
E RE
JECT
ION
(dBc
)
RF FREQUENCY (GHz)
20dBm18dBm16dBm14dBm
1364
5-02
3
Figure 21. Image Rejection vs. RF Frequency at Various LO Drives,
TA = 25°C
40
0
5
10
15
20
25
30
35
5 27252321191715131197
INPU
T IP
3 (d
Bm)
RF FREQUENCY (GHz)
20dBm18dBm16dBm14dBm
1364
5-02
4
Figure 22. Input IP3 vs. RF Frequency at Various LO Drives, TA = 25°C
Data Sheet HMC8191
Rev. C | Page 9 of 44
20
0
4
8
2
6
10
12
14
16
18
5 27252321191715131197
INPU
T P1
dB (d
Bm)
RF FREQUENCY (GHz)
TA = +85°CTA = +25°CTA = –40°C
1364
5-02
6
Figure 23. Input P1dB vs. RF Frequency at Various Temperatures,
LO Drive = 18 dBm
80
20
30
40
50
60
70
5 27252321191715131197
INPU
T IP
2(dB
m)
RF FREQUENCY (GHz)
TA = +85°CTA = +25°CTA = –40°C
1364
5-02
7
Figure 24. Input IP2 vs. RF Frequency at Various Temperatures,
LO Drive = 18 dBm
20
0
4
8
2
6
10
12
14
16
18
5 27252321191715131197
INPU
T P1
dB (d
Bm)
RF FREQUENCY (GHz)
20dBm18dBm16dBm14dBm
1364
5-02
9
Figure 25. Input P1dB vs. RF Frequency at Various LO Drives, TA = 25°C
80
20
30
40
50
60
70
5 27252321191715131197
INPU
T IP
2 (d
Bm)
RF FREQUENCY (GHz)
20dBm18dBm16dBm14dBm
1364
5-03
0
Figure 26. Input IP2 vs. RF Frequency at Various LO Drives, TA = 25°C
HMC8191 Data Sheet
Rev. C | Page 10 of 44
DOWNCONVERTER PERFORMANCE: IF = 5000 MHz, LOWER SIDEBAND (HIGH-SIDE LO) 0
–20
–18
–16
–14
–12
–10
–8
–6
–4
–2
6 2624222018161412108
CONV
ERSI
ON
GAI
N (d
B)
RF FREQUENCY (GHz)
TA = +85°CTA = +25°CTA = –40°C
1364
5-03
1
Figure 27. Conversion Gain vs. RF Frequency at Various Temperatures, LO Drive = 18 dBm
6 2624222018161412108RF FREQUENCY (GHz)
TA = +85°CTA = +25°CTA = –40°C
50
0
5
10
15
20
25
30
35
40
45
IMAG
E RE
JECT
ION
(dBc
)
1364
5-03
2
Figure 28. Image Rejection vs. RF Frequency at Various Temperatures,
LO Drive = 18 dBm
6 2624222018161412108RF FREQUENCY (GHz)
TA = +85°CTA = +25°CTA = –40°C
40
0
5
10
15
20
25
30
35
INPU
T IP
3 (d
Bm)
1364
5-03
3
Figure 29. Input IP3 vs. RF Frequency at Various Temperatures,
LO Drive = 18 dBm
0
–20
–18
–16
–14
–12
–10
–8
–6
–4
–2
6 2624222018161412108
CONV
ERSI
ON
GAI
N (d
B)
RF FREQUENCY (GHz)
20dBm18dBm16dBm14dBm
1364
5-03
4
Figure 30. Conversion Gain vs. RF Frequency at Various LO Drives,
TA = 25°C
6 2624222018161412108RF FREQUENCY (GHz)
20dBm18dBm16dBm14dBm
50
0
5
10
15
20
25
30
35
40
45
IMAG
E RE
JECT
ION
(dBc
)
1364
5-03
5
Figure 31. Image Rejection vs. RF Frequency at Various LO Drives,
TA = 25°C
6 2624222018161412108RF FREQUENCY (GHz)
40
0
5
10
15
20
25
30
35
INPU
T IP
3 (d
Bm)
20dBm18dBm16dBm14dBm
1364
5-03
6
Figure 32. Input IP3 vs. RF Frequency at Various LO Drives, TA = 25°C
Data Sheet HMC8191
Rev. C | Page 11 of 44
20
0
4
8
2
6
10
12
14
16
18
INPU
T P1
dB (d
Bm)
6 2624222018161412108RF FREQUENCY (GHz)
TA = +85°CTA = +25°CTA = –40°C
1364
5-03
7
Figure 33. Input P1dB vs. RF Frequency at Various Temperatures,
LO Drive = 18 dBm
80
10
20
30
40
50
60
70
INPU
T IP
2 (d
Bm)
6 2624222018161412108RF FREQUENCY (GHz)
TA = +85°CTA = +25°CTA = –40°C
1364
5-03
8
Figure 34. Input IP2 vs. RF Frequency at Various Temperatures,
LO Drive = 18 dBm
20
0
4
8
2
6
10
12
14
16
18
INPU
T P1
dB (d
Bm)
6 2624222018161412108RF FREQUENCY (GHz)
20dBm18dBm16dBm14dBm
1364
5-03
9
Figure 35. Input P1dB vs. RF Frequency at Various LO Drives, TA = 25°C
80
10
20
30
40
50
60
70
INPU
T IP
2 (d
Bm)
6 2624222018161412108RF FREQUENCY (GHz)
20dBm18dBm16dBm14dBm
1364
5-04
0
Figure 36. Input IP2 vs. RF Frequency at Various LO Drives, TA = 25°C
HMC8191 Data Sheet
Rev. C | Page 12 of 44
DOWNCONVERTER PERFORMANCE: IF = 100 MHz, UPPER SIDEBAND (LOW-SIDE LO) 0
–20
–18
–16
–14
–12
–10
–8
–6
–4
–2
6 282624222018161412108
CONV
ERSI
ON
GAI
N (d
B)
RF FREQUENCY (GHz)
TA = +85°CTA = +25°CTA = –40°C
1364
5-04
1
Figure 37. Conversion Gain vs. RF Frequency at Various Temperatures, LO Drive = 18 dBm
6 282624222018161412108
IMAG
E RE
JECT
ION
(dBc
)
RF FREQUENCY (GHz)
TA = +85°CTA = +25°CTA = –40°C
60
50
40
0
10
20
30
1364
5-04
2
Figure 38. Image Rejection vs. RF Frequency at Various Temperatures,
LO Drive = 18 dBm
6 282624222018161412108RF FREQUENCY (GHz)
40
0
5
10
15
20
25
30
35
INPU
T IP
3 (d
Bm)
TA = +85°CTA = +25°CTA = –40°C
1364
5-04
3
Figure 39. Input IP3 vs. RF Frequency at Various Temperatures,
LO Drive = 18 dBm
0
–20
–18
–16
–14
–12
–10
–8
–6
–4
–2
6 282624222018161412108
CONV
ERSI
ON
GAI
N (d
B)
RF FREQUENCY (GHz)
20dBm18dBm16dBm14dBm
1364
5-04
4
Figure 40. Conversion Gain vs. RF Frequency at Various LO Drives,
TA = 25°C
6 282624222018161412108
IMAG
E RE
JECT
ION
(dBc
)
RF FREQUENCY (GHz)
60
0
10
20
30
40
50
1364
5-04
5
20dBm18dBm16dBm14dBm
Figure 41. Image Rejection vs. RF Frequency at Various LO Drives,
TA = 25°C
6 282624222018161412108RF FREQUENCY (GHz)
40
0
5
10
15
20
25
30
35
INPU
T IP
3 (d
Bm)
20dBm18dBm16dBm14dBm
1364
5-04
6
Figure 42. Input IP3 vs. RF Frequency at Various LO Drives, TA = 25°C
Data Sheet HMC8191
Rev. C | Page 13 of 44
20
0
2
4
6
8
10
12
14
16
18
6 282624222018161412108
INPU
T P1
dB (d
Bm)
RF FREQUENCY (GHz)
TA = +85°CTA = +25°CTA = –40°C
1364
5-04
8
Figure 43. Input P1dB vs. RF Frequency at Various Temperatures,
LO Drive = 18 dBm
80
20
30
40
50
60
70
6 282624222018161412108
INPU
T IP
2 (d
Bm)
RF FREQUENCY (GHz)
TA = +85°CTA = +25°CTA = –40°C
1364
5-04
9
Figure 44. Input IP2 vs. RF Frequency at Various Temperatures,
LO Drive = 18 dBm
20
0
4
8
2
6
10
12
14
16
18
5 27252321191715131197
INPU
T P1
dB (d
Bm)
RF FREQUENCY (GHz)
20dBm18dBm16dBm14dBm
1364
5-05
1
Figure 45. Input P1dB vs. RF Frequency at Various LO Drives, TA = 25°C
80
10
20
30
40
50
60
70
6 282624222018161412108
INPU
T IP
2 (d
Bm)
RF FREQUENCY (GHz)
20dBm18dBm16dBm14dBm
1364
5-05
2
Figure 46. Input IP2 vs. RF Frequency at Various LO Drives, TA = 25°C
HMC8191 Data Sheet
Rev. C | Page 14 of 44
DOWNCONVERTER PERFORMANCE: IF = 2500 MHz, UPPER SIDEBAND (LOW-SIDE LO) 0
–20
–18
–16
–14
–12
–10
–8
–6
–4
–2
8 28262422201816141210
CONV
ERSI
ON
GAI
N (d
B)
RF FREQUENCY (GHz)
TA = +85°CTA = +25°CTA = –40°C
1364
5-05
3
Figure 47. Conversion Gain vs. RF Frequency at Various Temperatures, LO Drive = 18 dBm
60
0
10
20
30
40
50
8 28262422201816141210
IMAG
E RE
JECT
ION
(dBc
)
RF FREQUENCY (GHz)
TA = +85°CTA = +25°CTA = –40°C
1364
5-05
4
Figure 48. Image Rejection vs. RF Frequency at Various Temperatures,
LO Drive = 18 dBm
40
0
5
10
15
20
30
35
25
8 28262422201816141210
INPU
T IP
3 (d
Bm)
RF FREQUENCY (GHz)
TA = +85°CTA = +25°CTA = –40°C
1364
5-05
5
Figure 49. Input IP3 vs. RF Frequency at Various Temperatures,
LO Drive = 18 dBm
0
–20
–18
–16
–14
–12
–10
–8
–6
–4
–2
8 28262422201816141210
CONV
ERSI
ON
GAI
N (d
B)
RF FREQUENCY (GHz)
20dBm18dBm16dBm14dBm
1364
5-05
6
Figure 50. Conversion Gain vs. RF Frequency at Various LO Drives,
TA = 25°C
60
0
10
20
30
40
50
8 28262422201816141210
IMAG
E RE
JECT
ION
(dBc
)
RF FREQUENCY (GHz)
20dBm18dBm16dBm14dBm
1364
5-05
7
Figure 51. Image Rejection vs. RF Frequency at Various LO Drives,
TA = 25°C
40
0
5
10
15
20
30
35
25
8 28262422201816141210
INPU
T IP
3 (d
Bm)
RF FREQUENCY (GHz)
20dBm18dBm16dBm14dBm
1364
5-05
8
Figure 52. Input IP3 vs. RF Frequency at Various LO Drives, TA = 25°C
Data Sheet HMC8191
Rev. C | Page 15 of 44
20
0
4
8
2
6
10
12
14
16
18
INPU
T P1
dB (d
Bm)
TA = +85°CTA = +25°CTA = –40°C
8 28262422201816141210RF FREQUENCY (GHz) 13
645-
060
Figure 53. Input P1dB vs. RF Frequency at Various Temperatures,
LO Drive = 18 dBm
80
20
30
40
50
60
70
8 28262422201816141210
INPU
T IP
2 (d
Bm)
RF FREQUENCY (GHz)
TA = +85°CTA = +25°CTA = –40°C
1364
5-06
1
Figure 54. Input IP2 vs. RF Frequency at Various Temperatures,
LO Drive = 18 dBm
20
0
4
8
2
6
10
12
14
16
18
INPU
T P1
dB (d
Bm)
8 28262422201816141210RF FREQUENCY (GHz)
20dBm18dBm16dBm14dBm
1364
5-06
3
Figure 55. Input P1dB vs. RF Frequency at Various LO Drives, TA = 25°C
80
10
20
30
40
50
60
70
INPU
T IP
2 (d
Bm)
8 28262422201816141210RF FREQUENCY (GHz)
20dBm18dBm16dBm14dBm
1364
5-06
4
Figure 56. Input IP2 vs. RF Frequency at Various LO Drives, TA = 25°C
HMC8191 Data Sheet
Rev. C | Page 16 of 44
DOWNCONVERTER PERFORMANCE: IF = 5000 MHz, UPPER SIDEBAND (LOW-SIDE LO) 0
–20
–18
–16
–14
–12
–10
–8
–6
–4
–2
11 2725232119171513
CONV
ERSI
ON
GAI
N (d
B)
RF FREQUENCY (GHz)
TA = +85°CTA = +25°CTA = –40°C
1364
5-06
5
Figure 57. Conversion Gain vs. RF Frequency at Various Temperatures, LO Drive = 18 dBm
70
0
10
20
30
40
50
60
11 2725232119171513
IMAG
E RE
JECT
ION
(dBc
)
RF FREQUENCY (GHz)
TA = +85°CTA = +25°CTA = –40°C
1364
5-06
6
Figure 58. Image Rejection vs. RF Frequency at Various Temperatures,
LO Drive = 18 dBm
11 2725232119171513RF FREQUENCY (GHz)
TA = +85°CTA = +25°CTA = –40°C
40
0
5
10
15
20
25
30
35
INPU
T IP
3 (d
Bm)
1364
5-06
7
Figure 59. Input IP3 vs. RF Frequency at Various Temperatures,
LO Drive = 18 dBm
0
–20
–18
–16
–14
–12
–10
–8
–6
–4
–2
11 2725232119171513
CONV
ERSI
ON
GAI
N (d
B)
RF FREQUENCY (GHz)
20dBm18dBm16dBm14dBm
1364
5-06
8
Figure 60. Conversion Gain vs. RF Frequency at Various LO Drives,
TA = 25°C
70
0
10
20
30
40
50
60
11 2725232119171513
IMAG
E RE
JECT
ION
(dBc
)
RF FREQUENCY (GHz)
20dBm18dBm16dBm14dBm
1364
5-06
9
Figure 61. Image Rejection vs. RF Frequency at Various LO Drives,
TA = 25°C
11 2725232119171513RF FREQUENCY (GHz)
40
0
5
10
15
20
25
30
35
INPU
T IP
3 (d
Bm)
20dBm18dBm16dBm14dBm
1364
5-07
0
Figure 62. Input IP3 vs. RF Frequency at Various LO Drives, TA = 25°C
Data Sheet HMC8191
Rev. C | Page 17 of 44
24
4
6
8
10
12
14
16
18
20
22
11 2725232119171513
INPU
T P1
dB (d
Bm)
RF FREQUENCY (GHz)
TA = +85°CTA = +25°CTA = –40°C
1364
5-07
1
Figure 63. Input P1dB vs. RF Frequency at Various Temperatures,
LO Drive = 18 dBm
80
20
30
40
50
60
70
INPU
T IP
2 (d
Bm)
TA = +85°CTA = +25°CTA = –40°C
11 2725232119171513RF FREQUENCY (GHz) 13
645-
072
Figure 64. Input IP2 vs. RF Frequency at Various Temperatures,
LO Drive = 18 dBm
24
4
6
8
10
12
14
16
18
20
22
11 2725232119171513
INPU
T P1
dB (d
Bm)
RF FREQUENCY (GHz)
20dBm18dBm16dBm14dBm
1364
5-07
3
Figure 65. Input P1dB vs. RF Frequency at Various LO Drives, TA = 25°C
80
10
20
30
40
50
60
70
INPU
T IP
2 (d
Bm)
11 2725232119171513RF FREQUENCY (GHz)
20dBm18dBm16dBm14dBm
1364
5-07
4
Figure 66. Input IP2 vs. RF Frequency at Various LO Drives, TA = 25°C
HMC8191 Data Sheet
Rev. C | Page 18 of 44
UPCONVERTER PERFORMANCE: IF = 100 MHz, LOWER SIDEBAND (HIGH-SIDE LO) 0
–20
–18
–16
–14
–12
–10
–8
–6
–4
–2
6 282624222018161412108
CONV
ERSI
ON
GAI
N (d
B)
RF FREQUENCY (GHz)
TA = +85°CTA = +25°CTA = –40°C
1364
5-07
5
Figure 67. Conversion Gain vs. RF Frequency at Various Temperatures, LO Drive = 18 dBm
6 282624222018161412108
SIDE
BAND
REJ
ECTI
ON
(dBc
)
RF FREQUENCY (GHz)
TA = +85°CTA = +25°CTA = –40°C
50
0
5
10
15
20
25
30
35
40
45
1364
5-07
6
Figure 68. Sideband Rejection vs. RF Frequency at Various Temperatures,
LO Drive = 18 dBm
6 282624222018161412108RF FREQUENCY (GHz)
TA = +85°CTA = +25°CTA = –40°C
40
0
5
10
15
20
25
30
35
INPU
T IP
3 (d
Bm)
1364
5-07
7
Figure 69. Input IP3 vs. RF Frequency at Various Temperatures,
LO Drive = 18 dBm
0
–20
–18
–16
–14
–12
–10
–8
–6
–4
–2
6 282624222018161412108
CONV
ERSI
ON
GAI
N (d
B)
RF FREQUENCY (GHz)
20dBm18dBm16dBm14dBm
1364
5-07
8
Figure 70. Conversion Gain vs. RF Frequency at Various LO Drives,
TA = 25°C
6 282624222018161412108
SIDE
BAND
REJ
ECTI
ON
(dBc
)
RF FREQUENCY (GHz)
50
0
5
10
15
20
25
30
35
40
45
20dBm18dBm16dBm14dBm
1364
5-07
9
Figure 71. Sideband Rejection vs. RF Frequency at Various LO Drives,
TA = 25°C
6 282624222018161412108RF FREQUENCY (GHz)
40
0
5
10
15
20
25
30
35
INPU
T IP
3 (d
Bm)
20dBm18dBm16dBm14dBm
1364
5-08
0
Figure 72. Input IP3 vs. RF Frequency at Various LO Drives, TA = 25°C
Data Sheet HMC8191
Rev. C | Page 19 of 44
20
0
4
8
2
6
10
12
14
16
18
INPU
T P1
dB (d
Bm)
TA = +85°CTA = +25°CTA = –40°C
6 2624222018161412108RF FREQUENCY (GHz) 13
645-
081
Figure 73. Input P1dB vs. RF Frequency at Various Temperatures,
LO Drive = 18 dBm
20
0
4
8
2
6
10
12
14
16
18
INPU
T P1
dB (d
Bm)
6 2624222018161412108RF FREQUENCY (GHz)
20dBm18dBm16dBm14dBm
1364
5-08
2
Figure 74. Input P1dB vs. RF Frequency at Various LO Drives, TA = 25°C
HMC8191 Data Sheet
Rev. C | Page 20 of 44
UPCONVERTER PERFORMANCE: IF = 2500 MHz, LOWER SIDEBAND (HIGH-SIDE LO) 0
–20
–18
–16
–14
–12
–10
–8
–6
–4
–2
5 27252321191715131197
CONV
ERSI
ON
GAI
N (d
B)
RF FREQUENCY (GHz)
TA = +85°CTA = +25°CTA = –40°C
1364
5-08
3
Figure 75. Conversion Gain vs. RF Frequency at Various Temperatures, LO Drive = 18 dBm
5 27252321191715131197RF FREQUENCY (GHz)
TA = +85°CTA = +25°CTA = –40°CSI
DEBA
ND R
EJEC
TIO
N (d
Bc)
50
0
5
10
15
20
25
30
35
40
45
1364
5-08
4
Figure 76. Sideband Rejection vs. RF Frequency at Various Temperatures,
LO Drive = 18 dBm
40
0
5
10
15
20
25
30
35
INPU
T IP
3 (d
Bm)
5 27252321191715131197RF FREQUENCY (GHz)
TA = +85°CTA = +25°CTA = –40°C
1364
5-08
5
Figure 77. Input IP3 vs. RF Frequency at Various Temperatures,
LO Drive = 18 dBm
0
–20
–18
–16
–14
–12
–10
–8
–6
–4
–2
5 27252321191715131197
CONV
ERSI
ON
GAI
N (d
B)
RF FREQUENCY (GHz)
20dBm18dBm16dBm14dBm
1364
5-08
6
Figure 78. Conversion Gain vs. RF Frequency at Various LO Drives,
TA = 25°C
5 27252321191715131197RF FREQUENCY (GHz)
SIDE
BAND
REJ
ECTI
ON
(dBc
)
50
0
5
10
15
20
25
30
35
40
45
20dBm18dBm16dBm14dBm
1364
5-08
7
Figure 79. Sideband Rejection vs. RF Frequency at Various LO Drives,
TA = 25°C
40
0
5
10
15
20
25
30
35
INPU
T IP
3 (d
Bm)
5 27252321191715131197RF FREQUENCY (GHz)
20dBm18dBm16dBm14dBm
1364
5-08
8
Figure 80. Input IP3 vs. RF Frequency at Various LO Drives, TA = 25°C
Data Sheet HMC8191
Rev. C | Page 21 of 44
20
0
4
8
2
6
10
12
14
16
18
INPU
T P1
dB (d
Bm)
TA = +85°CTA = +25°CTA = –40°C
6 2624222018161412108RF FREQUENCY (GHz) 13
645-
089
Figure 81. Input P1dB vs. RF Frequency at Various Temperatures,
LO Drive = 18 dBm
20
0
4
8
2
6
10
12
14
16
18
INPU
T P1
dB (d
Bm)
6 2624222018161412108RF FREQUENCY (GHz)
20dBm18dBm16dBm14dBm
1364
5-09
0
Figure 82. Input P1dB vs. RF Frequency at Various LO Drives, TA = 25°C
HMC8191 Data Sheet
Rev. C | Page 22 of 44
UPCONVERTER PERFORMANCE: IF = 5000 MHz, LOWER SIDEBAND (HIGH-SIDE LO) 0
–20
–18
–16
–14
–12
–10
–8
–6
–4
–2
6 2624222018161412108
CONV
ERSI
ON
GAI
N (d
B)
RF FREQUENCY (GHz)
TA = +85°CTA = +25°CTA = –40°C
1364
5-09
1
Figure 83. Conversion Gain vs. RF Frequency at Various Temperatures, LO Drive = 18 dBm
70
0
10
20
30
40
50
60
6 2624222018161412108
SIDE
BAND
REJ
ECTI
ON
(dBc
)
RF FREQUENCY (GHz)
TA = +85°CTA = +25°CTA = –40°C
1364
5-09
2
Figure 84. Sideband Rejection vs. RF Frequency at Various Temperatures,
LO Drive = 18 dBm
6 2624222018161412108RF FREQUENCY (GHz)
TA = +85°CTA = +25°CTA = –40°C
40
0
5
10
15
20
25
30
35
INPU
T IP
3 (d
Bm)
1364
5-09
3
Figure 85. Input IP3 vs. RF Frequency at Various Temperatures,
LO Drive = 18 dBm
0
–20
–18
–16
–14
–12
–10
–8
–6
–4
–2
6 2624222018161412108
CONV
ERSI
ON
GAI
N (d
B)
RF FREQUENCY (GHz)
20dBm18dBm16dBm14dBm
1364
5-09
4
Figure 86. Conversion Gain vs. RF Frequency at Various LO Drives,
TA = 25°C
70
0
10
20
30
40
50
60
6 2624222018161412108
SIDE
BAND
REJ
ECTI
ON
(dBc
)
RF FREQUENCY (GHz)
20dBm18dBm16dBm14dBm
1364
5-09
5
Figure 87. Sideband Rejection vs. RF Frequency at Various LO Drives,
TA = 25°C
6 2624222018161412108RF FREQUENCY (GHz)
40
0
5
10
15
20
25
30
35
INPU
T IP
3 (d
Bm)
20dBm18dBm16dBm14dBm
1364
5-09
6
Figure 88. Input IP3 vs. RF Frequency at Various LO Drives,
TA = 25°C
Data Sheet HMC8191
Rev. C | Page 23 of 44
24
22
4
8
12
16
20
6
10
14
18
6 2624222018161412108
INPU
T P1
dB (d
Bm)
RF FREQUENCY (GHz)
TA = +85°CTA = +25°CTA = –40°C
1364
5-09
7
Figure 89. Input P1dB vs. RF Frequency at Various Temperatures,
LO Drive = 18 dBm
24
22
4
8
12
16
20
6
10
14
18
6 2624222018161412108
INPU
T P1
dB (d
Bm)
RF FREQUENCY (GHz)
20dBm18dBm16dBm14dBm
1364
5-09
8
Figure 90. Input P1dB vs. RF Frequency at Various LO Drives, TA = 25°C
HMC8191 Data Sheet
Rev. C | Page 24 of 44
UPCONVERTER PERFORMANCE: IF = 100 MHz, UPPER SIDEBAND (LOW-SIDE LO) 0
–20
–18
–16
–14
–12
–10
–8
–6
–4
–2
6 282624222018161412108
CONV
ERSI
ON
GAI
N (d
B)
RF FREQUENCY (GHz)
TA = +85°CTA = +25°CTA = –40°C
1364
5-09
9
Figure 91. Conversion Gain vs. RF Frequency at Various Temperatures, LO Drive = 18 dBm
50
0
5
10
15
20
25
30
35
40
45
6 282624222018161412108
SIDE
BAND
REJ
ECTI
ON
(dBc
)
RF FREQUENCY (GHz)
TA = +85°CTA = +25°CTA = –40°C
1364
5-10
0
Figure 92. Sideband Rejection vs. RF Frequency at Various Temperatures, LO
Drive = 18 dBm
40
0
5
10
15
20
25
30
35
6 282624222018161412108
INPU
T IP
3 (d
Bm)
RF FREQUENCY (GHz)
TA = +85°CTA = +25°CTA = –40°C
1364
5-10
1
Figure 93. Input IP3 vs. RF Frequency at Various Temperatures,
LO Drive = 18 dBm
0
–20
–18
–16
–14
–12
–10
–8
–6
–4
–2
6 282624222018161412108
CONV
ERSI
ON
GAI
N (d
B)
RF FREQUENCY (GHz)
20dBm18dBm16dBm14dBm
1364
5-10
2
Figure 94. Conversion Gain vs. RF Frequency at Various LO Drives,
TA = 25°C
50
0
5
10
15
20
25
30
35
40
45
6 282624222018161412108
SIDE
BAND
REJ
ECTI
ON
(dBc
)
RF FREQUENCY (GHz)
20dBm18dBm16dBm14dBm
1364
5-10
3
Figure 95. Sideband Rejection vs. RF Frequency at Various LO Drives,
TA = 25°C
40
0
5
10
15
20
25
30
35
6 282624222018161412108
INPU
T IP
3 (d
Bm)
RF FREQUENCY (GHz)
20dBm18dBm16dBm14dBm
1364
5-10
4
Figure 96. Input IP3 vs. RF Frequency at Various LO Drives, TA = 25°C
Data Sheet HMC8191
Rev. C | Page 25 of 44
20
0
4
8
2
6
10
12
14
16
18
INPU
T P1
dB (d
Bm)
6 2624222018161412108RF FREQUENCY (GHz)
TA = +85°CTA = +25°CTA = –40°C
1364
5-10
5
Figure 97. Input P1dB vs. RF Frequency at Various Temperatures,
LO Drive = 18 dBm
20
0
4
8
2
6
10
12
14
16
18
INPU
T P1
dB (d
Bm)
6 2624222018161412108RF FREQUENCY (GHz)
20dBm18dBm16dBm14dBm
1364
5-10
6
Figure 98. Input P1dB vs. RF Frequency at Various LO Drives, TA = 25°C
HMC8191 Data Sheet
Rev. C | Page 26 of 44
UPCONVERTER PERFORMANCE: IF = 2500 MHz, UPPER SIDEBAND (LOW-SIDE LO) 0
–20
–18
–16
–14
–12
–10
–8
–6
–4
–2
8 28262422201816141210
CONV
ERSI
ON
GAI
N (d
B)
RF FREQUENCY (GHz)
TA = +85°CTA = +25°CTA = –40°C
1364
5-10
7
Figure 99. Conversion Gain vs. RF Frequency at Various Temperatures, LO Drive = 18 dBm
60
0
10
20
30
40
50
8 28262422201816141210
SIDE
BAND
REJ
ECTI
ON
(dBc
)
RF FREQUENCY (GHz)
TA = +85°CTA = +25°CTA = –40°C
1364
5-10
8
Figure 100. Sideband Rejection vs. RF Frequency at Various Temperatures, LO
Drive = 18 dBm
40
0
5
10
15
20
25
30
35
8 28262422201816141210
INPU
T IP
3 (d
Bm)
RF FREQUENCY (GHz)
TA = +85°CTA = +25°CTA = –40°C
1364
5-10
9
Figure 101. Input IP3 vs. RF Frequency at Various Temperatures,
LO Drive = 18 dBm
0
–20
–18
–16
–14
–12
–10
–8
–6
–4
–2
8 28262422201816141210
CONV
ERSI
ON
GAI
N (d
B)
RF FREQUENCY (GHz)
20dBm18dBm16dBm14dBm
1364
5-11
0
Figure 102. Conversion Gain vs. RF Frequency at Various LO Drives,
TA = 25°C
60
0
10
20
30
40
50
8 28262422201816141210
SIDE
BAND
REJ
ECTI
ON
(dBc
)
RF FREQUENCY (GHz)
20dBm18dBm16dBm14dBm
1364
5-11
1
Figure 103. Sideband Rejection vs. RF Frequency at Various LO Drives,
TA = 25°C
40
0
5
10
15
20
25
30
35
8 28262422201816141210
INPU
T IP
3 (d
Bm)
RF FREQUENCY (GHz)
20dBm18dBm16dBm14dBm
1364
5-11
2
Figure 104. Input IP3 vs. RF Frequency at Various LO Drives, TA = 25°C
Data Sheet HMC8191
Rev. C | Page 27 of 44
20
0
4
8
2
6
10
12
14
16
18
INPU
T P1
dB (d
Bm)
6 2624222018161412108RF FREQUENCY (GHz)
TA = +85°CTA = +25°CTA = –40°C
1364
5-11
3
Figure 105. Input P1dB vs. RF Frequency at Various Temperatures,
LO Drive = 18 dBm
20
0
4
8
2
6
10
12
14
16
18
INPU
T P1
dB (d
Bm)
6 2624222018161412108RF FREQUENCY (GHz)
20dBm18dBm16dBm14dBm
1364
5-11
4
Figure 106. Input P1dB vs. RF Frequency at Various LO Drives, TA = 25°C
HMC8191 Data Sheet
Rev. C | Page 28 of 44
UPCONVERTER PERFORMANCE: IF = 5000 MHz, UPPER SIDEBAND (LOW-SIDE LO) 0
–20
–18
–16
–14
–12
–10
–8
–6
–4
–2
11 2725232119171513
CONV
ERSI
ON
GAI
N (d
B)
RF FREQUENCY (GHz)
TA = +85°CTA = +25°CTA = –40°C
1364
5-11
5
Figure 107. Conversion Gain vs. RF Frequency at Various Temperatures, LO Drive = 18 dBm
80
70
60
0
10
20
30
40
50
SIDE
BAND
REJ
ECTI
ON
(dBc
)
TA = +85°CTA = +25°CTA = –40°C
11 27
1364
5-11
6
25232119171513RF FREQUENCY (GHz)
Figure 108. Sideband Rejection vs. RF Frequency at Various Temperatures, LO Drive = 18 dBm
40
0
5
10
15
20
25
30
35
INPU
T IP
3 (d
Bm)
TA = +85°CTA = +25°CTA = –40°C
11 2725232119171513RF FREQUENCY (GHz) 13
645-
117
Figure 109. Input IP3 vs. RF Frequency at Various Temperatures,
LO Drive = 18 dBm
0
–20
–18
–16
–14
–12
–10
–8
–6
–4
–2
11 2725232119171513
CONV
ERSI
ON
GAI
N (d
B)
RF FREQUENCY (GHz)
20dBm18dBm16dBm14dBm
1364
5-11
8
Figure 110. Conversion Gain vs. RF Frequency at Various LO Drives,
TA = 25°C
80
70
60
0
10
20
30
40
50
SIDE
BAND
REJ
ECTI
ON
(dBc
)
11 2725232119171513RF FREQUENCY (GHz)
20dBm18dBm16dBm14dBm
1364
5-11
9
Figure 111. Sideband Rejection vs. RF Frequency at Various LO Drives,
TA = 25°C
40
0
5
10
15
20
25
30
35
INPU
T IP
3 (d
Bm)
11 2725232119171513RF FREQUENCY (GHz)
20dBm18dBm16dBm14dBm
1364
5-12
0
Figure 112. Input IP3 vs. RF Frequency at Various LO Drives, TA = 25°C
Data Sheet HMC8191
Rev. C | Page 29 of 44
30
0
5
10
15
20
25
INPU
T P1
dB (d
Bm)
10 2624222018161412RF FREQUENCY (GHz)
TA = +85°CTA = +25°CTA = –40°C
1364
5-12
1
Figure 113. Input P1dB vs. RF Frequency at Various Temperatures,
LO Drive = 18 dBm
30
0
5
10
15
20
25
INPU
T P1
dB (d
Bm)
10 2624222018161412RF FREQUENCY (GHz)
20dBm18dBm16dBm14dBm
1364
5-12
2
Figure 114. Input P1dB vs. RF Frequency at Various LO Drives, TA = 25°C
HMC8191 Data Sheet
Rev. C | Page 30 of 44
ISOLATION AND RETURN LOSS 80
70
10
20
40
60
30
50
6 282624222018161412108
LO T
O IF
ISO
LATI
ON
(dB)
LO FREQUENCY (GHz)
TA = +85°CTA = +25°CTA = –40°C
1364
5-12
3
LO TO IF1LO TO IF2
Figure 115. LO to IF Isolation vs. LO Frequency at Various Temperatures,
IF = 100 MHz, LO Drive = 18 dBm
80
70
10
20
40
60
30
50
6 282624222018161412108
LO T
O R
F IS
OLA
TIO
N (d
B)
LO FREQUENCY (GHz)
TA = +85°CTA = +25°CTA = –40°C
1364
5-12
4
Figure 116. LO to RF Isolation vs. LO Frequency at Various Temperatures,
IF = 100 MHz, LO Drive = 18 dBm
50
45
0
15
35
5
25
40
10
30
20
6 282624222018161412108
RF T
O IF
ISO
LATI
ON
(dB)
RF FREQUENCY (GHz) 1364
5-12
5
TA = +85°CTA = +25°CTA = –40°C
RF TO IF1RF TO IF2
Figure 117. RF to IF Isolation vs. RF Frequency at Various Temperatures,
IF = 100 MHz, LO Drive = 18 dBm
80
70
10
20
40
60
30
50
6 282624222018161412108
LO T
O IF
ISO
LATI
ON
(dB)
LO FREQUENCY (GHz) 1364
5-12
6
LO TO IF1LO TO IF2
20dBm18dBm16dBm14dBm
Figure 118. LO to IF Isolation vs. LO Frequency at Various LO Drives,
IF = 100 MHz, TA = 25°C
80
70
10
20
40
60
30
50
6 282624222018161412108
LO T
O R
F IS
OLA
TIO
N (d
B)
LO FREQUENCY (GHz)
20dBm18dBm16dBm14dBm
1364
5-12
7
Figure 119. LO to RF Isolation vs. LO Frequency at Various LO Drives,
IF = 100 MHz, TA = 25°C
50
45
0
15
35
5
25
40
10
30
20
6 282624222018161412108
RF T
O IF
ISO
LATI
ON
(dB)
RF FREQUENCY (GHz) 1364
5-12
8
RF TO IF1RF TO IF2
20dBm18dBm16dBm14dBm
Figure 120. RF to IF Isolation vs. RF Frequency at Various LO Drives,
IF = 100 MHz, TA = 25°C
Data Sheet HMC8191
Rev. C | Page 31 of 44
0
–40
–35
–30
–25
–20
–15
–10
–5
5 27252321191715131197
LO R
ETUR
N LO
SS (d
B)
LO FREQUENCY (GHz)
TA = +85°CTA = +25°CTA = –40°C
1364
5-12
9
Figure 121. LO Return Loss vs. LO Frequency at Various Temperatures,
LO Drive = 18 dBm
0
–40
–35
–30
–25
–20
–15
–10
–5
5 27252321191715131197
RF R
ETUR
N LO
SS (d
B)
RF FREQUENCY (GHz)
TA = +85°CTA = +25°CTA = –40°C
1364
5-13
0
Figure 122. RF Return Loss vs. RF Frequency at Various Temperatures,
LO Frequency = 16 GHz, LO Drive = 18 dBm
0
–30
–25
–20
–15
–10
–5
0 5.04.54.03.53.02.52.01.51.00.5
IF1/
IF2
RETU
RN L
OSS
(dB)
IF FREQUENCY (GHz)
IF1 AT TA = +85°CIF1 AT TA = +25°CIF1 AT TA = –40°CIF2 AT TA = +85°CIF2 AT TA = +25°CIF2 AT TA = –40°C
1364
5-13
1
Figure 123. IF1/IF2 Return Loss vs. IF Frequency at Various Temperatures,
LO Frequency = 16 GHz, LO Drive = 18 dBm
0
–40
–35
–30
–25
–20
–15
–10
–5
5 27252321191715131197
LO R
ETUR
N LO
SS (d
B)
LO FREQUENCY (GHz)
20dBm18dBm16dBm
1364
5-13
2
Figure 124. LO Return Loss vs. LO Frequency at Various LO Drives
0
–40
–35
–30
–25
–20
–15
–10
–5
5 27252321191715131197
RF R
ETUR
N LO
SS (d
B)
RF FREQUENCY (GHz)
20dBm18dBm16dBm
1364
5-13
3
Figure 125. RF Return Loss vs. RF Frequency at Various LO Drives,
LO Frequency = 16 GHz
0
–30
–25
–20
–15
–10
–5
0 5.04.54.03.53.02.52.01.51.00.5
IF1/
IF2
RETU
RN L
OSS
(dB)
IF FREQUENCY (GHz)
IF1 AT 20dBmIF1 AT 18dBmIF1 AT 16dBmIF2 AT 20dBmIF2 AT 18dBmIF2 AT 16dBm
1364
5-13
4
Figure 126. IF1/IF2 Return Loss vs. IF Frequency at Various LO Drives,
LO Frequency = 16 GHz
HMC8191 Data Sheet
Rev. C | Page 32 of 44
IF BANDWIDTH PERFORMANCE: DOWNCONVERTER, LOWER SIDEBAND (HIGH-SIDE LO) 0
–20
–18
–16
–14
–12
–10
–8
–6
–4
–2
CONV
ERSI
ON
GAI
N (d
B)
TA = +85°CTA = +25°CTA = –40°C
0.5 5.04.54.03.53.02.52.01.51.0IF FREQUENCY (GHz) 13
645-
135
Figure 127. Conversion Gain vs. IF Frequency at Various Temperatures, LO
Drive = 18 dBm at 16 GHz
TA = +85°CTA = +25°CTA = –40°C
0.5 5.04.54.03.53.02.52.01.51.0IF FREQUENCY (GHz)
50
45
40
35
30
25
20
15
10
5
0
IMAG
E RE
JECT
ION
(dBc
)
1364
5-13
6
Figure 128. Image Rejection vs. IF Frequency at Various Temperatures,
LO Drive = 18 dBm at 16 GHz
TA = +85°CTA = +25°CTA = –40°C
0.5 5.04.54.03.53.02.52.01.51.0IF FREQUENCY (GHz)
30
10
16
20
12
18
14
22
24
26
28
INPU
T IP
3 (d
Bm)
1364
5-13
7
Figure 129. Input IP3 vs. IF Frequency at Various Temperatures,
LO Drive = 18 dBm at 16 GHz
0
–20
–18
–16
–14
–12
–10
–8
–6
–4
–2
CONV
ERSI
ON
GAI
N (d
B)
0.5 5.04.54.03.53.02.52.01.51.0IF FREQUENCY (GHz)
20dBm18dBm16dBm14dBm
1364
5-13
8
Figure 130. Conversion Gain vs. IF Frequency at Various LO Drives,
LO Frequency = 16 GHz, TA = 25°C
0.5 5.04.54.03.53.02.52.01.51.0IF FREQUENCY (GHz)
20dBm18dBm16dBm14dBm
50
0
5
10
15
20
25
30
35
40
45
IMAG
E RE
JECT
ION
(dBc
)
1364
5-13
9
Figure 131. Image Rejection vs. IF Frequency at Various LO Drives,
LO Frequency = 16 GHz, TA = 25°C
0.5 5.04.54.03.53.02.52.01.51.0IF FREQUENCY (GHz)
30
10
16
20
12
18
14
22
24
26
28
INPU
T IP
3 (d
Bm)
20dBm18dBm16dBm14dBm
1364
5-14
0
Figure 132. Input IP3 vs. IF Frequency at Various LO Drives,
LO Frequency = 16 GHz, TA = 25°C
Data Sheet HMC8191
Rev. C | Page 33 of 44
AMPLITUDE AND PHASE IMBALANCE PERFORMANCE: DOWNCONVERTER, LOWER SIDEBAND (HIGH-SIDE LO) 4
–4
–3
–2
–1
0
1
2
3
6 2624222018161412108
AMPL
ITUD
E IM
BALA
NCE
(dB)
RF FREQUENCY (GHz)
TA = +85°CTA = +25°CTA = –40°C
1364
5-14
1
Figure 133. Amplitude Imbalance vs. RF Frequency at Various Temperatures,
LO Drive = 18 dBm, IF = 100 MHz
20
–20
–15
–10
–5
0
5
10
15
6 2624222018161412108
PHAS
E IM
BALA
NCE
(Deg
rees
)
RF FREQUENCY (GHz) 1364
5-14
2
TA = +85°CTA = +25°CTA = –40°C
Figure 134. Phase Imbalance vs. RF Frequency at Various Temperatures, LO
Drive = 18 dBm, IF = 100 MHz
4
–4
–3
–2
–1
0
1
2
3
6 2624222018161412108
AMPL
ITUD
E IM
BALA
NCE
(dB)
RF FREQUENCY (GHz)
TA = +85°CTA = +25°CTA = –40°C
1364
5-14
3
Figure 135. Amplitude Imbalance vs. RF Frequency at Various Temperatures,
LO Drive = 18 dBm, IF = 2500 MHz
4
–4
–3
–2
–1
0
1
2
3
6 2624222018161412108
AMPL
ITUD
E IM
BALA
NCE
(dB)
RF FREQUENCY (GHz)
20dBm18dBm16dBm14dBm
1364
5-14
4
Figure 136. Amplitude Imbalance vs. RF Frequency at Various LO Drives,
IF = 100 MHz, TA = 25°C
20
–20
–15
–10
–5
0
5
10
15
6 2624222018161412108
PHAS
E IM
BALA
NCE
(Deg
rees
)
RF FREQUENCY (GHz) 1364
5-14
5
20dBm18dBm16dBm14dBm
Figure 137. Phase Imbalance vs. RF Frequency at Various LO Drives,
IF = 100 MHz, TA = 25°C
4
–4
–3
–2
–1
0
1
2
3
6 2624222018161412108
AMPL
ITUD
E IM
BALA
NCE
(dB)
RF FREQUENCY (GHz) 1364
5-14
6
20dBm18dBm16dBm14dBm
Figure 138. Amplitude Imbalance vs. RF Frequency at Various LO Drives,
IF = 2500 MHz, TA = 25°C
HMC8191 Data Sheet
Rev. C | Page 34 of 44
20
–20
–15
–10
–5
0
5
10
15
6 2624222018161412108
PHAS
E IM
BALA
NCE
(Deg
rees
)
RF FREQUENCY (GHz) 1364
5-14
7
TA = +85°CTA = +25°CTA = –40°C
Figure 139. Phase Imbalance vs. RF Frequency at Various Temperatures,
LO Drive = 18 dBm, IF = 2500 MHz
20
–20
–15
–10
–5
0
5
10
15
6 2624222018161412108
PHAS
E IM
BALA
NCE
(Deg
rees
)
RF FREQUENCY (GHz) 1364
5-14
8
20dBm18dBm16dBm14dBm
Figure 140. Phase Imbalance vs. RF Frequency at Various LO Drives,
IF = 2500 MHz, TA = 25°C
Data Sheet HMC8191
Rev. C | Page 35 of 44
AMPLITUDE AND PHASE IMBALANCE PERFORMANCE: DOWNCONVERTER, UPPER SIDEBAND (LOW-SIDE LO) 4
–4
–3
–2
–1
0
1
2
3
6 2624222018161412108
AMPL
ITUD
E IM
BALA
NCE
(dB)
RF FREQUENCY (GHz)
TA = +85°CTA = +25°CTA = –40°C
1364
5-14
9
Figure 141. Amplitude Imbalance vs. RF Frequency at Various Temperatures,
LO Drive = 18 dBm, IF = 100 MHz
20
–20
–15
–10
–5
0
5
10
15
6 2624222018161412108
PHAS
E IM
BALA
NCE
(Deg
rees
)
RF FREQUENCY (GHz) 1364
5-15
0
TA = +85°CTA = +25°CTA = –40°C
Figure 142. Phase Imbalance vs. RF Frequency at Various Temperatures, LO
Drive = 18 dBm, IF = 100 MHz
4
–4
–3
–2
–1
0
1
2
3
6 2624222018161412108
AMPL
ITUD
E IM
BALA
NCE
(dB)
RF FREQUENCY (GHz)
TA = +85°CTA = +25°CTA = –40°C
1364
5-15
1
Figure 143. Amplitude Imbalance vs. RF Frequency at Various Temperatures,
LO Drive = 18 dBm, IF = 2500 MHz
4
–4
–3
–2
–1
0
1
2
3
6 2624222018161412108
AMPL
ITUD
E IM
BALA
NCE
(dB)
RF FREQUENCY (GHz) 1364
5-15
2
20dBm18dBm16dBm14dBm
Figure 144. Amplitude Imbalance vs. RF Frequency at Various LO Drives,
IF = 100 MHz, TA = 25°C
20
–20
–15
–10
–5
0
5
10
15
6 2624222018161412108
PHAS
E IM
BALA
NCE
(Deg
rees
)
RF FREQUENCY (GHz) 1364
5-15
3
20dBm18dBm16dBm14dBm
Figure 145. Phase Imbalance vs. RF Frequency at Various LO Drives,
IF = 100 MHz, TA = 25°C
4
–4
–3
–2
–1
0
1
2
3
6 2624222018161412108
AMPL
ITUD
E IM
BALA
NCE
(dB)
RF FREQUENCY (GHz) 1364
5-15
4
20dBm18dBm16dBm14dBm
Figure 146. Amplitude Imbalance vs. RF Frequency at Various LO Drives,
IF = 2500 MHz, TA = 25°C
HMC8191 Data Sheet
Rev. C | Page 36 of 44
20
–20
–15
–10
–5
0
5
10
15
6 2624222018161412108
PHAS
E IM
BALA
NCE
(Deg
rees
)
RF FREQUENCY (GHz) 1364
5-15
5
TA = +85°CTA = +25°CTA = –40°C
Figure 147. Phase Imbalance vs. RF Frequency at Various Temperatures,
LO Drive = 18 dBm, IF = 2500 MHz
20
–20
–15
–10
–5
0
5
10
15
6 2624222018161412108
PHAS
E IM
BALA
NCE
(Deg
rees
)
RF FREQUENCY (GHz) 1364
5-15
6
20dBm18dBm16dBm14dBm
Figure 148. Phase Imbalance vs. RF Frequency at Various LO Drives,
IF = 2500 MHz, TA = 25°C
Data Sheet HMC8191
Rev. C | Page 37 of 44
SPURIOUS AND HARMONICS PERFORMANCE N/A means not applicable.
LO Harmonics Isolation
LO power = 18 dBm, TA = 25°C, and all values are in dBc below the input LO level measured at the RF port.
Table 5. N × LO Spur at RF Output N × LO Spur at RF Port LO Frequency (GHz) 1 2 3 4 6 37 47 57 37 8 40 52 53 40 10 46 61 62 46 12 47 68 79 47 14 46 68 72 46 16 39 77 N/A 39 18 37 78 N/A 37 20 39 60 N/A 39 22 41 55 N/A 40 24 46 N/A N/A 46 26 45 N/A N/A 45
Downconverter M × N Spurious Outputs
Mixer spurious products are measured in dBc from the IF output power level, unless otherwise specified. Spur values are (M × RF) − (N × LO).
IF = 100 MHz, RF = 6000 MHz, LO = 6100 MHz, RF power = −10 dBm, LO power = 18 dBm, and TA = 25°C.
N × LO 0 1 2 3 4 5
M × RF
0 N/A −4 +15 +18 +35 N/A
1 +18 N/A +23 +31 +41 +57
2 +57 +49 +43 +53 +54 +72
3 +87 +72 +62 +59 +63 +63
4 +84 +86 +88 +80 +78 +80
5 N/A +84 +85 +88 +90 +88
IF = 100 MHz, RF = 16000 MHz, LO = 16100 MHz, RF power = −10 dBm, LO power = 18 dBm, and TA = 25°C.
N × LO 0 1 2 3 4 5
M × RF
0 N/A 9 N/A N/A N/A N/A
1 28 N/A N/A N/A N/A N/A
2 N/A 87 75 84 N/A N/A
3 N/A N/A 86 75 90 N/A
4 N/A N/A N/A 88 95 88
5 N/A N/A N/A N/A 87 96
IF = 100 MHz, RF = 26000 MHz, LO = 26100 MHz, RF power = −10 dBm, LO power = 18 dBm, and TA = 25°C.
N × LO 0 1 2 3 4 5
M × RF
0 7 N/A N/A N/A N/A
1 21 N/A 46 N/A N/A N/A
2 N/A 84 69 85 N/A N/A
3 N/A N/A 82 83 82 N/A
4 N/A N/A N/A 81 92 81
5 N/A N/A N/A N/A 81 94
IF = 2500 MHz, RF = 6000 MHz, LO = 8500 MHz, RF power = −10 dBm, LO power = 18 dBm, and TA = 25°C.
N × LO 0 1 2 3 4 5
M × RF
0 −2 +26 +22 0 0
1 +7 N/A +21 +41 0 0
2 +73 +71 +65 +75 +86 0
3 +85 +77 +71 +77 +85 +85
4 +83 +85 +90 +93 +88 +85
5 0 +84 +88 +93 +91 +88
IF = 2500 MHz, RF = 16000 MHz, LO = 18500 MHz, RF power = −10 dBm, LO power = 18 dBm, and TA = 25°C.
N × LO 0 1 2 3 4 5
M × RF
0 N/A 1 N/A N/A N/A N/A
1 13 N/A 40 N/A N/A N/A
2 N/A 78 65 79 N/A N/A
3 N/A N/A 85 88 84 N/A
4 N/A N/A N/A 90 87 N/A
5 N/A N/A N/A 85 89 87
IF = 2500 MHz, RF = 26000 MHz, LO = 28500 MHz, RF power = −10 dBm, LO power = 18 dBm, and TA = 25°C.
N × LO 0 1 2 3 4 5
M × RF
0 N/A N/A N/A N/A N/A N/A
1 11 N/A N/A N/A N/A N/A
2 N/A 82 73 N/A N/A N/A
3 N/A N/A 85 79 N/A N/A
4 N/A N/A N/A 85 86 N/A
5 N/A N/A N/A N/A 83 87
HMC8191 Data Sheet
Rev. C | Page 38 of 44
IF = 5000 MHz, RF = 6000 MHz, LO = 11000 MHz, RF power = −10 dBm, LO power = 18 dBm, and TA = 25°C.
N × LO 0 1 2 3 4 5
M × RF
0 N/A 4 23 N/A N/A N/A
1 7 N/A 30 N/A N/A N/A
2 73 92 68 84 N/A N/A
3 86 82 83 83 82 N/A
4 82 87 92 87 86 N/A
5 N/A 83 88 88 84 83
IF = 5000 MHz, RF = 16000 MHz, LO = 21000 MHz, RF power = −10 dBm, LO power = 18 dBm, and TA = 25°C.
N × LO 0 1 2 3 4 5
M × RF
0 N/A 3 N/A N/A N/A N/A
1 11 N/A 40 N/A N/A N/A
2 N/A 83 85 N/A N/A N/A
3 N/A N/A 85 82 N/A N/A
4 N/A N/A 82 81 84 N/A
5 N/A N/A N/A 82 88 80
IF = 5000 MHz, RF = 26000 MHz, LO = 31000 MHz, RF power = −10 dBm, LO power = 18 dBm, and TA = 25°C.
N × LO 0 1 2 3 4 5
M × RF
0 N/A N/A N/A N/A N/A N/A
1 5 N/A N/A N/A N/A N/A
2 N/A 58 43 N/A N/A N/A
3 N/A N/A 66 67 N/A N/A
4 N/A N/A N/A 79 78 N/A
5 N/A N/A N/A N/A 82 75
Upconverter M × N Spurious Outputs
Mixer spurious products are measured in dBc from the RF output power level, unless otherwise specified. Spur values are (M × IF) − (N × LO).
IF = 100 MHz, RF = 6000 MHz, LO = 6100 GHz, RF power = −10 dBm, LO power = 18 dBm, and TA = 25°C.
N × LO 0 1 2 3 4 5
M × IF
0 N/A −2 +10 +16 +18 +32
1 +56 N/A +16 +14 +31 +33
2 +93 +46 +45 +44 +51 +56
3 +92 +51 +62 +49 +57 +62
4 N/A −2 +10 +16 +18 +32
5 +56 N/A +16 +14 +31 +33
IF = 100 MHz, RF = 16000 MHz, LO = 16100 MHz, RF power = −10 dBm, LO power = 18 dBm, and TA = 25°C.
N × LO 0 1 2 3 4 5
M × IF
0 2 37 N/A N/A N/A
1 62 N/A 47 N/A N/A N/A
2 94 58 79 N/A N/A N/A
3 95 80 80 N/A N/A N/A
4 95 83 78 N/A N/A N/A
5 93 81 80 N/A N/A N/A
IF = 100 MHz, RF = 26000 MHz, LO = 26100 MHz, RF power = −10 dBm, LO power = 18 dBm, and TA = 25°C.
N × LO 0 1 2 3 4 5
M × IF
0 4 N/A N/A N/A N/A
1 58 N/A N/A N/A N/A N/A
2 93 57 N/A N/A N/A N/A
3 92 80 N/A N/A N/A N/A
4 91 82 N/A N/A N/A N/A
5 90 82 N/A N/A N/A N/A
IF = 2500 MHz, RF = 6000 MHz, LO = 8500 MHz, RF power = −10 dBm, LO power = 18 dBm, and TA = 25°C.
N × LO 0 1 2 3 4 5
M × IF
0 N/A 4 11 14 50 0
1 14 0 15 30 43 58
2 83 81 70 66 82 68
3 71 90 78 69 80 75
4 90 92 86 82 82 78
5 85 91 89 84 82 82
IF = 2500 MHz, RF = 16000 MHz, LO = 18500 MHz, RF power = −10 dBm, LO power = 18 dBm, and TA = 25°C.
N × LO 0 1 2 3 4 5
M × IF
0 N/A N/A 27 N/A N/A N/A
1 15 N/A 52 N/A N/A N/A
2 92 70 78 N/A N/A N/A
3 87 88 83 N/A N/A N/A
4 89 87 83 N/A N/A N/A
5 88 93 80 N/A N/A N/A
Data Sheet HMC8191
Rev. C | Page 39 of 44
IF = 2500 MHz, RF = 26000 MHz, LO = 28500 MHz, RF power = −10 dBm, LO power = 18 dBm, and TA = 25°C.
N × LO 0 1 2 3 4 5
M × IF
0 12 N/A N/A N/A N/A N/A
1 50 61 N/A N/A N/A N/A
2 70 66 N/A N/A N/A N/A
3 86 82 N/A N/A N/A N/A
4 83 83 N/A N/A N/A N/A
5 12 N/A N/A N/A N/A N/A
IF = 5000 MHz, RF = 6000 MHz, LO = 11000 MHz, RF power = −10 dBm, LO power = 18 dBm, and TA = 25°C.
N × LO 0 1 2 3 4 5
M × IF
0 N/A 6 23 34 N/A N/A
1 5 N/A 17 47 70 N/A
2 80 91 65 79 75 N/A
3 81 89 85 83 84 72
4 80 86 91 83 82 75
5 77 83 89 85 82 82
IF = 5000 MHz, RF = 16000 MHz, LO = 21000 MHz, RF power = −10 dBm, LO power = 18 dBm, and TA = 25°C.
N × LO 0 1 2 3 4 5
M × IF
0 N/A −3 N/A N/A N/A N/A
1 +1 N/A +62 N/A N/A N/A
2 +81 +72 +74 N/A N/A N/A
3 +82 +87 +81 N/A N/A N/A
4 +79 +89 +81 N/A N/A N/A
5 +76 +88 +84 +65 N/A N/A
IF = 5000 MHz, RF = 26000 MHz, LO = 31000 MHz, RF power = −10 dBm, LO power = 18 dBm, and TA = 25°C.
N × LO 0 1 2 3 4 5
M × IF
0 N/A +3 N/A N/A N/A N/A
1 −7 N/A N/A N/A N/A N/A
2 +41 +42 N/A N/A N/A N/A
3 +77 +78 N/A N/A N/A N/A
4 +76 +81 N/A N/A N/A N/A
5 +72 +84 +64 N/A N/A N/A
HMC8191 Data Sheet
Rev. C | Page 40 of 44
THEORY OF OPERATION The HMC8191 is a passive, wideband, I/Q MMIC mixer that can be used either as an image reject mixer for receiver operations, or as a single-sideband upconverter for transmitter operations. With an RF and LO range of 6 GHz to 26.5 GHz, and an IF bandwidth of dc to 5 GHz, the HMC8191 is ideal for applications requiring wide frequency range, excellent RF performance, and a simple design with fewer components and a small PCB footprint. A single HMC8191 can replace multiple narrow-band mixers in a design.
The inherent I/Q architecture of the HMC8191 offers excellent image rejection and thereby eliminates the need for expensive filtering for unwanted sidebands. The double balanced archi-tecture of the mixer also provides excellent LO to RF isolation and LO to IF isolation, and reduces the effect of LO leakage to ensure signal integrity.
Because the HMC8191 is a passive mixer, the HMC8191 does not require any dc power sources. It offers a lower noise figure compared to an active mixer, ensuring superior dynamic range for high performance and precision applications.
The HMC8191 is fabricated on a GaAs MESFET process and uses Analog Devices mixer cells and a 90° hybrid. The HMC8191 is available in a compact, 4 mm × 4 mm, 24-terminal LCC package and operates over a −40°C to +85°C temperature range. An evaluation board for the HMC8191 is also available from the Analog Devices website.
For both upconversion and downconversion, an external 90° hybrid is required. See the Applications Information section for details to interface with an external 90° hybrid.
Data Sheet HMC8191
Rev. C | Page 41 of 44
APPLICATIONS INFORMATION Figure 149 shows the typical application circuit for the HMC8191. To select the appropriate sideband, an external 90° hybrid is needed. For applications not requiring operation to dc, use an off-chip dc blocking capacitor. For applications that require the LO signal at the output to be suppressed, use a bias tee or RF feed as shown in Figure 149. Ensure that the source or sink current used for LO suppression is <3 mA for each IF port to prevent damage to the device. The common-mode voltage for each IF port is 0 V.
To select the upper sideband when using as an upconverter, connect the IF1 pin to the 90° port of the hybrid, and connect the IF2 pin to the 0° port of the hybrid. To select the lower
sideband, connect IF1 to the 0° port of the hybrid and IF2 to the 90° port of the hybrid. The input is from the sum port of the hybrid and the difference port is 50 Ω terminated.
To select the upper sideband (low-side LO) when using as a downconverter, connect the IF1 pin to the 0° port of the hybrid, and connect the IF2 pin to the 90° port of the hybrid. To select the lower sideband (high-side LO), connect the IF1 pin to the 90° port of the hybrid and IF2 to the 0° port of the hybrid. The output is from the sum port of the hybrid, and the difference port is 50 Ω terminated.
1364
5-15
7
RF
IF1
IF2
LO
50Ω IF
HMC8191 EVALUATION BOARD
SUPPLYFOR IF1
SUPPLYFOR IF2
BIAS TEE/DC FEED FOR IF2
BIAS TEE/DC FEED FOR IF1 DC BLOCKING
CAPACITORS
EXTERNAL90° HYBRID
NOTES1. DASHED SECTIONS ARE OPTIONAL AND MEANT FOR LO NULLING.
13
1
3
4
2
7
5
6
14
15
16
17
18
8 9 10 11 12192021222324
Figure 149. Typical Application Circuit
HMC8191 Data Sheet
Rev. C | Page 42 of 44
RF AND LO PERFORMANCE ABOVE 26 GHz Figure 150 and Figure 151 shows the RF performance above 26 GHz for both upconversion and downconversion. The data was taken at an IF frequency of 100 MHz and LO power at 18 dBm.
Note that this performance is typical and not guaranteed. 0
–30
–25
–20
–15
–10
–5
26.0 30.029.529.028.528.027.527.026.5
CONV
ERSI
ON
GAI
N (d
B)
RF FREQUENCY (GHz)
DOWNCONVERTERDOWNCONVERTERUPCONVERTERUPCONVERTER
MODE SIDEBANDLOWER SIDEBANDUPPER SIDEBANDLOWER SIDEBANDUPPER SIDEBAND
1364
5-15
8
Figure 150. Conversion Gain vs. RF Frequency above 26 GHz at TA = 25°C for
Upper and Lower Sidebands, Upconversion and Downconversion, LO Drive = 18 dBm, IF = 100 MHz, External Hybrid Not Calibrated
40
0
5
10
15
20
30
25
35
26.0 30.029.529.028.528.027.527.026.5
INPU
T IP
3 (d
Bm)
RF FREQUENCY (GHz)
DOWNCONVERTERDOWNCONVERTERUPCONVERTERUPCONVERTER
MODE SIDEBANDLOWER SIDEBANDUPPER SIDEBANDLOWER SIDEBANDUPPER SIDEBAND
1364
5-15
9
Figure 151. Input IP3 vs. RF Frequency above 26 GHz at TA = 25°C for Upper and Lower Sidebands, Upconversion and Downconversion, LO Drive = 18 dBm,
IF = 100 MHz, External Hybrid Not Calibrated
IF BANDWIDTH ABOVE 5 GHz Figure 152, Figure 153, and Figure 154 show the IF performance above 5 GHz. The data for these figures has been taken in upconverter configuration at LO frequency and power of 16 GHz and 18 dBm, respectively.
Note that this performance is typical and not guaranteed.
0
–30
–25
–20
–15
–10
–5
5 1211109876
CONV
ERSI
ON
GAI
N (d
B)
IF FREQUENCY (GHz)
TYPELOWER SIDEBANDUPPER SIDEBAND
1364
5-16
0
Figure 152. Conversion Gain vs. IF Frequency above 5 GHz at TA = 25°C for
Upper and Lower Sidebands, LO Drive = 18 dBm at 16 GHz, Calibration to the Connector of the Evaluation Board
5 1211109876IF FREQUENCY (GHz)
TYPELOWER SIDEBANDUPPER SIDEBAND
40
0
5
10
15
20
30
25
35
INPU
T IP
3 (d
Bm)
1364
5-16
1
Figure 153. Input IP3 vs. IF Frequency above 5 GHz at TA = 25°C for Upper and
Lower Sidebands, LO Drive = 18 dBm at 16 GHz, Calibration to the Connector of the Evaluation Board
5 1211109876IF FREQUENCY (GHz)
TYPELOWER SIDEBANDUPPER SIDEBAND
40
0
5
10
15
20
30
25
35
SIDE
BAND
REJ
ECTI
ON
(dBc
)
1364
5-16
2
Figure 154. Sideband Rejection vs. IF Frequency above 5 GHz at TA = 25°C for Upper and Lower Sidebands, LO Drive = 18 dBm at 16 GHz, Calibration to the
Connector of the Evaluation Board
Data Sheet HMC8191
Rev. C | Page 43 of 44
SOLDERING INFORMATION AND RECOMMENDED LAND PATTERN Figure 155 shows the recommended land pattern for the HMC8191. The HMC8191 is contained in a 4 mm × 4 mm 24-terminal, ceramic, LCC package, with an exposed ground pad (EPAD). This pad is internally connected to the ground of the chip. To minimize thermal impedance and ensure electrical performance, solder the pad to the low impedance ground plane on the PCB. It is recommended that the ground planes on all layers under the pad be stitched together with vias, to further reduce thermal impedance.
The land pattern on the HMC8191 evaluation board provides a simulated thermal resistance (θJA) of 38.3°C/W.
13645-163
Figure 155. Evaluation Board Layout for the HMC8191 Package
EVALUATION BOARD INFORMATION The EV1HMC8191LC4 evaluation board PCB used in the application must use RF circuit design techniques. Signal lines must have a 50 Ω impedance and connect the package ground leads and exposed pad directly to the ground plane similar to the setup shown in Figure 156. Use a sufficient number of via holes to connect the top and bottom ground planes.
13645-164
LO, J2
RF, J1
U1HMC8191
IF1, J3 IF2, J4
Figure 156. EV1HMC8191LC4 Evaluation Board PCB, Top Layer
Table 6. Bill of Materials for the EV1HMC8191LC41 Evaluation Board PCB Quantity Reference Designator Description Manufacturer Part Number 1 PCB, EV1HMC8191LC42 Analog Devices 08_040858a 4 J1 to J4 2.92 mm SMA connectors, SRI Connector Gage SRI Connector Gage Co. 25-146-1000-92 1 U1 Device under test, HMC8191 Analog Devices HMC8191 1 Reference this number when ordering the evaluation board PCB. 2 Circuit board material: Rogers 4350.
HMC8191 Data Sheet
Rev. C | Page 44 of 44
OUTLINE DIMENSIONS
12
0.50BSC
2.50 REFBOTTOM VIEWTOP VIEW
124
7
13
1819
6
02-2
7-20
17-B
0.360.300.24
EXPOSEDPAD
PKG
-004
840
PIN 1INDICATOR
4.053.90 SQ3.75
3.10 BSC
FOR PROPER CONNECTION OFTHE EXPOSED PAD, REFER TOTHE PIN CONFIGURATION ANDFUNCTION DESCRIPTIONSSECTION OF THIS DATA SHEET.
2.602.50 SQ2.40
PIN 1
0.32BSC
0.08BSC
SIDE VIEW1.000.900.80
SEATINGPLANE
Figure 157. 24-Terminal Ceramic Leadless Chip Carrier [LCC]
(E-24-1) Dimensions shown in millimeters
ORDERING GUIDE
Model1 Temperature Range
Package Body Material Lead Finish
Package Description
MSL Rating2
Package Option
HMC8191LC4 −40°C to +85°C Alumina Ceramic Gold over Nickel 24-Terminal Ceramic LCC MSL3 E-24-1 HMC8191LC4TR −40°C to +85°C Alumina Ceramic Gold over Nickel 24-Terminal Ceramic LCC MSL3 E-24-1 HMC8191LC4TR-R5 −40°C to +85°C Alumina Ceramic Gold over Nickel 24-Terminal Ceramic LCC MSL3 E-24-1 EV1HMC8191LC4 Evaluation PCB Assembly 1 The HMC8191LC4, HMC8191LC4TR, and HMC8191LC4TR-R5 are RoHS compliant parts. 2 See the Absolute Maximum Ratings section.
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