Thermo-Bond Film 615 and 615 EG Product Data Sheet Updated : November 2000 Supersedes : Products Description 3M Thermo-Bond Films 615 and 615 EG are flexible, light colored, thermoplastic adhesive bonding films which exhibit good adhesion to a variety of substrates. The bonding film is removable from the release coated paper carrier. Thermo -Bond Film 615 - 101 μm adhesive layer Thermo -Bond Film 615 EG - 63 μm adhesive layer Key Features • Suitable for kiss or through die cutting • Solvent-free • Consistent, uniform adhesive thickness • Excellent adhesion to many substrates • Quick fixturing/holding strength Typical Physical Note : The following technical information and data should be considered representative Properties or typical only and should not be used for specification purposes. Base Resin Polyester Thermoplastic (non-curing) Adhesive Thickness 615 Film – 101 μm 615 EG Film – 63 μm Liner Thickness 76 μm (nominal) Color Translucent/Tan Specific Gravity 1.00 Solids 100 % Ball and Ring Softening Range 116 to 123°C Tensile Strength @ Break 3,1 MPa Elongation @ Break ~300 % Two Lb Dead Load Heat Resistance 102°C Note 1 : The data reported in this data sheet were determined using 101 μm film thickness (Thermo-Bond Film 615). Performance values using the 63 μm Thermo-Bond Film 615 EG are expected to be similar, but should be tested in user’s application before use. Note 2 : As noted above the Thermo-Bond 615 and 615 EG products are 101 μm and 63 μm thickness, respectively. If required, this bonding film can be supplied in thicknesses from 20 to 1016 μm Contact your local 3M sales representative for details.
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Thermo-Bond Film 615 and 615 EG
Product Data Sheet Updated : November 2000 Supersedes : Products Description 3M Thermo -Bond Films 615 and 615 EG are flexible, light colored, thermoplastic
adhesive bonding films which exhibit good adhesion to a variety of substrates. The bonding film is removable from the release coated paper carrier.
Thermo -Bond Film 615 - 101 µm adhesive layer Thermo -Bond Film 615 EG - 63 µm adhesive layer Key Features • Suitable for kiss or through die cutting • Solvent-free • Consistent, uniform adhesive thickness • Excellent adhesion to many substrates • Quick fixturing/holding strength Typical Physical Note : The following technical information and data should be considered representative Properties or typical only and should not be used for specification purposes.
Base Resin Polyester Thermoplastic (non-curing)
Adhesive Thickness 615 Film – 101 µm 615 EG Film – 63 µm
Liner Thickness 76 µm (nominal)
Color Translucent/Tan
Specific Gravity 1.00
Solids 100 %
Ball and Ring Softening Range 116 to 123°C
Tensile Strength @ Break 3,1 MPa
Elongation @ Break ~300 %
Two Lb Dead Load Heat Resistance 102°C
Note 1 : The data reported in this data sheet were determined using 101 µm film thickness (Thermo-Bond
Film 615). Performance values using the 63 µm Thermo-Bond Film 615 EG are expected to be similar, but should be tested in user’s application before use.
Note 2 : As noted above the Thermo-Bond 615 and 615 EG products are 101 µm and 63 µm thickness,
respectively. If required, this bonding film can be supplied in thicknesses from 20 to 1016 µm Contact your local 3M sales representative for details.
Date : November 2000 Thermo -Bond Film
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Application Equipment Note : Appropriate application equipment can enhance bonding film performance. We Suggestions suggest the following equipment for the user’s evaluation in light of the user’s
particular purpose and method of application. The type of application equipment used to bond 3M Thermo -Bond Film 615 and
615 EG will depend on the application involved and on the type of equipment available to the user. Thin films and flexible substrates can be bonded using a heated roll laminator where heat and pressure can be varied to suit the application. Larger, thicker substrates can be bonded using a heated static press or, in some cases, an autoclave. For applications where a shaped adhesive is to be transferred to a flat or three-dimensional part, a hot shoe or thermode method may be appropriate.
It is recommended that whatever method of bonding the user chooses, the user
should determine the optimum bonding conditions using the specific substrates involved.
Directions For Use To make a bond using Thermo -Bond Film 615 and 615 EG, remove the liner and
place the adhesive film between the two substrates. The bond is then made through heat and pressure using a heated press, a hot roll laminator, a hot shoe thermode method or similar equipment. Alternatively, the adhesive can be first tacked (lightly bonded) to one of the substrates using low heat, then removing the liner and placing the second substrate to the exposed adhesive surface, making the bond using heat and pressure.
For optimum bonding, heat, pressure and dwell time will depend upon the type and
thicknesses of the substrates being bonded together. A suggested starting point is to use a method which will result in an adhesive bondline
temperature of 135°C for 2-5 seconds using 700 g/cm² - 1500 g/cm².
Suggested TACKING Conditions
38 to 49°C bondline temperature
1-2 seconds dwell time
350 g/cm² - 700 g/cm² pressure
Suggested BEGINNING Bonding Conditions
132 to 138°C bondline temperature
2-5 seconds dwell time
700 g/cm² - 1500 g/cm² pressure
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Directions For Use One approach to establishing the correct/optimum bonding conditions for a user’s (continued) application is to evaluate a series of bonding temperatures, for example 121, 135, 149,
163 and even 177°C. Time and pressure will be dictated by the thickness of the substrate and the type of substrate being bonded. Thicker substrates and more difficult to bond surfaces will require longer times, higher pressures and higher temperatures.
Once the bond is made, the bondline should be allowed to cool somewhat before
stress is applied to the bond. Generally, cooling the bondline below 93°C is adequate to allow the bonded parts to be unfixtured/unclamped and handled.
For reference, the following tables show typical bond strengths for bonds made at
various temperatures. Such tables can be used to evaluate optimum bondline temperatures. It is very important to note that this table is valid only for the specific substrates shown. Varying temperature, pressure, or substrates can affect bond strengths. User should develop a similar table using the specific substrates involved.
Note : Temperatures shown are bondline temperatures and not heat block or roll settings !
Overlap Shear Adhesion vs Bonding Temperature
CRS/CRS Overlap Shear
Peel Strength of Bonds Made at Various Temperatures
• Bond strength determined using Instron tester at 5 mm/minute. • Oven/Weight method 10 minutes, 300 g/cm².
126°C 137°C 149°C 159°C
16.8 N/cm 15.1 N/cm 14.5 N/cm
35.0 N/cm 33.6 N/cm 35.9 N/cm 36.8 N/cm
• Substrates used 38 µm foil copper, 203 µm stainless • CRS is Cold Rolled St eel steel (SS) and 3.2 mm in polycarbonate (PC). • Bonds made using 5 second dwell, 22 N pressure. • Peels tested at 90° angle, 50 mm/minute, Instron tester.
T-Peel Adhesion of PET/PET and PI/PI Bonded at Various Temperatures
• PET is 50 µm polyester film. • PI is 76 µm polyimide film. • Bonds made using 5 second dwell, 22 N gauge pressure. • T-Peel adhesion is 90° peel pulled @ room temperature using Instron tester @ 50 mm/minute.
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Typical Methods The following illustrations show several of the many methods that can be used to For Bonding 3M make bonds using Thermo -Bond Film adhesives. Equipment is generally available Thermo-Bond Film commercially or can be built or modified by the user to fit a particular application. Adhesives Hot Shoe or Thermode Bonding Oven (Static or Conveyorized) Bonding Hydraulic or Mechanical Press Bonding Lamination Bonding of Thin Substrates Debonding – Since Thermo -Bond Films are thermoplastic materials, no curing during
heating or aging occurs. To debond or open bonded parts, simply heat the bonded part to an adequate temp erature (typically 135-149°C) to soften the adhesive and then pry or peel the substrates apart.
Solvents, such as acetone, MEK, toluene and 3M Citrus Base Cleaner will soften these
Thermo -Bond Film adhesives and can be used to remove excess adhesive in unwanted areas. * Soaking bonds in these solvents can also aid in debonding operations where appropriate.
* Note : Before using solvents, extinguish all ignition sources and follow the manufacturer’s precautions and directions for use for handling such materials.
Generally used for small area bonding.
Heat/Pressure Hot Shoe
Substrate 1 Thermo -Bond Film with liner removed Substrate 2
Good for small volume or startup bonding.
Clamp
Substrate 1
Thermo -Bond Film with liner removed
Substrate 2
Place clamped assembly in oven
Useful in larger area applications.
Substrate 1 Thermo -Bond Film with liner removed
Substrate 2
Heated roll(s)
Suitable for thin, large area parts.
Substrate 1
Thermo -Bond Film with liner removed
Substrate 2
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Typical Performance Note : The following technical information and data should be considered representative Characteristics or typical only and should not be used for specification purposes.
Adhesion to Various Substrates Overlap Shear 90°Peel Thermo-Bond Film Thermo-Bond Film
• Overlap shear made bonding 508 µm aluminum to test substrates using 138°C bondline
temperature, 5 seconds dwell, 22 N gauge pressure. • Peel bonds made bonding 114 µm aluminum foil to test substrates using 138°C bondline
temperature, 5 seconds dwell, 22 N gauge pressure. • Adhesion tests done using Instron @ 50mm/minute for peel, 5 mm/minute for OLS. • NT – Not Tested
Bond Strength Retention After Humidity Aging
Thermo_Bond Film Copper to Polycarbonate Bonds 615 (101 µm)
Initial (Before Aging) 19.3 N/cm 6 days @ 95% RH / 66°C 17.9 N/cm 21 days @ 95% RH / 66°C 9.5 N/cm 6 days @ 95% RH / 85°C 17.9 N/cm 21 days @ 95% RH/ 85°C 7.4 N/cm
Adhesion Strength TESTED at Various Temperatures Thermo-Bond Film Thermo-Bond Film 615 (101µm) 615 (101µm)
Peel Strength Overlap Shear Strength Test temperature Cu to PC CRS to CRS 24°C 19.3 N/cm 7,8 Mpa 45°C 14.9 N/cm 1,5 Mpa 66°C 3.2 N/cm 0,2 Mpa 85°C 0.7 N/cm 0,1 Mpa 95°C 0.4 N/cm 0,04 Mpa
• Cu is 38 µm copper foil, PC is 3.2 mm in polycarbonate, CRS is Cold Rolled Steel. • Peel bonds made @ 127°C, 5 seconds dwell, 22 N pressure. • OLS bonds made @ 138°C, 10 minutes oven, 22 N pressure. • Adhesion determined using Instron tester @ 50 mm/minute for peels, 5 mm/minute for
OLS.
• Bonds made bonding 38 µm copper foil bonded to 3.2 mm polycarbonate @ 127°C, 5 second dwell, 22 N gauge pressure. • Bonds tested by Instrom peel @ 50 mm/minute @ 90° peel angle.
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Electrical Data
Test Method Value Dielectric Constant ASTM D-257 4.4 @ 1 kilohertz
Test Method Value Weight Loss By TGA (Thermal gravametric analysis)
Perkin-Elmer Series 7 RT to 800°C, 5°C/min, in air
1 % wt loss @ 202°C 5 % wt loss @ 268°C
10 % wt loss @ 307°C Coefficient of Thermal Expansion By TMA (Thermal gravametric analysis)
Perkin-Elmer Series 7 -60°C to 125°C @ 10°C/min
102 x 10-6 unit/unit/°C (-60°C to 20°C)
1800 x 10-6 unit/unit/°C (-60°C to 105°C)
3M is a trademark of the 3M Company
Values presented have been determined by standard test methods and are average values not to be used for specification purposes. Our recommendations on the use of our products are based on tests believed to be reliable but we would ask that you conduct your own tests to determine their suitability for your applications. This is because 3M cannot accept any responsibility or liability direct or consequential for loss or damage caused as a result of our recommendations.
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