6310 Hardware Installation Guide

Technical Documentation

Copyright © 2002-2004,2006 Tellabs. All rights reserved.

Product family Tellabs® 6300 Managed Transport System

Product name Tellabs® 6310 Edge Node

Title Flexible Version, 2U High

Document Hardware Installation ManualMA322 / Revision F1

Tellabs® 6310 Edge NodeFlexible Version, 2U High

Legal Notices

Legal Notices

Copyright Statement This Tellabs manual is owned by Tellabs or its licensors and protected by U.S.and international copyright laws, conventions, and treaties. Your right to usethis manual is subject to limitations and restrictions imposed by applicable li-censes and copyright laws. Unauthorized reproduction, modification, distri-bution, display or other use of this manual may result in criminal and civilpenalties.

Trademark Notice The following trademarks and service marks are owned by Tellabs Opera-tions, Inc., or its affiliates in the United States and/or other countries: AUDIOPLUS®, CABLESPAN®, CEC-128™, DYNAMIC SIGNAL TRANSFER™,DXX®, DXX logo®, EC DUO®, ENHANCED AUDIO PLUS®, EX-PRESS/PATH®, FOCUS™, MARTIS®, MARTISDXX®, MARTIS logo®, MAR-TISDXX logo®, METROVANTAGE®, METROWATCH™, NETREACH®,NETWISE®, SCULPTURED SOUND™, TELLABS®, TELLABS and T sym-bol®, T symbol, TELLABS PROPARTNER™, TEL/MAP™, TEL/MOR®, THEWORLD COMMUNICATES THROUGH TELLABS™, TITAN®, VERITY™,YOUR NETWORKING PARTNER®.

Any other company or product names may be trademarks of their respectivecompanies.

2 MA322 • Rev. F1


Environmental Notices

Environmental Notices

Instructions for use, maintenance and management of residual product

The equipment covered in this manual has been designed to fulfil the environ-mental demands of market and society. There are no apparent hazards duringuse and on-site maintenance of the equipment. We recommend that repair ofdefective equipment takes place at Tellabs premises, and it is likewise recom-mended to dispose of the equipment by use of certified local waste contractorsthat can assure environmental safe handling and disposal of the equipment.Arrangement for disposal of equipment can also be made through Tellabs.

Waste handling in member states of the European Union

The equipment covered in this manual must be disposed of in accordancewith "Directive 2002/96/EC of the European Parliament and of the council of27 January 2003 on waste electrical and electronic equipment (WEEE)".Disposal must follow national legislation for "IT and telecommunicationsequipment" in accordance with the WEEE directive.

• Do not dispose of waste electrical and electronic equipment with unsorted municipal and household waste

• Collect the equipment separately

• Return the equipment through the collection system agreed with Tellabs.

Correct handling of the disposed equipment contributes to reuse, recyclingand other form of recovery to protect the environment.

Label The equipment is marked with the figure shown below, to indicate that theequipment must be collected separately. In case of very small products, thefigure may only be on the packaging or in this manual. The Tellabs name andthe production date will also be labelled on the product.

Further information For further information about separation and handling the disposed equip-ment to ensure correct reuse or recycling, please look at www.tellabs.com.

MA322 • Rev. F1 3


Revision Information


Revision history This manual has changed as follows:

Rev. Date Description of Changes

A1 Sept. 27, 2002 First version.

B1 Nov. 8, 2002 Compared to revision A1:

• Procedures and descriptions have been updated to include the 10/100 Ethernet interface option ETEX4.

• Minor changes have been performed.

C1 June 30, 2003 Compared to revision B1:

• Procedures and descriptions have been updated to include the tributary option ETEX8S, that provides 4 x 10/100 BaseT Ethernet and 2 x 100 BaseFX Ethernet.

• Procedure describing how to replace an electri-cal tributary module has been added.


D1 Oct. 24, 2003 Compared to revision C1:

• Procedures and descriptions have been updated to include the tributary option ETEX8M, that provides 4 x 10/100 BaseT Ethernet and 2 x 100 BaseFX Ethernet.

• Procedures and descriptions have been updated to include the tributary option ETEX2S, that provides 2 x 1000 BaseSX/LX Ethernet.

• Procedure describing how to pack module be-fore sending it has been added.


D2 Dec. 10, 2004 Compared to revision D1:

• Specifications for the optical STM-1 and STM-4 interfaces have changed.

• Specifications for ETEX transceivers have been added.


E1 March 13, 2006 Compared to revision D2 the manual has changed as follows:

• Optical cables have been changed.


4 MA322 • Rev. F1



F1 Aug. 31, 2006 Compared to revision E1 the manual has changed as follows:

• The following interface options of the Tellabs 6310 node have been removed from the manual: LI1 (1 x STM-1 tributary), RI1 (2 x STM-1 tribu-tary) and TEX4 (140 Mbit/s).

• Minor changes have been performed in connec-tion with introduction of feature pack 6.2.

Rev. Date Description of Changes

MA322 • Rev. F1 5



6 MA322 • Rev. F1


Warnings and Cautions


Laser radiation Be aware of the warnings described here when installing and performing ser-vice on the equipment. The following rules describe how to avoid hazardoussituations.

Warning Please note the following warning.

Caution Please note the following caution.

The equipment has been designed for connection to an IT power system.

MA322 • Rev. F1 7



8 MA322 • Rev. F1


Contents

Legal Notices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2Environmental Notices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3Revision Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Warnings and Cautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Preface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11Purpose of the Manual . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11Structure of the Manual . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11Definition of Terms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151.2 Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

2 Installation Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 172.1 Optical Safety Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 172.2 Labels on Equipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 182.3 Physical Placement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 182.4 Installing the Tellabs 6310 Node . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

2.4.1 Mounting the Tellabs 6310 Node in the Rack . . . . . . . . . . . . . 202.4.2 Connecting the Cables to the Tellabs 6310 Node . . . . . . . . . 232.4.3 Identification Settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

2.5 Replacing the Air Filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 302.6 Replacing the Tributary Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

3 Reference Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 353.1 Front Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 353.2 Logistics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 363.3 LEDs and Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 383.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 403.5 Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

3.5.1 STM-4 and STM-1 Optical Interfaces . . . . . . . . . . . . . . . . . . . 433.5.2 PDH Electrical Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . 453.5.3 Ethernet Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 493.5.4 Synchronization Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . 523.5.5 Management Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 553.5.6 Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 583.5.7 Mechanical . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 593.5.8 Environmental . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 623.5.9 EMC Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 643.5.10 Safety . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 663.5.11 R&TTE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 673.5.12 MTBF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67

A Packing Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71

Index . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75

MA322 • Rev. F1 9


Contents

10 MA322 • Rev. F1


Preface

Preface

Introduction This preface describes the purpose of the manual and how the manual is struc-tured. Furthermore you will find explanations of abbreviations, definition ofterms and references used in the manual.

• ‘Purpose of the Manual’ on page 11

• ‘Structure of the Manual’ on page 11

• ‘Abbreviations’ on page 11

• ‘Definition of Terms’ on page 12

• ‘References’ on page 13

Purpose of the Manual

Purpose The purpose of this manual is to:

• Inform the user how to install and connect the Tellabs 6310 node, flexible version, 2U high.

• Provide reference information.

Structure of the Manual

Manual structure The manual is structured as follows:

• ‘1 Overview’ on page 15 introduces the Tellabs 6310 node.

• ‘2 Installation Information’ on page 17 describes how to install and con-nect the Tellabs 6310 node.

• ‘3 Reference Information’ on page 35 gives logistics, technical description and specification information about the Tellabs 6310 node.

• ‘A Packing Instructions’ on page 71 gives additional information like in-structions on how to pack modules before shipment.

Abbreviations

Abbreviations used in this manual

ADM Add/Drop MultiplexerAGGR AggregateAUX Auxiliary AlarmCID Consecutive Identical DigitECC Embedded Communications ChannelEMC Electromagnetic CompatibilityETSI European Telecommunications Standards InstituteGFP Generic Framing ProcedureID IdentificationIEC International Electrotechnical CommissionIETF The Internet Engineering Task Force community I/O Input/OutputIP Internet ProtocolITU-T ITU - Telecommunication Standardisation Sector

MA322 • Rev. F1 11


Preface

ITU International Telecommunication UnionLAPS Link Access Procedure - SDHLCAS Link Capacity Adjustment SchemeLED Light Emitting DiodeMAC Media Access ControlMDI Media Dependent Interface MDIX MDI cross-over MTBF Mean Time Between FailuresMLM Multi Longitudinal Mode LaserMPLS Multi-Protocol Label SwitchingNA Not ApplicablePDH Plesiochronous Digital HierarchyPIN P-doped, Intrinsic, N-dopedPPP Point-to-Point ProtocolPRC Primary Reference ClockRFC Request for CommentsS4 VC-4 path layerS12 VC-12 path layerSDH Synchronous Digital HierarchySEC Synchronous Equipment ClockSFP Small Formfactor PluggableSIR Signal / Interference RatioSLM Single Longitudinal Mode LaserSNC/I Inherently monitored Sub-Network Connection protectionSNMP Simple Network Management ProtocolSTM Synchronous Transport ModuleSW SoftwareT0 Outgoing SDH timing reference pointT1 Incoming SDH timing reference pointT2 Incoming PDH timing reference pointT3 External 2.048 MHz reference timing sourceTCP Transmission Control ProtocolTDEV Time DeviationTM Terminal MultiplexerTRIB TributaryUDP User Datagram ProtocolVC-4 Virtual Container of 4'th orderVC-12 Virtual Container of 1’st order

Definition of Terms

System/Network Element:

A complete functional unit with transport and element management function-ality, power supply; all mounted in one or more subracks.

Aggr. 1: Direction naming of the aggregate signal of a network element. Aggr.1 is alsonamed the S1 port.

Aggr. 2: Direction naming of the aggregate signal of a network element. Aggr.2 is alsonamed the S2 port.

12 MA322 • Rev. F1


Preface

References

References to Tellabs documents

[1] MA327, Tellabs® 6300 Managed Transport System, Tellabs® 6300 Net-work Manager, Managing Tellabs® 6310/6320 Edge Node, User's Manual

Note: See the product release notes for a list of manuals that are valid for yourcurrent software/hardware version.

MA322 • Rev. F1 13


Preface

14 MA322 • Rev. F1


1 Overview

1 Overview

In this overview This overview gives a short introduction of the Tellabs 6310 node.

• ‘1.1 Introduction’ on page 15

• ‘1.2 Layout’ on page 16

1.1 Introduction

Product relationship The Tellabs 6310 node is part of the Tellabs product range for access and re-gional telecommunication transmission networks based on the standards andrecommendations on SDH from ETSI and ITU.

Short product description The Tellabs 6310 node is a product where SDH Add/Drop Multiplexers(ADM1/4) and Terminal Multiplexers (TM1) are implemented in a standalone unit. In addition to the 2 Mbit/s tributary interfaces available, the fol-lowing interfaces are possible options:

• 34 Mbit/s

• 45 Mbit/s

• 10/100 Mbit/s Ethernet

• 1 Gbit/s Ethernet

Protection The possible protection schemes in the network includes SNC Protection.

Management Management of the Tellabs 6310 node can be performed from a local craft ter-minal, or remotely from a network element manager or a network manage-ment system (Tellabs® 6300 network manager).

MA322 • Rev. F1 15


1 Overview

1.2 Layout

Variants Two different front layouts of the Tellabs 6310 node reflect the two differentconnector types used for either the 120 ohm 2 Mbit/s interfaces or the 75 ohm2 Mbit/s interfaces.

Layout of unit with 120 ohm 2 Mbit/s interfaces

The figure below shows the Tellabs 6310 node with RJ-45 connectors for the120 Ω, 2Mbit/s interfaces.

Layout of unit with 75 ohm 2 Mbit/s interfaces

The figure below shows the Tellabs 6310 node with coax connectors for the75 Ω, 2Mbit/s interfaces.

16 MA322 • Rev. F1


2 Installation Information


Overview This installation information describes the installation and cabling of the Tel-labs 6310 node. It comprises the following parts:

• ‘2.1 Optical Safety Considerations’ on page 17

• ‘2.2 Labels on Equipment’ on page 18

• ‘2.3 Physical Placement’ on page 18

• ‘2.4 Installing the Tellabs 6310 Node’ on page 19

• ‘2.5 Replacing the Air Filter’ on page 30

• ‘2.6 Replacing the Tributary Module’ on page 31

2.1 Optical Safety Considerations

General The Tellabs 6310 node is classified as a Class 1 laser product in accordancewith IEC 825, that is exposure to hazardous laser radiation is impossible dur-ing normal operation and maintenance. When the system has been installed,the laser radiation is effectively enclosed in the optical fiber path between op-tical modules at each end.

In case of an interruption of the optical STM-1/STM-4 fiber path by accident(for instance cable rupture) an automatic safety mechanism will result in a pe-riodic shutdown of the transmitter laser. Hence, the laser radiation from anyfiber end is restricted to a 2 second period, which is repeated every 70 seconds.With less than 0 dBm (L-1.1 and L-1.2) or 2 dBm (L-4.1 and L-4.2) radiated op-tical power during the 2 second period, the time averaged power is less than-13 dBm, which is harmless at relevant wavelengths.

IEC825 classification limits of optical power radiated from single mode fiber end

Exposure to laser radiation risked during service or installation can be hazard-ous in case of double fault conditions.

Laser warning The illustration describes laser safety rules.

Classification 1310 nm 1550 nm

Class 1 Regarded as safe for all viewing conditions

+10.0 dBm +10.0 dBm

MA322 • Rev. F1 17



2.2 Labels on Equipment

Identification labels The Tellabs 6310 node is provided with identification labels at the front andbottom of the enclosure.

2.3 Physical Placement

Placement rules The Tellabs 6310 node is designed to operate in a typical commercial environ-ment. Please observe the following rules:

• In case of AC powering, use a grounded, three pronged power outlet ap-proved by the electrical code of the region.

• Location must be clean, dust free and well ventilated.

• Do not cover ventilation holes.

18 MA322 • Rev. F1



2.4 Installing the Tellabs 6310 Node

To install the Tellabs 6310 node

To complete the installation of the Tellabs 6310 node, the following steps mustbe performed.

Step Action

1 Mount the Tellabs 6310 node in the rack as described in ‘2.4.1 Mounting the Tellabs 6310 Node in the Rack’ on page 20.

Note: If you wish to use the Tellabs 6310 node outside a rack, you canprovide the housing with four rubber feet instead of the brackets andplace the Tellabs 6310 node at your preferred location. In that situa-tion this step can be omitted.

2 Connect the cables as described in ‘2.4.2 Connecting the Cables to the Tellabs 6310 Node’ on page 23.

3 Configure the Tellabs 6310 node by following the instructions in the Tellabs 6300 manager manuals [1]. See also ‘2.4.3 Identification Set-tings’ on page 29.

MA322 • Rev. F1 19



2.4.1 Mounting the Tellabs 6310 Node in the Rack

To mount the Tellabs 6310 node into a rack

Please follow the instructions below.

Step Action

1 If the rack system provides sufficient depth, then mount the left and right side brackets as shown below, each with 2 screws (M4 x 8) and washers.

The same brackets are used for both 19 inch rack and ETSI racks, but mounted differently.

20 MA322 • Rev. F1



2 If the rack system has limited depth, then mount the left and right side brackets as shown below, each with 2 screws (M4 x 8) and wash-ers.

The same brackets are used for both 19 inch rack and ETSI racks, but mounted differently.

3 Insert the nuts including clips in the holes corresponding to the de-sired rack position of the Tellabs 6310 node.

Step Action

MA322 • Rev. F1 21



4 Mount the Tellabs 6310 node in the desired rack position. Fasten it with four M6 screws including protection rings.

Note: The screw at the top left of the unit must be mounted withouta protection ring, to ensure firm contact to safety earth.

Step Action

22 MA322 • Rev. F1



2.4.2 Connecting the Cables to the Tellabs 6310 Node

Cable types Shielded cables are required on all interfaces except DC and AC power. Thisin order to ensure compliance with the EMC directive. It is the responsibilityof the user to provide and use shielded cables.

Available cables The cables available for the Tellabs 6310 node are listed in ‘3.2 Logistics’ onpage 36.

To connect the transport and management cables

The following procedure describes how to connect the transport and manage-ment cables to the unit. Some steps might not be relevant for your specificunit. In these situations you just go to the next step.

Warning: Care must be taken to protect optical connectors against dust, touch-ing and all contact with other objects.

Note: All disconnected optical connectors must be covered with dust protect-ing caps. Do not remove these caps until immediately before mounting.

Note: If it is difficult to connect or remove the coaxial cables of the 75 Ω inter-faces, then use an extraction tool (item number TOOL-H030).

Step Action

1 Connect the optical cables for the aggregate interfaces (MAIN S1-S2).

Note: Please observe the minimum bending radius of the optical fiber(35 mm), to avoid damage to the fibers.

MA322 • Rev. F1 23



2 Connect the optical cables for the optical Ethernet tributary interfac-es (TRIB S1-S2). Use connector S1 for Ethernet channel 5 and connec-tor S2 for Ethernet channel 6.

Note: Please observe the minimum bending radius of the optical fiber(35 mm), to avoid damage to the fibers.

Note: Use 50/125µm multi mode fiber cables for optical Ethernet in-terfaces unless you have the 1000BaseLX interface option. For this youmust use single mode fiber.

3 Connect the cables for the electrical 10/100 Mbit/s Ethernet interfac-es, channel 1-4 (D1-D4).

4 Connect the cables for the 34/45 Mbit/s interfaces (P1-P2-P3).

Step Action

24 MA322 • Rev. F1



5 Connect the cables for the 2 Mbit/s interfaces (1-21).

6 Connect the cables for the synchronization interface (SYNC)

Step Action

MA322 • Rev. F1 25



7 Connect the Ethernet cable (MGT) for management of the Tellabs 6310 node.

8 Connect a PC running the Craft Terminal program to the MGT/CT connector at the front of the unit for local management of the Tellabs 6310 node.

9 Connect alarm cable to the ALARM connector at the rear of the unit.

Step Action

26 MA322 • Rev. F1



To connect the DC power cables

The following procedure describes how to connect the DC power cables to theunit. This procedure can be omitted if only AC power is used.

10 Connect DTMF-EOW cable to the EOW connector at the rear of the unit.

11 Connect user channel cables to the USER1/2 connectors at the rear of the unit.

Step Action

Step Action

1 Connect an earthing cable to the earthing stud.

MA322 • Rev. F1 27



To connect the AC power cable

The following procedure describes how to connect the AC power cable to theunit. This procedure can be omitted if only DC power is used.

Warning Please note the following warning.

2 Connect the power supply to the DC input plug (3 pole Sub-D con-nector) at the rear of the unit.

Step Action

Step Action

1 Connect AC power cable to the mains connector.

Note: The AC power cable is not supplied with the Tellabs 6310 node.

2 Engage the locking mechanism.

28 MA322 • Rev. F1



Caution Please note the following caution.


2.4.3 Identification Settings

ID values The purpose of the ID settings is to obtain information about the addresses forinstalled modules when using the management system. The ID settings for theTellabs 6310 node are fixed and can therefore not be changed. The settings areas follows:

ID Value

Rack 15

Subrack 7

Slot 3 (Main module)

4 (Trib module)

MA322 • Rev. F1 29



2.5 Replacing the Air Filter

To replace the filter Follow the procedure below when you need to replace the air filter in the Tel-labs 6310 node.

Step Action

1 Pull out the used filter.

Use the strap on the front of the filter.

2 Install the new filter (item number NS-0286).

Note: It is important that the filter is turned correctly before it is in-serted in to the unit. The filter side with the grid must face towardsthe center of the unit.

30 MA322 • Rev. F1



2.6 Replacing the Tributary Module

To replace the tributary module

Please follow the procedure below if you have to replace the tributary modulein the Tellabs 6310 node.

Note: This procedure only applies to tributary modules with electrical inter-faces. It is recommended to send the whole unit to Tellabs if a modulewith optical interfaces has to be replaced.

Note: Performing this procedure will interrupt connections to EOW, userchannels and alarm connectors on the rear plate.

Note: To avoid damage on components sensitive to static electricity, use anantistatic bracelet connected to the chassis of the Tellabs 6310 node.

Step Action

1 Remove the four screws fastening the rear plate to the unit.

2 Pull the rear plate off. Do it in a straight movement.

The straight movement ensures that the connector between the fan module and the rear plate will not be damaged.

Note: Make sure to save the two EMC gaskets from the rear plate andchassis.

MA322 • Rev. F1 31



3 Push the release mechanism on the tributary module and pull out the tributary module using the two levers simultaneously.

Note: Look out for the optical fibers on the ADM/TM module.

4 Insert the new tributary module. For the last movement use the two levers simultaneously.

Note: Look out for the optical fibers on the ADM/TM module.

Note: If you are going to install a TEX31 or TEXDS31 module, thenperform ‘To verify the switches on the TEX31/TEXDS31 module’ onpage 34 before you install the module.

5 Reinstall the EMC gaskets on the rear plate and chassis.

Note: The springs on the gaskets must be positioned as shown.

Step Action

32 MA322 • Rev. F1



6 Reinstall the rear plate.

Note: Ensure that the connector on the rear plate fits correctly into theconnector on the fan module.

7 Fasten the rear plate with the four screws.

8 Connect cables to the Tellabs 6310 node as described in ‘2.4.2 Connecting the Cables to the Tellabs 6310 Node’ on page 23

Step Action

MA322 • Rev. F1 33



To verify the switches on the TEX31/TEXDS31 module

Working in the Tellabs 6310 node, the switches on the TEX31/TEXDS31 mod-ule must be placed as described in the procedure below.

Step Action

1 If not already so, then set the switches in the positions shown on the figure below.

34 MA322 • Rev. F1


3 Reference Information


Overview The reference information includes information about item numbers, func-tional description and specifications of the Tellabs 6310 node.

• ‘3.1 Front Layout’ on page 35

• ‘3.2 Logistics’ on page 36

• ‘3.3 LEDs and Connectors’ on page 38

• ‘3.4 Functional Description’ on page 40

• ‘3.5 Specifications’ on page 43

3.1 Front Layout

Tellabs 6310 node front layout

The figure below shows the Tellabs 6310 node with RJ-45 connectors for the120 Ω, 2Mbit/s interfaces and the Tellabs 6310 node with coax connectors forthe 75 Ω, 2Mbit/s interfaces.

MA322 • Rev. F1 35



3.2 Logistics

Tellabs 6310 node item numbers

The Tellabs 6310 node can be ordered in the following versions. The structureof the item number can be expressed as CU369#-####-#.

Cables The table lists the cables available for the Tellabs 6310 node.

CU369#- ####-# Description

CU3690- AC+DC version

CU3691- DC version

1###-# TM1, 21 x 2 Mbit/s, 75R

2###-# ADM1, 21 x 2 Mbit/s, 75R

4###-# ADM4, 21 x 2 Mbit/s, 75R

5###-# TM1, 21 x 2 Mbit/s, 120R

6###-# ADM1, 21 x 2 Mbit/s, 120R

8###-# ADM4, 21 x 2 Mbit/s, 120R

#1##-# S-x.1 optical aggregate

#2##-# L-x.1 optical aggregate

#3##-# L-x.2 optical aggregate

##01-A 1 x 34 Mbit/s (TEX31)

##02-A 1 x 45 Mbit/s (TEXDS31)

##09-A 4 x 10/100 BaseT Ethernet (ETEX4)

##10-A 4 x 10/100 BaseT and 2 x 100 BaseFX Ethernet (ETEX8M)

##11-A 3 x 34 Mbit/s (TEX33)

##12-A 3 x 45 Mbit/s (TEXDS33)

##19-B 4 x 10/100 BaseT and 2 x 100 BaseFX Ethernet, with L2 switch (ETEX8S)

##20-A 2 x 1000 BaseSX Ethernet, with L2 switch (ETEX2S)

##21-A 2 x 1000 BaseLX Ethernet, with L2 switch (ETEX2S)

Number Description

Optical single mode fiber cables, two fibers in one cable

W-OF203/05.0 2xLC to 2xLC single mode fiber cable, 5 m


36 MA322 • Rev. F1



Miscellaneous items The table lists miscellaneous items available for the Tellabs 6310 node.


W-OF204/05.0 2xLC to 2xFC/PC single mode fiber cable, 5 m



W-OF205/05.0 2xLC to 2xSC single mode fiber cable, 5 m



W-OF206/05.0 2xLC to 2xDIN single mode fiber cable, 5 m



Optical multi mode fiber cables, two fibers in one cable

W-OF207/05.0 2xLC to 2xLC multi mode fiber cable, 5 m



Electrical cables

461-0021-003 Shielded twisted pair, cross-over, RJ-45 to RJ-45, 5 m, Crossed trib. cable for 120 Ω interface.

WK-453B-03.0-01 Coaxial cable, 1.0/2.3 right angle to BNC right angle, 3 m, Trib. cable for 75 Ω interface.

WK-480X-03.0-01 Craft interface cable, RJ-45 to 9 pole sub-D, 3 m, Con-nection to the front of the unit.

W-A-4-4712 Ethernet cable. BNC male connector to BNC male connector, 3 m.

WK-061A Ethernet termination set. The set includes a BNC 50 Ω T adapter (Male-Female-Female) and two 50 Ω BNC terminations.

WK-454Z-02.6-01 DC power input cable, open ended to 3 pole sub-D, 2.6 m.

Number Description

Number Description

NS-0286 Air filter.

MA322 • Rev. F1 37



3.3 LEDs and Connectors

Front The figure below shows the LEDs and connectors on the front of the Tellabs6310 node.

The function of the LEDs and connectors are described in the table below.

TOOL-H030 Extraction tool for coaxial cable.

Number Description

LED/Connector Description

Power Green LEDON during normal operationOFF in case +/-5V exceeds lower limits

Alarm Red LEDOFF during normal operation

IN S1 OUT MAIN STM-1/4 optical S1 interface for ADM and TM module.

IN S2 OUT MAIN STM-1/4 optical S2 interface for ADM module.

38 MA322 • Rev. F1



Rear The figure below shows the connectors on the rear of the Tellabs 6310 node.

The function of the connectors are described in the table below.

IN S1 OUT TRIB Optical 100 Mbit/s Ethernet interface for ETEX8M/S and 1 Gbit/s Ethernet interface for ETEX2S, channel 5.

IN S2 OUT TRIB Optical 100 Mbit/s Ethernet interface for ETEX8M/S and 1 Gbit/s Ethernet interface for ETEX2S, channel 6.

S1 -

S2 -

P1 34/45 Mbit/s tributary interface for TEX31, TEX33, TEXDS31 and TEXDS33.

P2, P3 34/45 Mbit/s tributary interface for TEX33 and TEXDS33.

D1-D4 Electrical 10/100 Mbit/s Ethernet interfaces for ETEX4 and ETEX8M/S, channel 1-4.

1-21 2 Mbit/s tributary interfaces

SYNC 2 MHz synchronization input/output

MGT Ethernet interface, 10 Base 2

TRIB MGT TRIB module serial management interface

MGT/CT Craft terminal interface

LED/Connector Description

Connector Description

UCH1 User channels, ADM/TM module V.11 and V.28

UCH2 User channels, ADM/TM module V.11 and TRIB module V.28

EOW Engineering ordering wire (DTMF-EOW), ADM/TM module

ALARM System alarm

3 pole Sub-D power -48 V power input

MA322 • Rev. F1 39



3.4 Functional Description

Housing The Tellabs 6310 node is housed in a 2 U high subrack. The supplied flangescan be mounted to adapt to either 19 inch or ETSI wide racks. In addition it ispossible to place the housing on a desk using the supplied rubber feet.

All necessary connections are made directly to the connectors at the front andrear of the unit.

Block diagram The figure shows a simplified block diagram of the Tellabs 6310 node. Thetributary interfaces available depends on the specific variant of the Tellabs6310 node.

Earthing stud

3 pole power AC power connector with locking mechanism and with primary fuses.

Connector Description

40 MA322 • Rev. F1



Master controller Internally the Tellabs 6310 node is managed by means of a master controlleron the ADM/TM module.

The master controller contains a non-volatile memory for the application SWof the network element. This memory can contain two versions of the SW anddownload of new SW while in service is possible.

Protection The ADM can perform 1+1 SNC/I protection of the VC-12 signals.

SNC/I protection (Inherently monitored Sub-Network Connection protec-tion) is based upon Loss Of Pointer and AIS detection in the S4/S12 function.

Synchronization sources The source for the internal timing reference T0 is derived among:

• Two 2.048 Mbit/s Tributary inputs (T2 references), freely selectable

• STM-1/4 inputs (T1 references)

• One external 2.048 MHz reference timing source (T3 reference).

• Internal oscillator

Management Interface types

Management/supervision of the Tellabs 6310 node is possible via three typesof interfaces:

• Craft Terminal interface

• Ethernet interface

• Embedded Communications Channel (ECC) of STM-1/4 line.The ECC may be transferred in DCCR or DCCM bytes of the STM-1/4 line overhead or in selectable VC-12.

Management software The Tellabs 6310 node can be managed by the Tellabs 6300 manager software.

The purpose of the management software is to monitor and control the behav-ior of the Tellabs 6310 node and the associated transport signals and to man-age software downloading and upgrading. Proper installation of embeddedsoftware is required to enable the unit to operate.

The system is controlled via the Craft Terminal Interface, the Ethernet inter-face or via the STM-1/4 embedded control channels.

For detailed description of the mentioned management software please referto the respective user manuals [1].

Fans The Tellabs 6310 node is cooled by two fans running simultaneously in theunit.

Fan speed can have three levels and is controlled by a temperature monitoringcircuit on the power supply. If a fan fails then the other fan will be turned tofull speed. One fan is adequate to keep the Tellabs 6310 node within normaloperating temperature conditions.

Tachometer signals from the fans are monitored and fan failures are signalledto the AUX1 and AUX2 alarm ports on the MAIN module.

Power feeds and monitor signals are independent for the two fans.

MA322 • Rev. F1 41



Power supply configurations

The Tellabs 6310 node is powered from nominal 115/230 VAC and/or dual -48 VDC. The customer can choose between the following configurations:

• AC input only. This may be the case in many non telecommunications of-fices. If back-up of the supply is required, an uninterruptable power source (UPS) can be inserted between the mains and the Tellabs 6310 node.

• Combined AC and DC powering. AC input as main supply and one of the DC inputs as protection supply (in case the AC supply fails)

• DC input only. One of the DC inputs as main power supply input and the other as protection supply (in case the main supply fails).

Power system description

The following figure shows the power system on the Tellabs 6310 node. The115/230VAC input has priority over the -48 VDC inputs, that is, when the ACpower is present, this input will provide power. In case the AC power is notpresent, the DC input with the most negative voltage will provide power.

RTN (GND) of the DC/DC converter has a DC path to the Tellabs 6310 nodeenclosure/signal ground. RTN of the -48 VDC supply input is not connectedto enclosure/signal ground.

The input and output of the AC/DC and DC/DC converter are galvanicallyisolated.


The 115/230VAC input is double fused with a fuse on both phase and neutral.

It is possible to secure the AC power cable with a locking mechanism.

A green LED at the front of the Tellabs 6310 node indicates, that the +/-5Vsupply voltage for the ADM/TM module is within range.

42 MA322 • Rev. F1



3.5 Specifications

Overview The specifications for the Tellabs 6310 node are described in:

• ‘3.5.1 STM-4 and STM-1 Optical Interfaces’ on page 43

• ‘3.5.2 PDH Electrical Interfaces’ on page 45

• ‘3.5.3 Ethernet Interfaces’ on page 49

• ‘3.5.4 Synchronization Interface’ on page 52

• ‘3.5.5 Management Interfaces’ on page 55

• ‘3.5.6 Power’ on page 58

• ‘3.5.7 Mechanical’ on page 59

• ‘3.5.8 Environmental’ on page 62

• ‘3.5.9 EMC Conditions’ on page 64

• ‘3.5.10 Safety’ on page 66

• ‘3.5.11 R&TTE’ on page 67

• ‘3.5.12 MTBF’ on page 67

3.5.1 STM-4 and STM-1 Optical Interfaces

Optical STM-4 port The following table shows the optical STM-4 parameters.

Note: "na" in a cell of the table means "not applicable".

Parameter Value Unit

Class S-4.1 L-4.1 L-4.2

Specifications accord-ing to

G.957

Nominal Bit Rate 622,080 ± 20 ppm kbit/s

Transmitter at reference point S

Source Type MLM SLM SLM

Wavelength range 1274-1356 1280-1335 1480-1580 nm

- max. RMS width 2.5 na na nm

- max. -20 dB width na 1 1 nm

- min. SMSR na 30 30 dB

Mean launched power range

-15 to -8 -3 to +2 -3 to +2 dBm

Min. extinction ratio 8.2 10 10 dB

Pulse Mask According to Fig.2/G.957

Jitter Generation G.813 option 1

MA322 • Rev. F1 43



Optical STM-1 port The following table shows the optical STM-1 parameters.

Note: "na" in a cell of the table means "not applicable".

Optical Path between S and R

Attenuation range 0 to 12 10 to 24 10 to 24 dB

Maximum dispersion 74 na 2200 ps/nm

Min. opt. return loss of cable plant at S (incl. conn.)

na 20 24 dB

Max. discrete reflec-tance between S and R

na -25 -27 dB

Receiver at reference point R

Receiver type PIN PIN PIN

Minimum point R sen-sitivity at BER = 10-10

-28 -28 -28 dBm

Min. overload -8 -8 -8 dBm

Max. optical path pen-alty

1 1 1 dB

Max. receiver reflec-tance measured at R

na -14 -27 dB

Jitter Tolerance G.825

CID Immunity According to: App. 1/G.958


Class S-4.1 L-4.1 L-4.2


Class S-1.1 L-1.1 L-1.2

Specifications accord-ing to

G.957

Nominal Bit Rate 155,520 ± 20 ppm kbit/s

Transmitter at reference point S

Source Type MLM MLM SLM

Wavelength range 1261-1360 1263-1360 1480-1580 nm

- max. RMS width 7.7 3 na nm

- max. -20 dB width na na 1 nm

- min. SMSR na na 30 dB

44 MA322 • Rev. F1



3.5.2 PDH Electrical Interfaces

45 Mbit/s Input port The following table shows the specifications for the electrical input ports atreference point ER.

Mean launched power range

-15 to -8 -5 to 0 -5 to 0 dBm

Min. extinction ratio 8.2 10 10 dB

Pulse Mask According to Fig.2/G.957

Jitter Generation G.813 option 1

Optical Path between S and R

Attenuation range 0 to 12 10 to 28 10 to 28 dB

Maximum dispersion 96 246 na ps/nm

Min. opt. return loss of cable plant at S (incl. conn.)

na na 20 dB

Max. discrete reflec-tance between S and R

na na -25 dB

Receiver at reference point R

Receiver type PIN PIN PIN

Minimum point R sen-sitivity at BER = 10-10

-28 -34 -34 dBm

Min. overload -8 -10 -10 dBm

Max. optical path pen-alty

1 1 1 dB

Max. receiver reflec-tance measured at R

na na -25 dB

Jitter Tolerance G.825

CID Immunity According to: App. 1/G.958


Class S-1.1 L-1.1 L-1.2

Parameter Value for 45 Mbit/s tributary input ports

Interface Coaxial pair - 75 Ohm

Bit rate 44.736 Mbit/s +/- 20 ppm

Code B3ZS

Jitter and wander toler-ance

Table 2 / G.824, TR– TSY– 000499 Cat. 2

MA322 • Rev. F1 45



45 Mbit/s output port The following table shows the specifications for the electrical output ports atreference point ES.


Over voltage protection ITU-T K.41

√f attenuation (Cable: 0-135 meters WECO 728A coaxial or equivalent)

Grounding of outer conductor / screen

Only connection of outer conductor to ground is supported.


Parameter Value for 45 Mbit/s tributary output ports



Code B3ZS

Jitter generation ANSI T1.105 / T1.102

Jitter generation (Map-ping A0)

• 10 Hz - 400 kHz: 0.4 UIpp

• 30 kHz - 400 kHz: 0.1 UIPP

Jitter generation (Com-bined, pointer se-quence)

• A1: A0 + 0.3 UIpp

• A2,A5: 1.3 UIPP

• A3: 1.2 UIPP

• A4: 1.0 UIPP


Peak voltage mark 0.36 to 0.85 VP

Pulse shape Figure 4 / ANSI T1.102




Code HDB3


Figure 15 /G.823


46 MA322 • Rev. F1





Return loss • >12 dB @ 860-1720 kHz

• >18 dB @ 1720-34368 kHz

• >14 dB @ 34368-51550 kHz

√f attenuation 12 dB @ 17.184 MHz

SIR 20 dB







Code HDB3

Jitter generation (Map-ping)

• 100 Hz - 800 kHz: 0.25 UIpp

• 10 kHz - 800 kHz: 0.075 UIPP

Jitter generation (Com-bined, pointer sequence B-D-E)

• 100 Hz - 800 kHz: 0.4 UIpp

• 10 kHz - 800 kHz: 0.075 UIPP

Jitter generation (Com-bined, pointer sequence C)

• 100 Hz - 800 kHz: 0.75 UIpp

• 10 kHz - 800 kHz: 0.075 UIPP


Return loss • 6 dB @ 860-1720 kHz

• 8 dB @ 1720-51550 kHz

Peak voltage mark 1.00 VP +/- 10%

Pulse shape Table 8 /G.703, Figure 17 /G.703


Interface • Coaxial pair - 75 Ohm

• Symmetrical pair - 120 Ohm


Code HDB3

MA322 • Rev. F1 47





Figure 13 /G.823


Return loss • >12 dB @ 51-102 kHz

• >18 dB @ 102-2048 kHz

• >14 dB @ 2048-3072 kHz

√f attenuation 6 dB @ 1.024 MHz

SIR 18 dB





Interface • Coaxial pair - 75 Ohm

• Symmetrical pair - 120 Ohm


Code HDB3

Jitter generation (Map-ping)

• 20 Hz - 100 kHz: 0.25 UIpp

• 700 Hz - 100 kHz: 0.075 UIPP

Jitter generation (Com-bined)

• 20 Hz - 100 kHz: 0.4 UIpp

• 700 Hz - 100 kHz: 0.075 UIPP


Return loss • 0 dB (Coaxial pair - 75 Ohm)

• >10dB 50-3000 kHz (Symmetrical pair - 120 Ohm)

Peak voltage mark • 2.37 VP +/- 10% (Coaxial pair - 75 Ohm)

• 3.00 VP +/- 10% (Symmetrical pair - 120 Ohm)

Pulse shape Table 6 /G.703, Figure 15 /G.703

48 MA322 • Rev. F1



3.5.3 Ethernet Interfaces

Electrical ports for ETEX4 option

The following table shows the specifications for the ETEX4 Ethernet ports.

Electrical ports for ETEX8M/S option

The following table shows the specifications for the electrical ETEX8M/SEthernet ports.

Auto-negotiation The electrical Ethernet interface automatically distinguishes whether to oper-ate at 10 or 100 Mbit/s.

Optical ports for ETEX8M/S option

The following table shows the specifications for the optical ETEX8M/S Ether-net ports.

Parameter Value for electrical Ethernet ports

Interface • 10 BaseT: 10 Mbit/s full duplex STP CAT3/5 ca-ble

• 100 BaseTX: 100 Mbit/s full duplex STP CAT5 ca-ble

• Auto-negotiation

Bit rate • 10 BaseT: 10 Mbit/s ± 100 ppm

• 100 BaseTX: 100 Mbit/s ± 100 ppm

Standards IEEE 802.3

Parameter Value for electrical Ethernet ports

Interface • 10 BaseT: 10 Mbit/s full duplex STP CAT3/5 ca-ble

• 100 BaseTX: 100 Mbit/s full duplex STP CAT5 ca-ble

• Full auto-negotiation Auto MDI/MDIX

Bit rate • 10 BaseT: 10 Mbit/s ± 100 ppm

• 100 BaseTX: 100 Mbit/s ± 100 ppm


Parameter Value for optical Ethernet ports

Interface 100 BaseFX: 100 Mbit/s full duplex, optical 2 km

Bit rate 100 Mbit/s ± 100 ppm


Fiber cable 50/125 µm multi mode

MA322 • Rev. F1 49



100BASE-FX ports The 100BASE-FX interfaces are according to ANSI INCITS 237-1955.

Optical ports for ETEX2S option

The following table shows the specifications for the optical ETEX2S Ethernetports.

Parameter Minimum Maximum Unit

Transmitter

Center wavelength (λ, range) 1270 1380 nm

Spectrum FWHM na 250 nm

Average power -22.0 -14.0 dBm

Trise (10% - 90%) na 4.0 ns

Tfall (90% - 10%) na 4.0 ns

Duty cycle distortion, peak-peak 0.0 1.0 ns

Data dependent jitter, peak-peak 0.0 0.6 ns

Random jitter, peak-peak 0.0 0.76 ns

Extinction ratio (min) 0.0 10.0 %

Receiver

Center wavelength (λ, range) 1270 1380 nm

Average power -29.0 -14.0 dBm

Trise (10% - 90%) na 4.5 ns

Tfall (90% - 10%) na 4.5 ns

Duty cycle distortion, peak-peak 0.0 1.0 ns

Data dependent jitter, peak-peak 0.0 0.6 ns

Random jitter, peak-peak 0.0 0.76 ns

Parameter Value for optical Ethernet ports

Interface • 1000 BaseSX: 1 Gbit/s full duplex, optical

• 1000 BaseLX: 1 Gbit/s full duplex, optical

Bit rate 1 Gbit/s ± 100 ppm


Fiber cable • 1000 BaseSX: 50/125 µm multi mode

• 1000 BaseLX: Single mode

50 MA322 • Rev. F1



1000BASE-SX ports The 1000BASE-SX interfaces are according to IEEE802.3.

1000BASE-LX ports The 1000BASE-LX interfaces are according to IEEE802.3.


Fiber type 50 µm multi mode

Transmitter

Transmitter type Shortwave laser

Signalling speed (range) 1.25 ± 100 ppm Gbit/s

Wavelength (λ, range) 770 to 860 nm

Trise/Tfall (max: 20% - 80%, λ > 830 nm) 0.26 ns

Trise/Tfall (max: 20% - 80%, λ < 830 nm) 0.21 ns

RMS spectral width (max) 0.85 nm

Average launch power (max) 0 dBm

Average launch power (min) -9.5 dBm

Average launch power of OFF transmit-ter (max)

-30 dBm

Extinction ratio (min) 9 dB

RIN (max) -117 dB/Hz

Coupled Power Ratio (CPR) (min) 9 < CPR dB

Receiver



Average receive power (max) 0 dBm

Receive sensitivity -17 dBm

Return loss (min) 12 dB

Stressed receive sensitivity -13.5 dBm

Vertical eye-closure penalty 2.20 dB

Receive electrical 3 dB upper cutoff fre-quency (max)

1500 MHz


Fiber type 10 µm single mode

Transmitter

Transmitter type Longwave laser

MA322 • Rev. F1 51



3.5.4 Synchronization Interface

External 2 MHz reference timing source

The following table shows the specifications for the external 2 MHz synchro-nization input at reference point ER.



Trise/Tfall (max: 20% - 80% response time)

0.26 ns

RMS spectral width (max) 4 nm

Average launch power (max) -3 dBm

Average launch power (min) -11.0 dBm

Average launch power of OFF transmit-ter (max)

-30 dBm

Extinction ratio (min) 9 dB

RIN (max) -120 dB/Hz

Coupled Power Ratio (CPR) (min) n/a dB

Receiver



Average receive power (max) -3 dBm

Receive sensitivity -19 dBm

Return loss (min) 12 dB

Stressed receive sensitivity -14.4 dBm

Vertical eye-closure penalty 2.60 dB

Receive electrical 3 dB upper cutoff fre-quency

max. 1500 MHz


Parameter Reference Value for 2 MHz synchronization input port

Input imped-ance (75 ohm unit)

G.703 • 75 Ohm

• High impedance

Input imped-ance (120 ohm unit)

G.703 • 120 Ohm

• High impedance (>1.6 kOhm with par-allel capacity < 60 pF)

Frequency 2.048 MHz +/- 20 ppm (as output)

52 MA322 • Rev. F1



2 MHz output ports The following table shows the specifications for the external 2 MHz synchro-nization output at reference point ES.

Synchronization function in locked mode

The following table describes the specifications for the synchronization func-tion in locked mode.

Jitter and Wander toler-ance

EN 300 462-5 Figure 2 and 3

Over voltage protection

G.703 ITU-T K.41

Return loss G.703 >15 dB @ 2.048 MHz

√f attenuation G.703 6 dB @ 2.048 MHz

Grounding of outer conduc-tor or screen

G.703 Always connected to ground

Parameter Reference Value for 2 MHz synchronization input port

Parameter Reference Value for 2 MHz synchronization output port

Frequency 2.048 MHz +/- 20 ppm

Mask Figure 21/G.703FTZ TL 5805-3170

• 1.5 - 3 VPP (Coaxial pair - 75 Ohm)

• 2.4 - 3.6 VPP (Symmetrical pair - 120 Ohm)

Jitter

Wander

Table 10/G.703

Figure 1/EN 300 462-5

0.05 UIPP @ 20 Hz - 100 kHz

Over voltage protection

G.703 ITU-T K.41

Voltage at squelch

< 40 mVP @ 50 kHz to 6.144 MHz

Parameter Reference SETG output

Locking performance

Capture range G.813, EN 300 462-5

minimum +/- 4.6 ppm

Lock range (fre-quency range where locked is maintained)

Tellabs +/- 20ppm

MA322 • Rev. F1 53



Synchronization function in holdover mode

The following table describes the specifications for the synchronization func-tion in holdover mode.

Jitter and Wan-der tolerance

EN 300 462-5 EN 300 462-5 figure 2 and 5The maximum permitted peak-to-peak sinusoidal jitter, when applied on the synchronization interfaces, shall not make the SEC loose track-ing.

Phase stability TDEV MRTIE (ns)

Ideal Operation EN 300 462-5 fig-ure 1

• 0.1<S<25s 32[ns]

• 25<S<100s 0.64xS0.5 [ns]

• 100 <S<1000s 6.4[ns]

• 0.1<S<1s 40ns

• 1 <S<100s 40xS0.2 [ns]

• 100 <S<1000s 25.25xS0.2[ns]

Stressed opera-tion (Phase tran-sient)

G.813

EN 300 462-5

-

-

According to chapter 9.1

According to fig-ure 6

Change of clock source

EN 300417-1 The change-over of synchronization from one source to another (each traceable to the same PRC) shall be performed so that the resultant fre-quency/phase change is compliant with the MRTIE mask (constraint by disturbances) given in EN 300 462-5.

The transition between synchroniza-tion sources may introduce a phase transient which may result in the generation of AU/TU pointer ad-justments but should not introduce bit errors

Jitter

Jitter transfer function

EN 300 462-5 Gain < 0.1 dB, Clock bandwidth 1 to 10 Hz



Frequency Stability

Memorized frequency resolution

Tellabs 0.025 ppm

Frequency offset EN 300 462-5 +/- 4.6 ppm end of life

Frequency offset on en-try into holdover.

implicit G.813, EN 300 462-5

+/- 0.05 ppm

54 MA322 • Rev. F1



Synchronization function in free-running mode

The following table describes the specifications for the synchronization func-tion in free-running mode.

3.5.5 Management Interfaces

Management protocol stack

Specification of the management protocol stack.

Frequency drift over temperature

EN 300 462-5 +/- 2.0 ppm

Phase stability MRTIE

Long term phase tran-sient response

EN 300 462-5 figure 7 • S>15s: (a1 + a2)S + 0.5bS2 + c [ns]

• a1 =50 ns/s (initial frequency offset (0.05ppm)

• a2 =2000 nS/S ac-counts for tempera-ture variations (2ppm)

• b=1.16x10-4 ns/s2 accounts ageing (0.01 ppm/day)

• c=120ns



Frequency Stability

Frequency offset EN 300 462-5 +/- 4.6 ppm for ap-proximately 10 years.A software option will allow in system recali-bration.

Craft Terminal In-terface

Ethernet ECC Channels

Connection type co co/cl co/cl

Layer

Application LMIP (1) LMIP (1) LMIP (1)

Presentation - - -

Session - - -

MA322 • Rev. F1 55



Note: (1) Proprietary protocol

Note: (2) A limited but compatible version

Ethernet management protocol stack

Specification of the Ethernet management protocol stack.

Auxiliary alarm I/O's The system is equipped with auxiliary alarms I/O circuits. The following tabledepicts the interface specifications for these interfaces.

Transport NTH(1) TP4:X.224, X.214 (class 4)(ISO 8073)

TP4:X.224, X.214 (class 4)(ISO 8073)

Network - CLNP: ISO 8473Addr: ISO 8348:AD2ES-IS: ISO 9542IS-IS: ISO 10589 (2)

CLNP: ISO 8473Addr: ISO 8348:AD2ES-IS: ISO 9542IS-IS: ISO 10589 (2)

Data link S-link(1) LLC-1ISO 8802-2 Type 1

Q.921LAPD

Physical V.28 9600 baud

CSMA/CDISO 8802-3

DCC-R, DCC-M, F2, VC-12

Craft Terminal In-terface

Ethernet ECC Channels

Craft Terminal Interface Ethernet

Layer

Application SNMP v2c (IETF RFC 3416)

SNMP v2c (IETF RFC 3416)

Presentation - -

Session - -

Transport TCP (IETF RFC 793) or UDP (IETF RFC 768)

TCP (IETF RFC 793) or UDP (IETF RFC 768)

Network IP (IETF RFC 791) IP (IETF RFC 791)

Data link PPP over RS-232 Ethernet 10/100-TX

Physical RS-232 Ethernet 10/100-TX

Signal Description Interface

AUX 2-way configurable control signals

3V CMOS level. Can source 5 mA as output

56 MA322 • Rev. F1



AUX port configuration To ensure proper operation of Alarm LED and alarm reporting in case of acooling fan failure or AUX alarms, the AUX ports must be configured as fol-lows:

Use the Tellabs 6300 manager to configure the AUX ports and to perform thealarm configuration of the AUX ports. Please refer to the manual for Tellabs6300 manager [1].

As an input, the external alarm can be connected to dry contacts and can be setvia the management system to be either open or closed in the alarm state.

Open inputs are pulled high by pull-up resistors on the ADM/TM module.

Monitored parameters. The following parameters are only monitored at the ADM/TM aggregateport.

AUX number Configure as

AUX0 Alarm Led, output, active high.

AUX1 Cooling Fan #1 failure, input, active high.

AUX2 Cooling Fan #2 failure, input, active high.

AUX3 -48 V input A missing, input, active low.

AUX4 -48 V input B missing, input, active low.

AUX5 - 7 User configurable inputs, user defined polarity.

Signal Description RangeAccura-

cy

Laser power Optical transmitted mean power

S-1.1: -20 to -5 dBm ± 3 dB

L-1.2: -10 to +5 dBm

Optical in-put power

Received optical mean pow-er

S-1.1: -28 to -5 dBm ± 3 dB

L-1.2: -37 to -1 dBm

Laser bias Temperature compensated bias current relative to initial factory value

25 to 200% ± 30%

Laser Tem-perature

Temperature of the laser (for instance used for calculation of the relative bias current).

0 to +90 ° C ± 6 ° C

MA322 • Rev. F1 57



3.5.6 Power

AC input The table lists the AC power specifications.

Secondary supply Dual DC supply. One supply can be used as protection supply for the other.

Tertiary supply The table list the system internal power specifications.

Parameter Value

Nominal Voltage 115 or 230 VAC

Input Voltage 96 to 264 VAC

Input Frequency 47 to 63 Hz

Fuse 2 x T3.15A250V

Power consumption max. 75 W

Parameter Value

Nominal voltage -48 V

Operating voltage -40.5 V to -60 V

Power consumption max. 75 W

Parameter Value

Output from DC/DC converters

+5 V and -5 V

Power LED Trigger Level

Less than +4.9 V

More than -4.9 V

58 MA322 • Rev. F1



3.5.7 Mechanical

Dimensions The dimensions of the Tellabs 6310 node is shown in the figure below.

Weight The weight is 4.7 kg

Air filter replacement To ensure optimum cooling under normal environmental conditions, it is rec-ommended to replace the air filter every 12 months. In dusty conditions morefrequent replacement of filter might be necessary.

Transport The Tellabs 6310 node is not designed for transport installed in a rack, as thismay damage the mechanics. It is recommended to use the factory suppliedpackaging.

Connectors The table specifies the connectors on the front and rear plate.

Function Equipment Connector Type Remarks

2 Mbit/s tributary (120 Ω) Shielded RJ-45 21, use shielded cables

Synchronization (120 Ω) Shielded RJ-45 1, use shielded cable

2 Mbit/s tributary (75 Ω) Coaxial 1.0/2.3 (IEC 169-29 and CECC 22 230) (female)

42

Synchronization (75 Ω) Coaxial 1.0/2.3 (IEC 169-29 and CECC 22 230) (female)

2

MA322 • Rev. F1 59



34 Mbit/s, 45 Mbit/s trib-utary (75 Ω)

Coaxial 1.0/2.3 (IEC 169-29 and CECC 22 230) (female)

6

10/100 Ethernet Shielded RJ-45 4 x 10/100 BaseT Ethernet

Optical Ethernet tributary input

LC, multi mode (single mode for 1000BaseLX)

2 x 100 BaseFX Ethernet or 2 x 1000 BaseSX/LX EthernetOptical Ethernet tributary

output

Optical aggregate input LC, single mode 2 for ADM1 for TM

Optical aggregate output

Management interface (CT)

RJ-45 Craft terminal in-terface. Use shielded cable if permanently connected.

Management interface (TRIB)

RJ-45 F-interface for TRIB module. Use shielded ca-ble if permanent-ly connected.

Management interface BNC 10 Base 2 Ether-net

AUX (ALARM) 9 pole DIN 41652 (male) Use shielded ca-ble

EOW 15 pole DIN 41652 (male) Use shielded ca-ble

User Channels (UCH1/2) 15 pole DIN 41652 (male) Use shielded ca-bles

-48 V DC 3 pole DIN 41652 (male)

Mains IEC 320 receptacle with locking mechanism

Function Equipment Connector Type Remarks

60 MA322 • Rev. F1



Pin designations The figure shows the pin designations of the connectors.

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3.5.8 Environmental

Climatic and mechanical conditions

Classification according to ETSI ETS 300 019-1:

• Storage:

ETS 300 019-1-1 class 1.2, not temperature controlled storage locations.

• Transportation:

ETS 300 019-1-2 class 2.3, public transportation.

• In use:

• when AC powered:ETS 300 019-1-3 class 3.2, stationary, weather protected, partly temper-ature-controlled locations.

• when DC powered:ETS 300 019-1-3 class 3.3, stationary, weather protected, not tempera-ture-controlled locations.

Climatic and mechanical conditions

The table specifies climatic and mechanical conditions of the Tellabs 6310node during storage, transport and operation.

Note: The temperature range is -5 ° C to +45 ° C for the ETEX8M, ETEX8S andETEX2S options.

Parameter Storage and Transportation In use

Temperature -40 ° C to +70 ° C • when AC powered -5 ° C to +45 ° C

• when DC powered -25 ° C to +55 ° C (see note)

Humidity 10% to 100% RH, condens-ing

5% to 100% RH, condens-ing

Vibration Sinusoidal, 2 - 9 Hz, 3.5 mm 9 - 200 Hz, 10 m/s2 200 - 500 Hz 15 m/s2

Sinusoidal, 2 - 9 Hz 1.5 mm, 9 - 200 Hz 5 m/s2

Shock Shock spectrum type I 11 ms 100 m/s2

Shock spectrum type L 22 ms 40 m/s2

Fall 1.2 m -

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Climatic and mechanical tests

Test severities according to EN 300 019-2:

• Storage:

Test specification T 1.2

• Transportation:

Test specification T 2.3

• In use:

Test specification T 3.2 and T 3.3

Test sequence for storage and transportation

The table specifies the test sequence for storage and transportation.

Test sequence in use The table specifies the test sequence for in use.

Parameter Severity Reference

Temperature shocks -40/30 ° C, 1° C/min., t=3h, 5 cycles

IEC 60068-2-14 Nb

Mechanical shocks 400m/s2, 6ms, 6 x 500 shocks

IEC 60068-2-29 Eb

Humidity, condensa-tion

25/40 ° C, 90-100% RH, 2 days

IEC 60068-2-30 Db 1

Low Temperature -40 ° C, 3 days IEC 60068-2-1 Ab

High Temperature 85 ° C, 3 days IEC 60068-2-2 Bb

Vibration, sinusoidal 5 - 9 - 200 - 500 Hz3.5 mm - 10 - 15 m/s2

1 octave/minute3 x 5 sweep cycles

IEC 60068-2-6 Fc

High humidity 40 ° C, 93%RH, 4 days IEC 60068-2-56 Cb

Free Fall 1 m IEC 60068-2-32 Ed 1


Low temperature when AC powered -5 ° C, 16 hwhen DC powered -25 ° C, 16 h

IEC 60068-2-1 Ad

High temperature when AC powered 45 ° C, 16 hwhen DC powered 55 ° C, 16 h

IEC 60068-2-2 Bd

Temperature change -5/45 ° C, 0.5 ° C/min t1 = 3 h, 1 cycle

IEC 60068-2-14 Nb

Mechanical shocks 100 m/s2, 11 ms, 6 x 3 shocks

IEC 60068-2-27 Ea

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Functional tests are made during and at the end of each test to verify that per-formance parameters are fulfilled.

3.5.9 EMC Conditions

Compliance The principal protection requirements of the EMC Directive 89/336/EEC aresatisfied.

Test specifications Verification of compliance with conditions is done by testing in accordancewith EN 300 386: Telecommunication Network Equipment, EMC require-ments. Sub clause 7.2 Equipment operating in locations other than telecom-munication centres.

EMC emission tests The table shows the EMC emission test specifications.

EMC immunity tests The immunity and resistibility performance criteria are according to EN 300386 subclass 12.3.

Vibration, sinusoidal

5 - 9 - 200 Hz,1.5 mm - 5 m/s2

3 x 5 sweep cycles

IEC 60068-2-6 Fc

Humidity, condensation

25/40 ° C, 90-100%RH, 2 days

IEC 60068-2-30 Db 1

High humidity 40 ° C, 93%RH, 4 days IEC 60068-2-56 Cb


Phenomenon Limits Reference

Enclosure Ports:

Electromagnetic Field30-1000 MHz, 10m

30 - 230 - 1000 MHz30 - 30/37 - 37 dBµV/m

EN 55022Class B

AC Power Supply Ports:

Conducted RF voltage0.15 - 30 MHzQuasi peak det.Average det.

0.15 - 0.5 - 5.0 - 30 MHz66 - 56 - 56/60 - 60 dBµV56 - 46 - 46/50 - 50 dBµV

EN 55022Class B

DC Power Supply Ports:

Conducted RF voltage0.02 - 30 MHzQuasi peak det.Average det.

0.02 - 0.15 - 0.5 - 5.0 - 30 MHz79 - 79/66 - 56 - 56/60 - 60 dBµV56 - 46 - 46/50 - 50 dBµV

EN 55022Class B and EN 300 386

64 MA322 • Rev. F1



EMC immunity tests for enclosure ports

Specifications for enclosure ports.

EMC immunity tests for AC power supply ports

Specifications for AC power supply ports.

EMC immunity tests for DC power supply ports

Specifications for DC power supply ports.

Phenomenon Test Level Performance Reference

Electrostatic Discharge contact/air exposure

6kV/0-8kV B EN 61000-4-2

8kV/0-15kV R

Electromagnetic Field (26) 80 - 1000 MHz80% AM, 1kHz

10 V/m A EN 61000-4-3EN 300 386, sub clause 12.2.2

Electromagnetic Field GSM 900 MHz @ 200Hz50% duty c.

10 V/m A ENV 50140


Voltage Dips and Short Interruptions

> 95 %, 10 ms B EN61000-4-11

30 %, 500 ms C

> 95 %, 5000 ms C

Radio Frequency CM Voltage0.15 – 80 MHz80 % AM, 1 kHz

10 V A EN 61000-4-6EN 300 386, sub clause 12.2.2

Fast Transientsrise time 5ns decay time 50ns

1 kV B EN 61000-4-4

2 kV C

Surge Transientsrise time 1.2µs decay time 50µs

1 kV line to line2 kV line to ground

B EN 61000-4-5


R


Voltage Variations and Short Interrup-tions

40.5 - 57.0 V50.0 - 72.0 V 5V/ms

A ETS 300 132-2

0 V in 4 ms A

0 V in 50 ms C

MA322 • Rev. F1 65



EMC immunity tests for signal and control ports

Specifications for signal and control ports.

3.5.10 Safety

Compliance The principal protection requirements of the low voltage directive 73/23/EECare satisfied.

Safety requirements The requirements of EN 60950 “Safety of information technology equipment”is fulfilled.

CAUTION: Double-pole / Neutral fusing.

The requirements of EN 60825-1: Equipment classification, requirements anduser’s guide, and EN 60825-2: Safety of optical fibre communication systems,are fulfilled.

An automatic laser shutdown function is provided for the optical STM-1/STM-4 interfaces. This function complies with ITU-T G.664: Optical safetyprocedures and requirements for optical transport systems.

Radio FrequencyCM Voltage0.15 – 80 MHz80 % AM, 1 kHz



1 kV B EN 61000-4-4

2 kV C


0.5 kV line to line1 kV line to ground

B EN 61000-4-5


C

0.5 kV C ITU-T K.41



Radio FrequencyCM Voltage0.15 – 80 MHz80% AM, 1kHz



0.5 kV B EN 61000-4-4

1 kV C


0.5kV B EN 61000-4-5

0.5kV C ITU-T K.41

66 MA322 • Rev. F1



3.5.11 R&TTE

Compliance The principal protection requirements of the Radio Equipment and Telecom-munications Terminal Equipment Directive (R&TTE) 1999/5/EC are satis-fied.

Requirements This is verified by performing the tests according to the EMC directive and theLVD directive, i.e.:

• EN 300 386: Telecommunication Network Equipment, EMC requirements. Sub clause 7.2 Equipment operating in locations other than telecommuni-cation centres, see part 5 of this document.

• EN 60950: Safety of information technology equipment.

Connections It is only the optical interfaces of the Tellabs 6310 node, that are intended to beconnected to interfaces of public telecommunications networks.

The safety status of the electrical interfaces of the Tellabs 6310 node is SELVcircuit according to EN60950.

The electrical interfaces of the Tellabs 6310 node must only be connected toother earthed equipment, and must not be connected directly to outdoor sig-nal lines.

3.5.12 MTBF

Calculation method The FIT and MTBF values are calculated according to British Telecom Hand-book of Reliability Data for components used in Telecommunication systems[HRD5]/Telcordia SR-332. The used method is based on part count analysiswith parameters as described in the table below.

In the calculation of the FIT and MTBF values, the following parameters areused for the electrical components, photo diodes and optical fibers. The con-version from FIT to MTBF (years) is based on the following formula: MTBF =1.14 x 105/FIT

Reliability Calculation parameters

The table lists the reliability calculation parameters.

Tempera-ture

Environ-ment

Connec-tions

Quality level

Components Level

30 ° C Ground Fix

Machine soldered or Press Fit

Integrated Circuits and Transistors

HRM2

Discrete Semiconduc-tors

PLS2

Active Components HRM2

Passive Components LEV2

Miscellaneous Parts LEV2

MA322 • Rev. F1 67



FIT and MTBF for Tellabs 6310 node without main and trib modules

The table below specifies the FIT and MTBF values for the Tellabs 6310 nodewithout the main and trib modules.

FIT and MTBF for main modules

The table below specifies the FIT and MTBF values for main modules in theTellabs 6310 node.

FIT and MTBF for trib modules

The table below specifies the FIT and MTBF values for trib modules in the Tel-labs 6310 node.

To calculate the MTBF for the Tellabs 6310 node

Use the procedure below to calculate the MTBF for a specific configuration ofthe Tellabs 6310 node.

Item Description FIT MTBF

CU3690-xxxx Unit without main and trib modules, AC/DC

2816 40.5

CU3691-xxxx Unit without main and trib modules, DC

2360 48.3


TM1 Terminal Multiplexer, STM-1 6785 16.8

ADM1 Add/drop multiplexer, STM-1 7862 14.5

ADM4 Add/drop multiplexer, STM-4 7862 14.5


TEX31 1 x 34 Mbit/s 1789 63.7

TEX33 3 x 34 Mbit/s 2151 53.0

TEXDS31 1 x 45 Mbit/s 1789 63.7

TEXDS33 3 x 45 Mbit/s 2151 53.0

ETEX4 4 x 10/100 Mbit/s Ethernet (electri-cal)

2901 39.3

ETEX8M/S 4 x 10/100 Mbit/s Ethernet (electri-cal) and 2 x 100 Mbit/s Ethernet (op-tical)

6495 17.6

ETEX2S 2 x 1 Gbit/s Ethernet (optical) 6147 18.6

Step Action

1 Find the separate FIT values for the unit without main and trib mod-ules, the main module and the trib module for a specific unit.

Find the values in ‘FIT and MTBF for Tellabs 6310 node without main and trib modules’ on page 68, ‘FIT and MTBF for main mod-ules’ on page 68 and ‘FIT and MTBF for trib modules’ on page 68.

2 Calculate the total FIT value for the unit by adding the separate FIT values.

68 MA322 • Rev. F1



Operational lifetime The Tellabs 6310 node unit is designed for a 15 year lifetime.

3 Calculate the MTBF (years) using the formula: MTBF=114000/FIT

Step Action

MA322 • Rev. F1 69



70 MA322 • Rev. F1


A Packing Instructions


Overview This appendix describes the recommended procedures to follow when pack-ing modules for shipment.

Use original packing material

It is recommended to use the original packing material from the factory. Butif the material is not available then follow the instructions here when packingmodules for shipment.

Required materials If you do not have the original packing material, then the following materialsare required for packing the module.

• Antistatic bag (antistatic inner layer and metal coated outer layer) with a suitable size

• Carton-box with a suitable size

• Foam supporting pad with dimensions that fit the box.

To pack the module Follow the instructions below when you are packing the module before ship-ment.

Step Action

1 Put an antistatic bracelet on your wrist, and connect the bracelet to ESD ground on the workplace.

Note: Make sure that the workplace, on which you are connecting thebracelet, is correctly ESD grounded.

MA322 • Rev. F1 71



2 Place the module in the antistatic bag.

Note: Only one module per bag

3 Unfold/assemble the carton-box

4 Place the lower part of the foam supporting pad in the bottom of the box.

Step Action

72 MA322 • Rev. F1



5 Place the module with the top side up into the box, carefully wrap-ping the antistatic bag around the module.

Note: Only one module per box

6 Place the upper part of the foam supporting pad in the box.

Step Action

MA322 • Rev. F1 73



7 Close the box

Use tape if necessary to ensure that the box stays closed during trans-portation.

Step Action

74 MA322 • Rev. F1


Index

Index

AAbbreviations 11AC input 42, 58Air filter 30

BBlock diagram

Power system 42Unit 40

CCable types 23Cabling 23, 27Cautions 7Connecting cables 23Connectors 38Considerations 17

DDC input 42, 58Definition of Terms 12Description 40Dimensions 59

EEMC 64Environmental 62Equipment labels 18

FFilter 30Front Layout 35Functional description 40

IIdentification

Labels 18Settings 29

IDs 29Installation

Connecting cables 23In rack 20

Installing cables 23Item numbers 36

LLabels 18Layout 16, 35LEDs 38Location 18Logistics 36

MManagement 15Management interface 55Manual

Purpose 11Structure 11

Mechanical 59MTBF 67

NNumbers 36

OOptical Safety 17Ordering numbers 36

PPDH interface 45Physical placement 18Pin designations 61Power 58Protection 15, 41Purpose of manual 11

RR&TTE 67Rack ID 29References 13Replacing

Filter 30Tributary Module 31

SSafety 17, 66Slot ID 29Specification

EMC 64Environmental 62Ethernet interface 49Management interface 55

MA322 • Rev. F1 75


Index

Mechanical 59MTBF 67PDH electrical interface 45Power 58R&TTE 67Safety 66STM-1/4 optical interface 43Synchronization interface 52

STM-1 interface 43STM-4 interface 43Structure of manual 11Subrack ID 29Synchronization interface 52

TTerms 12

WWarnings 7Weight 59

76 MA322 • Rev. F1

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6310 Hardware Installation Guide

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