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24 V Y0 3x ISO714x B B B C o n n e c t o r 3.3 V/ 50 mA Isolation 500 V DRV8803 Y3 Y7 Y4 DRV8803 Simple protection LED LED LED LED 2 x Isolated fault 5 V/ 50 mA 18 V…30 V 8 x port pin Enable Reset 2 x 4 x isolated pin Isolated enable Isolated reset SM72485 DC/DC 2 x Fault TI Designs 8-Ch Parallel 0.5-A Low-Side Digital Output Module for Programmable Logic Controllers (PLCs) TI Designs Design Features TI Designs provide the foundation that you need High-density 8-Ch, 24-V Low-Side Digital Output including methodology, testing and design files to 500 mA/Ch Unregulated (20%), 2-A Peak quickly evaluate and customize the system. TI Designs Parallel Control for Simple MCU Interface help you accelerate your time to market. Capable of Switching Inductive Loads Design Resources LED to Indicate Output State Beaglebone Black Cape Form Factor for Easy Design Folder TIDA-00320 Evaluation TIDA-00236 Design Folder Beaglebone Black Community Featured Applications DRV8803 Product Folder PLC, DCS, and PAC ISO7140CC Product Folder Digital Output ISO7142CC Product Folder SM72485 Product Folder CPU (PLC) Motor Control I/O Modules Sensor Concentrators ASK Our E2E Experts WEBENCH® Calculator Tools An IMPORTANT NOTICE at the end of this TI reference design addresses authorized use, intellectual property matters and other important disclaimers and information. All trademarks are the property of their respective owners. 1 TIDU705A – January 2015 – Revised January 2015 8-Ch Parallel 0.5-A Low-Side Digital Output Module for Programmable Logic Controllers (PLCs) Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated
Transcript
Page 1: 8-Ch Parallel 0.5-A Low-Side Digital Output Module for ...

24 V

Y0

3x

ISO714x

B

B

B

C

o

n

n

e

c

t

o

r

3.3 V/

50 mA

Isolation

500 V

DRV8803

Y3

Y7

Y4

DRV8803

Simple

protection

LED

LED

LED

LED

2 x Isolated fault

5 V/

50 mA

18 V…30 V

8 x port pin

Enable

Reset

2 x 4 x isolated pin

Isolated enable

Isolated reset

SM72485

DC/DC

2 x Fault

TI Designs8-Ch Parallel 0.5-A Low-Side Digital Output Module forProgrammable Logic Controllers (PLCs)

TI Designs Design FeaturesTI Designs provide the foundation that you need • High-density 8-Ch, 24-V Low-Side Digital Outputincluding methodology, testing and design files to • 500 mA/Ch Unregulated (20%), 2-A Peakquickly evaluate and customize the system. TI Designs

• Parallel Control for Simple MCU Interfacehelp you accelerate your time to market.• Capable of Switching Inductive Loads

Design Resources • LED to Indicate Output State• Beaglebone Black Cape Form Factor for EasyDesign FolderTIDA-00320

EvaluationTIDA-00236 Design FolderBeaglebone Black Community Featured ApplicationsDRV8803 Product Folder

• PLC, DCS, and PACISO7140CC Product Folder– Digital OutputISO7142CC Product Folder

SM72485 Product Folder – CPU (PLC)• Motor Control I/O Modules• Sensor ConcentratorsASK Our E2E Experts

WEBENCH® Calculator Tools

An IMPORTANT NOTICE at the end of this TI reference design addresses authorized use, intellectual property matters and otherimportant disclaimers and information.

All trademarks are the property of their respective owners.

1TIDU705A–January 2015–Revised January 2015 8-Ch Parallel 0.5-A Low-Side Digital Output Module for Programmable LogicControllers (PLCs)Submit Documentation Feedback

Copyright © 2015, Texas Instruments Incorporated

Page 2: 8-Ch Parallel 0.5-A Low-Side Digital Output Module for ...

Key System Specifications www.ti.com

1 Key System Specifications

Table 1. Key System Specifications

SPECIFICATIONSYMBOL PARAMETER CONDITIONS UNIT

MIN TYP MAXVIN Input voltage Normal operation 10 24 33 VIIN Input current Normal operation — 15 50 mA

VLOAD Load supply voltage Normal operation 0 24 44 VPer channel TA = 85°C — 500 600 mA

ILOAD Load current Per channel TA = 25°C — 700 1000 mASingle channel per driver, TA = 25°C — — 2000 mA

PLOSS Power loss per channel RL = 48 Ω, VLOAD = 24 V, TA = 25°C — 200 — mWResistive load 1000 Hz

fSW Switching frequencyInductive load, 0.1 H, all channels 10 Hz

tRISE Load voltage rise time 10% .. 90% RL = 48 Ω, VLOAD = 24 V, TA = 25°C — 600 — nsPropagation Delay Input L→H, outputtPDHL RL = 50 Ω, VLOAD = 24 V, TA = 25°C — 440 — nsH→L (<90%)

tFALL Load voltage fall time 90% .. 10% RL = 48 Ω, VLOAD = 24 V, TA = 25°C — 140 — nsPropagation Delay Input H→L, outputtPDLH RL = 50 Ω, VLOAD = 24 V, TA = 25°C — 540 — nsL→H (> 10%)

IPEAK Peak current (1 ms) 2.3 3.8 AInductive power for each group ofPIND 0.5 J/schannels (1)

(1) Outputs Y0 to Y3 are one group, and outputs Y4 to Y7 are another group.

2 System DescriptionA digital output (DO) module is a standard module in a PLC or DCS system. The DO module is used topermanently turn on and off resistive, capacitive, or inductive loads or control them with pulse widthmodulation (PWM).

A DO with a MOSFET can be realized as a high-side or low-side switch. This design uses the low-sideswitch principal, which means that the load connected to the output between the 24-V supply and theoutput of the module. Therefore, the switch is below the load seen from the 24-V DC supply.

The advantage with this principle is its lower cost of the switching MOSFETs as they can be of NMOStype. These MOSFETs are about 2.5 times smaller compared to a PMOS FET with the same Rds(on). Agate voltage of 10 V above GND is sufficient to keep these FETs in the saturated region. This gate voltagealso saves level shifters and charge pumps. A low-side configuration is on the other hand more sensitiveto corrosion as the load is permanently connected to a 24-V supply even when switched off. Thisconfiguration also means that a short to ground turns on the load unintentionally.

The TIDA-00320 is designed as a Beaglebone Black Cape form factor. The microprocessor (MPU) on theBeaglebone Black can be used to control the outputs or the board can be used stand alone or any otherMCU with 3.3-V GPIOs.

In most cases, the digital outputs are galvanic isolated from the control of the outputs. This design useslow-power digital isolators to separate the 24-V field side from the driving logic implemented by theBeaglebone Black. Even a lightning strike on the field side with ground shifts of 500 V and more willpreserve the operation of the MPU.

2 8-Ch Parallel 0.5-A Low-Side Digital Output Module for Programmable Logic TIDU705A–January 2015–Revised January 2015Controllers (PLCs) Submit Documentation Feedback

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Page 3: 8-Ch Parallel 0.5-A Low-Side Digital Output Module for ...

24 V

Y0

3x

ISO714x

B

B

B

C

o

n

n

e

c

t

o

r

3.3 V/

50 mA

Isolation

500 V

DRV8803

Y3

Y7

Y4

DRV8803

Simple

protection

LED

LED

LED

LED

2 x Isolated fault

5 V/

50 mA

18 V…30 V

8 x port pin

Enable

Reset

2 x 4 x isolated pin

Isolated enable

Isolated reset

SM72485

DC/DC

2 x Fault

www.ti.com Block Diagram

3 Block Diagram

Figure 1. TIDA-00320 Block Diagram

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Thermal

Shut down

OUT1

GND

(multiple pins)

VCLAMP

IN1

IN2

IN3

Internal

Reference

Regs

UVLO

Int. VCC

nFAULT

Control

Logic

IN4

nENBL

VMLS Gate

Drive

OUT2

OUT3

OUT4

OCP

&

Gate

Drive

8.2V – 60V

OCP

&

Gate

Drive

OCP

&

Gate

Drive

OCP

&

Gate

Drive

8.2V – 60V

Optional

Zener

Inductive

Load

Inductive

Load

Inductive

Load

Inductive

Load

RESET

IN1

IN4

IN3

IN2

ENBL OUT1

OUT2

OUT3

OUT4

Block Diagram www.ti.com

3.1 Highlighted ProductsThe TIDA-00320 has eight DOs configured as low-side drivers. The design uses two DRV8803 with fourprotected low-side drivers integrated in each device. The ISO7140 provides galvanic isolation for the SPIchannel. Each DRV8803 also has a global fault pin, which indicates fault on any of the four outputchannels. Those signals are connected to the ISO7140, which galvanic isolate the signals. The SM72485is used in a low-cost buck configuration to provide 5 V for powering the secondary side of the ISO7140and ISO7142. Eight status LEDs are connected to the outputs of the DRV8803s and indicate the physicalstatus of the output.

3.1.1 DRV8803

Figure 2. DRV8803 Block Diagram Figure 3. DRV8803 Simplified Diagram

3.1.2 ISO7140The design uses eight Beaglebone Black signals for the outputs Y0 to Y7. Two additional signals aredriving RESET and nENBL of the DRV8803s. The two signals /FAULT0 and /FAULT1 from the twoDRV8803s are fed back to the Beaglebone Black to indicate error conditions. These ten forward and twobackward signals are distributed over three isolator devices with four channels each. Two of the isolatorsare of an ISO7140 type with four channels in one direction and one isolator is of an ISO7142 type with twochannels in each direction. The ISO714x family provides galvanic isolation at 2500 VRMS for one minuteper UL or 4242 VPK per VDE. The selected isolators support up to 50 Mbps, which is well above thecommunication speed used in the design.

3.1.3 SM72485The SM72485 is a wide input step down non-synchronous converter with integrated FET. In the design,this device provides a 5-V regulated output from the 24-V field connector to supply the isolator devices.

4 8-Ch Parallel 0.5-A Low-Side Digital Output Module for Programmable Logic TIDU705A–January 2015–Revised January 2015Controllers (PLCs) Submit Documentation Feedback

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www.ti.com System Design Theory

4 System Design Theory

4.1 Low-Side Driver SelectionTo demonstrate the small form factor, this design uses two DRV8803. These devices integrate four poweroutputs in a PWP package at 5×7-mm board space and are capable of simultaneously driving 0.5 A ateach output with only PCB cooling. An area of about 15 cm2 per DRV8803 would suffice to operate atambient temperatures of 85°C and the design provides around 22-cm2 copper per device. The DRV8803shave internal diodes to a common clamping pin. This pin allows setting a clamping voltage different fromthe operating voltage for fast inductive discharge. The discharge then happens in an external Zener diode(D57 and D58). The power capability of the zener diodes defines the quantity of inductive discharge themodule can handle and can be set application specific. The TIDA-00320 uses a clamp of 48 V and theZener diodes have a 3-W power capability each. Thus, a maximum inductive discharge of 750 mJ canoccur once each second for each output. The designer must take care of thermal management. In thisdesign, the TVS cooling is sufficient for 500 mW, limiting the discharge to 125 mJ per second. The designconsiderations are also elaborated in Section 4.3.

Unlike the application circuit in the DRV8803 datasheet (SLVSAW5), the Zener diodes are connectedbetween the clamping point and ground. This connection guarantees independence of the 24-V supplyand the clamping voltage. Otherwise the 24-V supply voltage might creep up from inductive discharge untilthe clamping point voltage exceeds the absolute maximum voltage. Also, it is easier from a layout point ofview to keep the current into ground close together during inductive switching, thus preventing noise frominjecting into the ground.

4.2 Thermal ManagementThe thermal management budget has been calculated based on the following design considerations:• The junction temperature should not surpass 150°C.• The thermal resistance of the package is 2.3°K/W junction to bottom plate.• The thermal vias have an inner diameter of 8 mm and a thermal resistance of 170°K/W.• The board space provides thermal resistance to air of around 900°K/W per cm2 (see formula 23 in

Reference 2).

The RDS(on) of the DRV8803 is max 0.8 Ω, and with four outputs turned on at 0.5 A, the total powerdissipation is 0.8 W per device (4 × 0.52 × 0.8). For an ambient temperature of 85°C, the junctiontemperature may increase 65°K. Therefore TIDA-00320 has 5 thermal vias per device, which results in34°K/W resistance. The pad is also connected on the top side of the PCB with about the same thermalresistance of 34°K/W. The total connection resistance then is 17°K/W corresponding to a 14°K increaseon top of the 1.8°K junction case rise. As a consequence, the copper area may only have a temperatureincrease of 49°K. The copper area therefore needs a thermal resistance to air of less than 61°K/W, whichis equivalent to 15 cm2. The TIDA-00320 has approximately 22 cm2 available per DRV8803, so anambient temperature of 85°C is safe to operate.

If an ambient temperature beyond 85°C is desired, the thermal management could be further optimized byusing a four-layer board with thicker copper. While the inner layers cannot radiate the heat, they could stillprovide for better heat distribution and prevent the outer layers from being split by traces. Therefore, theactive cooling area could be increased.

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System Design Theory www.ti.com

4.3 Switch off an Inductive LoadThe TIDA-00320 can be used to switch off inductive loads like motors, valves, and so on. An inductiveload has the property that it stores energy. When the switch wants to turn, the inductive load off thisenergy is released. The inductor tries to keep the current flowing, which could result in a high voltagespike at the output of the switch. Typical methods to prevent the occurrence of spikes are freewheelingdiodes. These diodes limit the voltage at the inductor so that the diode does not exceed the typical diodeforward voltage of 0.7 V. The resulting voltage at the output of the switch would be 24.7 V, assuming apower supply of 24 V. The method is simple, but it has the disadvantage the current keeps flowing forsome period of time. The time is reverse proportional to the freewheeling voltage. For high speedactuators like injection valves in process control systems, this is not desired. The preferred method is touse a Zener diode so that the freewheeling voltage can be higher. In this reference design, thefreewheeling voltage is clamped to 48 V. At a 24-V supply, this voltage will result in a freewheeling voltageof 24 V and a much faster decay of the inductor current. Therefore, this reference design is best suited fordirect control of stepper motors or injection valves.

The DRV8803 has protected the low-side switches with one integrated clamping diode per each output. Allclamping diodes are fed to one pin for an external Zener diode. This diode will clamp the voltage to 48 V.

The external Zener diodes in the TIDA-00320 (D57 and D58) is a 3-W TVS diode with cooling calculatedfor 500 mW; therefore, all outputs of one DRV8803 can absorb 0.5 J/s of energy. An inductive load of 100mH can store around 12.5 mJ (E = ½ × L × I2) at a current of 0.5 A. The diode could therefore switch at arate of 40 Hz for one output or 10 Hz if all four outputs are loaded and switched.

4.4 Switching Light BulbsThe TIDA-00320 can be used to switch conventional light bulbs. Such a load has a very low coldresistance so that the initial current can be as much as 10 times higher than the continuous current. A 24-V, 5-W light bulb has an in-rush current of 2 A, which is within the operating range of the DRV8803.Larger light bulbs would trigger the overcurrent protection without harming the DRV8803, but the light bulbmight not turn on as desired.

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www.ti.com Getting Started Hardware

5 Getting Started HardwareThe TIDA-00320 can be used either as cape with the Beaglebone Black evaluation platform or as astandalone card with any processor capable of handling parallel GPIO communication. For the connectionto the Beaglebone Black connector, J20 and J21 will handle the communication.

5.1 Pin Assignment

Table 2. Pin Assignment

TIDA-00320 FUNCTION TIDA-00320 HEADER BBB HEADER SOFTWARE DIRECTIONY0 J20, PIN 8 P8_8 TIMER7 OUTY1 J21, PIN 12 P9_12 GPIO1_28 OUTY2 J21, PIN 23 P9_23 GPIO1_17 OUTY3 J21, PIN 22 P9_22 UART2_RXD OUTY4 J20, PIN 9 P8_9 TIMER5 OUTY5 J20, PIN 10 P8_10 TIMER6 OUTY6 J20, PIN 14 P8_14 GPIO0_26 OUTY7 J20, PIN 17 P8_17 GPIO0_27 OUT

nENBL J21, PIN 15 P9_15 GPIO1_16 OUTRESET J21, PIN 21 P9_21 UART2_TXD OUT

/FAULT0(Y0..Y3) J20, PIN 26 P8_26 GPIO1_29 IN/FAULT1(Y4..Y7) J20, PIN 18 P8_18 GPIO2_1 IN

5.2 Initialization and ControlDuring the start-up phase, the Beaglebone Black I/O pins might be floating. The selected isolator typeISO7140CC drives in this case its outputs high. These levels will keep RESET and nENBL high, whichdeactivates the DRV8803 outputs and prevents undesired switching. The following initialization sequencewill help to activate outputs only after the control code is up and running:1. Configure P9_15 as output.2. Set nENBL high (P9_15).3. Configure P9_21 as output.4. Set RESET high (P9_21).5. Set In_Y0 – In_Y7 low: Y0 to Y7 = P8_8, P9_12, P9_23, P9_22, P8_9, P8_10, P8_14, P8_176. Set RESET low. 7. Set nENBL low.

The TIDA-00320 is now active. The following sequence should be part of the control loop:1. Set In_x high for any output to activate: Y0 to Y7 = P8_8, P9_12, P9_23, P9_22, P8_9, P8_10, P8_14,

P8_172. Set In_x low for any output to deactivate.3. Monitor input /FAULT0 for Y0 to Y3 (BBB pin P8_26) and display error condition (error: /FAULT0 =

low) in conjunction with group Y0 to Y3.4. Monitor input /FAULT1 for Y4 to Y7 (BBB pin P8_18) and display error condition (error: /FAULT0 =

low) in conjunction with group Y4 to Y7.

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VF3

VF2

VF1

+ VG1

C7

4.7

n

C4 4

.7n

C6

100n

C5 1

00n

L3 1u

L2 1u

C3

4.7

n

C2

1u

L1 1u

C1

1u

R1 47

Getting Started Hardware www.ti.com

5.3 Fault SignalThe /XFAULT0 signal on pin 26 of J20 is a global fault signal for any of the four outputs Y0 to Y3./XFAULT1 provides the same function for outputs Y4 to Y7. The pin will be driven low in the case of anovercurrent in any of the DRV8803. At the same time, the corresponding output driver will be turned off.After 1.2 ms, THE OUTPUT DRIVER will retry to drive the output and clear the fault signal if theovercurrent situation is gone. /XFAULT will also be cleared if the XRST pin is activated or the 24-V fieldsupply is removed (J61 or J62).

If the die temperature in the DRV8803s exceeds safe limits, all outputs will be switched off and the/XFAULT of that DRV8803 will be driven low. The operation will resume when the temperature falls underthe limit.

5.4 Power SupplyThe board is connected to a 24-V field supply. The 5 V for the isolators are coming from this supply aswell as the voltage VM for the DRV parts. A combination of a fusible resistor and a 33-V TVS diode isused as protection against surge pulses of 500 V. For faster transients like ESD strikes, a filter based onthe fusible resistor and three low ESR capacitors is formed. Reverse polarity protection follows after thissurge protection and is implemented as simple diode.

EMI protection is implemented using the series resistor RF80 and set of PI-filters for the DC/DC converterand each of the DRV8804 driver ICs. The PI-filter for the DC/DC converter consists of C93, C94, L40,C47, and C48. The filter has the –3-dB point at 600 kHz and a steepness of 18 dB per octave. The filterfor the DRVs consists of C93, C94, and L80/C80 for U60 and L81/C81 for U61. Below 600 kHz, thecapacitive behavior of the PI-filter creates a low pass with RF80 with its –3-dB point at 30 kHz and asteepness of 6 dB per octave. This low pass leads to a damping factor of –30 dB at 600 kHz for bothDRV8803 parts and –50 dB for the SM72485. At 1.2 MHz, these factors are already –64 dB for the DRVsand –84 dB for the SM72485.

The spice simulation model for the set of filters is shown in Figure 4 and the corresponding AC simulationplot in Figure 5.

Figure 4. EMI Filter Simulation Model

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Gain

(dB

)

-201.45

-100.73

0.00

Frequency (Hz)

10.00 31.62k 100.00M

Ph

ase

[de

g]

-270.00

-90.35

89.29

www.ti.com Getting Started Hardware

Figure 5. AC Simulation Plot

5.5 Output and Field Power ConnectorAll DRV8803 outputs are connected to blue LEDs. The LED current is set to around 2 mA. Additionaldiodes are in series with the LEDs to eliminate reverse currents from inductive switching. Close to eachoutput connector pin is a 10-nF capacitor to reduce ESD sensitivity and reduce EMI. The board connectoris a low-profile type so that it is possible to stack capes and still have access to each of the boards.

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Y6

Y5

Y4

GND

Earth

Y2

Y0

+24V

Y3

Y1

GND

Earth

Y7

+24V

Oscilloscope

48

48

48

48

DC0 to 33 V

Ch 1Ch 2

P8-Header

Test Setup www.ti.com

6 Test Setup

6.1 Output Current CapabilitySetup for testing the output current capability:• Power supply: GW inSTEK GPS-4303 quad output DC power supply 2 × 0 to 30 V, 3 A and 8 to 15 V,

1 A and 2.2 to 5.5 V, 1 A• Thermo scan: Fluke Ti40FT 160×120, calibrated from –20°C to 350°C

The correctness of the thermal management is verified by connecting the output Y7 through an electronicload to the 24 V of the power supply. GND and Earth are connected to 0 V of the power supply. Theoutput is programmed to turn on. The current from the power supply into the electronic load is set to thelevel required to achieve an approximate 0.8-W power loss in the DRV8803, which is the equivalent powerloss as if all outputs carry 0.5 A each. The value will be close to 1.15 A, causing a drop voltage of 0.72 V.The temperature of the driving switch is observed using the thermo scan. The temperature is expected tosettle at around 65˚C at a room temperature of 25˚C. The typical drop voltage over the switch at roomtemperature and at the nominal current of 500 mA is expected to be 250 mV.

6.2 Rise, Fall, and Propagation Delay TimesSetup for testing the rise, fall, and propagation delay times:• Power supply: GW inSTEK GPS-4303 quad output DC power supply 2 × 0 to 30 V, 3 A and 8 to 15 V,

1 A and 2.2 to 5.5 V, 1 A• Oscilloscope: Tektronix TDS 3034

All four outputs of one group (Y4 to Y7) are connected through individual 48-Ω, 12-W resistors to 24 V ofthe power supply. GND and Earth are connected to 0 V of the power supply. The oscilloscope isconnected to the latch input on the host side with channel one and to output Y7 with channel two. It is setto normal trigger rising edge with the trigger coming from channel one. Trigger level is 1 V. Then, alloutputs are programmed to turn on. The oscilloscope will capture a falling edge on Y7. Thereafter, alloutputs are programmed to turn off and the oscilloscope will capture a rising edge on Y7. Themeasurement is repeated with the other three outputs of the same group. Then, the resistors areconnected to the second group of outputs (Y0 to Y3) and the measurement continues on these.

Figure 6. Measurement Setup for Rise, Fall, and Propagation Delay Times

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www.ti.com Test Data

7 Test Data

Table 3. Test Results

SPECIFICATIONSYMBOL PARAMETER CONDITIONS MEAS. UNIT

MIN TYP MAXVIN Input voltage Normal operation 10 24 33 24.5 VIIN Input current Normal operation — 15 50 (1) 14 mA

VLOAD Load supply voltage Normal operation 0 24 44 24.5 VPer channel TA = 60°C — 500 600 — (2) mA

ILOAD Load currentPer channel TA = 25°C — 700 1000 — (2) mA

PLOSS Power loss per channel RL = 48 Ω, VLOAD = 24 V, TA = 25°C — 200 — — (2) mWResistive load 1000 1000 Hz

fSW Switching frequencyInductive load, 0.1 H all channels 10 — (2) Hz

Load voltage rise time (10% totRISE RL = 48 Ω, VLOAD = 24 V, TA = 25°C — 600 — 550 ns90%)tFALL Load voltage fall time (90% to 10%) RL = 48 Ω, VLOAD = 24 V, TA = 25°C — 120 — 125 ns

Propagation Delay (latch to outputtPD RL = 50 Ω, VLOAD = 24 V, TA = 25°C 60 150 200 165 nschange)IPEAK Peak current (1 ms) 2.3 3.8 — (2) A

Inductive power for each group ofPIND 0.5 — (2) J/schannels (3)

(1) Depends on number of LEDs on and communication activity.(2) Based on calculations derived from DRV8803 datasheet.(3) Outputs Y0 to Y3 are one group, and outputs Y4 to Y7 are another group.

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Test Data www.ti.com

In Figure 7, channel 2 (red) is connected to the In0 signal of the host connector and triggers on risingedge. This edge causes the data to transfer to the output Y0 in the form of a high to low transition and istherefore suited to capture this output transition on channel 1 (blue) and the timing for the tpd(HL)propagation delay measurement. The fall time is dominated by the switching speed of the output transistorin the driver. Due to the open drain configuration, the rise time results from the RC combination formed bythe 10-nF capacitor connected to the switch output in the reference design, the driver output capacitance,and the 48-Ω load resistor at the output.

Figure 7. Fall Time and Propagation Delay

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www.ti.com Test Data

In Figure 8, channel 2 (red) is still connected to the In0 signal of the host connector and triggers now onthe falling edge. This edge causes the data to transfer to the output Y0 in form of a low to high transitionand is therefore suited to capture this output transition on channel 1 (blue) and the timing for the tpd(LH)propagation delay measurement. Due to the open drain configuration, the rise time results from the RCcombination formed by the 10-nF capacitor connected to the switch output in the reference design, thedriver output capacitance, and the 48-Ω load resistor at the output.

Figure 8. Rise Time and Propagation Delay

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Test Data www.ti.com

The result of the heat management verification is visible in Figure 9 for the bottom of the PCB and in Figure 10 for the top of PCB. The bottom sidereaches round 50°C under the DRV8803, and the top side peaks at 65°C on the top surface of the IC. These peaks correspond to a temperaturerise of 35°K to 40°K in the silicon above the ambient temperature. Based on the heat distribution on thermal images with both DRV8803 active, thetemperature rise would be 10°K higher. Assuming a maximum silicon temperature of 150°C, an ambient temperature of 100°C would be absolutemaximum. 85°C would leave sufficient guard band for safe operation under all conditions.

Figure 9. Thermal Scan of PCB Bottom Under Load Figure 10. Thermal Scan of PCB Top Under Load

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DGND DGND

MMC1_DAT6

MMC1_DAT2

TIMER4

TIMER5

GPIO1_13

EHRPWM2B

GPIO1_15

GPIO0_27

EHRPWM2A

MMC1_CLK

MMC1_DAT4

MMC1_DAT0

LCD_VSYNC

LCD_HSYNC

LCD_DATA14

LCD_DATA13

LCD_DATA12

LCD_DATA8

LCD_DATA6

LCD_DATA4

LCD_DATA2

LCD_DATA0

MMC1_DAT7

MMC1_DAT3

TIMER7

TIMER6

GPIO1_12

GPIO0_26

GPIO1_14

GPIO2_1

MMC1_CMD

MMC1_DAT5

MMC1_DAT1

GPIO1_29

LCD_PCLK

LCD_DE

LCD_DATA15

LCD_DATA11

LCD_DATA10

LCD_DATA9

LCD_DATA7

LCD_DATA5

LCD_DATA3

LCD_DATA1

P8 Header

Outputs available from P8 header pins:

P8-11 PTOP8-12 PTOP8-15 PRU0_inP8-16 PRU0_in

P8-7 Timer - DigOP8-8 Timer - DigOP8-9 Timer - DigOP8-10 Timer - DigOP8-13 EHRPWM2B DigOP8-14 DigO

P8-17 DigOP8-18 DigIP8-19 EHRPWM2AP8-26 DigI

1 2

3 4

5 6

7 8

9 10

11 12

13 14

15 16

17 18

19 20

21 22

23 24

25 26

27 28

29 30

31 32

33 34

35 36

37 38

39 40

41 42

43 44

45 46

J20

SSHQ-123-D-08-F-LF

www.ti.com Design Files

8 Design Files

8.1 SchematicsTo download the schematics, see the design files at TIDA-00320.

Figure 11. Beaglebone Connector and ID Prom1

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5.62kR22

5.62kR21

5.62kR20

DGND

VDD_3V3B

DGND

I2C2_SCL

I2C2_SDA

DGND

5.62kR23

5.62kR24

DGND

0.1µFC20

VDD_3V3B

Green

12

D20

DGND

VDD_3V3B

453R25

1 4

S20A

CVS-02TB

2 3

S20B

CVS-02TB

A01

A12

A23

VSS4

SDA5

SCL6

WP7

VCC8

U20

AT24C02D-SSHM-T

DGND

VDD_5V

VDD_ADC

SYS_5VVDD_5V

GNDA_ADC

SYS_5V

DGNDVDD_3V3B VDD_3V3B

DGND DGND

PWR_BUT

UART4_RXD

UART4_TXD

GPIO1_16

I2C1_SCL

I2C2_SCL

UART2_TXD

GPIO1_17

GPIO3_21

GPIO3_19

SPI1_D0

SPI1_SCLK

AIN4

AIN6

AIN2

AIN0

CLKOUT2

SYS_RESETn

GPIO1_28

EHRPWM1A

EHRPWM1B

I2C1_SDA

I2C2_SDA

UART2_RXD

UART1_TXD

UART1_RXD

SPI1_CS0

SPI1_D1

AIN5

AIN3

AIN1

GPIO0_7

P9 Header

Outputs available from P9 header pins:

P9-11P9-12 DigOP9-13P9-14P9-15 DigOP9-16P9-17 I2C1 SCLP9-18 I2C1 SDA

P9-21 DigOP9-22 DigOP9-23 DigOP9-24 UART1 TXD

P9-26 UART1 RXDP9-27 PTO

P9-41 PTO

1 2

3 4

5 6

7 8

9 10

11 12

13 14

15 16

17 18

19 20

21 22

23 24

25 26

27 28

29 30

31 32

33 34

35 36

37 38

39 40

41 42

43 44

45 46

J21

SSHQ-123-D-08-F-LF

Design Files www.ti.com

Figure 12. Beaglebone Connector and ID Prom2

Figure 13. Beaglebone Connector and ID Prom3

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ISOLATION BARRIER

GND_iso

1000pF

C43

VCC11

GND12

INA3

INB4

INC5

IND6

NC7

GND18

GND29

EN10

OUTD11

OUTC12

OUTB13

OUTA14

GND215

VCC216

U40

ISO7140CCDBQ

VCC11

GND12

INA3

INB4

INC5

IND6

NC7

GND18

GND29

EN10

OUTD11

OUTC12

OUTB13

OUTA14

GND215

VCC216

U41

ISO7140CCDBQ

VCC11

GND12

INA3

INB4

OUTC5

OUTD6

EN17

GND18

GND29

EN210

IND11

INC12

OUTB13

OUTA14

GND215

VCC216

U42

ISO7142CCDBQ

VDD_3V3B

DGND

0.1µFC40

DGND

0.1µFC41

DGND

0.1µFC42

In_Y0

In_Y1

In_Y2

In_Y3

In_Y4

In_Y5

In_Y6

In_Y7

nENBL

RESET

/FAULT0

/FAULT1

GPIO0_27

GPIO0_26

TIMER6

TIMER5

GPIO1_17

UART2_RXD

UART2_TXD

GPIO1_16

GPIO2_1

GPIO1_29

TIMER7

GPIO1_28

DGND

DGND

DGND GND_iso

GND_iso

GND_iso

+5V_iso

+5V_iso

+5V_iso

VDD_3V3B

VDD_3V3B

VDD_3V3B

VDD_3V3B

VDD_3V3B

SYS_RESETn

+5V_iso

DGND

0.1µFC44

GND_iso

+5V_iso

0.1µFC45

GND_iso

+5V_iso

0.1µFC46

GND_iso

+5V_iso

+5V_iso

+5V_iso

www.ti.com Design Files

Figure 14. Digital Isolators and Field Power Supply1

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VCC7

VIN8

RCL3

SW1

FB5

RTN4

BST2

RT/SD6

U43

SM72485MM/NOPB

1

3

2

D41BAV70-V

2.00k

R44

2.00kR43

GND_iso GND_iso

0.022µFC50

4.7µFC51

1.00

R45

GND_iso

0.1µFC49

GND_iso

86.6kR41

66.5k

R42

GND_iso

+5V_iso

L41

SRN4026-680M

TP40

TP42TP41

Green

12

D42

1.21kR46

Green1

2

D40

7.50kR40

+24V_Field

GND_iso

GND_iso

1µFC47

GND_iso

0.1µFC48

600 ohmL40

GND_iso

GND_iso

Design Files www.ti.com

Figure 15. Digital Isolators and Field Power Supply2

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Y4

Y5

Y6

Y7

Y0

Y1

Y2

Y3

GND_iso

GND_iso

GND_iso

GND_iso

+24V_EMI1

0.1µFC60

0.1µFC61

GND_iso

48V

D60

SMBJ48A-13-F

48V

D61

SMBJ48A-13-F

GND_iso

GND_iso

GND_iso

0.1µFC62

0.1µFC63

In_Y0

In_Y1

In_Y2

In_Y3

In_Y4

In_Y5

In_Y6

In_Y7

nENBL

nENBL

RESET

RESET

/FAULT0

/FAULT1

600 ohm

L60

+24V_Field +24V_EMI1+24V_EMI1

600 ohm

L61

+24V_Field +24V_EMI2 +24V_EMI2

+24V_EMI2

+5V_iso

2.00kR60

2.00kR61

+5V_iso

VM1

VCLAMP2

OUT13

OUT24

GND5

OUT36

OUT47

ENBL8

RESET9

IN410

IN311

GND12

IN213

IN114

NC15

FAULT16

PAD17

U60

DRV8803PWPR

VM1

VCLAMP2

OUT13

OUT24

GND5

OUT36

OUT47

ENBL8

RESET9

IN410

IN311

GND12

IN213

IN114

NC15

FAULT16

PAD17

U61

DRV8803PWPR

www.ti.com Design Files

Figure 16. Digital Output Stage

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GND_iso

GND_iso

Blue

1 2

D92

10.0k

R84

Blue

1 2

D93

10.0k

R85

Blue

1 2

D94

10.0k

R86

Blue

1 2

D95

10.0k

R87

0.01µF

C87

0.01µF

C86

0.01µF

C85

0.01µF

C84

Blue

1 2

D88

10.0k

R80

Blue

1 2

D89

10.0k

R81

Blue

1 2

D90

10.0k

R82

Blue

1 2

D91

10.0k

R83

0.01µF

C83

0.01µF

C82

0.01µF

C81

0.01µF

C80

+24V_Field

D80

CD0603-S0180

Y4

Y5

Y6

Y7

Y0

Y1

Y2

Y3

24V_ext

24V_ext

5

4

1

2

3

6

7

J80

1844265

5

4

1

2

3

6

7

J81

1844265

D81

CD0603-S0180

D82

CD0603-S0180

D83

CD0603-S0180

D84

CD0603-S0180

D85

CD0603-S0180

D86

CD0603-S0180

D87

CD0603-S0180

1-TI Designs.lnk

Design Files www.ti.com

Figure 17. Output Connectors and Surge Protection1

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+24V_Field

4700pFC88

4700pFC89

4700pFC90

4700pF

C91

GND_iso

1µFC93

GND_iso

0.1µFC94

GND_iso

33V

D96SMAJ33CA

RF80

47 Ohm

D97

MRA4003T3G

24V_ext

4700pF

C92

GND_iso

www.ti.com Design Files

Figure 18. Output Connectors and Surge Protection2

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Design Files www.ti.com

8.2 Bill of MaterialsTo download the bill of materials (BOM), see the design files at TIDA-00320.

Table 4. BOM

PACKAGEITEM # DESIGNATOR QTY VALUE PARTNUMBER MANUFACTURER DESCRIPTION REFERENCE1 !PCB1 1 TIDA-00320 Any Printed Circuit Board

C20, C40, C41, C42, CAP, CERM, 0.1 µF, 50 V,2 C44, C45, C46, C49, 10 0.1 µF C0603C104K5RACTU Kemet 0603±10%, X7R, 0603C60, C61CAP, CERM, 1000 pF, 2 KV3 C43 1 1000 pF 202R18W102KV4E Johanson Dielectrics Inc 120610% X7R 1206CAP, CERM, 1 µF, 50 V, ±10%,4 C47 1 1 µF C3216X7R1H105K TDK 1206X7R, 1206CAP, CERM, 0.1 µF, 50 V,5 C48, C94 2 0.1 µF C0603C104K5RACTU Kemet 0603±10%, X7R, 0603CAP, CERM, 0.022 µF, 50 V,6 C50 1 0.022 µF C0603C223K5RACTU Kemet 0603±10%, X7R, 0603CAP, CERM, 4.7 µF, 10 V,7 C51 1 4.7 µF C0603C475K8PACTU Kemet 0603±10%, X5R, 0603CAP, CERM, 0.1 µF, 100 V,8 C62, C63 2 0.1 µF CL21B104KCFSFNE Samsung 0805±10%, X7R, 0805

C80, C81, C82, C83, CAP, CERM, 0.01 µF, 100 V,9 8 0.01 µF C1608X7R2A103M TDK 0603C84, C85, C86, C87 ±20%, X7R, 0603C88, C89, C90, C91, CAP, CERM, 4700 pF, 100 V,10 5 4700 pF C1608X8R2A472K TDK 0603C92 ±10%, X8R, 0603

CAP, CERM, 1 µF, 50 V, ±10%,11 C93 1 1 µF CL21B105KBFNNNE Samsung 0805X7R, 080512 D20, D40, D42 3 Green LTST-C190KGKT Lite-On LED, Green, SMD 1.6 × 0.8 × 0.8 mm

Diode, Switching, 70 V, 0.25 A,13 D41 1 70 V BAV70-V Vishay-Semiconductor SOT-23SOT-23Diode, TVS, Uni, 48 V, 600 W,14 D60, D61 2 48 V SMBJ48A-13-F Diodes Inc. SMBSMB

D80, D81, D82, D83, Diode, Switching, 90 V, 0.1 A,15 8 90 V CD0603-S0180 Bourns 0603 DiodeD84, D85, D86, D87 0603 DiodeD88, D89, D90, D91,16 8 Blue LB Q39G-L2N2-35-1 OSRAM LED, Blue, SMD BLUE 0603 LEDD92, D93, D94, D95

Diode, TVS, Bi, 33 V, 400 W,17 D96 1 33 V SMAJ33CA Littelfuse SMASMADiode, Standard Recovery18 D97 1 300 V MRA4003T3G ON Semiconductor SMARectifier, 300 V, 1 A, SMA

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www.ti.com Design Files

Table 4. BOM (continued)PACKAGEITEM # DESIGNATOR QTY VALUE PARTNUMBER MANUFACTURER DESCRIPTION REFERENCE

FID1, FID2, FID3, FID4, Fiducial mark. There is nothing19 5 N/A N/A FiducialFID5 to buy or mount.Female Connector, 2.54 mm, Female Connector,20 J20, J21 2 SSHQ-123-D-08-F-LF Major League Electronics 23×2, TH 2.54 mm, 23×2, TH

TH, 7-Leads, BodyHeader (Shrouded), 3.5 mm,21 J80, J81 2 1844265 Phoenix Contact 9.2 × 25.9, Pitch 3.57×1, R/A, TH mmFerrite Bead, 600 Ω @ 10022 L40, L60, L61 3 600 Ω BLM18KG601SN1D MuRata 0603MHz, 1.3 A, 0603Inductor, Wirewound, Ferrite, 68 SMD, 2-Leads, Body23 L41 1 68 µH SRN4026-680M Bourns µH, 0.35 A, 0.852 Ω, SMD 4.2×4.2 mmThermal Transfer Printable PCB Label 0.650"H24 LBL1 1 THT-14-423-10 Brady Labels, 0.650" W × 0.200" H - × 0.200"W10,000 per roll

R20, R21, R22, R23,25 5 5.62 k CRCW06035K62FKEA Vishay-Dale RES, 5.62 k, 1%, 0.1 W, 0603 0603R2426 R25 1 453 CRCW0603453RFKEA Vishay-Dale RES, 453, 1%, 0.1 W, 0603 060327 R40 1 7.50 k CRCW06037K50FKEA Vishay-Dale RES, 7.50 k, 1%, 0.1 W, 0603 060328 R41 1 86.6 k CRCW060386K6FKEA Vishay-Dale RES, 86.6 kΩ, 1%, 0.1 W, 0603 060329 R42 1 66.5 k CRCW060366K5FKEA Vishay-Dale RES, 66.5 kΩ, 1%, 0.1 W, 0603 060330 R43, R44, R60, R61 4 2.00 k CRCW06032K00FKEA Vishay-Dale RES, 2.00 k, 1%, 0.1 W, 0603 060331 R45 1 1.00 CRCW06031R00FKEA Vishay-Dale RES, 1.00, 1%, 0.1 W, 0603 060332 R46 1 1.21 k CRCW06031K21FKEA Vishay-Dale RES, 1.21 k, 1%, 0.1 W, 0603 0603

R80, R81, R82, R83,33 8 10.0 k CRCW060310K0FKEA Vishay-Dale RES, 10.0 kΩ, 1%, 0.1W, 0603 0603R84, R85, R86, R87RES, 47 Ω, 10%, 2 W, Fusible,34 RF80 1 47 EMC2-47RKI TT Electronics/IRC Axial resistorTHDIP Switch, SPST, 2Pos, Slide, SW, 4.7 × 1.45 × 335 S20 1 CVS-02TB Copal Electronics SMT mmI2C-Compatible (2-wire) Serial

36 U20 1 AT24C02D-SSHM-T Atmel EEPROM 2-Kbit (256 × 8), SOIC-8SOIC-84242-VPK Small-Footprint and

37 U40, U41 2 ISO7140CCDBQ Texas Instruments Low-Power Quad Channels DBQ0016ADigital Isolators, DBQ0016A4242-VPK Small-Footprint and

38 U42 1 ISO7142CCDBQ Texas Instruments Low-Power Quad Channel DBQ0016ADigital Isolator, DBQ0016A

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Table 4. BOM (continued)PACKAGEITEM # DESIGNATOR QTY VALUE PARTNUMBER MANUFACTURER DESCRIPTION REFERENCE

SolarMagic 100 V, 150 mA39 U43 1 SM72485MM/NOPB Texas Instruments Constant On-Time Buck DGK0008A

Switching Regulator, DGK0008AQuad Low-Side Driver IC,40 U60, U61 2 DRV8803PWPR Texas Instruments PWP0016DPWP0016D

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www.ti.com Design Files

8.3 PCB Layout Recommendations and GuidelinesSufficient cooling of the DRV8803s is critical to the design and requires thermal vias under the devicesand contiguous copper area. In this design, thermal vias are also used to transfer the heat between thelayers if traces break the cooling area. The goal was to have sufficient cooling and still maintain a two-layer design. The red circle in Figure 19 shows an area where heat is blocked by a trace. A number ofvias around the trace will lead the heat to the bottom layer under the trace and back to the top layerbeyond the trace. Figure 20 shows contiguous copper for that part of the PCB. All together, this designpractice effectively increasing the active copper area by around 50%. The result and effectiveness of thispractice can be seen in Figure 9 and Figure 10 where heat is transferred beyond the trace on the toplayer.

Figure 19. Top View

Figure 20. Bottom View

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Design Files www.ti.com

8.3.1 Layer PlotsTo download the layer plots, see the design files at TIDA-00320.

Figure 21. Top Silkscreen Figure 22. Top Solder Mask

Figure 23. Top Layer Figure 24. Bottom Layer

Figure 25. Bottom Solder Mask Figure 26. Bottom Silkscreen

Figure 27. Mechanical Dimensions

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www.ti.com Design Files

8.4 Altium ProjectTo download the Altium project files, see the design files at TIDA-00320.

Figure 28. Multilayer Composite Print

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Design Files www.ti.com

8.5 Gerber FilesTo download the Gerber files, see the design files at TIDA-00320.

Figure 29. Fabrication Drawing

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8.6 Assembly Drawings

Figure 30. Top Assembly Drawing Figure 31. Bottom Assembly Drawing

8.7 Software FilesTo download the software files, see the design files at TIDA-00320.

9 References

1. Texas Instruments, Low Side 0.5-A, 8-Ch Digital Output Module for PLC, TIDA-00236 Design Guide(TIDU470)

2. Charles Mauney, Texas Instruments, Thermal Considerations for Surface Mount Layouts (PDF)

10 About the AuthorINGOLF FRANK is a systems engineer in the Texas Instruments Factory Automation and Control team,focusing on PLC I/O modules. Ingolf works across multiple product families and technologies to leveragethe best solutions possible for system-level application designs. Ingolf earned his electrical engineeringdegree (Dipl. Ing. (FH)) in the field of information technology at the University of Applied SciencesBielefeld, Germany in 1991.

HENRIK MANNESSON is a system engineer at Texas Instruments Germany in the Factory Automationand Control team. Henrik earned his master of science in electrical engineering (MSEE) from LundsUniversity of Technology (LTH), Lund, Sweden.

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Revision History www.ti.com

Revision History

Changes from Original (January 2015) to A Revision .................................................................................................... Page

• Changed preview page to completed design guide .................................................................................. 1

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

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IMPORTANT NOTICE FOR TI REFERENCE DESIGNS

Texas Instruments Incorporated ("TI") reference designs are solely intended to assist designers (“Buyers”) who are developing systems thatincorporate TI semiconductor products (also referred to herein as “components”). Buyer understands and agrees that Buyer remainsresponsible for using its independent analysis, evaluation and judgment in designing Buyer’s systems and products.TI reference designs have been created using standard laboratory conditions and engineering practices. TI has not conducted anytesting other than that specifically described in the published documentation for a particular reference design. TI may makecorrections, enhancements, improvements and other changes to its reference designs.Buyers are authorized to use TI reference designs with the TI component(s) identified in each particular reference design and to modify thereference design in the development of their end products. HOWEVER, NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPELOR OTHERWISE TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY THIRD PARTY TECHNOLOGYOR INTELLECTUAL PROPERTY RIGHT, IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right,or other intellectual property right relating to any combination, machine, or process in which TI components or services are used.Information published by TI regarding third-party products or services does not constitute a license to use such products or services, or awarranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectualproperty of the third party, or a license from TI under the patents or other intellectual property of TI.TI REFERENCE DESIGNS ARE PROVIDED "AS IS". TI MAKES NO WARRANTIES OR REPRESENTATIONS WITH REGARD TO THEREFERENCE DESIGNS OR USE OF THE REFERENCE DESIGNS, EXPRESS, IMPLIED OR STATUTORY, INCLUDING ACCURACY ORCOMPLETENESS. TI DISCLAIMS ANY WARRANTY OF TITLE AND ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESSFOR A PARTICULAR PURPOSE, QUIET ENJOYMENT, QUIET POSSESSION, AND NON-INFRINGEMENT OF ANY THIRD PARTYINTELLECTUAL PROPERTY RIGHTS WITH REGARD TO TI REFERENCE DESIGNS OR USE THEREOF. TI SHALL NOT BE LIABLEFOR AND SHALL NOT DEFEND OR INDEMNIFY BUYERS AGAINST ANY THIRD PARTY INFRINGEMENT CLAIM THAT RELATES TOOR IS BASED ON A COMBINATION OF COMPONENTS PROVIDED IN A TI REFERENCE DESIGN. IN NO EVENT SHALL TI BELIABLE FOR ANY ACTUAL, SPECIAL, INCIDENTAL, CONSEQUENTIAL OR INDIRECT DAMAGES, HOWEVER CAUSED, ON ANYTHEORY OF LIABILITY AND WHETHER OR NOT TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES, ARISING INANY WAY OUT OF TI REFERENCE DESIGNS OR BUYER’S USE OF TI REFERENCE DESIGNS.TI reserves the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services perJESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevantinformation before placing orders and should verify that such information is current and complete. All semiconductor products are soldsubject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s termsand conditions of sale of semiconductor products. Testing and other quality control techniques for TI components are used to the extent TIdeems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is notnecessarily performed.TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products andapplications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provideadequate design and operating safeguards.Reproduction of significant portions of TI information in TI data books, data sheets or reference designs is permissible only if reproduction iswithout alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable forsuch altered documentation. Information of third parties may be subject to additional restrictions.Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirementsconcerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or supportthat may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards thatanticipate dangerous failures, monitor failures and their consequences, lessen the likelihood of dangerous failures and take appropriateremedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components inBuyer’s safety-critical applications.In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is tohelp enable customers to design and create their own end-product solutions that meet applicable functional safety standards andrequirements. Nonetheless, such components are subject to these terms.No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the partieshave executed an agreement specifically governing such use.Only those TI components that TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use inmilitary/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components thathave not been so designated is solely at Buyer's risk, and Buyer is solely responsible for compliance with all legal and regulatoryrequirements in connection with such use.TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use ofnon-designated products, TI will not be responsible for any failure to meet ISO/TS16949.IMPORTANT NOTICE

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