A 1 GS/s 6-bit Time-Based Analog-to-Digital
Converter (T-ADC) for Front-End Receivers
Ali H. Hassan1, Ahmed Ali2, M. Wagih Ismail3, Mohamed Refky4, Yehea Ismail5, and Hassan Mostafa6 1,2,4,6Electronics and Communications Engineering Department, Cairo University, Giza 12613, Egypt
3Department of Electrical and Computer Engineering, University of Toronto 5,6Center for Nanoelectronics and Devices, AUC and Zewail City of Science and Technology, New Cairo 11835, Egypt
Email: {[email protected], [email protected], [email protected], [email protected],
[email protected], and [email protected]}
Abstract— Recently, researchers are targeting low-power
consumption, and integrating more blocks on-chip. This paper
proposes a 1GS/s 6-bit time-based analog-to-digital converter (T-
ADC) for front-end receivers. This T-ADC eliminates the pre-
processing analog blocks, and reduces power consumption by
removing the power-hungry sample and hold circuit. A prototype of
the proposed T-ADC is implemented in 65nm CMOS technology,
where it consumes 1 mW and achieves a maximum SNDR of 35.5 dB
with sampling rate 1 GHZ that corresponds to a Figure of Merit (FoM)
of 20.62 fJ/step.
Keywords— Time-Based ADC, Inherit sample and hold, front end
receivers, voltage-to-time converter, time-to-digital converter.
I. INTRODUCTION
Analog-to-Digital Converter (ADC) is considered one of
the most essential blocks in Software Defined Radio (SDR),
Ultra-Wide Band (UWB) receivers, biomedical applications,
and embedded systems. The majority of the Integrated Circuits
(ICs) today are mixed analog/digital systems to get benefit from
the growing capabilities in Digital Signal Processing (DSP).
The DSP is preferred to the analog signal processing in many
different ways such as: power consuming and processing speed.
Thus, the main target is to decrease the analog processing
blocks and increase the digital processing blocks in the
aforementioned systems.
Decreasing the percentage of the analog part and increasing
the percentage of the digital part in integrated circuits is the
current trend and is highly recommended to maximize the
benefit of the unceasing CMOS technology scaling. The
unceasing CMOS technology scaling makes transistors channel
length shorter and increases transistors integration density
leading to supply voltage reduction. This reduction in supply
voltage increases the difficulties imposed on the analog circuit
design because the threshold voltage and the noise level do not
scale with the same factor as the supply voltage. Therefore, the
digital circuits are preferred to the analog circuits in deep sub-
micron technology. The switching time becomes smaller and
the circuits that depend on time resolution get a superior
accuracy over the analog circuits.
The time-based ADC (T-ADC) has the advantage of being
highly digitally oriented, thus the scaling of CMOS which
provides better timing accuracy with low power consumption
at high frequencies is a fundamental advantage to it as opposed
to traditional analog circuits.
The T-ADC converts the analog signal to a time delay
representation through a Voltage-to-Time Converter (VTC).
Then, the time-represented signal is converted to digital code
through a Time-to-Digital Converter (TDC). The main idea is
to scale the input voltage 𝑉𝑖𝑛 into a difference between the input
rising edge and the input reference signal. This delay difference
is digitized using a TDC that divide the delay difference into
constant delay steps to be digitized into a digital word.
The rest of the paper is organized as follows. In Section II,
the proposed circuit implementation of each block of T-ADC is
presented, and the chip layout as well as the simulation results
are provided in Section III. Finally, a conclusion is drawn in
Section IV.
II. CIRCUIT IMPLEMENTATION
Fig. 1 Half-Cell VTC Circuit Schematic
A. VTC
Voltage-to-time conversion is the process of sampling an
analog input voltage and converting it into a pulse width
modulated signal. Thus, VTC output is referred either a pulse
position modulator (PPM) or pulse width modulator (PWM)
[1]. Fig. 1 portrays the half-cell schematic of the implemented
VTC circuit, where the first current starved inverter is used to
provide a fixed delay to the falling edge of the input clock.
While the second starved inverter varies the rising edge of its
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input according to 𝑉𝑖𝑛 , shown in Fig. 2, where biasing
voltage 𝑉𝑐𝑜𝑛𝑠𝑡 is used to control operation region of VTC half-
cell. This provides a time window long enough for the
conversion.
Fig. 2 Output signal with different 𝑉𝑖𝑛
Fig.3 displays the proposed differential VTC circuit that
consists of two identical half-cells, where one of them
processes on the input voltage signal, and the other half-cell
processes on reference voltage signal. The identical two half-
cell VTC circuits are used to generate the two triggering pulses
for the TDC (𝐼𝑛𝑃 𝑎𝑛𝑑 𝐼𝑛𝑁), where 𝐼𝑛𝑃 is modulated by 𝑉𝑖𝑛, and
𝐼𝑛𝑁 is the reference signal.
Fig. 3 VTC Core Block Diagram
VTC introduces a non-linearity and distortion to the output
modulated signal that affects the T-ADC resolution. In order to
increase linearity, and reduce the VTC circuit mismatch: 1) the
main current starving transistor M3 is linearized using source
degeneration that is implemented by cascoding transistor M6,
and 2) the parallel transistors (M4 and M5) with different gate
bias voltages are used in order to ease the compression of the
pulse delay time versus input voltage characteristic at high
input voltages. Using only source degeneration for linearizing,
and increasing the width of the main current starved transistor
(M3) results in a VTC insensitive to the input voltage as the
VTC circuit with the enhanced linearization scheme [2].
Fig. 4, shows the output delay versus the input voltage
𝑉𝑖𝑛 that changes from -86.1 mV to 86.1 mV providing dynamic
input voltage range of 172.2 mV, while achieving the linearity
error less than 3%.
Fig. 4 Linear range of operation
B. TDC
The TDC is used to convert the output delay produced by
the differential VTC into a thermometer code that is encoded
into a binary code. TDC is designed using 6-bit Vernier delay
line architecture [3] that consists of 63 differential delay stages.
Each stage consists of tunable differential delay cell, and sense-
amplifier D-flip-flop [4] as shown in Fig. 5. Each delay stage
of TDC provides a constant delay step (𝑡𝛿) which is given by:
𝑡𝛿 =𝑂𝑢𝑡𝑝𝑢𝑡 𝐷𝑒𝑙𝑎𝑦 𝑅𝑎𝑛𝑔𝑒
2𝑁−𝑏𝑖𝑡𝑠 = 216.5
26 = 3.38 ps
Fig. 5 6-bits Vernier Delay Line
The proposed TDC, shown in Fig. 7, has two input signals
one positive (𝐼𝑛𝑃) signal and another negative signal (𝐼𝑛𝑁). The
delay cells are used to digitize the delay between the 𝐼𝑛𝑃 and
the 𝐼𝑛𝑁, where D-flip-flop acts as a phase detector, i.e. If the
𝐼𝑛𝑃 come before the 𝐼𝑛𝑁 the output of the D-flip-flop is logic
one otherwise the output of the D-flip-flop is logic zero. The
first cell is used to delay 𝐼𝑛𝑁 by 31tδ referred to 𝐼𝑛𝑃, while the
other cells only delay its input signals by tδ only till the end of
the delay line. The two input signals are delayed by 31tδ to
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process the output delay range in parallel. Fig. 6 shows an
example, where input phase difference (∆𝑇𝑖𝑛) equals zero.
Fig. 6 Simulated Waveforms of the illustrated Idea
The two propagating signals 𝐼𝑛𝑃 and 𝐼𝑛𝑁 change over 32
delay stages, where the phase difference became again
equivalent to the same phase difference at the input stage after
these 32 delay stages, so we make use of this to divide the delay
line that consists of 63 stages into two parallel lines as shown
in Fig. 7 at the input signals travel through both lines at same
time. This almost doubled the throughput speed of TDC.
Fig. 7 6-bits parallel Vernier Delay Line
The tuneable delay cell, shown in Fig. 8, is implemented
using a current starved inverter circuit which consists of 6
transistors, the basic CMOS inverter which is formed from the
2 transistors M3 and M4 are followed by another inverter
formed from the transistors M5 and M6. The devices M7 and
M8 will operate in saturation region in order to control the
amount of current passing through the first inverter. While the
transistors M1 and M2 are very small compared to M7 and M8,
as they are used to control the beginning of operation of the
current starved inverter circuit.
Fig. 8 Schematic of Tuneable Delay Cell
The tunable delay stage used in the TDC design uses a
current starved inverter to delay the rising and the falling edges
of the input signal by the same amount to maintain a constant
pulse width. Using the tuning voltages (𝑉𝑔𝑁 and 𝑉𝑔𝑃) to adjust
the 63 stages of the T-ADC to compensate the non-idealities of
the VTC and get 63 constant delay stages. Based on [3], the
number of these tuning voltages equal to 63. By analogy, it is
noticed that first cell, the middle cells, and the last cell
experience different loading effect. Based on that the number
of tuning voltages is optimized to be only 3 per delay line.
A 6-bit mux-based thermometer-to-binary encoder is used
to count the number of logic ones in the output thermometer
code, then coverts it to the corresponding binary code. The
mux-based thermometer-to-binary encoder provides lowest
power consumption, smaller area on chip, minimum path delay,
and its architecture is easy to be extended [7].
III. CHIP LAYOUT AND SIMULATION RESULTS
A prototype of the T-ADC is implemented on 65 nm CMOS
technology process as shown in Fig. 9, where the T-ADC
layout is highlighted with the main design blocks. Table I
illustrates the key performance parameters where it shows that
the effective number of bits (ENOB) equals to 5.6 bits using
sampling rate equals 1 GS/s. Moreover, the T-ADC consumes
1 mW from 1V supply. In Fig. 10, fast fourier transform (FFT)
is applied on the output reconstructed signal where the signal
to noise and distortion ratio (SNDR) at different sampling
frequency remains above 30 dB while varying the input signal
frequency.
Fig. 9 T-ADC Chip Layout
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Fig. 10 Output Spectrum due to input frequency = 110 MHz without sample
and hold circuit
Walden in [6] defined a Figure of Merit (FoM) to make a
fair comparison with other ADCs operating at different speeds
and resolutions is:
FoM= 𝑃
2𝐸𝑁𝑂𝐵∗ 𝐹𝑠
Where P is the power consumption, and 𝑓𝑠 is the sampling
frequency. Based on the shown comparison in Table II with
state-of-the-art ADCs, this T-ADC has one of the best power
efficiencies.
IV. CONCLUSION
Using 1V supply and 65 nm CMOS process technology,
A 1 GS/s 6-bit T-ADC is introduced for low-power, high-speed
front-end receivers. In this T-ADC, the proposed VTC
enhanced the sensitivity up to 1.25 ps/mV that fulfills the TDC
time resolution of wide range of applications. Moreover, the
proposed TDC circuit doubles the throughput to achieve a high
resolution with high sampling rate. This T-ADC helps in
decreasing the analog part, and increasing the digital part in the
circuits to save time and effort in the design cycle, and make
use of technology scaling.
ACKNOWLEDGMENT
This research was partially funded by Cairo University,
ITIDA, NTRA, NSERC, Zewail City of Science and
Technology, AUC, the STDF, Intel, Mentor Graphics, SRC,
ASRT and MCIT.
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TABLE I: T-ADC Performance
Technology Process TSMC 65 nm CMOS
Sampling Rate 1 GHZ
Resolution 6 bits
ENOB @ 150 MHZ 5.6
Input Dynamic Range 172.2 mVpp
Supply Voltage 1 V
Power Consumption 1 mW
Area 0.024 𝑚𝑚2
TABLE II: Performance Comparison of State of the Art ADCs
Reference Architecture Technology Process Power Resolution 𝑭𝒔 FOM (fJ/conv. Step)
[5] Delay-Line 65 nm 2 mW 4 1.2 GS/s 196
[8] Delay-Line 65 nm 1.8 mW 6 500 MS/s 74
[9] Async. SAR 65 nm 6.7 mW 6 1 GS/s 209
[10] 2b/cycle SAR 65 nm 4 mW 8 400 MS/s 73
[11] pipelined SAR 65 nm 11.1 mW 13 160 MS/s 41.6
[12] T-ADC 65 nm 1.9 mW 8 200 MS/s 39.7
This Work T-ADC 65 nm 1 mW 6 1 GS/s 20.62
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